B360MHDV - Motherboard ASROCK - Free user manual and instructions

USER MANUAL B360MHDV ASROCK

Version 1.0 Published February 2018 Copyright©2018 ASRock INC. All rights reserved. Copyright Notice: No part of this documentation may be reproduced, transcribed, transmitted, or translated in any language, in any form or by any means, except duplication of documentation by the purchaser for backup purpose, without written consent of ASRock Inc. Products and corporate names appearing in this documentation may or may not be registered trademarks or copyrights of their respective companies, and are used only for identication or explanation and to the owners’ benet, without intent to infringe. Disclaimer: Specications and information contained in this documentation are furnished for informational use only and subject to change without notice, and should not be constructed as a commitment by ASRock. ASRock assumes no responsibility for any errors or omissions that may appear in this documentation. With respect to the contents of this documentation, ASRock does not provide warranty of any kind, either expressed or implied, including but not limited to the implied warranties or conditions of merchantability or tness for a particular purpose. In no event shall ASRock, its directors, ocers, employees, or agents be liable for any indirect, special, incidental, or consequential damages (including damages for loss of prots, loss of business, loss of data, interruption of business and the like), even if ASRock has been advised of the possibility of such damages arising from any defect or error in the documentation or product. is device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

CALIFORNIA, USA ONLY

e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance controlled in Perchlorate Best Management Practices (BMP) regulations passed by the California Legislature. When you discard the Lithium battery in California, USA, please follow the related regulations in advance. “Perchlorate Material-special handling may apply, see www.dtsc.ca.gov/hazardouswaste/ perchlorate” ASRock Website: http://www.asrock.comAUSTRALIA ONLY Our goods come with guarantees that cannot be excluded under the Australian Consumer Law. You are entitled to a replacement or refund for a major failure and compensation for any other reasonably foreseeable loss or damage caused by our goods. You are also entitled to have the goods repaired or replaced if the goods fail to be of acceptable quality and the failure does not amount to a major failure. If you require assistance please call ASRock Tel : +886-2-28965588 ext.123 (Standard International call charges apply) e terms HDMI™ and HDMI High-Denition Multimedia Interface, and the HDMI logo are trademarks or registered trademarks of HDMI Licensing LLC in the United States and other countries.English

• ere are two LEDs on each LAN port. Please refer to the table below for the LAN port LED indications. Activity / Link LED Speed LED Status Description Status Description O No Link O 10Mbps connection Blinking Data Activity Orange 100Mbps connection On Link Green 1Gbps connection ACT/LINK LEDSPEED LEDLAN Port

** To congure 7.1 CH HD Audio, it is required to use an HD front panel audio module and enable the multi- channel audio feature through the audio driver. Please set Speaker Conguration to “7.1 Speaker”in the Realtek HD Audio Manager. Function of the Audio Ports in 7.1-channel Conguration: Port Function Light Blue (Rear panel) Rear Speaker Out Lime (Rear panel) Front Speaker Out Pink (Rear panel) Central /Subwoofer Speaker Out Lime (Front panel) Side Speaker OutEnglish

ank you for purchasing ASRock B360M-HDV motherboard, a reliable motherboard produced under ASRock’s consistently stringent quality control. It delivers excellent performance with robust design conforming to ASRock’s commitment to quality and endurance.

ASRock B360M-HDV Motherboard (Micro ATX Form Factor)

ASRock B360M-HDV Support CD

1 x I/O Panel Shield

1 x Screw for M.2 Socket (Optional) Because the motherboard specications and the BIOS soware might be updated, the content of this documentation will be subject to change without notice. In case any modi-cations of this documentation occur, the updated version will be available on ASRock’s website without further notice. If you require technical support related to this mother-board, please visit our website for specic information about the model you are using. You may nd the latest VGA cards and CPU support list on ASRock’s website as well. ASRock website http://www.asrock.com.English

Solid Capacitor design CPU

Supports Intel® Turbo Boost 2.0 Technology Chipset

Dual Channel DDR4 Memory Technology

Supports DDR4 2666/2400/2133 non-ECC, un-buered memory

Max. capacity of system memory: 32GB

Supports Intel® Extreme Memory Prole (XMP) 2.0

• Supports NVMe SSD as boot disks

Intel® UHD Graphics Built-in Visuals and the VGA outputs can be supported only with processors which are GPU integrated.

Supports Intel® UHD Graphics Built-in Visuals : Intel® Quick Sync Video with AVC, MVC (S3D) and MPEG-2 Full HW Encode1, Intel® InTru

HWAEncode/Decode: AVC/H.264, HEVC/H.265 8-bit, HEVC/H.265 10-bit, VP8, VP9 8-bit, VP9 10-bit (Decode only), MPEG2, MJPEG, VC-1 (Decode only)English

Supports HDMI with max. resolution up to 4K x 2K (4096x2160) @ 30Hz

Supports DVI-D with max. resolution up to 1920x1200 @ 60Hz

Supports D-Sub with max. resolution up to 1920x1200 @ 60Hz

Supports Auto Lip Sync, Deep Color (12bpc), xvYCC and HBR (High Bit Rate Audio) with HDMI Port (Compliant HDMI monitor is required)

Supports HDCP with DVI-D and HDMI Ports

Supports 4K Ultra HD (UHD) playback with HDMI Port Audio

• To congure 7.1 CH HD Audio, it is required to use an HD front panel audio module and enable the multi-channel audio feature through the audio driver.

Supports Surge Protection

Supports Wake-On-LAN

Supports Lightning/ESD Protection

Supports Energy Ecient Ethernet 802.3az

Supports PXE Rear Panel I/O

2 x USB 2.0 Ports (Supports ESD Protection)

1 x RJ-45 LAN Port with LED (ACT/LINK LED and SPEED LED)

HD Audio Jacks: Line in / Front Speaker / MicrophoneEnglish

6 x SATA3 6.0 Gb/s Connectors, support NCQ, AHCI and Hot Plug*

• If M2_1 is occupied by a SATA-type M.2 device, SATA3_3 will be disabled.

Technology ** Supports NVMe SSD as boot disks ** Supports ASRock U.2 Kit Connector

1 x Chassis Intrusion and Speaker Header

1 x CPU Fan Connector (4-pin)

• e CPU Fan Connector supports the CPU fan of maximum 1A (12W) fan power.

• e Chassis/Water Pump Fan supports the water cooler fan of maximum 2A (24W) fan power.

• CHA_FAN1/WP and CHA_FAN2/WP can auto detect if 3-pin or 4-pin fan is in use.

1 x Front Panel Audio Connector

2 x USB 2.0 Headers (Support 4 USB 2.0 ports) (Supports ESD Protection)

1 x USB 3.1 Gen1 Header (Supports 2 USB 3.1 Gen1 ports) (Supports ESD Protection) BIOS Feature

AMI UEFI Legal BIOS with multilingual GUI support

ACPI 6.0 Compliant wake up events

Quiet Fan (Auto adjust chassis fan speed by CPU temperature): CPU, Chassis/Water Pump Fans

ErP/EuP ready (ErP/EuP ready power supply is required)

• For detailed product information, please visit our website: http://www.asrock.com Please realize that there is a certain risk involved with overclocking, including adjusting the setting in the BIOS, applying Untied Overclocking Technology, or using third-party overclocking tools. Overclocking may aect your system’s stability, or even cause damage to the components and devices of your system. It should be done at your own risk and expense. We are not responsible for possible damage caused by overclocking.English

is is a Micro ATX form factor motherboard. Before you install the motherboard, study the conguration of your chassis to ensure that the motherboard ts into it. Pre-installation Precautions Take note of the following precautions before you install motherboard components or change any motherboard settings.

Make sure to unplug the power cord before installing or removing the motherboard components. Failure to do so may cause physical injuries and damages to motherboard components.

In order to avoid damage from static electricity to the motherboard’s components, NEVER place your motherboard directly on a carpet. Also remember to use a grounded wrist strap or touch a safety grounded object before you handle the components.

Hold components by the edges and do not touch the ICs.

Whenever you uninstall any components, place them on a grounded anti-static pad or in the bag that comes with the components.

When placing screws to secure the motherboard to the chassis, please do not over- tighten the screws! Doing so may damage the motherboard.

2.1 Installing the CPU

1. Before you insert the 1151-Pin CPU into the socket, please check if the PnP cap is on the

socket, if the CPU surface is unclean, or if there are any bent pins in the socket. Do not force to insert the CPU into the socket if above situation is found. Otherwise, the CPU will be seriously damaged.

B360M-HDV Please save and replace the cover if the processor is removed. e cover must be placed if you wish to return the motherboard for aer service.English

2.2 Installing the CPU Fan and Heatsink

is motherboard provides two 288-pin DDR4 (Double Data Rate 4) DIMM slots, and supports Dual Channel Memory Technology. e DIMM only ts in one correct orientation. It will cause permanent damage to the motherboard and the DIMM if you force the DIMM into the slot at incorrect orientation.

1. For dual channel conguration, you always need to install identical (the same

brand, speed, size and chip-type) DDR4 DIMM pairs.

2. It is unable to activate Dual Channel Memory Technology with only one memory

3. It is not allowed to install a DDR, DDR2 or DDR3 memory module into a DDR4

slot; otherwise, this motherboard and DIMM may be damaged.English

ere are 3 PCI Express slots on the motherboard. PCIe slots: PCIE1 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards. PCIE2 (PCIe 3.0 x16 slot) is used for PCI Express x16 lane width graphics cards. PCIE3 (PCIe 3.0 x1 slot) is used for PCI Express x1 lane width cards. Before installing an expansion card, please make sure that the power supply is switched o or the power cord is unplugged. Please read the documentation of the expansion card and make necessary hardware settings for the card before you start the installation.English

e illustration shows how jumpers are setup. When the jumper cap is placed on the pins, the jumper is “Short”. If no jumper cap is placed on the pins, the jumper is “Open”. Clear CMOS Jumper (CLRCMOS1) (see p.1, No. 11) Short: Clear CMOS Open: Default CLRCMOS1 allows you to clear the data in CMOS. e data in CMOS includes system setup information such as system password, date, time, and system setup parameters. To clear and reset the system parameters to default setup, please turn o the computer and unplug the power cord, then use a jumper cap to short the pins on CLRCMOS1 for 3 seconds. Please remember to remove the jumper cap aer clearing the CMOS. If you need to clear the CMOS when you just nish updating the BIOS, you must boot up the system rst, and then shut it down before you do the clear-CMOS action. 2-pin Jumper If you clear the CMOS, the case open may be detected. Please adjust the BIOS option “Clear Status” to clear the record of previous chassis intrusion status.English

2.6 Onboard Headers and Connectors

System Panel Header (9-pin PANEL1) (see p.1, No. 15) Connect the power button, reset button and system status indicator on the chassis to this header according to the pin assignments below. Note the positive and negative pins before connecting the cables. GND

RESET#PWRBTN#PLED-PLED+

GND Onboard headers and connectors are NOT jumpers. Do NOT place jumper caps over these headers and connectors. Placing jumper caps over the headers and connectors will cause permanent damage to the motherboard. PWRBTN (Power Button): Connect to the power button on the chassis front panel. You may congure the way to turn o your system using the power button. RESET (Reset Button): Connect to the reset button on the chassis front panel. Press the reset button to restart the computer if the computer freezes and fails to perform a normal restart. PLED (System Power LED): Connect to the power status indicator on the chassis front panel. e LED is on when the system is operating. e LED keeps blinking when the system is in S1/S3 sleep state. e LED is o when the system is in S4 sleep state or powered o (S5). HDLED (Hard Drive Activity LED): Connect to the hard drive activity LED on the chassis front panel. e LED is on when the hard drive is reading or writing data. e front panel design may dier by chassis. A front panel module mainly consists of power button, reset button, power LED, hard drive activity LED, speaker and etc. When connect- ing your chassis front panel module to this header, make sure the wire assignments and the pin assignments are matched correctly.English

Chassis Intrusion and Speaker Header (7-pin SPK_CI1) (see p.1, No. 16) Please connect the chassis power LED and the chassis speaker to this header. Serial ATA3 Connectors (SATA3_0: see p.1, No. 12) (SATA3_1: see p.1, No. 13) (SATA3_2: see p.1, No. 9) (SATA3_3: see p.1, No. 10) (SATA3_4: see p.1, No. 8) (SATA3_5: see p.1, No. 7) ese six SATA3 connectors support SATA data cables for internal storage devices with up to

6.0 Gb/s data transfer rate.

• If M2_1 is occupied by a SATA-type M.2 device, SATA3_3 will be disabled. USB 2.0 Headers (9-pin USB_7_8) (see p.1, No. 17) (9-pin USB_13_14) (see p.1, No. 18) ere are two USB

motherboard. Each USB

2.0 header can support

two ports. USB 3.1 Gen1 Header (19-pin USB_11_12) (see p.1, No. 6) ere is one header on this motherboard. is USB 3.1 Gen1 header can support two ports.

B360M-HDV Front Panel Audio Header (9-pin HD_AUDIO1) (see p.1, No. 22) is header is for connecting audio devices to the front audio panel. Chassis/Water Pump Fan Connectors (4-pin CHA_FAN1/WP) (see p.1, No. 4) (4-pin CHA_FAN2/WP) (see p.1, No. 14) is motherboard provides two 4-Pin water cooling chassis fan connectors. If you plan to connect a 3-Pin chassis water cooler fan, please connect it to Pin 1-3. CPU Fan Connector (4-pin CPU_FAN1) (see p.1, No. 2) is motherboard provides a 4-Pin CPU fan (Quiet Fan) connector. If you plan to connect a 3-Pin CPU fan, please connect it to Pin 1-3.

1. High Denition Audio supports Jack Sensing, but the panel wire on the chassis

must support HDA to function correctly. Please follow the instructions in our manual and chassis manual to install your system.

2. If you use an AC’97 audio panel, please install it to the front panel audio header by

the steps below: A. Connect Mic_IN (MIC) to MIC2_L. B. Connect Audio_R (RIN) to OUT2_R and Audio_L (LIN) to OUT2_L. C. Connect Ground (GND) to Ground (GND). D. MIC_RET and OUT_RET are for the HD audio panel only. You don’t need to connect them for the AC’97 audio panel. E. To activate the front mic, go to the “FrontMic” Tab in the Realtek Control panel and adjust “Recording Volume”. GND

FAN_VOLTAGECHA_FAN_SPEED

ATX Power Connector (24-pin ATXPWR1) (see p.1, No. 5) is motherboard provides a 24-pin ATX power connector. To use a 20-pin ATX power supply, please plug it along Pin 1 and Pin 13. ATX 12V Power Connector (8-pin ATX12V1) (see p.1, No. 1) is motherboard provides an 8-pin ATX 12V power connector. To use a 4-pin ATX power supply, please plug it along Pin 1 and Pin 5. Serial Port Header (9-pin COM1) (see p.1, No. 19) is COM1 header supports a serial port module. TPM Header (17-pin TPMS1) (see p.1, No. 21) is connector supports Trusted Platform Module (TPM) system, which can securely store keys, digital certicates, passwords, and data. A TPM system also helps enhance network security, protects digital identities, and ensures platform integrity. Print Port Header (25-pin LPT1) (see p.1, No. 20) is is an interface for print port cable that allows convenient connection of printer devices.

S_ PWR DWN #SE RIR Q #

CCTS#1RRTS#1DDSR#1DDTR#1RRXD1

The M.2, also known as the Next Generation Form Factor (NGFF), is a small size and versatile card edge connector that aims to replace mPCIe and mSATA. e M.2 Socket (M2_1) supports SATA3 6.0 Gb/s module and M.2 PCI Express module up to Gen2 x2 (10 Gb/s).

• If M2_1 is occupied by a SATA-type M.2 device, SATA3_3 will be disabled. Installing the M.2_SSD (NGFF) Module Step 1 Prepare a M.2_SSD (NGFF) module and the screw.

Step 3 Move the stando based on the module type and length. e stando is placed at the nut location D by default. Skip Step 3 and 4 and go straight to Step 5 if you are going to use the default nut. Otherwise, release the stando by hand. BCD

Step 4 Peel o the yellow protective lm on the nut to be used. Hand tighten the stando into the desired nut location on the motherboard. ABCD ABCD

Step 5 Gently insert the M.2 (NGFF) SSD module into the M.2 slot. Please be aware that the M.2 (NGFF) SSD module only ts in one orientation.

Step 6 Tighten the screw with a screwdriver to secure the module into place. Please do not overtighten the screw as this might damage the module.English

ADATA SATA3 ASU800NS38-512GT-C

ASRock B360M-HDV-Support-CD

RESET#PWRBTN#PLED-PLED+

FR AM ESM B_CLK_ MAIN

CCTS#1RRTS#1DDSR#1DDTR#1RRXD1

RESET#PWRBTN#PLED-PLED+

CCTS#1RRTS#1DDSR#1DDTR#1RRXD1

Supporto WOL (Wake-On-LAN)

Supporto Energy Ecient Ethernet 802.3az

RESET#PWRBTN#PLED-PLED+

RESET#PWRBTN#PLED-PLED+

S_ P WRDWN #SE R IRQ #

CCTS#1RRTS#1DDSR#1DDTR#1RRXD1

RESET#PWRBTN#PLED-PLED+

CCTS#1RRTS#1DDSR#1DDTR#1RRXD1

RESET#PWRBTN#PLED-PLED+

S_ P WRDWN #SE R IRQ #

RESET#PWRBTN#PLED-PLED+

CCTS#1RRTS#1DDSR#1DDTR#1RRXD1

RESET#PWRBTN#PLED-PLED+

CCTS#1RRTS#1DDSR#1DDTR#1RRXD1

RESET#PWRBTN#PLED-PLED+

CCTS#1RRTS#1DDSR#1DDTR#1RRXD1

RESET#PWRBTN#PLED-PLED+

CCTS#1RRTS#1DDSR#1DDTR#1RRXD1

RESET#PWRBTN#PLED-PLED+

CCTS#1RRTS#1DDSR#1DDTR#1RRXD1

RESET#PWRBTN#PLED-PLED+

CCTS#1RRTS#1DDSR#1DDTR#1RRXD1

SLCTContact Information If you need to contact ASRock or want to know more about ASRock, you’re welcome to visit ASRock’s website at http://www.asrock.com; or you may contact your dealer for further information. For technical questions, please submit a support request form at https://event.asrock.com/tsd.asp ASRock Incorporation 2F., No.37, Sec. 2, Jhongyang S. Rd., Beitou District, Taipei City 112, Taiwan (R.O.C.) ASRock EUROPE B.V. Bijsterhuizen 11-11 6546 AR Nijmegen e Netherlands Phone: +31-24-345-44-33 Fax: +31-24-345-44-38 ASRock America, Inc. 13848 Magnolia Ave, Chino, CA91710 U.S.A. Phone: +1-909-590-8308 Fax: +1-909-590-1026DECLARATION OF CONFORMITY Per FCC Part 2 Section 2.1077(a)

Responsible Party Name: ASRock Incorporation Address:13848 Magnolia Ave, Chino, CA91710+1-909-590-8308/+1-909-590-1026 Phone/FaxNo: hereby declares that the product

Product Name : Motherboard Model Number : Conforms to the following specifications:

FCC Part 15, Subpart B, Unintentional Radiators

Supplementary Information: is device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) is device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Representative Person’s Name: James Signature : Date : May 12, 2017

B360M-HDVEU Declaration of Conformity

For the following equipment:Motherboard(Product Name)B360M-HDV / ASRock(Model Designation / Trade Name)ASRock Incorporation(Manufacturer Name)2F., No.37, Sec. 2, Jhongyang S. Rd., Beitou District, Taipei City 112, Taiwan (R.O.C.)(Manufacturer Address)ASRock EUROPE B.V.(Company Name)Bijsterhuizen 1111 6546 AR Nijmegen e Netherlands(Company Address)Person responsible for making this declaration:(Name, Surname)A.V.P(Position / Title)March 9, 2018(Date)P/N: 15G062081000AK V1.0 EMC

LVD —Directive 2014/35/EU (from April 20th, 2016) EN 60950-1 : 2011+ A2: 2013 ☐

(EU conformity marking)