M386AAG40AM3-CWE - Memory Card SAMSUNG - Free user manual and instructions

Product Type	Memory Module (RAM)
Brand	Samsung
Model	M386AAG40AM3-CWE
Form Factor	DIMM (288-pin)
Memory Type	DDR4
Capacity	64 GB
Speed	3200 MHz (PC4-25600)
CAS Latency	CL22
Voltage	1.2 V
ECC	Registered ECC (RDIMM)
Operating Temperature	0°C to 85°C
Dimensions (W x D x H)	133.35 mm x 31.25 mm x 3.9 mm
Weight	30 g
Interface	SDRAM
Power Consumption	~4.5 W (typical)
Compatibility	Server motherboards supporting DDR4 RDIMM
Features	Low power, high reliability, thermal sensor
Security	No encryption; handle with ESD precautions
Care and Cleaning	Use compressed air; avoid liquids; keep away from magnets
Spare Parts / Repairability	Not user-serviceable; replace module if faulty

Frequently Asked Questions - M386AAG40AM3-CWE SAMSUNG

What type of memory is the Samsung M386AAG40AM3-CWE?

It is a DDR4 registered ECC (RDIMM) memory module designed for servers and workstations.

What is the capacity of this module?

The capacity is 64 GB per module.

What speed does it support?

It operates at 3200 MHz (PC4-25600).

Is this memory compatible with my desktop motherboard?

No, it is registered ECC and requires a server/workstation motherboard that supports RDIMMs. Standard desktop motherboards will not work.

What voltage does it use?

It uses 1.2 V standard DDR4 voltage.

How do I install this memory module?

Align the notch on the module with the DIMM slot and press down firmly until the clips lock. Ensure the module is correctly oriented. Handle with anti-static precautions.

Does it support ECC?

Yes, it is a Registered ECC module, which detects and corrects single-bit memory errors.

What are the physical dimensions?

Approximately 133.35 mm x 31.25 mm x 3.9 mm.

Can I mix this module with non-ECC RAM?

No, ECC and non-ECC memory cannot be mixed. The system will not boot or may be unstable.

How do I clean the memory module?

Use compressed air to remove dust. Do not use liquids. Keep away from strong magnetic fields.

USER MANUAL M386AAG40AM3-CWE SAMSUNG

Illustration of various Samsung and DDR4 memory chips with visible internal structure (no text or symbols on the chip surfaces)

Module Handling Guide

How to handle the module

Recently module failure related with Active/Passive/Component crack has increased.

Main root causes are wrong handling method and mechanical damage.

Current products have more cap. & resistors and the sizes of those passives are reduced and most of them are located around edge area.

These characteristics require more cautious module handling method.

This guide book tries to find out tendency and range of module crack pattern based on experiments from several aspects. The main purpose is to reinforce Samsung's process control and help customer effectively control module handling process.

Test methods are PCB Bow, Twist, Drop Test, UTM(Universal Testing Machine) Test for DRAM, Resister & Capacitor. We observed crack phenomena and tendency through the datum and pictures. Tested products are limited to Registered DIMM [RDIMM], Unbuffered DIMM [UDIMM] and BOC PKG based Module, therefore test results might be different when applied to other products.

Memory Module Introduction

Green printed circuit board with multiple black integrated circuits (no visible text or symbols)

Unbuffered DIMM

Green integrated circuit chip with multiple 12-pin memory chips and a central RCD (no visible text or symbols)

Load Reduced DIMM

Registered DIMM

SODIMM

Person in white protective suit with blue wristband and blue cord, no visible text or symbols

Close-up of gloved hands handling a black plastic tray with green internal components (no text or symbols visible)

Person in cleanroom attire holding a memory chip (no visible text or symbols)

Close-up of a gloved hand holding a transparent plastic tray with internal channels, placed on a green surface (no visible text or symbols)

• Anti-ESD * straps should be used.
  • The strap should be linked to your body.

*ESD : Electro Static Discharge

• Modules should be picked up from packing trays only one-by-one.
  • Product should be handled at the conductive mat.

• Do not grab packages. Hold only the edge of the PCB with both hands.

• Wear gloves when handling.

- Tray must be covered when handling module tray.

Person in cleanroom suit holding a green circuit board with a red diagonal line (no text or symbols visible)

Person in white gloves and gloves handling multiple RAM chips on a carpet, with a red diagonal line overlay (no text or symbols)

Hand in white glove holding a series of microcontroller chips against a green background (no text or symbols visible)

Close-up of a hand holding a small electronic component against a green background, with a red diagonal line overlay (no text or symbols visible)

- Do not twist or bow a module.

- Do not drop modules on the floor.

- Do not grip several modules using one hand.

- Do not touch module without gloves. It can cause tab contamination.

Close-up of gloved hands holding a small mechanical component with a red diagonal line, against a green background (no text or symbols visible)

- Do not detach H/S * or clip. (FDHS product) *H/S : Heat Spreader

Close-up of gloved hands holding a microchip with a red diagonal line above, against a green background (no text or symbols visible)

- Handling modules near tools is prohibited because hard metal objects can damage Module.

Close-up of a computer motherboard with a red diagonal line overlay, showing a stack of RAM chips and connected cables (no visible text or symbols)

- Do not insert the module by seating one end first then seating the other. (This is called zippering or rock)

Close-up of a computer motherboard with a green RAM module and blue CPU socket, overlaid with a red diagonal line (no text or symbols visible)

- Do not insert module upper side.

Close-up of electronic circuit boards with a red diagonal line overlay (no readable text or symbols)

Close-up of a green RAM module being processed with blue ribbeds, no visible text or symbols

Close-up of gloved hands adjusting a red diagonal line on a computer motherboard (no visible text or symbols)

Close-up of a computer motherboard with a red diagonal line indicating a performance gap (no text or symbols visible)

- Do not insert module between sockets.

- Do not insert key notch reverse.

- Do not insert several modules at the same time. (or simultaneously)

- Do not use metal tools when the socketing.

Close-up of a computer motherboard with CPU socket and RAM slots (no visible text or symbols)

Close-up of a computer motherboard with blue and white CPU slots, marked by yellow circles and red prohibition signs (no readable text or symbols)

Close-up of gloved hands installing or adjusting a memory card into a rack (no visible text or symbols)

Close-up of hands assembling a memory module with blue and black components (no visible text or symbols)

1. Socketing must be conducted before turn-on.

2. Ensure that both latch ejectors of connector are fully opened.

3. Grip the module edge side with both hands. (avoid touching component area)

4. Align module to socket notch & side guide.

Close-up of gloved hands assembling a memory chip into a motherboard (no visible text or symbols)

Close-up of a computer motherboard with visible slots, chips, and connectors (no readable text or symbols)

1. Press down both edge side of module at the same time.

2. Confirm latch ejectors closed properly.

We validated the possibility of cracking tendencies through various tests. Various products, Environments, and characteristics of tools can cause errors and affect test results.

However, the most important conclusion that can be deduced from the tests is that special caution against mechanical damage and handling errors should be taken from the point of unpacking modules to inserting into the sockets on system boards.

Recent memory module products are structurally weak to external damage due to the increasing numbers of ICs and passive components and the unit's diminishing size.

It's difficult to predict and find out clear root causes of failures related with BOC PKG passive components due to many variances and circumstances. However, the above guidelines for memory module handling based on test results should help with crack-related problems and make more effective process control possible.

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