PM 2PG - Laser level HILTI - Free user manual and instructions
Find the device manual for free PM 2PG HILTI in PDF.
| Product type | Self-leveling laser level (laser point) |
| Brand | Hilti |
| Model | PM 2-PG |
| Dimensions (L x W x H) | 66 mm x 116 mm x 145 mm (with base) |
| Weight | 590 g (with base and batteries) |
| Power supply | 4 AA 1.5 V batteries |
| Operating time | 70 h (at 24 °C) |
| Laser class | Class 2 (IEC 60825-1:2014), visible |
| Wavelength | 510 - 530 nm |
| Range of points | 30 m |
| Self-leveling range | ±4° |
| Leveling time | 3 s |
| Accuracy at 10 m | ±3 mm |
| Beam diameter at 5 m | < 4 mm |
| Beam diameter at 20 m | < 15 mm |
| Auto power off | After 1 h (can be disabled) |
| Tripod thread (product) | UNC 1/4" |
| Tripod thread (base) | BSW 5/8" and UNC 1/4" |
| Dust and water protection | IP54 |
| Operating temperature | -10 °C to 40 °C |
| Storage temperature | -25 °C to 63 °C |
| Slope function | Yes (pendulum locked, beam flashes every 5 s) |
| Drop protection | Use Hilti PMA 92 wrist strap |
| Cleaning | Damp cloth, do not use silicone-based cleaners |
| Repairability | Have repairs done exclusively by Hilti service center |
Frequently Asked Questions - PM 2PG HILTI
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USER MANUAL PM 2PG HILTI
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PM 2-PG OFF ON ① ② ③ ④ ⑤ ⑥ ⑦ ⑧
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Technical diagram showing a 3D printer setup with labeled components and a close-up of the interior space, including a door and wall layout.
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Ø 3 mm (∅1/8") 10 m (30 ft) 2 (90°) 3 (180°) 4 (270°) Ø 3 mm (∅1/8") www.hilti.comPM 2-PG
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PM 2-PG ① ② ③ ④ ⑤ ⑥ ⑦ ⑧以下表格均依据 SJT 11364 通则制定。
o: 表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 标准规定的限量要求以下。
x:表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 标准规定的限量要求。
(企业可基于其实际情况在包装箱内提供 “X” 标识的详细技术说明。)
The following tables are prepared in accordance with the provision of SJT 11364.
O: Indicates that said hazardous substances contained in all of the homogeneous materials for this part is below limit requirement of GB/T 26572
X: Indicates that said hazardous substances contained in at least one of the homogeneous materials used for this is above the limit requirement of GB/T 26572.
(Enterprises may further provide in this box technical explanation for marking "X" based on their actual circumsta
Declaration of the Presence Condition of the Restricted Substances Marking
| 設備名稱: PM 2-LG (02) / PM 2-PG (01), 型號(型式): Laser Equipment name: PM 2-LG (02) / PM 2-PG (01), Type designation: Laser | ||||||
| 單元Unit | 限用物質及其化學符號Restricted substances and its chemical symbols | |||||
| 鉛Lead(Pb) | 汞Mercury(Hg) | 鎘Cadmium (Cd) | 六價鉻HexavalentChromium (Cr(VI)) | 多溴聯苯Polybrominatedbiphenyls(PBB) | 多Pol bip | |
| 电子元件(PCBs)Electronics (PCBs) | 0 | 0 | 0 | 0 | 0 | |
| 壳体组件Housing | 0 | 0 | 0 | 0 | 0 | |
| 电气联接线Electrical wirings | 0 | 0 | 0 | 0 | 0 | |
| 核心部件Core part | - | 0 | 0 | 0 | 0 | |
備考 1. “超出 0.1 wt %” 及 “超出 0.01 wt %” 係指限用物質之百分比含量超出百分比含量基準值。
Note 1: "Exceeding 0.1wt.% and exceeding 0.01wt %" indicate that the percentage contain of the restricted s exceeds the reference percentage value of presence condition.
備考 2. “○”係指該項限用物質之百分比含量未超出百分比含量基準值。
Note 2: "o" – indicates that the percentage contain of the restricted substance does not exceeds the percent reference value of presence.
備考 3. "一" 係指該項限用物質為排除項目。
Note 3: The “-” indicates that the restricted substance corresponds to the exemption.
Original operating instructions
1 Information about the operating instructions
1.1 About these operating instructions
- Read these operating instructions before the product is used or operated for the first time. This is a prerequisite for safe, trouble-free handling and use of the product.
- Observe the safety instructions and warnings in these operating instructions and on the product.
- Always keep the operating instructions with the product and make sure that the product is accompanied by these operating instructions only, when the product is given to other persons.
1.2 Explanation of symbols used
1.2.1 Warnings
Warnings alert persons to hazards that occur when handling or using the product. The following signal words are used:

DANGER
DANGER!
- Draws attention to imminent danger that will lead to serious personal injury or fatality.

WARNING
WARNING!
- Draws attention to a potential threat of danger that can lead to serious injury or fatality.

CAUTION
CAUTION!
- Draws attention to a potentially dangerous situation that could lead to personal injury or damage to the equipment or other property.
1.2.2 Symbols in the documentation
The following symbols are used in this document:

Read the operating instructions before use.

Instructions for use and other useful information

Dealing with recyclable materials

Do not dispose of electric equipment and batteries as household waste
1.2.3 Symbols in the illustrations
The following symbols are used in illustrations:
| 2 | These numbers refer to the corresponding illustrations found at the beginning of these operating instructions |
| 3 | The numbering reflects the sequence of operations shown in the illustrations and may deviate from the steps described in the text |
| 11 | Item reference numbers are used in theoverview illustrationsand refer to the numbers used in theproduct overview section |
| ! | This symbol is intended to draw special attention to certain points when handling the product. |
1.3 Product-dependent symbols
1.3.1 Symbols on the product
The following symbols can be used on the product:

The product supports near-field communication (NFC) technology compatible with iOS and Android platforms.
1.4 Product information

products are designed for professional users and only trained, authorized personnel are
permitted to operate, service and maintain the products. This personnel must be specifically informed about the possible hazards. The product and its ancillary equipment can present hazards if used incorrectly by untrained personnel or if used not in accordance with the intended use.
The type designation and serial number are printed on the rating plate.
Write down the serial number in the table below. You will be required to state the product details when contacting Hilti Service or your local Hilti organization to inquire about the product.
Product information
| Type PM 2-PG | |
| Generation 01 | |
| Serial no. |
1.5 Declaration of conformity
The manufacturer declares, on his sole responsibility, that the product described here complies with the applicable legislation and standards.
The technical documentation is filed here:
Hilti Entwicklungsgesellschaft mbH | Tool Certification | Hiltistrasse 6 | D-86916 Kaufering, Germany
1.6 Sticker on the product
Laser information
| LASER 2 |
Laser class 2 based on standard IEC60825-1 / EN60825-1:2014 and compliant with CFR 21 § 1040.10 and 1040.11 (Laser Notice 56). Do not look straight into the laser beam.
2 Safety
2.1 General safety instructions, measuring tools
WARNING! Read all safety precautions and other instructions. Measuring tools can present hazards if handled incorrectly. Failure to observe the safety instructions and other instructions can result in damage to the measuring tool and/or serious injury.
Keep all safety precautions and instructions for future reference.
Work area safety
- Keep your workplace clean and well lit. Cluttered or poorly lit workplaces invite accidents.
- Do not operate the product in explosive atmospheres, such as in the presence of flammable liquids, gases or dust.
- Keep children and other persons clear when the product is in use.
▶ Use the product only within its specified limits. - Comply with your national accident prevention regulations.
Electrical safety
Do not expose the product to rain or moisture. Penetrating moisture can cause short circuits, electrical shock, burns or explosions.
Although the product is protected against the entry of moisture, it should be wiped dry before being put away in its transport container.
Personal safety
Stay alert, watch what you are doing and use common sense when operating a measuring tool. Do not use a measuring tool while you are tired or under the influence of drugs, alcohol or medication. A moment of inattention while operating the measuring tool can result in serious personal injury.
- Avoid unusual body positions. Keep proper footing and balance at all times.
▶ Wear personal protective equipment. Wearing personal protective equipment reduces the risk of injury.
- Do not render safety devices ineffective and do not remove information and warning notices.
- Avoid accidental starting. Make sure that the measuring tool is switched off before connecting it to the battery and before picking it up or carrying it.
▶ Use the product and accessories in accordance with these instructions and in the way specified for this special type of tool. Take the working conditions and the work to be performed into account. Use of products for applications different from those intended could result in hazardous situations.
- Do not lull yourself into a false sense of security and do not flout the safety rules for measuring tools, even if you are familiar with the measuring tool after using it many times. Carelessness can result in serious injury within a fraction of a second.
- Do not use the measuring tool in the vicinity of medical devices.
Using and handling the measuring tool
▶ Use the product and accessories only when they are in perfect working order.
- Store measuring tools out of reach of children when not in use. Do not allow persons who are not familiar with the product or these instructions to operate it. Measuring tools are dangerous in the hands of inexperienced persons.
▶ Measuring tools need care and attention. Check that moving parts operate satisfactorily and do not jam, and make sure that no parts are broken or damaged in such a way that the measuring tool might no longer function correctly. Have damaged parts repaired before using the measuring tool. Many accidents are caused by poorly maintained measuring tools.
- Do not under any circumstances modify or tamper with the product. Changes or modifications not expressly approved by Hilti may restrict the user's authorization to operate the product.
▶ Check the accuracy of the measuring tool before using it for important measurements, and if it has been dropped or subjected to other mechanical stresses.
▶ Due to the measuring principle employed, the results of measurements can be negatively affected by certain ambient conditions. These include, for example, the proximity of devices that produce strong magnetic or electro-magnetic fields, vibrations and temperature changes.
▶ Rapidly changing measuring conditions can falsify the results.
- When the product is brought into a warm environment from very cold conditions, or vice-versa, allow it to become acclimatized before use. Big differences in temperature can lead to incorrect operation and incorrect results.
- When adapters or accessories are used, make sure they are mounted securely.
The measuring tool is designed for the tough conditions of jobsite use, but as with other optical and electrical products (e.g. binoculars, spectacles, cameras) it must be handled with care.
The specified operating and storage temperatures must be observed.
2.2 Additional safety instructions for laser measuring tools
▶ Laser radiation in excess of Class 2 can be emitted if the product is opened without correct procedure being followed. Have the product repaired only by Hilti Service.
- Secure the area in which you will be taking measurements. While setting up the product, make sure that you do not direct the laser beam toward yourself or others. Laser beams should be projected well above or well below eye height.
- Keep the laser exit window clean in order to avoid measurement errors.
▶ Check the accuracy of the product before use and several times during use.
Readings taken in the vicinity of reflective objects or surfaces, through panes of glass or similar materials can falsify the result of measurement.
Mount the product on a suitable holder or bracket or on a tripod, or set it on a smooth, level surface.
- Do not work with surveyor's staffs in the vicinity of high-voltage electricity cables.
- Make sure that no other laser measuring tool that can influence your measurements is in use in the vicinity.
- Do not permit the laser beam to project beyond the controlled area.
2.3 Additional safety instructions
Risk of injury by falling tools and/or accessories. Before starting work, check that installed accessories are secure.
2.4 Electromagnetic compatibility
Although the device complies with the strict requirements of the applicable directives, Hilti cannot entirely rule out the possibility of interference to the device caused by powerful electromagnetic radiation, possibly leading to incorrect operation. Check the accuracy of the device by taking measurements by other means when working under such conditions, or if you are unsure. Likewise, Hilti cannot rule out the possibility of interference with other devices (e.g. aircraft navigation equipment).
2.5 Laser classification for Class 2 laser products
The product corresponds to Laser Class 2 in accordance with IEC / EN 60825-1:2014 and in accordance with CFR 21 § 1040 (FDA). This product may be used without need for further protective measures. Nevertheless, as with the sun, do not look directly into the light source. If you do inadvertently look into the laser beam, immediately close your eyes and move your head clear of the laser beam. Do not aim the laser beam at persons.
2.6 Careful handling and use of batteries
Remove the batteries from the product if it is to remain unused for a lengthy period of time. Batteries can corrode and self-discharge during prolonged storage.
▶ Make sure that batteries are inaccessible to children.
- Do not mix old and new batteries. Always replace all batteries at the same time. Do not mix batteries of different makes or types.
▶ Do not use damaged batteries.
▶ Use only the battery type intended for this product. Use of other batteries may create a risk of injury and fire.
- When changing batteries, make sure that polarity is correct. There is a risk of explosion.
- Do not allow batteries to overheat and do not expose them to fire. Batteries can explode and release toxic substances.
- Do not attempt to charge non-rechargeable batteries.
▶ Do not solder batteries into the product.
- Do not discharge batteries by short-circuiting. Batteries can develop a leak, explode, catch fire and injure persons.
- Do not damage batteries and do not attempt to take batteries apart. Batteries can develop a leak, explode, catch fire and injure persons.
3 Description
3.1 Product overview

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PM 2-PG ① ② ③ ④ ⑤ ⑥ ⑦ ⑧① Position of rating plate
② Battery compartment
③ Operating status display and battery charge status display
④ Laser exit window
⑤ Magnetic foot
⑥ Mounting thread
⑦ Selector switch for ON / OFF and lock / unlock pendulum
⑧ Eye for attaching the retaining strap PMA 92
3.2 Intended use
The product described is a self-leveling point laser which allows a single person to carry out vertical alignmer work quickly and accurately. The product features two coincident laser beams (beams that originate from the same point). All beams have the same range of 30 m (range depends on the brightness of ambient light). The product is designed for marking plumb points indoors.
Possible applications are: Transferring points marked on the floor to the ceiling.
Do not tamper with or attempt to make alterations to the product.
Observe the information printed in the operating instructions concerning operation, care and maintenance.
To avoid risk of injury, use only genuine Hilti accessories and accessory tools.
The product and its ancillary equipment may present hazards when used incorrectly by untrained personnel or when used not as directed.
3.3 Features
The product is self-leveling within typicallyapprox. 4.0^ in all directions. Self-leveling takes only approximately 3 seconds.
When the self-leveling range is exceeded, the laser beam flashes to warn the user.
The product is characterized by its ease of operation and use and its rugged plastic housing. Small and light it is easy to transport. In normal operating mode, the product switches off after 1 hour. Sustained operating mode is possible by switching on, switching off and switching on again within 3 seconds.
3.4 Information displayed during operation
| Status Meaning | ||
| Operating status and charge status indicator | LED does not light up • Product is switched off• Batteries are exhausted• Batteries are inserted incorrectly | |
| LED shows continuously • Laser beam is switched onProduct is in operation | ||
| LED quick-flashes • Batteries are almost exhausted | ||
| Laser beam Laser beam flashes | twice every 10 seconds | • Batteries are almost exhausted |
| Laser beam flashes five times and then remains permanently on. | • Automatic power-off has been deactivated | |
| Laser beam flashes at high frequency. | • Product unable to level. | |
3.5 Items supplied
Point laser, pouch, 4 AA batteries (not in all markets), operating instructions, manufacturer's certificate
4 Technical data
| Range of the points | 30 m(98 ft - 10 in) | |
| Self-leveling time | 3 s | |
| Self-leveling range (typical) | ±4° | |
| Accuracy at 10 m (33 ft) | ±3 mm(±0.1 in) | |
| Beam diameter Distance 5 | m (16.4 ft) | < 4 mm(< 0.2 in) |
| Distance 20 m (65.6 ft) | < 15 mm(< 0.6 in) | |
| Laser class | Class 2, visible, 510 - 530 nm, ±10 nm(IEC 60825-1:2014); class II (CFR 21 §1040.10 and 1040.11) (FDA) | |
| Beam divergence, laser points | 0.7 mrad | |
| Average output power (max) (p) | < 1 mW | |
| Wavelength (λ), ±10 nm | 510 nm ... 530 nm | |
| Pulse duration (tp) | < 60 μs | |
| Pulse frequency (f) | < 12 kHz | |
| Power source | 4x 1.5V AA battery | |
| Battery life (typical) | at 24 °C (72 °F) : 70 h | |
| Automatic power-off after | 1 h | |
| Operating status indicator | LED and laser beams | |
| Operating temperature | -10 °C ... 40 °C(14 °F ... 104 °F) | |
| Storage temperature | -25 °C ... 63 °C(-13 °F ... 145 °F) | |
| Protection against dust and water spray | IP 54 as per IEC 60529 | |
| Tripod thread (product) | UNC 1/4" | |
| Stand thread (foot) | BSW 5/8" UNC 1/4" | |
| Dimensions, length x width x height (including foot) | 66 mm x 116 mm x 145 mm(2.6 in x 4.6 in x 5.7 in) | |
| Weight with foot and including batteries | 590 g(20.8 oz) | |
5 Operation
5.1 Inserting/changing batteries

- Make sure that battery polarity is correct.
- Changes all the batteries at the same time.
-
Use only batteries that have been manufactured in accordance with international standards.
-
Flip the battery compartment open.
- Remove the spent batteries, if applicable.
- Insert the new batteries.
- Close the battery compartment.
5.2 Fall arrest

WARNING
Risk of injury by falling tool and/or accessory!
▶ Use only the Hilti anti-fall cable recommended for your product.
Prior to each use, always check the anti-fall cable and the attachment points of the anti-fall cable for possible damage.

Comply with the national regulations for working at heights.
As drop arrester for this product, use only the Hilti PMA 92 anti-fall cable.
- Secure the anti-fall cable to the laser and to a load-bearing structure. Check that it holds securely.

Comply with the operating instructions of the Hilti anti-fall cable.
5.3 Switching the laser beams on
- Set the selector switch to the position (ON / unlocked).
The laser beams are switched on and the laser levels automatically.

The product switches off automatically after one hour.
5.4 Deactivating the automatic power-off feature
- Switch the product on and off, then on again within 3 seconds. Laser beam flashes five times to confirm deactivation.

The product is switched off when the selector switch is set to the OFF position or when battery power is exhausted.
5.5 Setting the laser beam for the "Inclined line" function
▶ Set the selector switch to the position (ON / locked).
▶ The laser beams are switched on.

When the "Inclined line" function is active, the pendulum is locked and the laser is not leveled. The laser beams flash every 5 seconds.
5.6 Switching the laser beams off
▶ Set the selector switch to the OFF position.
▶ The laser beam is switched off and the pendulum is locked.
5.7 Examples of applications
5.7.1 Aligning drywall tracks
5.7.2 Aligning lights 4
5.8 Checking the plumb point
- In a high room (for example in a stairwell with a height of 10 m), make a mark (a cross) on the floor.
- Set the laser on a flat, horizontal surface.
- Switch the laser on and unlock the pendulum.
- Position the laser so that the lower plumb beam coincides with the center of the cross marked on the floor.
- Mark the upper plumb point on the ceiling.
- Turn the laser through 90°.

The lower plumb beam must remain on the center of the cross.
- Mark the upper plumb point on the ceiling.
- Repeat the procedure after pivoting the tool through 180° and 270°.
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Form a circle on the ceiling from the 4 marked points. Measure the diameter of the circle D in millimeters or inches and the room height RH in meters or feet.
-
Calculate the value R.
▶ The value R should be less than 3 mm (1/8).
▶ If the result is out of tolerance, consult Hilti Service.
$$ R = \frac {D [ m m ]}{2} \times \frac {1 0}{R H [ m ]} \tag {1} $$
$$ R = \frac {D [ 1 / 8 \text { in } ]}{2} \times \frac {3 0}{R H [ f t ]} \tag {2} $$
6 Care and maintenance
Care of the product
- Carefully remove stubborn dirt.
- Blow dust off the laser exit window. Do not touch the laser exit window with your fingers.
- Use only a slightly damp cloth to clean the housing. Do not use cleaning agents containing silicone as these can attack the plastic parts.
Maintenance
- Check all visible parts and controls for signs of damage at regular intervals and make sure that they all function correctly.
- Do not use the product if signs of damage are found or if parts malfunction. Immediately have the product repaired by Hilti Service.
- After cleaning and maintenance, install all guards and protective devices and check that they are in full working order.

To help ensure safe and reliable operation, use only genuine Hilti spare parts and consumables. Spare parts, consumables and accessories approved by Hilti for use with your product can be found at your Hilti Store or online at: www.hilti.group
6.1 Hilti Measuring Systems Service
Hilti Measuring Systems Service checks the scanning tool and, if deviations from the specified accuracy are found, recalibrates it and rechecks to ensure conformity with specifications. The service certificate provides written confirmation of conformity with specifications at the time of the test. The following is recommended:
- Choose a test/inspection interval that matches usage of the device.
- Have the product checked by Hilti Measuring Systems Service after exceptionally heavy use or subjection to unusual conditions or stress, before important work or at least once a year.
Testing and inspection by Hilti Measuring Systems Service does not relieve the user of the obligation to check the scanning tool before and during use.
7 Transport and storage
Transport
▶ Prior to each use and before and after prolonged transport, check the product for damage.
Storage
- Store the product and the batteries in a cool and dry place. Comply with the temperature limits stated in the technical data.
▶ Never leave the product or batteries in direct sunlight, on sources of heat, or behind glass. - Store the product and batteries where they cannot be accessed by children or unauthorized persons.
▶ Prior to each use and before and after prolonged storage, check the product for damage.
8 Troubleshooting
If the trouble you are experiencing is not listed in this table or you are unable to rectify the problem by yourself, contact Hilti Service.
| Malfunction Possible cause | Action to be taken | |
| The product cannot be switched on. | Battery is empty ▶ Replace the batteries. | |
| Battery polarity incorrect ▶ Insert | the batteries correctly. | |
| Battery compartment is not closed | ▸ Close the battery compartment | |
| Product or on/off switch is faulty | ▸ Contact Hilti Service. | |
| Individual laser beams don’t function. | Laser source or laser control unit faulty | is Contact Hilti Service. |
| Product can be switched on but no laser beam is visible. | Laser source or laser control unit faulty | is Contact Hilti Service. |
| Temperature is too high or too low | ▸ Allow the product to cool down or warm up. | |
| Automatic leveling doesn’t work. | Product set up on an excessively inclined surface | ▸ Set the product on a flat, horizontal surface. |
| Pendulum is locked | ▸ Release the pendulum. | |
9 Manufacturer's warranty
▶ Please contact your local Hilti representative if you have questions about the warranty conditions.
10 Further information
Accessories, system products and more information about your product can all be found here.
根据 SJ/T 11364-2014 的有害物质材料披露
Hazardous substances material disclosure according to SJ/T 11364-2014
Product type: Laser
Products: PM 2-LG (02) / PM 2-PG (01)
| 零件名称Part name | 有害物质 | |||||
| Hazardous substances | ||||||
| 铅 | 汞 | 镉 | 六价铬 | 多溴联苯 | 多溴 | |
| Lead (Pb) | Mercury (Hg) | Cadmium (Cd) | Hexavalent Chromium (Cr(VI)) | Polybrominated biphenyls (PBB) | Polybrominated biphenyls (PBB) | |
| 电子元件(PCBs)Electronics (PCBs) | o | o | o | o | o | |
| 壳体组件Housing | o | o | o | o | o | |
| 电气联接线Electrical wirings | o | o | o | o | o | |
| 核心部件Core part | x | o | o | o | o | |
以下表格均依据 SJT 11364 通则制定。
o: 表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 标准规定的限量要求以下。
x: 表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 标准规定的限量要求。
(企业可基于其实际情况在包装箱内提供 “X” 标识的详细技术说明。)
The following tables are prepared in accordance with the provision of SJT 11364.
O: Indicates that said hazardous substances contained in all of the homogeneous materials for this part is below limit requirement of GB/T 26572
X: Indicates that said hazardous substances contained in at least one of the homogeneous materials used for this is above the limit requirement of GB/T 26572.
(Enterprises may further provide in this box technical explanation for marking "X" based on their actual circumsta
This table is valid for the China market.
限用物質含有情況標示聲明書
Declaration of the Presence Condition of the Restricted Substances Marking
| 設備名稱: PM 2-LG (02) / PM 2-PG (01), 型號(型式): LaserEquipment name: PM 2-LG (02) / PM 2-PG (01), Type designation: Laser | ||||||
| 單元Unit | 限用物質及其化學符號Restricted substances and its chemical symbols | |||||
| 鉛Lead(Pb) | 汞Mercury(Hg) | 鎘Cadmium (Cd) | 六價鉻HexavalentChromium (Cr(VI)) | 多溴聯苯Polybrominatedbiphenyls(PBB) | 多Pol bip | |
| 电子元件(PCBs)Electronics (PCBs) | 0 | 0 | 0 | 0 | 0 | |
| 壳体组件Housing | 0 | 0 | 0 | 0 | 0 | |
| 电气联接线Electrical wirings | 0 | 0 | 0 | 0 | 0 | |
| 核心部件Core part | - | 0 | 0 | 0 | 0 | |
備考 1. “超出 0.1 wt %” 及 “超出 0.01 wt %” 係指限用物質之百分比含量超出百分比含量基準值。
Note 1: "Exceeding 0.1wt.% and exceeding 0.01wt %" indicate that the percentage contain of the restricted s exceeds the reference percentage value of presence condition.
備考 2. “○”係指該項限用物質之百分比含量未超出百分比含量基準值。
Note 2: "o" – indicates that the percentage contain of the restricted substance does not exceeds the percent reference value of presence.
備考 3. "一" 係指該項限用物質為排除項目。
Note 3: The “-” indicates that the restricted substance corresponds to the exemption.
This table is valid for the Taiwan market.
11 Disposal

Most of the materials from which Hilti tools and appliances are manufactured can be recycled. The terials must be correctly separated before they can be recycled. In many countries, your old tools, chines or appliances can be returned to Hilti for recycling. Ask Hilti Service or your Hilti representative further information.

- Do not dispose of power tools, electronic equipment or batteries as household waste!
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PM 2-PG ① ② ③ ④ ⑤ ⑥ ⑦ ⑧以下表格均依据 SJT 11364 通则制定。
o: 表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 标准规定的限量要求以下。
x:表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 标准规定的限量要求。
(企业可基于其实际情况在包装箱内提供 “X” 标识的详细技术说明。)
The following tables are prepared in accordance with the provision of SJT 11364.
O: Indicates that said hazardous substances contained in all of the homogeneous materials for this part is below limit requirement of GB/T 26572
X: Indicates that said hazardous substances contained in at least one of the homogeneous materials used for this is above the limit requirement of GB/T 26572.
(Enterprises may further provide in this box technical explanation for marking "X" based on their actual circumsta
Declaration of the Presence Condition of the Restricted Substances Marking
| 設備名稱: PM 2-LG (02) / PM 2-PG (01), 型號(型式): Laser Equipment name: PM 2-LG (02) / PM 2-PG (01), Type designation: Laser | ||||||
| 單元Unit | 限用物質及其化學符號Restricted substances and its chemical symbols | |||||
| 鉛Lead(Pb) | 汞Mercury(Hg) | 鎘Cadmium (Cd) | 六價鉻HexavalentChromium (Cr(VI)) | 多溴聯苯Polybrominatedbiphenyls(PBB) | 多Pol bip | |
| 电子元件(PCBs)Electronics (PCBs) | 0 | 0 | 0 | 0 | 0 | |
| 壳体组件Housing | 0 | 0 | 0 | 0 | 0 | |
| 电气联接线Electrical wirings | 0 | 0 | 0 | 0 | 0 | |
| 核心部件Core part | - | 0 | 0 | 0 | 0 | |
備考 1. “超出 0.1 wt %” 及 “超出 0.01 wt %” 係指限用物質之百分比含量超出百分比含量基準值。
Note 1: "Exceeding 0.1wt.% and exceeding 0.01wt %" indicate that the percentage contain of the restricted s exceeds the reference percentage value of presence condition.
備考 2. “○”係指該項限用物質之百分比含量未超出百分比含量基準值。
Note 2: "o" – indicates that the percentage contain of the restricted substance does not exceeds the percent reference value of presence.
備考 3. "一" 係指該項限用物質為排除項目。
Note 3: The “-” indicates that the restricted substance corresponds to the exemption.
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PM 2-PG out out ① ② ③ ④ ⑤ ⑥ ⑦ ⑧以下表格均依据 SJT 11364 通则制定。
o: 表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 标准规定的限量要求以下。
x: 表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 标准规定的限量要求。
(企业可基于其实际情况在包装箱内提供 “X” 标识的详细技术说明。)
The following tables are prepared in accordance with the provision of SJT 11364.
O: Indicates that said hazardous substances contained in all of the homogeneous materials for this part is by limit requirement of GB/T 26572
X: Indicates that said hazardous substances contained in at least one of the homogeneous materials used for is above the limit requirement of GB/T 26572.
(Enterprises may further provide in this box technical explanation for marking "X" based on their actual circuit
Declaration of the Presence Condition of the Restricted Substances Marking
| 設備名稱: PM 2-LG (02) / PM 2-PG (01), 型號(型式): LaserEquipment name: PM 2-LG (02) / PM 2-PG (01), Type designation: Laser | ||||||
| 單元Unit | 限用物質及其化學符號Restricted substances and its chemical symbols | |||||
| 鉛Lead(Pb) | 汞Mercury(Hg) | 鎘Cadmium (Cd) | 六價鉻HexavalentChromium (Cr(VI)) | 多溴聯苯Polybrominatedbiphenyls(PBB) | 多溴Polybrbipher(PB) | |
| 电子元件(PCBs)Electronics (PCBs) | 0 | 0 | 0 | 0 | 0 | |
| 壳体组件Housing | 0 | 0 | 0 | 0 | 0 | |
| 电气联接线Electrical wirings | 0 | 0 | 0 | 0 | 0 | |
| 核心部件Core part | - | 0 | 0 | 0 | 0 | |
| 備考1. “超出0.1 wt %”及“超出0.01 wt %”係指限用物質之百分比含量超出百分比含量基準值。Note 1: “Exceeding 0.1wt.% and exceeding 0.01wt %” indicate that the percentage contain of the restricted subsexceeds the reference percentage value of presence condition.備考2. “o”係指該項限用物質之百分比含量未超出百分比含量基準值。Note 2: “o”-indicates that the percentage contain of the restricted substance does not exceeds the percentagereference value of presence.備考3. “-”係指該項限用物質為排除項目。Note 3: The “-” indicates that the restricted substance corresponds to the exemption. | ||||||
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PM 2-PG ① ② ③ ④ ⑤ ⑥ ⑦ ⑧以下表格均依据 SJT 11364 通则制定。
o: 表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 标准规定的限量要求以下。
x: 表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 标准规定的限量要求。
(企业可基于其实际情况在包装箱内提供 “X” 标识的详细技术说明。)
The following tables are prepared in accordance with the provision of SJT 11364.
O: Indicates that said hazardous substances contained in all of the homogeneous materials for this part is below limit requirement of GB/T 26572
X: Indicates that said hazardous substances contained in at least one of the homogeneous materials used for this is above the limit requirement of GB/T 26572.
(Enterprises may further provide in this box technical explanation for marking "X" based on their actual circumsta
Declaration of the Presence Condition of the Restricted Substances Marking
| 設備名稱: PM 2-LG (02) / PM 2-PG (01), 型號(型式): LaserEquipment name: PM 2-LG (02) / PM 2-PG (01), Type designation: Laser | ||||||
| 單元Unit | 限用物質及其化學符號Restricted substances and its chemical symbols | |||||
| 鉛Lead(Pb) | 汞Mercury(Hg) | 鎘Cadmium (Cd) | 六價鉻HexavalentChromium (Cr(VI)) | 多溴聯苯Polybrominatedbiphenyls(PBB) | 多Pol bip | |
| 电子元件(PCBs)Electronics (PCBs) | 0 | 0 | 0 | 0 | 0 | |
| 壳体组件Housing | 0 | 0 | 0 | 0 | 0 | |
| 电气联接线Electrical wirings | 0 | 0 | 0 | 0 | 0 | |
| 核心部件Core part | - | 0 | 0 | 0 | 0 | |
| 備考1. “超出0.1wt%”及“超出0.01wt%”係指限用物質之百分比含量超出百分比含量基準值。Note 1: “Exceeding 0.1wt.% and exceeding 0.01wt%” indicate that the percentage contain of the restricted s exceeds the reference percentage value of presence condition.備考2. “o”係指該項限用物質之百分比含量未超出百分比含量基準值。Note 2: “o” - indicates that the percentage contain of the restricted substance does not exceeds the percentat reference value of presence.備考3. “-”係指該項限用物質為排除項目。Note 3: The “-” indicates that the restricted substance corresponds to the exemption. | ||||||
text_image
PM 2-PG on: 100%5.1 Colocar / mudar as pilhas 2

The following tables are prepared in accordance with the provision of SJT 11364.
O: Indicates that said hazardous substances contained in all of the homogeneous materials for this part is by limit requirement of GB/T 26572
X: Indicates that said hazardous substances contained in at least one of the homogeneous materials used for is above the limit requirement of GB/T 26572.
(Enterprises may further provide in this box technical explanation for marking "X" based on their actual circuit
Declaration of the Presence Condition of the Restricted Substances Marking
| 設備名稱: PM 2-LG (02) / PM 2-PG (01), 型號(型式): LaserEquipment name: PM 2-LG (02) / PM 2-PG (01), Type designation: Laser | ||||||
| 單元Unit | 限用物質及其化學符號Restricted substances and its chemical symbols | |||||
| 鉛Lead(Pb) | 汞Mercury(Hg) | 鎘Cadmium (Cd) | 六價鉻HexavalentChromium (Cr(VI)) | 多溴聯苯Polybrominatedbiphenyls(PBB) | 多溴Polybrbipher(PB) | |
| 电子元件(PCBs)Electronics (PCBs) | 0 | 0 | 0 | 0 | 0 | |
| 壳体组件Housing | 0 | 0 | 0 | 0 | 0 | |
| 电气联接线Electrical wirings | 0 | 0 | 0 | 0 | 0 | |
| 核心部件Core part | - | 0 | 0 | 0 | 0 | |
| 備考1. “超出0.1 wt %”及“超出0.01 wt %”係指限用物質之百分比含量超出百分比含量基準值。Note 1: “Exceeding 0.1wt.% and exceeding 0.01wt %” indicate that the percentage contain of the restricted subsexceeds the reference percentage value of presence condition.備考2. “o”係指該項限用物質之百分比含量未超出百分比含量基準值。Note 2: “o”-indicates that the percentage contain of the restricted substance does not exceeds the percentagereference value of presence.備考3. “-”係指該項限用物質為排除項目。Note 3: The “-” indicates that the restricted substance corresponds to the exemption. | ||||||
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PM 2-PG ① ② ③ ④ ⑤ ⑥ ⑦ ⑧以下表格均依据 SJT 11364 通则制定。
o: 表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 标准规定的限量要求以下。
x: 表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 标准规定的限量要求。
(企业可基于其实际情况在包装箱内提供 “X” 标识的详细技术说明。)
The following tables are prepared in accordance with the provision of SJT 11364.
O: Indicates that said hazardous substances contained in all of the homogeneous materials for this part is below limit requirement of GB/T 26572
X: Indicates that said hazardous substances contained in at least one of the homogeneous materials used for this is above the limit requirement of GB/T 26572.
(Enterprises may further provide in this box technical explanation for marking "X" based on their actual circumsta
Declaration of the Presence Condition of the Restricted Substances Marking
| 設備名稱: PM 2-LG (02) / PM 2-PG (01), 型號(型式): Laser Equipment name: PM 2-LG (02) / PM 2-PG (01), Type designation: Laser | ||||||
| 單元Unit | 限用物質及其化學符號Restricted substances and its chemical symbols | |||||
| 鉛Lead(Pb) | 汞Mercury(Hg) | 鎘Cadmium (Cd) | 六價鉻HexavalentChromium (Cr(VI)) | 多溴聯苯Polybrominatedbiphenyls(PBB) | 多Pol bip | |
| 电子元件(PCBs)Electronics (PCBs) | 0 | 0 | 0 | 0 | 0 | |
| 壳体组件Housing | 0 | 0 | 0 | 0 | 0 | |
| 电气联接线Electrical wirings | 0 | 0 | 0 | 0 | 0 | |
| 核心部件Core part | - | 0 | 0 | 0 | 0 | |
備考 1. “超出 0.1 wt %” 及 “超出 0.01 wt %” 係指限用物質之百分比含量超出百分比含量基準值。
Note 1: "Exceeding 0.1wt.% and exceeding 0.01wt %" indicate that the percentage contain of the restricted s exceeds the reference percentage value of presence condition.
備考 2. “○”係指該項限用物質之百分比含量未超出百分比含量基準值。
Note 2: "o" – indicates that the percentage contain of the restricted substance does not exceeds the percent reference value of presence.
備考 3. "一" 係指該項限用物質為排除項目。
Note 3: The “-” indicates that the restricted substance corresponds to the exemption.
text_image
PM 2-PG ① ② ③ ④ ⑤ ⑥ ⑦ ⑧以下表格均依据 SJT 11364 通则制定。
o: 表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 标准规定的限量要求以下。
x: 表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 标准规定的限量要求。
(企业可基于其实际情况在包装箱内提供 “X” 标识的详细技术说明。)
The following tables are prepared in accordance with the provision of SJT 11364.
O: Indicates that said hazardous substances contained in all of the homogeneous materials for this part is below limit requirement of GB/T 26572
X: Indicates that said hazardous substances contained in at least one of the homogeneous materials used for this is above the limit requirement of GB/T 26572.
(Enterprises may further provide in this box technical explanation for marking "X" based on their actual circumsta
Declaration of the Presence Condition of the Restricted Substances Marking
| 設備名稱: PM 2-LG (02) / PM 2-PG (01), 型號(型式): LaserEquipment name: PM 2-LG (02) / PM 2-PG (01), Type designation: Laser | ||||||
| 單元Unit | 限用物質及其化學符號Restricted substances and its chemical symbols | |||||
| 鉛Lead(Pb) | 汞Mercury(Hg) | 鎘Cadmium (Cd) | 六價鉻HexavalentChromium (Cr(VI)) | 多溴聯苯Polybrominatedbiphenyls(PBB) | 多Pol bip | |
| 电子元件(PCBs)Electronics (PCBs) | 0 | 0 | 0 | 0 | 0 | |
| 壳体组件Housing | 0 | 0 | 0 | 0 | 0 | |
| 电气联接线Electrical wirings | 0 | 0 | 0 | 0 | 0 | |
| 核心部件Core part | - | 0 | 0 | 0 | 0 | |
| 備考1. “超出0.1wt%”及“超出0.01wt%”係指限用物質之百分比含量超出百分比含量基準值。Note 1: “Exceeding 0.1wt.% and exceeding 0.01wt%” indicate that the percentage contain of the restricted s exceeds the reference percentage value of presence condition.備考2. “o”係指該項限用物質之百分比含量未超出百分比含量基準值。Note 2: “o” - indicates that the percentage contain of the restricted substance does not exceeds the percentat reference value of presence.備考3. “-”係指該項限用物質為排除項目。Note 3: The “-” indicates that the restricted substance corresponds to the exemption. | ||||||
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PM 2-PG 1 2 3 4 5 6 7 8Declaration of the Presence Condition of the Restricted Substances Marking
| 設備名稱: PM 2-LG (02) / PM 2-PG (01), 型號(型式): Laser Equipment name: PM 2-LG (02) / PM 2-PG (01), Type designation: Laser | ||||||
| 單元Unit | 限用物質及其化學符號Restricted substances and its chemical symbols | |||||
| 鉛Lead(Pb) | 汞Mercury(Hg) | 鎘Cadmium (Cd) | 六價鉻HexavalentChromium (Cr(VI)) | 多溴聯苯Polybrominatedbiphenyls(PBB) | 多Pol bip | |
| 电子元件(PCBs)Electronics (PCBs) | 0 | 0 | 0 | 0 | 0 | |
| 壳体组件Housing | 0 | 0 | 0 | 0 | 0 | |
| 电气联接线Electrical wirings | 0 | 0 | 0 | 0 | 0 | |
| 核心部件Core part | - | 0 | 0 | 0 | 0 | |
備考 1. “超出 0.1 wt %” 及 “超出 0.01 wt %” 係指限用物質之百分比含量超出百分比含量基準值。
Note 1: "Exceeding 0.1wt.% and exceeding 0.01wt %" indicate that the percentage contain of the restricted s exceeds the reference percentage value of presence condition.
備考 2. “○”係指該項限用物質之百分比含量未超出百分比含量基準值。
Note 2: "o" – indicates that the percentage contain of the restricted substance does not exceeds the percent reference value of presence.
備考 3. "一" 係指該項限用物質為排除項目。
Note 3: The “-” indicates that the restricted substance corresponds to the exemption.
以下表格均依据 SJT 11364 通则制定。
o: 表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 标准规定的限量要求以下。
x: 表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 标准规定的限量要求。
(企业可基于其实际情况在包装箱内提供 “X” 标识的详细技术说明。)
The following tables are prepared in accordance with the provision of SJT 11364.
O: Indicates that said hazardous substances contained in all of the homogeneous materials for this part is below limit requirement of GB/T 26572
X: Indicates that said hazardous substances contained in at least one of the homogeneous materials used for this is above the limit requirement of GB/T 26572.
(Enterprises may further provide in this box technical explanation for marking "X" based on their actual circumsta
Denne tabellen gjelder for markedet Kina.
限用物質含有情況標示聲明書
Declaration of the Presence Condition of the Restricted Substances Marking
| 設備名稱: PM 2-LG (02) / PM 2-PG (01), 型號(型式): Laser Equipment name: PM 2-LG (02) / PM 2-PG (01), Type designation: Laser | ||||||
| 單元Unit | 限用物質及其化學符號Restricted substances and its chemical symbols | |||||
| 鉛Lead(Pb) | 汞Mercury(Hg) | 鎘Cadmium (Cd) | 六價鉻HexavalentChromium (Cr(VI)) | 多溴聯苯Polybrominatedbiphenyls(PBB) | 多Pol bip | |
| 电子元件(PCBs)Electronics (PCBs) | 0 | 0 | 0 | 0 | 0 | |
| 壳体组件Housing | 0 | 0 | 0 | 0 | 0 | |
| 电气联接线Electrical wirings | 0 | 0 | 0 | 0 | 0 | |
| 核心部件Core part | - | 0 | 0 | 0 | 0 | |
備考 1. “超出 0.1 wt %” 及 “超出 0.01 wt %” 係指限用物質之百分比含量超出百分比含量基準值。
Note 1: "Exceeding 0.1wt.% and exceeding 0.01wt %" indicate that the percentage contain of the restricted s exceeds the reference percentage value of presence condition.
備考 2. “○”係指該項限用物質之百分比含量未超出百分比含量基準值。
Note 2: "o" – indicates that the percentage contain of the restricted substance does not exceeds the percent reference value of presence.
備考 3. "一" 係指該項限用物質為排除項目。
Note 3: The “-” indicates that the restricted substance corresponds to the exemption.
Denne tabellen gjelder for markedet Taiwan.
11 Avhending
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PM 2-PG ###-01-02以下表格均依据 SJT 11364 通则制定。
o: 表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 标准规定的限量要求以下。
x: 表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 标准规定的限量要求。
(企业可基于其实际情况在包装箱内提供 “X” 标识的详细技术说明。)
The following tables are prepared in accordance with the provision of SJT 11364.
O: Indicates that said hazardous substances contained in all of the homogeneous materials for this part is below limit requirement of GB/T 26572
X: Indicates that said hazardous substances contained in at least one of the homogeneous materials used for this is above the limit requirement of GB/T 26572.
(Enterprises may further provide in this box technical explanation for marking "X" based on their actual circumsta
Declaration of the Presence Condition of the Restricted Substances Marking
| 設備名稱: PM 2-LG (02) / PM 2-PG (01), 型號(型式): LaserEquipment name: PM 2-LG (02) / PM 2-PG (01), Type designation: Laser | ||||||
| 單元Unit | 限用物質及其化學符號Restricted substances and its chemical symbols | |||||
| 鉛Lead(Pb) | 汞Mercury(Hg) | 鎘Cadmium (Cd) | 六價鉻HexavalentChromium (Cr(VI)) | 多溴聯苯Polybrominatedbiphenyls(PBB) | 多Pol bip | |
| 电子元件(PCBs)Electronics (PCBs) | 0 | 0 | 0 | 0 | 0 | |
| 壳体组件Housing | 0 | 0 | 0 | 0 | 0 | |
| 电气联接线Electrical wirings | 0 | 0 | 0 | 0 | 0 | |
| 核心部件Core part | - | 0 | 0 | 0 | 0 | |
備考 1. “超出 0.1 wt %” 及 “超出 0.01 wt %” 係指限用物質之百分比含量超出百分比含量基準值。
Note 1: "Exceeding 0.1wt.% and exceeding 0.01wt %" indicate that the percentage contain of the restricted s exceeds the reference percentage value of presence condition.
備考 2. “○”係指該項限用物質之百分比含量未超出百分比含量基準值。
Note 2: "o" – indicates that the percentage contain of the restricted substance does not exceeds the percent reference value of presence.
備考 3. "一" 係指該項限用物質為排除項目。
Note 3: The “-” indicates that the restricted substance corresponds to the exemption.
以下表格均依据 SJT 11364 通则制定。
o: 表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 标准规定的限量要求以下。
x: 表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 标准规定的限量要求。
(企业可基于其实际情况在包装箱内提供 “X” 标识的详细技术说明。)
The following tables are prepared in accordance with the provision of SJT 11364.
O: Indicates that said hazardous substances contained in all of the homogeneous materials for this part is below limit requirement of GB/T 26572
X: Indicates that said hazardous substances contained in at least one of the homogeneous materials used for this is above the limit requirement of GB/T 26572.
(Enterprises may further provide in this box technical explanation for marking "X" based on their actual circumsta
Declaration of the Presence Condition of the Restricted Substances Marking
| 設備名稱: PM 2-LG (02) / PM 2-PG (01), 型號(型式): Laser Equipment name: PM 2-LG (02) / PM 2-PG (01), Type designation: Laser | ||||||
| 單元Unit | 限用物質及其化學符號Restricted substances and its chemical symbols | |||||
| 鉛Lead(Pb) | 汞Mercury(Hg) | 鎘Cadmium (Cd) | 六價鉻HexavalentChromium (Cr(VI)) | 多溴聯苯Polybrominatedbiphenyls(PBB) | 多Pol bip | |
| 电子元件(PCBs)Electronics (PCBs) | 0 | 0 | 0 | 0 | 0 | |
| 壳体组件Housing | 0 | 0 | 0 | 0 | 0 | |
| 电气联接线Electrical wirings | 0 | 0 | 0 | 0 | 0 | |
| 核心部件Core part | - | 0 | 0 | 0 | 0 | |
備考 1. “超出 0.1 wt %” 及 “超出 0.01 wt %” 係指限用物質之百分比含量超出百分比含量基準值。
Note 1: "Exceeding 0.1wt.% and exceeding 0.01wt %" indicate that the percentage contain of the restricted s exceeds the reference percentage value of presence condition.
備考 2. “○”係指該項限用物質之百分比含量未超出百分比含量基準值。
Note 2: "o" – indicates that the percentage contain of the restricted substance does not exceeds the percent reference value of presence.
備考 3. "一" 係指該項限用物質為排除項目。
Note 3: The “-” indicates that the restricted substance corresponds to the exemption.
text_image
PMS-2-PG ① ② ③ ④ ⑤ ⑥ ⑦ ⑧以下表格均依据 SJT 11364 通则制定。
o: 表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 标准规定的限量要求以下。
x: 表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 标准规定的限量要求。
(企业可基于其实际情况在包装箱内提供 “X” 标识的详细技术说明。)
The following tables are prepared in accordance with the provision of SJT 11364.
O: Indicates that said hazardous substances contained in all of the homogeneous materials for this part is below limit requirement of GB/T 26572
X: Indicates that said hazardous substances contained in at least one of the homogeneous materials used for this is above the limit requirement of GB/T 26572.
(Enterprises may further provide in this box technical explanation for marking "X" based on their actual circumsta
Šī tabula attiecas uz Kīnas tirgu.
限用物質含有情況標示聲明書
Declaration of the Presence Condition of the Restricted Substances Marking
| 設備名稱: PM 2-LG (02) / PM 2-PG (01), 型號(型式): LaserEquipment name: PM 2-LG (02) / PM 2-PG (01), Type designation: Laser | ||||||
| 單元Unit | 限用物質及其化學符號Restricted substances and its chemical symbols | |||||
| 鉛Lead(Pb) | 汞Mercury(Hg) | 鎘Cadmium (Cd) | 六價鉻HexavalentChromium (Cr(VI)) | 多溴聯苯Polybrominatedbiphenyls(PBB) | 多Pol bip | |
| 电子元件(PCBs)Electronics (PCBs) | 0 | 0 | 0 | 0 | 0 | |
| 壳体组件Housing | 0 | 0 | 0 | 0 | 0 | |
| 电气联接线Electrical wirings | 0 | 0 | 0 | 0 | 0 | |
| 核心部件Core part | - | 0 | 0 | 0 | 0 | |
備考 1. “超出 0.1 wt %” 及 “超出 0.01 wt %” 係指限用物質之百分比含量超出百分比含量基準值。
Note 1: "Exceeding 0.1wt.% and exceeding 0.01wt %" indicate that the percentage contain of the restricted s exceeds the reference percentage value of presence condition.
備考 2. “○”係指該項限用物質之百分比含量未超出百分比含量基準值。
Note 2: "o" – indicates that the percentage contain of the restricted substance does not exceeds the percent reference value of presence.
備考 3. "一" 係指該項限用物質為排除項目。
Note 3: The “-” indicates that the restricted substance corresponds to the exemption.
Šī tabula attiecas uz Taivānas tirgu.
The following tables are prepared in accordance with the provision of SJT 11364.
O: Indicates that said hazardous substances contained in all of the homogeneous materials for this part is by limit requirement of GB/T 26572
X: Indicates that said hazardous substances contained in at least one of the homogeneous materials used for is above the limit requirement of GB/T 26572.
(Enterprises may further provide in this box technical explanation for marking "X" based on their actual circuit
Declaration of the Presence Condition of the Restricted Substances Marking
| 設備名稱: PM 2-LG (02) / PM 2-PG (01), 型號(型式): LaserEquipment name: PM 2-LG (02) / PM 2-PG (01), Type designation: Laser | ||||||
| 單元Unit | 限用物質及其化學符號Restricted substances and its chemical symbols | |||||
| 鉛Lead(Pb) | 汞Mercury(Hg) | 鎘Cadmium (Cd) | 六價鉻HexavalentChromium (Cr(VI)) | 多溴聯苯Polybrominatedbiphenyls(PBB) | 多溴Polybrbipher(PB) | |
| 电子元件(PCBs)Electronics (PCBs) | 0 | 0 | 0 | 0 | 0 | |
| 壳体组件Housing | 0 | 0 | 0 | 0 | 0 | |
| 电气联接线Electrical wirings | 0 | 0 | 0 | 0 | 0 | |
| 核心部件Core part | - | 0 | 0 | 0 | 0 | |
| 備考1. “超出0.1 wt %”及“超出0.01 wt %”係指限用物質之百分比含量超出百分比含量基準值。Note 1: “Exceeding 0.1wt.% and exceeding 0.01wt %” indicate that the percentage contain of the restricted subsexceeds the reference percentage value of presence condition.備考2. “o”係指該項限用物質之百分比含量未超出百分比含量基準值。Note 2: “o”-indicates that the percentage contain of the restricted substance does not exceeds the percentagereference value of presence.備考3. “-”係指該項限用物質為排除項目。Note 3: The “-” indicates that the restricted substance corresponds to the exemption. | ||||||
text_image
PM 2-PG on Bokul ① ② ③ ④ ⑤ ⑥ ⑦ ⑧以下表格均依据 SJT 11364 通则制定。
o: 表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 标准规定的限量要求以下。
x: 表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 标准规定的限量要求。
(企业可基于其实际情况在包装箱内提供 “X” 标识的详细技术说明。)
The following tables are prepared in accordance with the provision of SJT 11364.
O: Indicates that said hazardous substances contained in all of the homogeneous materials for this part is below limit requirement of GB/T 26572
X: Indicates that said hazardous substances contained in at least one of the homogeneous materials used for this is above the limit requirement of GB/T 26572.
(Enterprises may further provide in this box technical explanation for marking "X" based on their actual circumsta
Declaration of the Presence Condition of the Restricted Substances Marking
| 設備名稱: PM 2-LG (02) / PM 2-PG (01), 型號(型式): LaserEquipment name: PM 2-LG (02) / PM 2-PG (01), Type designation: Laser | ||||||
| 單元Unit | 限用物質及其化學符號Restricted substances and its chemical symbols | |||||
| 鉛Lead(Pb) | 汞Mercury(Hg) | 鎘Cadmium (Cd) | 六價鉻HexavalentChromium (Cr(VI)) | 多溴聯苯Polybrominatedbiphenyls(PBB) | 多Pol bip | |
| 电子元件(PCBs)Electronics (PCBs) | 0 | 0 | 0 | 0 | 0 | |
| 壳体组件Housing | 0 | 0 | 0 | 0 | 0 | |
| 电气联接线Electrical wirings | 0 | 0 | 0 | 0 | 0 | |
| 核心部件Core part | - | 0 | 0 | 0 | 0 | |
| 備考1. “超出0.1wt%”及“超出0.01wt%”係指限用物質之百分比含量超出百分比含量基準值。Note 1: “Exceeding 0.1wt.% and exceeding 0.01wt%” indicate that the percentage contain of the restricted s exceeds the reference percentage value of presence condition.備考2. “o”係指該項限用物質之百分比含量未超出百分比含量基準值。Note 2: “o” - indicates that the percentage contain of the restricted substance does not exceeds the percentat reference value of presence.備考3. “-”係指該項限用物質為排除項目。Note 3: The “-” indicates that the restricted substance corresponds to the exemption. | ||||||
text_image
PM 2-PG ① ② ③ ④ ⑤ ⑥ ⑦ ⑧以下表格均依据 SJT 11364 通则制定。
o: 表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 标准规定的限量要求以下。
x: 表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 标准规定的限量要求。
(企业可基于其实际情况在包装箱内提供 “X” 标识的详细技术说明。)
The following tables are prepared in accordance with the provision of SJT 11364.
O: Indicates that said hazardous substances contained in all of the homogeneous materials for this part is below limit requirement of GB/T 26572
X: Indicates that said hazardous substances contained in at least one of the homogeneous materials used for this is above the limit requirement of GB/T 26572.
(Enterprises may further provide in this box technical explanation for marking "X" based on their actual circumsta
Declaration of the Presence Condition of the Restricted Substances Marking
| 設備名稱: PM 2-LG (02) / PM 2-PG (01), 型號(型式): LaserEquipment name: PM 2-LG (02) / PM 2-PG (01), Type designation: Laser | ||||||
| 單元Unit | 限用物質及其化學符號Restricted substances and its chemical symbols | |||||
| 鉛Lead(Pb) | 汞Mercury(Hg) | 鎘Cadmium (Cd) | 六價鉻HexavalentChromium (Cr(VI)) | 多溴聯苯Polybrominatedbiphenyls(PBB) | 多Pol bip | |
| 电子元件(PCBs)Electronics (PCBs) | 0 | 0 | 0 | 0 | 0 | |
| 壳体组件Housing | 0 | 0 | 0 | 0 | 0 | |
| 电气联接线Electrical wirings | 0 | 0 | 0 | 0 | 0 | |
| 核心部件Core part | - | 0 | 0 | 0 | 0 | |
備考 1. “超出 0.1 wt %” 及 “超出 0.01 wt %” 係指限用物質之百分比含量超出百分比含量基準值。
Note 1: "Exceeding 0.1wt.% and exceeding 0.01wt %" indicate that the percentage contain of the restricted s exceeds the reference percentage value of presence condition.
備考 2. “○”係指該項限用物質之百分比含量未超出百分比含量基準值。
Note 2: "o" – indicates that the percentage contain of the restricted substance does not exceeds the percent reference value of presence.
備考 3. "一" 係指該項限用物質為排除項目。
Note 3: The “-” indicates that the restricted substance corresponds to the exemption.
以下表格均依据 SJT 11364 通则制定。
o: 表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 标准规定的限量要求以下。
x: 表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 标准规定的限量要求。
(企业可基于其实际情况在包装箱内提供 “X” 标识的详细技术说明。)
The following tables are prepared in accordance with the provision of SJT 11364.
O: Indicates that said hazardous substances contained in all of the homogeneous materials for this part is below limit requirement of GB/T 26572
X: Indicates that said hazardous substances contained in at least one of the homogeneous materials used for this is above the limit requirement of GB/T 26572.
(Enterprises may further provide in this box technical explanation for marking "X" based on their actual circumsta
Declaration of the Presence Condition of the Restricted Substances Marking
| 設備名稱: PM 2-LG (02) / PM 2-PG (01), 型號(型式): LaserEquipment name: PM 2-LG (02) / PM 2-PG (01), Type designation: Laser | ||||||
| 單元Unit | 限用物質及其化學符號Restricted substances and its chemical symbols | |||||
| 鉛Lead(Pb) | 汞Mercury(Hg) | 鎘Cadmium (Cd) | 六價鉻HexavalentChromium (Cr(VI)) | 多溴聯苯Polybrominatedbiphenyls(PBB) | 多Pol bip | |
| 电子元件(PCBs)Electronics (PCBs) | 0 | 0 | 0 | 0 | 0 | |
| 壳体组件Housing | 0 | 0 | 0 | 0 | 0 | |
| 电气联接线Electrical wirings | 0 | 0 | 0 | 0 | 0 | |
| 核心部件Core part | - | 0 | 0 | 0 | 0 | |
備考 1. “超出 0.1 wt %” 及 “超出 0.01 wt %” 係指限用物質之百分比含量超出百分比含量基準值。
Note 1: "Exceeding 0.1wt.% and exceeding 0.01wt %" indicate that the percentage contain of the restricted s exceeds the reference percentage value of presence condition.
備考 2. “○”係指該項限用物質之百分比含量未超出百分比含量基準值。
Note 2: "o" – indicates that the percentage contain of the restricted substance does not exceeds the percent reference value of presence.
備考 3. "一" 係指該項限用物質為排除項目。
Note 3: The “-” indicates that the restricted substance corresponds to the exemption.
Táto tabul'ka platí pre trh Taiwanu.
11 Likvidácia
text_image
① ② ③ ④ ⑤ ⑥ ⑦ ⑧ PMS-2-PG PMT-6 on PCThe following tables are prepared in accordance with the provision of SJT 11364.
O: Indicates that said hazardous substances contained in all of the homogeneous materials for this part is below limit requirement of GB/T 26572
X: Indicates that said hazardous substances contained in at least one of the homogeneous materials used for this is above the limit requirement of GB/T 26572.
(Enterprises may further provide in this box technical explanation for marking "X" based on their actual circumsta
Declaration of the Presence Condition of the Restricted Substances Marking
| 設備名稱: PM 2-LG (02) / PM 2-PG (01), 型號(型式): LaserEquipment name: PM 2-LG (02) / PM 2-PG (01), Type designation: Laser | ||||||
| 單元Unit | 限用物質及其化學符號Restricted substances and its chemical symbols | |||||
| 鉛Lead(Pb) | 汞Mercury(Hg) | 鎘Cadmium (Cd) | 六價鉻HexavalentChromium (Cr(VI)) | 多溴聯苯Polybrominatedbiphenyls(PBB) | 多Pol bip | |
| 电子元件(PCBs)Electronics (PCBs) | 0 | 0 | 0 | 0 | 0 | |
| 壳体组件Housing | 0 | 0 | 0 | 0 | 0 | |
| 电气联接线Electrical wirings | 0 | 0 | 0 | 0 | 0 | |
| 核心部件Core part | - | 0 | 0 | 0 | 0 | |
備考 1. “超出 0.1 wt %” 及 “超出 0.01 wt %” 係指限用物質之百分比含量超出百分比含量基準值。
Note 1: "Exceeding 0.1wt.% and exceeding 0.01wt %" indicate that the percentage contain of the restricted s exceeds the reference percentage value of presence condition.
備考 2. “○”係指該項限用物質之百分比含量未超出百分比含量基準值。
Note 2: "o" – indicates that the percentage contain of the restricted substance does not exceeds the percent reference value of presence.
備考 3. "一" 係指該項限用物質為排除項目。
Note 3: The “-” indicates that the restricted substance corresponds to the exemption.
以下表格均依据 SJT 11364 通则制定。
o: 表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 标准规定的限量要求以下。
x: 表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 标准规定的限量要求。
(企业可基于其实际情况在包装箱内提供 “X” 标识的详细技术说明。)
The following tables are prepared in accordance with the provision of SJT 11364.
O: Indicates that said hazardous substances contained in all of the homogeneous materials for this part is below limit requirement of GB/T 26572
X: Indicates that said hazardous substances contained in at least one of the homogeneous materials used for this is above the limit requirement of GB/T 26572.
(Enterprises may further provide in this box technical explanation for marking "X" based on their actual circumsta
Declaration of the Presence Condition of the Restricted Substances Marking
| 設備名稱: PM 2-LG (02) / PM 2-PG (01), 型號(型式): Laser Equipment name: PM 2-LG (02) / PM 2-PG (01), Type designation: Laser | ||||||
| 單元Unit | 限用物質及其化學符號Restricted substances and its chemical symbols | |||||
| 鉛Lead(Pb) | 汞Mercury(Hg) | 鎘Cadmium (Cd) | 六價鉻HexavalentChromium (Cr(VI)) | 多溴聯苯Polybrominatedbiphenyls(PBB) | 多Pol bip | |
| 电子元件(PCBs)Electronics (PCBs) | 0 | 0 | 0 | 0 | 0 | |
| 壳体组件Housing | 0 | 0 | 0 | 0 | 0 | |
| 电气联接线Electrical wirings | 0 | 0 | 0 | 0 | 0 | |
| 核心部件Core part | - | 0 | 0 | 0 | 0 | |
備考 1. “超出 0.1 wt %” 及 “超出 0.01 wt %” 係指限用物質之百分比含量超出百分比含量基準值。
Note 1: "Exceeding 0.1wt.% and exceeding 0.01wt %" indicate that the percentage contain of the restricted s exceeds the reference percentage value of presence condition.
備考 2. “○”係指該項限用物質之百分比含量未超出百分比含量基準值。
Note 2: "o" – indicates that the percentage contain of the restricted substance does not exceeds the percent reference value of presence.
備考 3. "一" 係指該項限用物質為排除項目。
Note 3: The “-” indicates that the restricted substance corresponds to the exemption.
以下表格均依据 SJT 11364 通则制定。
o: 表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 标准规定的限量要求以下。
x: 表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 标准规定的限量要求。
(企业可基于其实际情况在包装箱内提供 “X” 标识的详细技术说明。)
The following tables are prepared in accordance with the provision of SJT 11364.
O: Indicates that said hazardous substances contained in all of the homogeneous materials for this part is below limit requirement of GB/T 26572
X: Indicates that said hazardous substances contained in at least one of the homogeneous materials used for this is above the limit requirement of GB/T 26572.
(Enterprises may further provide in this box technical explanation for marking "X" based on their actual circumsta
Ova tablica vrijedi samo za kinesko tržište.
限用物質含有情況標示聲明書
Declaration of the Presence Condition of the Restricted Substances Marking
| 設備名稱: PM 2-LG (02) / PM 2-PG (01), 型號(型式): LaserEquipment name: PM 2-LG (02) / PM 2-PG (01), Type designation: Laser | ||||||
| 單元Unit | 限用物質及其化學符號Restricted substances and its chemical symbols | |||||
| 鉛Lead(Pb) | 汞Mercury(Hg) | 鎘Cadmium (Cd) | 六價鉻HexavalentChromium (Cr(VI)) | 多溴聯苯Polybrominatedbiphenyls(PBB) | 多Pol bip | |
| 电子元件(PCBs)Electronics (PCBs) | 0 | 0 | 0 | 0 | 0 | |
| 壳体组件Housing | 0 | 0 | 0 | 0 | 0 | |
| 电气联接线Electrical wirings | 0 | 0 | 0 | 0 | 0 | |
| 核心部件Core part | - | 0 | 0 | 0 | 0 | |
備考 1. “超出 0.1 wt %” 及 “超出 0.01 wt %” 係指限用物質之百分比含量超出百分比含量基準值。
Note 1: "Exceeding 0.1wt.% and exceeding 0.01wt %" indicate that the percentage contain of the restricted s exceeds the reference percentage value of presence condition.
備考 2. “○”係指該項限用物質之百分比含量未超出百分比含量基準值。
Note 2: "o" – indicates that the percentage contain of the restricted substance does not exceeds the percent reference value of presence.
備考 3. "一" 係指該項限用物質為排除項目。
Note 3: The “-” indicates that the restricted substance corresponds to the exemption.
text_image
PM 2-PG ① ② ③ ④ ⑤ ⑥ ⑦ ⑧① Položaj pločice sa performansama
② Odeljak za bateriju
③ Prikaz režima rada i prikaz statusa napunjenosti akumulatora
④ Izlazni prozor laserskog snopa
⑤ Magnetna stopa
⑥ Pričvrsni navoj
⑦ Izborni prekidač Uklj/lsklj i Blokiranje/Deblokiranje klatna
⑧ Ušica za pričvršćivanje zaštite od pada PMA 92
3.2 Upotreba u skladu sa odredbama
Opisani proizvod je samonivelirajući linijski tačkasti laser kojim jedna osoba brzo i precizno može da vrši lemljenje. Proizvod ima dva laserska zraka koji se preklapaju (zraci sa istom polaznom tačkom). Svi zraci imaju isti domet od 30 m (domet zavisi od osvetljenosti u okruženju). Proizvod je namenjen za obeležavanje vertikalnih tačaka u unutrašnjim prostorima.
以下表格均依据 SJT 11364 通则制定。
o: 表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 标准规定的限量要求以下。
x: 表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 标准规定的限量要求。
(企业可基于其实际情况在包装箱内提供 “X” 标识的详细技术说明。)
The following tables are prepared in accordance with the provision of SJT 11364.
O: Indicates that said hazardous substances contained in all of the homogeneous materials for this part is below limit requirement of GB/T 26572
X: Indicates that said hazardous substances contained in at least one of the homogeneous materials used for this is above the limit requirement of GB/T 26572.
(Enterprises may further provide in this box technical explanation for marking "X" based on their actual circumsta
Ova tabelu važi za tržište Kine.
限用物質含有情況標示聲明書
Declaration of the Presence Condition of the Restricted Substances Marking
| 設備名稱: PM 2-LG (02) / PM 2-PG (01), 型號(型式): LaserEquipment name: PM 2-LG (02) / PM 2-PG (01), Type designation: Laser | ||||||
| 單元Unit | 限用物質及其化學符號Restricted substances and its chemical symbols | |||||
| 鉛Lead(Pb) | 汞Mercury(Hg) | 鎘Cadmium (Cd) | 六價鉻HexavalentChromium (Cr(VI)) | 多溴聯苯Polybrominatedbiphenyls(PBB) | 多Pol bip | |
| 电子元件(PCBs)Electronics (PCBs) | 0 | 0 | 0 | 0 | 0 | |
| 壳体组件Housing | 0 | 0 | 0 | 0 | 0 | |
| 电气联接线Electrical wirings | 0 | 0 | 0 | 0 | 0 | |
| 核心部件Core part | - | 0 | 0 | 0 | 0 | |
| 備考1. “超出0.1wt%”及“超出0.01wt%”係指限用物質之百分比含量超出百分比含量基準值。Note 1: “Exceeding 0.1wt.% and exceeding 0.01wt%” indicate that the percentage contain of the restricted s exceeds the reference percentage value of presence condition.備考2. “o”係指該項限用物質之百分比含量未超出百分比含量基準值。Note 2: “o” - indicates that the percentage contain of the restricted substance does not exceeds the percentat reference value of presence.備考3. “-”係指該項限用物質為排除項目。Note 3: The “-” indicates that the restricted substance corresponds to the exemption. | ||||||
Ova tabela važi za tržište u Tajvanu.
11 Zbrinjavanje otpada
Hilti uređaji su sa velikim udelom proizvedeni od reciklažnih materijala. Preduslov za ponovnu upotrebu je stručna podela materijala. U mnogim zemljama Hilti predaje Vaš stari uređaj na reciklažu. Pitajte Hilti servis za klijente ili Vašeg konsultanta za prodaju.

Električne alate, elektronske uređaje i akumulatorske baterije ne odlazite u kućne otpatke!
text_image
1 2 3 4 5 6 7 8 PM 2-PG以下表格均依据 SJT 11364 通则制定。
o: 表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 标准规定的限量要求以下。
x: 表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 标准规定的限量要求。
(企业可基于其实际情况在包装箱内提供 “X” 标识的详细技术说明。)
The following tables are prepared in accordance with the provision of SJT 11364.
O: Indicates that said hazardous substances contained in all of the homogeneous materials for this part is below limit requirement of GB/T 26572
X: Indicates that said hazardous substances contained in at least one of the homogeneous materials used for this is above the limit requirement of GB/T 26572.
(Enterprises may further provide in this box technical explanation for marking "X" based on their actual circumsta
Declaration of the Presence Condition of the Restricted Substances Marking
| 設備名稱: PM 2-LG (02) / PM 2-PG (01), 型號(型式): LaserEquipment name: PM 2-LG (02) / PM 2-PG (01), Type designation: Laser | ||||||
| 單元Unit | 限用物質及其化學符號Restricted substances and its chemical symbols | |||||
| 鉛Lead(Pb) | 汞Mercury(Hg) | 鎘Cadmium (Cd) | 六價鉻HexavalentChromium (Cr(VI)) | 多溴聯苯Polybrominatedbiphenyls(PBB) | 多Pol bip | |
| 电子元件(PCBs)Electronics (PCBs) | 0 | 0 | 0 | 0 | 0 | |
| 壳体组件Housing | 0 | 0 | 0 | 0 | 0 | |
| 电气联接线Electrical wirings | 0 | 0 | 0 | 0 | 0 | |
| 核心部件Core part | - | 0 | 0 | 0 | 0 | |
| 備考1. “超出0.1wt%”及“超出0.01wt%”係指限用物質之百分比含量超出百分比含量基準值。Note 1: “Exceeding 0.1wt.% and exceeding 0.01wt%” indicate that the percentage contain of the restricted s exceeds the reference percentage value of presence condition.備考2. “o”係指該項限用物質之百分比含量未超出百分比含量基準值。Note 2: “o” - indicates that the percentage contain of the restricted substance does not exceeds the percentat reference value of presence.備考3. “-”係指該項限用物質為排除項目。Note 3: The “-” indicates that the restricted substance corresponds to the exemption. | ||||||
以下表格均依据 SJT 11364 通则制定。
o: 表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 标准规定的限量要求以下。
x: 表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 标准规定的限量要求。
(企业可基于其实际情况在包装箱内提供 “X” 标识的详细技术说明。)
The following tables are prepared in accordance with the provision of SJT 11364.
O: Indicates that said hazardous substances contained in all of the homogeneous materials for this part is b limit requirement of GB/T 26572
X: Indicates that said hazardous substances contained in at least one of the homogeneous materials used for is above the limit requirement of GB/T 26572.
(Enterprises may further provide in this box technical explanation for marking "X" based on their actual circuit
Declaration of the Presence Condition of the Restricted Substances Marking
| 設備名稱: PM 2-LG (02) / PM 2-PG (01), 型號(型式): LaserEquipment name: PM 2-LG (02) / PM 2-PG (01), Type designation: Laser | ||||||
| 單元Unit | 限用物質及其化學符號Restricted substances and its chemical symbols | |||||
| 鉛Lead(Pb) | 汞Mercury(Hg) | 鎘Cadmium (Cd) | 六價鉻HexavalentChromium (Cr(VI)) | 多溴聯苯Polybrominatedbiphenyls(PBB) | 多溴Polybrbipher(PB) | |
| 电子元件(PCBs)Electronics (PCBs) | 0 | 0 | 0 | 0 | 0 | |
| 壳体组件Housing | 0 | 0 | 0 | 0 | 0 | |
| 电气联接线Electrical wirings | 0 | 0 | 0 | 0 | 0 | |
| 核心部件Core part | - | 0 | 0 | 0 | 0 | |
| 備考1. “超出0.1 wt %”及“超出0.01 wt %”係指限用物質之百分比含量超出百分比含量基準值。Note 1: “Exceeding 0.1wt.% and exceeding 0.01wt %” indicate that the percentage contain of the restricted subsexceeds the reference percentage value of presence condition.備考2. “o”係指該項限用物質之百分比含量未超出百分比含量基準值。Note 2: “o”-indicates that the percentage contain of the restricted substance does not exceeds the percentagereference value of presence.備考3. “-”係指該項限用物質為排除項目。Note 3: The “-” indicates that the restricted substance corresponds to the exemption. | ||||||
text_image
PM 2-PG SOX 8.013 ① ② ③ ④ ⑤ ⑥ ⑦ ⑧以下表格均依据 SJT 11364 通则制定。
o: 表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 标准规定的限量要求以下。
x:表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 标准规定的限量要求。
(企业可基于其实际情况在包装箱内提供 “X” 标识的详细技术说明。)
The following tables are prepared in accordance with the provision of SJT 11364.
O: Indicates that said hazardous substances contained in all of the homogeneous materials for this part is below limit requirement of GB/T 26572
X: Indicates that said hazardous substances contained in at least one of the homogeneous materials used for this is above the limit requirement of GB/T 26572.
(Enterprises may further provide in this box technical explanation for marking "X" based on their actual circumsta
Declaration of the Presence Condition of the Restricted Substances Marking
| 設備名稱: PM 2-LG (02) / PM 2-PG (01), 型號(型式): LaserEquipment name: PM 2-LG (02) / PM 2-PG (01), Type designation: Laser | ||||||
| 單元Unit | 限用物質及其化學符號Restricted substances and its chemical symbols | |||||
| 鉛Lead(Pb) | 汞Mercury(Hg) | 鎘Cadmium (Cd) | 六價鉻HexavalentChromium (Cr(VI)) | 多溴聯苯Polybrominatedbiphenyls(PBB) | 多Pol bip | |
| 电子元件(PCBs)Electronics (PCBs) | 0 | 0 | 0 | 0 | 0 | |
| 壳体组件Housing | 0 | 0 | 0 | 0 | 0 | |
| 电气联接线Electrical wirings | 0 | 0 | 0 | 0 | 0 | |
| 核心部件Core part | - | 0 | 0 | 0 | 0 | |
備考 1. “超出 0.1 wt %” 及 “超出 0.01 wt %” 係指限用物質之百分比含量超出百分比含量基準值。
Note 1: "Exceeding 0.1wt.% and exceeding 0.01wt %" indicate that the percentage contain of the restricted s exceeds the reference percentage value of presence condition.
備考 2. “○”係指該項限用物質之百分比含量未超出百分比含量基準值。
Note 2: "o" – indicates that the percentage contain of the restricted substance does not exceeds the percent reference value of presence.
備考 3. "一" 係指該項限用物質為排除項目。
Note 3: The “-” indicates that the restricted substance corresponds to the exemption.
以下表格均依据 SJT 11364 通则制定。
o: 表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 标准规定的限量要求以下。
x: 表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 标准规定的限量要求。
(企业可基于其实际情况在包装箱内提供 “X” 标识的详细技术说明。)
The following tables are prepared in accordance with the provision of SJT 11364.
O: Indicates that said hazardous substances contained in all of the homogeneous materials for this part is by limit requirement of GB/T 26572
X: Indicates that said hazardous substances contained in at least one of the homogeneous materials used for is above the limit requirement of GB/T 26572.
(Enterprises may further provide in this box technical explanation for marking "X" based on their actual circuit
Declaration of the Presence Condition of the Restricted Substances Marking
| 設備名稱: PM 2-LG (02) / PM 2-PG (01), 型號(型式): LaserEquipment name: PM 2-LG (02) / PM 2-PG (01), Type designation: Laser | ||||||
| 單元Unit | 限用物質及其化學符號Restricted substances and its chemical symbols | |||||
| 鉛Lead(Pb) | 汞Mercury(Hg) | 鎘Cadmium (Cd) | 六價鉻HexavalentChromium (Cr(VI)) | 多溴聯苯Polybrominatedbiphenyls(PBB) | 多溴Polybrbipher(PB) | |
| 电子元件(PCBs)Electronics (PCBs) | 0 | 0 | 0 | 0 | 0 | |
| 壳体组件Housing | 0 | 0 | 0 | 0 | 0 | |
| 电气联接线Electrical wirings | 0 | 0 | 0 | 0 | 0 | |
| 核心部件Core part | - | 0 | 0 | 0 | 0 | |
| 備考1. “超出0.1 wt %”及“超出0.01 wt %”係指限用物質之百分比含量超出百分比含量基準值。Note 1: “Exceeding 0.1wt.% and exceeding 0.01wt %” indicate that the percentage contain of the restricted subsexceeds the reference percentage value of presence condition.備考2. “o”係指該項限用物質之百分比含量未超出百分比含量基準值。Note 2: “o”-indicates that the percentage contain of the restricted substance does not exceeds the percentagereference value of presence.備考3. “-”係指該項限用物質為排除項目。Note 3: The “-” indicates that the restricted substance corresponds to the exemption. | ||||||
text_image
PM 2-PG ① ② ③ ④ ⑤ ⑥ ⑦ ⑧以下表格均依据 SJT 11364 通则制定。
o: 表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 标准规定的限量要求以下。
x: 表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 标准规定的限量要求。
(企业可基于其实际情况在包装箱内提供 “X” 标识的详细技术说明。)
The following tables are prepared in accordance with the provision of SJT 11364.
O: Indicates that said hazardous substances contained in all of the homogeneous materials for this part is below limit requirement of GB/T 26572
X: Indicates that said hazardous substances contained in at least one of the homogeneous materials used for this is above the limit requirement of GB/T 26572.
(Enterprises may further provide in this box technical explanation for marking "X" based on their actual circumst
Declaration of the Presence Condition of the Restricted Substances Marking
| 設備名稱: PM 2-LG (02) / PM 2-PG (01), 型號(型式): Laser Equipment name: PM 2-LG (02) / PM 2-PG (01), Type designation: Laser | ||||||
| 單元Unit | 限用物質及其化學符號Restricted substances and its chemical symbols | |||||
| 鉛Lead(Pb) | 汞Mercury(Hg) | 鎘Cadmium (Cd) | 六價鉻HexavalentChromium (Cr(VI)) | 多溴聯苯Polybrominatedbiphenyls(PBB) | 多Pol bip | |
| 电子元件(PCBs)Electronics (PCBs) | 0 | 0 | 0 | 0 | 0 | |
| 壳体组件Housing | 0 | 0 | 0 | 0 | 0 | |
| 电气联接线Electrical wirings | 0 | 0 | 0 | 0 | 0 | |
| 核心部件Core part | - | 0 | 0 | 0 | 0 | |
備考 1. “超出 0.1 wt %” 及 “超出 0.01 wt %” 係指限用物質之百分比含量超出百分比含量基準值。
Note 1: "Exceeding 0.1wt.% and exceeding 0.01wt %" indicate that the percentage contain of the restricted s exceeds the reference percentage value of presence condition.
備考 2. “○”係指該項限用物質之百分比含量未超出百分比含量基準值。
Note 2: "o" – indicates that the percentage contain of the restricted substance does not exceeds the percentage reference value of presence.
備考 3. "一" 係指該項限用物質為排除項目。
Note 3: The “-” indicates that the restricted substance corresponds to the exemption.
以下表格均依据 SJT 11364 通则制定。
o: 表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 标准规定的限量要求以下。
x: 表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 标准规定的限量要求。
(企业可基于其实际情况在包装箱内提供 “X” 标识的详细技术说明。)
The following tables are prepared in accordance with the provision of SJT 11364.
O: Indicates that said hazardous substances contained in all of the homogeneous materials for this part is by limit requirement of GB/T 26572
X: Indicates that said hazardous substances contained in at least one of the homogeneous materials used for is above the limit requirement of GB/T 26572.
(Enterprises may further provide in this box technical explanation for marking "X" based on their actual circuit
Declaration of the Presence Condition of the Restricted Substances Marking
| 設備名稱: PM 2-LG (02) / PM 2-PG (01), 型號(型式): LaserEquipment name: PM 2-LG (02) / PM 2-PG (01), Type designation: Laser | ||||||
| 單元Unit | 限用物質及其化學符號Restricted substances and its chemical symbols | |||||
| 鉛Lead(Pb) | 汞Mercury(Hg) | 鎘Cadmium (Cd) | 六價鉻HexavalentChromium (Cr(VI)) | 多溴聯苯Polybrominatedbiphenyls(PBB) | 多溴Polybrbipher(PB) | |
| 电子元件(PCBs)Electronics (PCBs) | 0 | 0 | 0 | 0 | 0 | |
| 壳体组件Housing | 0 | 0 | 0 | 0 | 0 | |
| 电气联接线Electrical wirings | 0 | 0 | 0 | 0 | 0 | |
| 核心部件Core part | - | 0 | 0 | 0 | 0 | |
| 備考1. “超出0.1 wt %”及“超出0.01 wt %”係指限用物質之百分比含量超出百分比含量基準值。Note 1: “Exceeding 0.1wt.% and exceeding 0.01wt %” indicate that the percentage contain of the restricted subsexceeds the reference percentage value of presence condition.備考2. “o”係指該項限用物質之百分比含量未超出百分比含量基準值。Note 2: “o”-indicates that the percentage contain of the restricted substance does not exceeds the percentagereference value of presence.備考3. “-”係指該項限用物質為排除項目。Note 3: The “-” indicates that the restricted substance corresponds to the exemption. | ||||||
text_image
Technical diagram of a mechanical component with numbered parts labeled 1 through 8The following tables are prepared in accordance with the provision of SJT 11364.
O: Indicates that said hazardous substances contained in all of the homogeneous materials for this part is by limit requirement of GB/T 26572
X: Indicates that said hazardous substances contained in at least one of the homogeneous materials used for is above the limit requirement of GB/T 26572.
(Enterprises may further provide in this box technical explanation for marking "X" based on their actual circuit
Declaration of the Presence Condition of the Restricted Substances Marking
| 設備名稱: PM 2-LG (02) / PM 2-PG (01), 型號(型式): LaserEquipment name: PM 2-LG (02) / PM 2-PG (01), Type designation: Laser | ||||||
| 單元Unit | 限用物質及其化學符號Restricted substances and its chemical symbols | |||||
| 鉛Lead(Pb) | 汞Mercury(Hg) | 鎘Cadmium (Cd) | 六價鉻HexavalentChromium (Cr(VI)) | 多溴聯苯Polybrominatedbiphenyls(PBB) | 多溴Polybrbipher(PB) | |
| 电子元件(PCBs)Electronics (PCBs) | 0 | 0 | 0 | 0 | 0 | |
| 壳体组件Housing | 0 | 0 | 0 | 0 | 0 | |
| 电气联接线Electrical wirings | 0 | 0 | 0 | 0 | 0 | |
| 核心部件Core part | - | 0 | 0 | 0 | 0 | |
| 備考1. “超出0.1 wt %”及“超出0.01 wt %”係指限用物質之百分比含量超出百分比含量基準值。Note 1: “Exceeding 0.1wt.% and exceeding 0.01wt %” indicate that the percentage contain of the restricted subsexceeds the reference percentage value of presence condition.備考2. “o”係指該項限用物質之百分比含量未超出百分比含量基準值。Note 2: “o”-indicates that the percentage contain of the restricted substance does not exceeds the percentagereference value of presence.備考3. “-”係指該項限用物質為排除項目。Note 3: The “-” indicates that the restricted substance corresponds to the exemption. | ||||||
Hazardous substances material disclosure according to SJ/T 11364-2014
Product type: Laser
Products: PM 2-LG (02) / PM 2-PG (01)
| 零件名称Part name | 有害物质 | |||||
| Hazardous substances | ||||||
| 铅 | 汞 | 镉 | 六价铬 | 多溴联苯 | 多溴二苯醚 | |
| Lead(Pb) | Mercury(Hg) | Cadmium(Cd) | HexavalentChromium(Cr(VI)) | Polybrominatedbiphenyls (PBB) | Polybrominatedbiphenyletherts(PBDE) | |
| CBs)PCBs) | o | o | o | o | o | o |
| o | o | o | o | o | o | |
| ings | o | o | o | o | o | o |
| x | o | o | o | o | o | |
| 依据 SJT 11364 通则制定。有害物质在该部件所有均质材料中的含量均在 GB/T 26572 标准规定的限量要求以下。害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 标准规定的限量要求。F 其实际情况在包装箱内提供 “X” 标识的详细技术说明。)g tables are prepared in accordance with the provision of SJT 11364.that said hazardous substances contained in all of the homogeneous materials for this part is below the ment of GB/T 26572that said hazardous substances contained in at least one of the homogeneous materials used for this part limit requirement of GB/T 26572.may further provide in this box technical explanation for marking "X" based on their actual circumstances.) | ||||||
Declaration of the Presence Condition of the Restricted Substances Marking
| 設備名稱: PM 2-LG (02) / PM 2-PG (01), 型號(型式): LaserEquipment name: PM 2-LG (02) / PM 2-PG (01), Type designation: Laser | ||||||
| 單元Unit | 限用物質及其化學符號Restricted substances and its chemical symbols | |||||
| 鉛Lead(Pb) | 汞Mercury(Hg) | 鎘Cadmium (Cd) | 六價鉻HexavalentChromium (Cr(VI)) | 多溴聯苯Polybrominatedbiphenyls(PBB) | 多溴二苯醚Polybrominatedbiphenyletherts(PBDE) | |
| (PCBs)cs (PCBs) | 0 | 0 | 0 | 0 | 0 | 0 |
| 0 | 0 | 0 | 0 | 0 | 0 | |
| 线wirings | 0 | 0 | 0 | 0 | 0 | 0 |
| t | - | 0 | 0 | 0 | 0 | 0 |
| “超出0.1 wt %”及“超出0.01 wt %”係指限用物質之百分比含量超出百分比含量基準值。Exceeding 0.1wt.% and exceeding 0.01wt %" indicate that the percentage contain of the restricted substance the reference percentage value of presence condition."o"係指該項限用物質之百分比含量未超出百分比含量基準值。p" - indicates that the percentage contain of the restricted substance does not exceeds the percentage of the value of presence.-"係指該項限用物質為排除項目。The "-" indicates that the restricted substance corresponds to the exemption. | ||||||
text_image
Labeled diagram of a 3D printer or scanner component with numbered parts for identification.以下表格均依据 SJT 11364 通则制定。
o: 表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 标准规定的限量要求以下。
x:表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 标准规定的限量要求。
(企业可基于其实际情况在包装箱内提供 “X” 标识的详细技术说明。)
The following tables are prepared in accordance with the provision of SJT 11364.
O: Indicates that said hazardous substances contained in all of the homogeneous materials for this part is below limit requirement of GB/T 26572
X: Indicates that said hazardous substances contained in at least one of the homogeneous materials used for this is above the limit requirement of GB/T 26572.
(Enterprises may further provide in this box technical explanation for marking "X" based on their actual circumsta
この表は中国市場に適用されるものです。
限用物質含有情況標示聲明書
Declaration of the Presence Condition of the Restricted Substances Marking
| 設備名稱: PM 2-LG (02) / PM 2-PG (01), 型號(型式): LaserEquipment name: PM 2-LG (02) / PM 2-PG (01), Type designation: Laser | ||||||
| 單元Unit | 限用物質及其化學符號Restricted substances and its chemical symbols | |||||
| 鉛Lead(Pb) | 汞Mercury(Hg) | 鎘Cadmium (Cd) | 六價鉻HexavalentChromium (Cr(VI)) | 多溴聯苯Polybrominatedbiphenyls(PBB) | 多Pol bip | |
| 电子元件(PCBs)Electronics (PCBs) | 0 | 0 | 0 | 0 | 0 | |
| 壳体组件Housing | 0 | 0 | 0 | 0 | 0 | |
| 电气联接线Electrical wirings | 0 | 0 | 0 | 0 | 0 | |
| 核心部件Core part | - | 0 | 0 | 0 | 0 | |
| 備考1. “超出0.1wt%”及“超出0.01wt%”係指限用物質之百分比含量超出百分比含量基準值。Note 1: “Exceeding 0.1wt.% and exceeding 0.01wt%” indicate that the percentage contain of the restricted s exceeds the reference percentage value of presence condition.備考2. “o”係指該項限用物質之百分比含量未超出百分比含量基準值。Note 2: “o” - indicates that the percentage contain of the restricted substance does not exceeds the percentat reference value of presence.備考3. “-”係指該項限用物質為排除項目。Note 3: The “-” indicates that the restricted substance corresponds to the exemption. | ||||||
この表は台湾市場に適用されるものです。
11 廃棄
text_image
PM 2-PG ① ② ③ ④ ⑤ ⑥ ⑦ ⑧以下表格均依据 SJT 11364 通则制定。
o: 表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 标准规定的限量要求以下。
x:表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 标准规定的限量要求。
(企业可基于其实际情况在包装箱内提供 “X” 标识的详细技术说明。)
The following tables are prepared in accordance with the provision of SJT 11364.
O: Indicates that said hazardous substances contained in all of the homogeneous materials for this part is below limit requirement of GB/T 26572
X: Indicates that said hazardous substances contained in at least one of the homogeneous materials used for this is above the limit requirement of GB/T 26572.
(Enterprises may further provide in this box technical explanation for marking "X" based on their actual circumsta
본 도표는 중국 시장에 적용됩니다.
限用物質含有情況標示聲明書
Declaration of the Presence Condition of the Restricted Substances Marking
| 設備名稱: PM 2-LG (02) / PM 2-PG (01), 型號(型式): LaserEquipment name: PM 2-LG (02) / PM 2-PG (01), Type designation: Laser | ||||||
| 單元Unit | 限用物質及其化學符號Restricted substances and its chemical symbols | |||||
| 鉛Lead(Pb) | 汞Mercury(Hg) | 鎘Cadmium (Cd) | 六價鉻HexavalentChromium (Cr(VI)) | 多溴聯苯Polybrominatedbiphenyls(PBB) | 多Pol bip | |
| 电子元件(PCBs)Electronics (PCBs) | 0 | 0 | 0 | 0 | 0 | |
| 壳体组件Housing | 0 | 0 | 0 | 0 | 0 | |
| 电气联接线Electrical wirings | 0 | 0 | 0 | 0 | 0 | |
| 核心部件Core part | - | 0 | 0 | 0 | 0 | |
| 備考1. “超出0.1wt%”及“超出0.01wt%”係指限用物質之百分比含量超出百分比含量基準值。Note 1: “Exceeding 0.1wt.% and exceeding 0.01wt%” indicate that the percentage contain of the restricted s exceeds the reference percentage value of presence condition.備考2. “o”係指該項限用物質之百分比含量未超出百分比含量基準值。Note 2: “o” - indicates that the percentage contain of the restricted substance does not exceeds the percentat reference value of presence.備考3. “-”係指該項限用物質為排除項目。Note 3: The “-” indicates that the restricted substance corresponds to the exemption. | ||||||
본 도표는 대만 시장에 적용됩니다.
11 폐기
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PM 2-PG ① ② ③ ④ ⑤ ⑥ ⑦ ⑧24F., No. 16, Xinzhan Rd., Banqiao Dist., New Taipei City 220, Taiwan (R.O.C.)
Tel. 0800-221-036
10 其他資訊
以下表格均依据 SJT 11364 通则制定。
o: 表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 标准规定的限量要求以下。
x: 表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 标准规定的限量要求。
(企业可基于其实际情况在包装箱内提供 “X” 标识的详细技术说明。)
The following tables are prepared in accordance with the provision of SJT 11364.
O: Indicates that said hazardous substances contained in all of the homogeneous materials for this part is below limit requirement of GB/T 26572
X: Indicates that said hazardous substances contained in at least one of the homogeneous materials used for this is above the limit requirement of GB/T 26572.
(Enterprises may further provide in this box technical explanation for marking "X" based on their actual circumsta
此表適用於中國市場。
限用物質含有情況標示聲明書
Declaration of the Presence Condition of the Restricted Substances Marking
| 設備名稱: PM 2-LG (02) / PM 2-PG (01), 型號(型式): LaserEquipment name: PM 2-LG (02) / PM 2-PG (01), Type designation: Laser | ||||||
| 單元Unit | 限用物質及其化學符號Restricted substances and its chemical symbols | |||||
| 鉛Lead(Pb) | 汞Mercury(Hg) | 鎘Cadmium (Cd) | 六價鉻HexavalentChromium (Cr(VI)) | 多溴聯苯Polybrominatedbiphenyls(PBB) | 多Pol bip | |
| 电子元件(PCBs)Electronics (PCBs) | 0 | 0 | 0 | 0 | 0 | |
| 壳体组件Housing | 0 | 0 | 0 | 0 | 0 | |
| 电气联接线Electrical wirings | 0 | 0 | 0 | 0 | 0 | |
| 核心部件Core part | - | 0 | 0 | 0 | 0 | |
| 備考1. “超出0.1wt%”及“超出0.01wt%”係指限用物質之百分比含量超出百分比含量基準值。Note 1: “Exceeding 0.1wt.% and exceeding 0.01wt%” indicate that the percentage contain of the restricted s exceeds the reference percentage value of presence condition.備考2. “o”係指該項限用物質之百分比含量未超出百分比含量基準值。Note 2: “o” - indicates that the percentage contain of the restricted substance does not exceeds the percentat reference value of presence.備考3. “-”係指該項限用物質為排除項目。Note 3: The “-” indicates that the restricted substance corresponds to the exemption. | ||||||
此表適用於臺灣市場。
11 廢棄設備處置
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PM 2-PG ① ② ③ ④ ⑤ ⑥ ⑦ ⑧以下表格均依据 SJT 11364 通则制定。
o: 表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 标准规定的限量要求以下。
x: 表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 标准规定的限量要求。
(企业可基于其实际情况在包装箱内提供 “X” 标识的详细技术说明。)
The following tables are prepared in accordance with the provision of SJT 11364.
O: Indicates that said hazardous substances contained in all of the homogeneous materials for this part is below limit requirement of GB/T 26572
X: Indicates that said hazardous substances contained in at least one of the homogeneous materials used for this is above the limit requirement of GB/T 26572.
(Enterprises may further provide in this box technical explanation for marking "X" based on their actual circumsta
该表适用于中国市场。
限用物質含有情況標示聲明書
Declaration of the Presence Condition of the Restricted Substances Marking
| 設備名稱: PM 2-LG (02) / PM 2-PG (01), 型號(型式): LaserEquipment name: PM 2-LG (02) / PM 2-PG (01), Type designation: Laser | ||||||
| 單元Unit | 限用物質及其化學符號Restricted substances and its chemical symbols | |||||
| 鉛Lead(Pb) | 汞Mercury(Hg) | 鎘Cadmium (Cd) | 六價鉻HexavalentChromium (Cr(VI)) | 多溴聯苯Polybrominatedbiphenyls(PBB) | 多Pol bip | |
| 电子元件(PCBs)Electronics (PCBs) | 0 | 0 | 0 | 0 | 0 | |
| 壳体组件Housing | 0 | 0 | 0 | 0 | 0 | |
| 电气联接线Electrical wirings | 0 | 0 | 0 | 0 | 0 | |
| 核心部件Core part | - | 0 | 0 | 0 | 0 | |
| 備考1. “超出0.1wt%”及“超出0.01wt%”係指限用物質之百分比含量超出百分比含量基準值。Note 1: “Exceeding 0.1wt.% and exceeding 0.01wt%” indicate that the percentage contain of the restricted s exceeds the reference percentage value of presence condition.備考2. “o”係指該項限用物質之百分比含量未超出百分比含量基準值。Note 2: “o” - indicates that the percentage contain of the restricted substance does not exceeds the percentat reference value of presence.備考3. “-”係指該項限用物質為排除項目。Note 3: The “-” indicates that the restricted substance corresponds to the exemption. | ||||||
该表适用于中国台湾市场。
11 废弃处置

.הכלההוּרָהוּרָהוּרָהוּרָהוּרָהוּרָהוּרָהוּרָהוּרָהוּרָהוּרָהוּרָהוּרָהוּרָהוּרָה
.הכלההוּרָהוּרָהוּרָהוּרָהוּרָהוּרָהוּרָהוּרָהוּרָהוּרָהוּרָהוּרָהוּרָהוּרָהוּרָה
הכלה 2.2
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1 2 3 4 5 6 7 8 PM 2-PMהכלה 3.2
Hazardous substances material disclosure according to SJ/T 11364-2014
Product type: Laser
Products: PM 2-LG (02) / PM 2-PG (01)
| 零件名称Part name | 有害物质 | |||||
| Hazardous substances | ||||||
| 铅 | 汞 | 镉 | 六价铬 | 多溴联苯 | 多溴二苯醚 | |
| Lead(Pb) | Mercury(Hg) | Cadmium(Cd) | HexavalentChromium(Cr(VI)) | Polybrominatedbiphenyls (PBB) | Polybrominatedbiphenyletherts(PBDE) | |
| CBs)PCBs) | o | o | o | o | o | o |
| o | o | o | o | o | o | |
| ings | o | o | o | o | o | o |
| x | o | o | o | o | o | |
| 数据 SJT 11364 通则制定。有害物质在该部件所有均质材料中的含量均在 GB/T 26572 标准规定的限量要求以下。害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 标准规定的限量要求。F 其实际情况在包装箱内提供 “X” 标识的详细技术说明。)g tables are prepared in accordance with the provision of SJT 11364.that said hazardous substances contained in all of the homogeneous materials for this part is below the ment of GB/T 26572that said hazardous substances contained in at least one of the homogeneous materials used for this part limit requirement of GB/T 26572.may further provide in this box technical explanation for marking "X" based on their actual circumstances.) | ||||||
Declaration of the Presence Condition of the Restricted Substances Marking
| 設備名稱: PM 2-LG (02) / PM 2-PG (01), 型號(型式): LaserEquipment name: PM 2-LG (02) / PM 2-PG (01), Type designation: Laser | ||||||
| 單元Unit | 限用物質及其化學符號Restricted substances and its chemical symbols | |||||
| 鉛Lead(Pb) | 汞Mercury(Hg) | 鎘Cadmium (Cd) | 六價鉻HexavalentChromium (Cr(VI)) | 多溴聯苯Polybrominatedbiphenyls(PBB) | 多溴二苯醚Polybrominatedbiphenyletherts(PBDE) | |
| (PCBs)cs (PCBs) | 0 | 0 | 0 | 0 | 0 | 0 |
| 0 | 0 | 0 | 0 | 0 | 0 | |
| 线wirings | 0 | 0 | 0 | 0 | 0 | 0 |
| t | - | 0 | 0 | 0 | 0 | 0 |
| “超出0.1 wt %”及“超出0.01 wt %”係指限用物質之百分比含量超出百分比含量基準值。Exceeding 0.1wt.% and exceeding 0.01wt %" indicate that the percentage contain of the restricted substancethe reference percentage value of presence condition."o"係指該項限用物質之百分比含量未超出百分比含量基準值。p" - indicates that the percentage contain of the restricted substance does not exceeds the percentage ofe value of presence.-"係指該項限用物質為排除項目。The "-" indicates that the restricted substance corresponds to the exemption. | ||||||
EC Declaration of Conformity | UK Declaration of Conformity

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HILTIManufacturer:
Hilti Corporation
Hilti (Gt. Britain) Limited
1 Trafford Wharf Road, Old Trafford
Manchester, M17 1BY
PM 2-PG (01)
Serial Numbers: 1-99999999999
2014/30/EU | Electromagnetic Compatibility Regulations 2016
2011/65/EU | The Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment Regulations 2012
EN 61010-1:2010 +
A1:2019
EN 55011:2016 + A1:2017
EN 61326-1:2013

Dr. Tahar Zrilli
Head of Quality and Process Management Business Area Electric Tools & Accessories
Schaan, 03.12.2021

Thomas Hillbrand
Head of BU Measuring Systems
Business Unit Measuring Systems

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HILTIHilti Corporation
LI-9494 Schaan
Tel.:+423 234 21 11
Fax:+423 234 29 65
www.hilti.group
