M393A2K43CB2-CVF - Memory Card SAMSUNG - Free user manual and instructions

Product Type	Memory Module (RDIMM)
Brand	Samsung
Model	M393A2K43CB2-CVF
Capacity	16 GB
Memory Type	DDR4
Speed	2666 MHz (PC4-21300)
Form Factor	288-pin RDIMM
Voltage	1.2 V
ECC Support	Yes (Error-Correcting Code)
Registered/Buffered	Registered
CAS Latency	19
Operating Temperature	0°C to 85°C
Dimensions (L x W x H)	133.35 mm x 30 mm x 1.23 mm
Weight	Approx. 15 g
Warranty	Limited lifetime warranty
Compatibility	Servers and workstations supporting DDR4 RDIMMs
RoHS Compliant	Yes
Manufacturing Date	Check label on module
Memory Rank	1Rx8 or 2Rx8
Use Case	Enterprise servers, data centers
Safety Precautions	Handle by edges, avoid static discharge, install in compatible slot

Frequently Asked Questions - M393A2K43CB2-CVF SAMSUNG

What is the capacity of the Samsung M393A2K43CB2-CVF memory module?

The Samsung M393A2K43CB2-CVF is a 16 GB DDR4 memory module.

What is the speed and type of this memory?

It is a DDR4-2666 (PC4-21300) memory module operating at 1.2V.

Is this memory ECC or non-ECC?

Yes, it supports ECC (Error-Correcting Code) and is registered (RDIMM).

What form factor does this module use?

It uses the 288-pin RDIMM form factor, commonly used in servers.

Is this memory compatible with my desktop motherboard?

No, this module is designed for servers and workstations that support registered DDR4 memory. It is not compatible with standard desktop motherboards.

How do I install this memory module?

Power off the system, open the chassis, align the notch on the module with the slot, and press down firmly until the clips lock. Handle by the edges to avoid static damage.

What is the CAS latency of this module?

The CAS latency is 19 (CL19).

Does this module come with a warranty?

Samsung offers a limited lifetime warranty for this memory module.

Can I mix this module with other memory modules?

It is recommended to use identical modules for best performance. Mixing with different speeds or capacities may cause instability.

What is the operating temperature range?

The recommended operating temperature is 0°C to 85°C.

USER MANUAL M393A2K43CB2-CVF SAMSUNG

Module Handling Guide

How to handle the module

Recently module failure related with Active/Passive/Component crack has increased.

Main root causes are wrong handling method and mechanical damage.

Current products have more cap. & resistors and the sizes of those passives are reduced and most of them are located around edge area.

These characteristics require more cautious module handling method.

This guide book tries to find out tendency and range of module crack pattern based on experiments from several aspects. The main purpose is to reinforce Samsung's process control and help customer effectively control module handling process.

Test methods are PCB Bow, Twist, Drop Test, UTM(Universal Testing Machine) Test for DRAM, Resister & Capacitor. We observed crack phenomena and tendency through the datum and pictures. Tested products are limited to Registered DIMM [RDIMM], Unbuffered DIMM [UDIMM] and BOC PKG based Module, therefore test results might be different when applied to other products.

Memory Module Introduction

Green printed circuit board with multiple black integrated circuits (no visible text or symbols)

Unbuffered DIMM

Green integrated circuit chip with multiple 12-pin memory chips and a central RCD (no visible text or symbols)

Load Reduced DIMM

Registered DIMM

Green printed circuit board with multiple black and white memory chips (no visible text or symbols)

SODIMM

Person in white protective suit with blue wristband and blue cord, no visible text or symbols

Close-up of gloved hands installing or adjusting a black plastic tray with green internal components (no text or symbols visible)

Person in white lab coat and gloves holding a memory chip (no visible text or symbols)

Close-up of a gloved hand holding a transparent plastic tray with internal channels, placed on a green surface (no visible text or symbols)

• Anti-ESD * straps should be used.
  • The strap should be linked to your body.

*ESD : Electro Static Discharge

• Modules should be picked up from packing trays only one-by-one.
  • Product should be handled at the conductive mat.

• Do not grab packages. Hold only the edge of the PCB with both hands.

• Wear gloves when handling.

- Tray must be covered when handling module tray.

Person in cleanroom suit holding a green circuit board with a red diagonal line (no text or symbols visible)

Person in white gloves and gloves handling multiple RAM chips on a carpet, with a red diagonal line overlay (no text or symbols)

Hand in white glove holding a series of microcontroller chips against a green background (no text or symbols visible)

Close-up of a hand holding a small electronic component against a green background, with a red diagonal line overlay (no text or symbols visible)

- Do not twist or bow a module.

- Do not drop modules on the floor.

- Do not grip several modules using one hand.

- Do not touch module without gloves. It can cause tab contamination.

Close-up of gloved hands using a tool on a green surface, with a red diagonal line overlay (no text or symbols)

Close-up of gloved hands holding a microchip with a red diagonal line against a green background (no text or symbols visible)

Close-up of a computer motherboard with a red diagonal line overlay, showing a stack of RAM chips and connected cables (no visible text or symbols)

Close-up of a computer motherboard with a green RAM module and blue CPU socket, overlaid with a red diagonal line (no text or symbols visible)

- Do not detach H/S * or clip. (FDHS product) *H/S : Heat Spreader

- Handling modules near tools is prohibited because hard metal objects can damage Module.

- Do not insert the module by seating one end first then seating the other. (This is called zippering or rock)

- Do not insert module upper side.

Close-up of electronic circuit boards with a red diagonal line overlay (no readable text or symbols)

Close-up of a green RAM module being lifted by a red diagonal line over a blue rack (no text or symbols visible)

Close-up of gloved hands adjusting a red diagonal line on a computer motherboard (no visible text or symbols)

Close-up of a computer motherboard with a red diagonal line indicating a performance gap (no text or symbols visible)

- Do not insert module between sockets.

- Do not insert key notch reverse.

- Do not insert several modules at the same time. (or simultaneously)

- Do not use metal tools when the socketing.

Close-up of a computer motherboard with RAM slots and CPU socket (no visible text or symbols)

Close-up of a computer motherboard with blue and white CPU slots, marked by yellow circles and red prohibition signs (no readable text or symbols)

Close-up of gloved hands installing a memory card into a rack (no visible text or symbols)

Close-up of hands assembling a memory module with blue and black components (no visible text or symbols)

1. Socketing must be conducted before turn-on.

2. Ensure that both latch ejectors of connector are fully opened.

3. Grip the module edge side with both hands. (avoid touching component area)

4. Align module to socket notch & side guide.

Close-up of gloved hands assembling a memory chip into a motherboard (no visible text or symbols)

Close-up of a computer motherboard with visible slots, chips, and connectors (no readable text or symbols)

1. Press down both edge side of module at the same time.

2. Confirm latch ejectors closed properly.

We validated the possibility of cracking tendencies through various tests. Various products, Environments, and characteristics of tools can cause errors and affect test results.

However, the most important conclusion that can be deduced from the tests is that special caution against mechanical damage and handling errors should be taken from the point of unpacking modules to inserting into the sockets on system boards.

Recent memory module products are structurally weak to external damage due to the increasing numbers of ICs and passive components and the unit's diminishing size.

It's difficult to predict and find out clear root causes of failures related with BOC PKG passive components due to many variances and circumstances. However, the above guidelines for memory module handling based on test results should help with crack-related problems and make more effective process control possible.

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