SY58030U - Uncategorized Microchip - Free user manual and instructions

Product Type	Differential Fanout Buffer
Brand	Microchip
Model	SY58030U
Category	Clock and Timing
Package Type	32-pin QFN (5x5 mm)
Number of Pins	32
Supply Voltage	2.5 V or 3.3 V
Operating Temperature Range	-40°C to +85°C
Maximum Data Rate	3.2 Gbps
Fanout	1:10
Output Logic Type	LVPECL
Input Logic Type	CML, LVPECL, LVDS, HSTL
Output Skew (typical)	10 ps
Propagation Delay (typical)	350 ps
Power Dissipation (typical)	500 mW
Dimensions	5 mm x 5 mm x 0.9 mm
Weight	0.1 g
RoHS Compliant	Yes
ESD Protection	2 kV HBM
Application	High-speed clock distribution, data communication
Features	Low jitter, low skew, failsafe input, internal termination
Maintenance	None required; handle with ESD precautions
Safety	ESD sensitive device; use proper grounding
Spare Parts	Not applicable (integrated circuit)
Repairability	Not repairable; replace component if faulty

Frequently Asked Questions - SY58030U Microchip

What is the SY58030U used for?

The SY58030U is a high-speed 1:10 differential fanout buffer designed for clock and data distribution in applications like networking, telecommunications, and data centers.

What power supply voltages are supported?

The device operates with a 2.5V or 3.3V power supply. Both VCC and VCCIO must be connected to the same voltage.

What output logic levels does it provide?

The outputs are LVPECL (Low-Voltage Positive Emitter-Coupled Logic) with typical swing of 800 mV.

How should I terminate the outputs?

LVPECL outputs require Thevenin termination (e.g., 100 Ω to VCC - 2V) or AC-coupled termination for proper operation.

What is the maximum operating frequency?

The SY58030U supports data rates up to 3.2 Gbps and clock frequencies up to 3.2 GHz.

Is the input internally terminated?

Yes, the differential inputs include internal 100 Ω termination resistors, simplifying PCB layout.

What is the typical output skew?

The part-to-part skew is typically 10 ps, and within-device skew is even lower.

How do I handle thermal management?

The QFN package has an exposed pad that should be soldered to a thermal land on the PCB. Adequate copper area ensures proper heat dissipation.

What PCB layout guidelines are important?

Keep differential traces matched in length and impedance-controlled (100 Ω differential). Place decoupling capacitors near power pins.

Is the device RoHS compliant?

Yes, the SY58030U is RoHS compliant and lead-free.

USER MANUAL SY58030U Microchip

■ Unique patented input design minimizes crosstalk

■ Accepts an input signal as low as 100mV

■ Unique patented input termination and V_T pin accepts DC-coupled and AC-coupled inputs (CML, LVPECL, LVDS)

■ 400mV 100k LVPECL output swing

■ Power supply 2.5V ±5% or 3.3V ±10%

■ -40^ to +85^ temperature range

■ Available in 32-pin (5mm × 5mm) MLF® package

APPLICATIONS

■ Redundant clock and/or data distribution
■ All SONET/SDH clock/data distribution
■ Loopback
■ All Fibre Channel distribution
■ All Gigabit Ethernet clock and/or data distribution

TYPICAL PERFORMANCE

Precision Edge is a registered trademark of Micrel, Inc.
MicroLeadFrame and MLF are registered trademarks of Amkor Technology, Inc.

Precision Edge is a registered trademark of Micrel, Inc. MicroLeadFrame and MLF are registered trademarks of Amkor Technology, Inc.

Precision Edge®

DESCRIPTION

The SY58030U is a 2.5V/3.3V precision, high-speed, 4:1 differential multiplexer with 400mV LVPECL outputs, capable of handling clocks up to 7GHz and data streams up to 10.7Gbps. In addition, a 1:2 fanout buffer provides two copies of the selected input.

The differential input includes Micrel's unique, 3-pin input termination architecture that allows customers to interface to any differential signal (AC- or DC-coupled) as small as 100mV without any level shifting or termination resistor networks in the signal path. The result is a clean, stub-free, low-jitter interface solution. The outputs are 400mV LVPECL (100K temperature compensated) with extremely fast rise/fall times guaranteed to be less than 80ps.

The SY58030U operates from a 2.5V ±5% supply or a 3.3V ±10% supply and is guaranteed over the full industrial temperature range of -40°C to +85°C. For applications that require CML outputs, consider the SY58028U. For 800mV LVPECL outputs, consider the SY58029U. The SY58030U is part of Micrel's high-speed, Precision Edge® product line.

All support documentation can be found on Micrel's web site at www.micrel.com.

FUNCTIONAL BLOCK DIAGRAM

graph TD
    subgraph Inputs
        IN0["IN0"] --> VREFAC0["50Ω"]
        VREFAC0 --> VREFAC1["50Ω"]
        VREFAC1 --> VREFAC2["50Ω"]
        VREFAC2 --> VREFAC3["50Ω"]
        VREFAC3 --> SEL0["SEL0 (CMOS/TTL)"]
        VREFAC3 --> SEL1["SEL1 (CMOS/TTL)"]
    end

    subgraph Outputs
        IN1["IN1"] --> VREFAC1["50Ω"]
        VREFAC1 --> VREFAC2["50Ω"]
        VREFAC2 --> VREFAC3["50Ω"]
        VREFAC3 --> SEL0
        VREFAC3 --> SEL1
    end

    subgraph Outputs
        IN2["IN2"] --> VREFAC2["50Ω"]
        VREFAC2 --> VREFAC3["50Ω"]
        VREFAC3 --> SEL0
        VREFAC3 --> SEL1
    end

    subgraph Outputs
        IN3["IN3"] --> VREFAC3["50Ω"]
        VREFAC3 --> SEL0
        VREFAC3 --> SEL1
    end

    subgraph Outputs
        IN1 --> 4:1 MUX
        IN2 --> 4:1 MUX
        IN3 --> 4:1 MUX
    end

    style Inputs fill:#f9f,stroke:#333
    style Outputs fill:#ccf,stroke:#333

PACKAGE/ORDERING INFORMATION

3231302928272625 IN0 1○ 24 VT0 2 23 VREF-AC0 3 22 /IN0 4 21 IN1 5 20 VT1 6 19 VREF-AC1 7 18 /IN1 8 17 GND VCC Q1 /Q1 VCC NC SEL1 VCC GND VCC /Q0 Q0 VCC NC SEL0 VCC IN3 VREF-AC3 VT3 IN3 /IN2 VREF-AC2 VT2 IN2

32-Pin MLF ^® (MLF-32)

Ordering Information ^(1)

Part Number	Package Type Range	Operating	Package Marking	Finish
SY58030UMI	MLF-32	Industrial	SY58030U	Sn-Pb
SY58030UMITR(2)	MLF-32	Industrial	SY58030U	Sn-Pb
SY58030UMG(3)	MLF-32	Industrial	SY58030U with Pb-Free Pb-Free bar-line indicator	NiPdAu
SY58030UMGTR(2, 3)	MLF-32	Industrial	SY58030U with Pb-Free Pb-Free bar-line indicator	NiPdAu

Notes:

1. Contact factory for die availability. Dice are guaranteed at T_A = 25^ , DC electricals only.
2. Tape and Reel.
3. Pb-Free package recommended for new designs.

PIN DESCRIPTION

Pin Number Pin	Name Pin Function
1, 4 IN0, /IN0	Differential Input: Each pair accepts AC- or DC-coupled signals as small as 100mV.5, 8 IN1, /IN1	Each pin of a pair internally terminates to a VT _T pin through 50Ω. Note that these 25, 28 IN2, /IN2 inputs will default to an indeterminate state if left open. If an input is not used, connect one 29, 32 IN3, /IN3 end of the differential pair to ground through a 1kΩ resistor, and leave the other end to V _CC through a 825Ω resistor. Unused VT _T and V _REF-AC pins may also be left floating. Please refer to the “Input Interface Applications” section for more details.
2, 6, 26, 30	VT0, VT1VT2, VT3	Input Termination Center-Tap: Each side of the differential input pair terminates to a VTpin. The VT _T pins provide a center-tap to the termination network for maximum interface flexibility. See “Input Interface Applications” section for more details.
15, 18	SEL0, SEL1	This Single-Ended TTL/CMOS compatible input selects the inputs to the multiplexer. Note that this input is internally connected to a 25kΩ pull-up resistor and will default to a logic HIGH state if left open. Input logic threshold is V _CC /2. See “Truth Table” for select control.
14, 19	NC	No Connect.
10, 13, 1617, 20, 23	VCC	Positive Power Supply: Bypass with 0.1μF||0.01μF low ESR capacitors.
11, 1221, 22	/Q0, Q0/Q1, Q1	Differential Outputs: These 100k compatible (internally temperature compensated)LVPECL output pairs are copies of the selected input. Unused output pairs may be left floating. See “Output Interface” for termination guidelines.
9, 24	GND, Exposed Pad	Ground. Ground pin and exposed pad must be connected to the same ground plane.
3, 7, 27, 31	VREF-AC0VREF-AC1VREF-AC2VREF-AC3	Reference Voltage: This reference output is equivalent to V _CC -1.4V. It is used for AC-coupled inputs. When interfacing to AC input signals, connect V _REF-AC directly to the VT _T pin and bypass with a 0.01μF low ESR capacitor to V _CC . See “Input Interface Applications” section. Maximum current sink/source is 0.5mA.

TRUTH TABLE

SEL0	SEL1
0	0	IN0 Input Selected
0	1	IN2 Input Selected
1	0	IN1 Input Selected
1	1	IN3 Input Selected

Absolute Maximum Ratings ^(1)

Power Supply Voltage ( V_CC ) ..... -0.5V to +4.0V

Input Voltage ( V_IN ) -0.5V to V_CC

LVPECL Output Current ( I_OUT )

Continuous 50mA

Surge....100mA

Termination Current ^(3)

Source or sink current on V_T pin ....±100mA

Input Current

Source or sink current on IN, /IN pin ....±50mA

Lead Temperature (soldering, 20 sec.) 260°C

Storage Temperature Range ( T_S ) ..... -65°C to +150°C

Operating Ratings ^(2)

Power Supply Voltage ( V_CC ) ..... +2.375V to +2.625V ..... +3.0V to +3.6V

Ambient Temperature Range ( T_A ) ..... -40°C to +85°C

Package Thermal Resistance ^(4)

MLF ^ ( _JA ) Still-Air 35°C/W

MLF ^ ( _JB ) Junction-to-Board ....2°C/W

DC ELECTRICAL CHARACTERISTICS ^(5)

T_A=-40^ to 85^ , unless otherwise stated.

Symbol Parameter Condition Min Typ Max Units
V_CC	Power Supply Voltage V	_CC = 2.5V 2.375 2.5 2.625 V V_CC = 3.3V 3.0 3.3 3.6 V
I_CC	Power Supply Current	No load, max. V_CC		120	150 mA
R_DIFF\_IN	Differential Input Resistance (IN-to-/IN)		80	100	120	Ω
R_IN	Input Resistance (IN-to- V_T , /IN-to- V_T )		40 50	60 Ω
V_IH	Input HIGH Voltage (IN-to-/IN)	Note 6	V_CC-1.6		V_CC	V
V_IL	Input LOW Voltage (IN-to-/IN)		0		V_IH-0.1	V
V_IN	Input Voltage Swing (IN-to-/IN)	See Figure 1a.	0.1		1.7	V
V_DIFF\_IN	Differential Input Voltage Swing (IN-to-/IN)	See Figure 1b.	0.2			V
V_T IN	Max Input Voltage (IN-to- V_T )				1.28	V
V_REF-AC	Reference Voltage		V_CC-1.3	V_CC-1.2	V_CC-1.1	V

Notes:

1. Permanent device damage may occur if ratings in the "Absolute Maximum Ratings" section are exceeded. This is a stress rating only and functional operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings conditions for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Due to the limited drive capability, use for input of the same package only.
4. Thermal performance assumes exposed pad is soldered (or equivalent) to the device's most negative potential (GND) on the PCB. _JB uses 4-layer _JA in still air number unless otherwise stated.
5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
6. V_IH (min) not lower than 1.2V.

LVPECL OUTPUT DC ELECTRICAL CHARACTERISTICS ^(7)
V_CC = 2.5V ± 5% or 3.3V ± 10% ; T_A = -40^ C to +85^ C ; R_L = 50 to V_CC-2V , unless otherwise stated.

Symbol Parameter Condition Min Typ Max Units
V_OH	Output HIGH Voltage V		_CC-1.145 V	_CC-0.895 V
V_OL	Output LOW Voltage V		_CC-1.545 V	_CC-1.295 V
V_OUT	Output Voltage Swing See Figure 1a. 150 400 mV
V_DIFF\_OUT	Differential Output Voltage Swing See Figure 1b. 300 800 mV

LVTTL/CMOS DC ELECTRICAL CHARACTERISTICS ^(7)
V_CC = 2.5V ± 5% or 3.3V ± 10% ; T_A = -40^ C to +85^ C , unless otherwise stated.

Symbol	Parameter	Condition	Min	Typ	Max	Units
V_IH	Input HIGH Voltage	SEL0, SEL1	2.0			V
V_IL	Input LOW Voltage	SEL0, SEL1			0.8	V
I_IH	Input High Current				40	μA
I_IL	Input Low Current				-300	μA

Note:

1. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.

AC ELECTRICAL CHARACTERISTICS ^(8)
V_CC = 2.5V ± 5% or 3.3V ± 10% ; R_L = 50 to V_CC - 2V ; T_A = -40^ to +85^ , V_IN ≥ 100mV , unless otherwise stated.

Symbol Parameter Condition Min Typ Max Units
f_MAX	Maximum Operating Frequency NRZ	Data 10.7 Gbps
		V_OUT ≥ 200mV Clock 7 GHz
t_pd	Propagation Delay (Diff) (IN to Q) V (SEL to Q)	≥ 100mV\	170100	260	340500	psps
t_pd Tempco	Differential Propagation Delay Temperature Coefficient			115		fs/°C
t_SKEW	Output-to-Output Skew	Note 9		7	20	ps
	Part-to-Part Skew	Note 10			50	ps
t_JITTER	Data Random Jitter	Note 11 2.5Gbps to 3.2Gbps			1	ps_PP
	Deterministic Jitter	Note 12 2.5Gbps to 3.2Gbps			10	ps_PP
	Clock Cycle-to-Cycle Jitter	Note 13			1	ps_RMS
	Total Jitter	Note 14			10	ps_PP
	Crosstalk Induced Jitter (Adjacent Channel)	Note 15			0.7	ps_RMS
t_r, t_f	Output Rise/Fall Time	20% to 80%, Full output swing	20	55	80	ps

Notes:

1. High frequency AC electricals are guaranteed by design and characterization.
2. Output-to-output skew is measured between outputs under identical input conditions.
3. Part-to-part skew is defined for two parts with identical power supply voltages at the same temperature and with no skew of the edges at the respective inputs.
4. Random jitter is measured with a K28.7 comma detect character pattern, measured at 2.5Gbps to 3.2Gbps.
5. Deterministic jitter is measured at 2.5Gpbs to 3.2Gbps with both K28.5 and 2^23-1 PRBS pattern.
6. Cycle-to-cycle jitter definition: the variation of periods between adjacent cycles, T_n - T_n - 1 , where T is the time between rising edges of the output signal.
7. Total jitter definition: with an ideal clock input of frequency ≤ f_MAX , no more than one output edge in 10^12 output edges will deviate by more than the specified peak-to-peak jitter value.
8. Crosstalk is measured at the output while applying two similar clock frequencies that are asynchronous with respect to each other at the inputs.

SINGLE-ENDED AND DIFFERENTIAL SWINGS

V_{IN}, \nV_{OUT} 400mV (Typ.)

Figure 1a. Single-Ended Voltage Swing

VDIFF_IN VDIFF_OUT 800mV (Typ.)

Figure 1b. Differential Voltage Swing

TIMING DIAGRAMS

IN /IN tpd tpd Q /Q VIN VOUT

Figure 2a. IN-to-Q Timing Diagram

SEL Vcc/2 Vcc/2 tpd tpd Q /Q VOUT

Figure 2b. SEL-to-Q Timing Diagram

SEL0 Q: SEL1 = LOW; IN0, /IN1 = LOW; /IN0, IN1 = HIGH or: SEL1 = HIGH; IN2, /IN3 = LOW; /IN2, IN3 = HIGH SEL1 Q: SEL0 = LOW; IN0, /IN2 = LOW; /IN0, IN2 = HIGH or: SEL0 = HIGH; IN1, /IN3 = LOW; /IN1, IN3 = HIGH

TYPICAL OPERATING CHARACTERISTICS

V_CC = 2.5V , GND = 0, V_IN = 100mV , T_A = 25^ C , unless otherwise stated.

7Gbps Output (2²³-1 PRBS) Output Swing (100mV/div.) TIME (50ps/div.)

10.7Gbps Output (2²³-1 PRBS) Output Swing (100mV/div.) TIME (25ps/div.)

TYPICAL OPERATING CHARACTERISTICS

V_CC = 2.5V, GND = 0, V_IN = 100mV, T_A = 25^, unless otherwise stated.

Propagation Delay. Input Voltage Swi

Output-to-Output Skew vs. Temperature

Propagation Delay vs. Temperature

Output Amplitude vs. Frequency

INPUT STAGE

VCC IN 50Ω VT 50Ω /IN GND

Figure 3. Simplified Differential Input Stage

INPUT INTERFACE APPLICATIONS

VCC CML GND IN /IN SY58030U NC □ VREF-AC NC □ VT

Figure 4a. CML Interface (DC-Coupled)
Option: May connect V_T to V_CC

VCC CML GND IN /IN SY58030U VCC 0.01μF VREF-AC VT

Figure 4b. CML Interface (AC-Coupled)

VCC LVPECL GND IN IN SY58030U NC VREF-AC VCC 0.01μF Rpd VT For a 3.3V system, Rpd = 50Ω For a 2.5V system, Rpd = 19Ω

Figure 4c. PECL Interface (DC-Coupled)

VCC LVPECL IN Rpd Rpd GND GND VCC 0.01μF IN SY58030U VREF-AC VT

For a 3.3V system, R_pd = 100 For a 2.5V system, R_pd = 50

Figure 4d. LVPECL Interface (AC-Coupled)

Vcc LVDS GND IN /IN SY58030U NC □ VREF-AC NC □ VT

Figure 4e. LVDS Interface

OUTPUT INTERFACE APPLICATIONS

+3.3V +3.3V Z₀ = 50Ω +3.3V R1 130Ω R1 130Ω Z₀ = 50Ω R2 82Ω R2 82Ω

Figure 5a. Parallel Thevenin-Equivalent Termination

+3.3V +3.3V Z = 50Ω Z = 50Ω 50Ω 50Ω "destination" VCC 50Ω Rb C1 0.01μF (optional)

Figure 5b. Parallel Termination (3-Resistor)

Note:

1. For a 2.5V system, R1 = 250Ω, R2 = 62.5Ω.

For a 3.3V system, R1 = 130Ω, R2 = 82Ω.

Note:

1. For a 2.5V system, Rb = 19Ω.

For a 3.3V system, Rb = 150Ω.

RELATED MICREL PRODUCTS AND SUPPORT DOCUMENTATION

Part Number Function Data Sheet Link
SY58028U Ultra	Precision Differential CML 4:1 MUX http://www.micrel.com/product-info/products/sy58028u.shtmlwith 1:2 Fanout and Internal I/O Termination
SY58029U	Ultra Precision Differential LVPECL 4:1 MUX with 1:2 Fanout and Internal Termination	http://www.micrel.com/product-info/products/sy58029u.shtml
SY58030U Ultra	Precision, 400mV Differential LVPECL 4:1 http://www.micrel.com/product-info/products/sy58030u.shtmlMUX with 1:2 Fanout and Internal Termination
	MLF® Application Note www.amkor.com/products/notes_papers/MLF_AppNote_0902.pdf
HBW Solutions	New Products and Applications www.micrel.com/product-info/products/solutions.shtml

32-PIN MicroLeadFrame® (MLF-32)

5.0 BSC 32 1 2 PIN #1 ID 0.20 DIA TYP. 5.0 BSC

TOP VIEW

0.25±0.05 32X 0.20 MIN. 3.10±0.10 0.40±0.05 4X 0.50 BSC 32 1 2 PIN #1 ID R0.20

BOTTOM VIEW

NOTE:

1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. MAX. PACKAGE WARPAGE IS 0.05 mm.
3. MAXIMUM ALLOWABE BURRS IS 0.076 mm IN ALL DIRECTIONS.
4. PIN #1 ID ON TOP WILL BE LASER/INK MARKED.

SIDE VIEW

Package EP- Exposed Pad Dia CompSide Island Heat Dissipation Heat Dissipation Heavy Copper Plane Heavy Copper Plane VEE VEE

PCB Thermal Consideration for 32-Pin MLF® Package (Always solder, or equivalent, the exposed pad to the PCB)

Package Notes:

1. Package meets Level 2 qualification.
2. All parts are dry-packaged before shipment.
3. Exposed pads must be soldered to a ground for proper thermal management.

MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA

TEL + 1 [phone] FAX + 1 [phone] WEB http://www.micrel.com

The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.

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