BG3 - SSD Drive TOSHIBA - Free user manual and instructions

Product Type	SSD Drive
Manufacturer	Toshiba (Kioxia)
Model Series	BG3
Capacities	128GB, 256GB, 512GB
Form Factors	M.2 1620 single package (20mm x 16mm x 1.3/1.5mm) and M.2 2230 single-sided module (30mm x 22mm x 2.18/2.38mm)
Interface	PCIe Gen3 x2, NVMe 1.2.1
Memory Type	Toshiba 64-layer BiCS FLASH TLC
Sequential Read (Max)	Non-SED: up to 1,500 MB/s; SED: up to 1,300 MB/s
Sequential Write (Max)	Non-SED: up to 1,000 MB/s; SED: up to 950 MB/s
Power Consumption (Typical)	Read: 2.7-3.3W, Write: 2.1-3.2W, Idle PS3: 50mW, PS4: 5mW
Supply Voltage	3.3V, 1.8V, 1.2V (1620); 3.3V (2230)
Operating Temperature	0 to 80°C (package or component temperature)
Non-operating Temperature	-40 to 85°C
Shock Resistance	Operating: 1,500 G / 0.5ms; Non-operating: 100cm free drop
Vibration Resistance	Operating: 20 G peak, 10-2000 Hz
Reliability	MTTF: 1,500,000 hours; Product Life: ~5 years
Weight	M.2 1620: 0.85-1.00g; M.2 2230: 2.42-2.60g
Key Features	Host Memory Buffer (HMB), Host Controlled Thermal Management (HCTM), Device Self-test, Firmware Security, TCG OPAL 2.01 (SED models)
Compliance	UL, cUL, TÜV, KC, FCC, BSMI, CE, RCM, ISED, VCCI, Moroccan conformity (M.2 2230 only)
Maintenance	No user-serviceable parts. Use in clean, dry environment.
Safety Precautions	Use within specified voltage and temperature. Avoid physical shock.
Spare Parts and Repairability	Not repairable. Replacement required. Warranty coverage varies.

Frequently Asked Questions - BG3 TOSHIBA

What is the maximum sequential read speed of the Toshiba BG3 SSD?

The maximum sequential read speed is up to 1,500 MB/s for non-SED models and up to 1,300 MB/s for SED models.

What capacities are available for the BG3 series?

The BG3 series is available in 128GB, 256GB, and 512GB capacities.

What is the difference between SED and non-SED models?

SED (Self-Encrypting Drive) models support TCG OPAL 2.01 for hardware-based encryption, while non-SED models do not have this feature.

Which form factors does the BG3 support?

The BG3 supports two form factors: M.2 1620 single package (20mm x 16mm) and M.2 2230 single-sided module (30mm x 22mm).

Does the BG3 SSD support NVMe?

Yes, it supports NVMe Revision 1.2.1 via PCIe Gen3 x2 interface.

What is the typical power consumption of the BG3?

Typical power consumption: read 2.7-3.3W, write 2.1-3.2W, idle (PS3) 50mW, and deep sleep (PS4) 5mW.

What is the operating temperature range?

The operating temperature range is 0 to 80°C (measured at package or component surface).

Is the BG3 compatible with PCIe Gen3 x2?

Yes, it uses a PCIe Gen3 x2 lane interface and is backward compatible with Gen2 and Gen1.

What is the expected lifespan of the BG3 SSD?

The product life is approximately 5 years with an MTTF of 1,500,000 hours.

What applications is the BG3 suitable for?

It is ideal for ultra-mobile PCs, 2-in-1 notebooks, IoT/embedded devices, and server boot drives.

USER MANUAL BG3 TOSHIBA

The BG3 series leverages 64-layer, 3-bit-per-cell (TLC) BICS FLASH™ and features NVMe™ Revision 1.2.1. With Host Memory Buffer (HMB) technology, this SSD series retains high performance in a DRAM-less architecture, while enabling reduced power and a smaller footprint.

BG3 SSDs, as an innovative, next generation single-package ball grid array (BGA) SSD product line, harness the flexibility in system design that enables mobile computing and IoT embedded devices to be smaller, lighter, faster, and more power efficient. Also, these power-saving BG3 SSDs offer data center applications an alternative solution for server boot storage.

The BG3 series is available in 128GB, 256GB, and 512GB capacities. All three models are available in a surface-mount single package M.2 1620 or a removable module M.2 2230 form factor. BG3 SED models are also available.

> KEY FEATURES

• Toshiba 64-Layer BiCS FLASH™
• PCIe® Gen3*2L NVMe™
• Capacities up to 512GB
- M.2 1620 single package and M.2 2230 single-sided form factor
• TCG OPAL 2.01 Optional for SED

> APPLICATIONS

• Ultra-mobile PCs
  • 2-in-1 notebook PCs
  • IoT/embedded devices
  • Server and storage array boot drives

> SPECIFICATIONS

Standard Models		M.2 1620-S2Single Package		M.2 1620-S3Single Package		M.2 2230-S2Single-sided		M.2 2230-S3Single-sided
Model Number	(Non-SED)	KBG30ZPZ128G	KBG30ZPZ256G	KBG30ZPZ512G	KBG30ZMS128G	KBG30ZMS256G	KBG30ZMS512G
	(SED)	KBG3AZPZ128G	KBG3AZPZ256G	KBG3AZP Z512G	KBG3AZMS128G	KBG3AZMS256G	KBG3AZMS512G
Memory		TLC (BiCS FLASHTM)
Interface		PCI Express® Base Specification Revision 3.1a (PCIe®)

Standard Models		M.2 1620-S2Single Package	M.2 1620-S3Single Package	M.2 2230-S2Single-sided	M.2 2230-S3Single-sided
Size		20.0 mm x16.0 mm x1.3 mm	20.0 mm x16.0 mm x1.5 mm	30.0 mm x22.0 mm x2.18 mm	30.0 mm x22.0 mm x2.38 mm
Weight		0.85 g typ.	1.00 g typ.	2.42 g typ.	2.60 g typ.
Tempera-ture	Operating	0 to 80 °C(Package Surface Temperature)		0 to 80 °C(Components Temperature)
	Non-operating	-40 to 85 °C
Reliability3)		Mean Time to Failure (MTTF): 1,500,000 hoursProduct Life: Approximately 5 years
More Features		·Device Self-test is supported.·Host Controlled Thermal Management (HCTM) is supported.·The feature of Host Memory Buffer (HMB) is supported.·Firmware security feature (only digitally signed firmware can be installed) is supported.
Compliance4)		UL, cUL, TÜV, KC, FCC, BSMI, CE, RCM, ISED, VCCI, Moroccan conformity mark

Note: 1) Definition of capacity: Toshiba Memory Corporation defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1GB = 2³⁰ = 1,073,741,824 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, such as Microsoft Operating System and/or pre-installed software applications, or media content. Actual formatted capacity may vary.
2) Read and write speed, tested on the state of "Host Memory Buffer (HMB) = On", may vary depending on the host device, read and write conditions, and file size. 1 MiB (mebibyte) = 2²⁰ bytes = 1,048,576 bytes, and 1 MB (megabyte) = 1,000,000 bytes.
3) MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean failure rates for a large number of products which may not accurately reflect actual operation. Actual operating life of the product may be different from the MTTF.
4) The Safety/EMI Standard is supported for KBG3xZMSxxxx only.

* PCIe and PCI Express are registered trademarks of PCI-SIG

* NVMe™ and NVM Express™ are trademarks of NVM Express, Inc.

* All other company names, product names, and service names mentioned herein may be trademarks of their respective companies.

* Availability of the SED model line-up may vary by region.

> ORDERING INFORMATION

1

2

3

4

5

6

7

8

1. Product Name K: SSD product
2. Prodct Category BG: BG Series
3. Development Generation 3: Generation 3
4. Option Code 1 0: Non-SED

A: SED

1. Option Code 2 Z: No-option

2. Connector Type M: M.2 (B-M Key)

P: M.2 BGA

1. Form Factor S: M.2 2230 Single Sided

Z: M.2 1620 Single Package

1. Capacity 128G / 256G / 512G

128G is 128 GB, 256G is 256 GB and 512G is 512 GB

(1 GB = 1,000,000,000 bytes)

PRODUCT LINE UP

Model Number	Formatted Capacity	Form Factor/Connect Type	Function
			Note
KBG30ZPZ128G	128 GB	M.2 1620-S2 1)	Non-SED
KBG30ZPZ256G	256 GB
KBG30ZPZ512G	512 GB	M.2 1620-S3 2)
KBG3AZPZ128G	128 GB	M.2 1620-S2 1)	SED 3)
KBG3AZPZ256G	256 GB
KBG3AZPZ512G	512 GB	M.2 1620-S3 2)
KBG30ZMS128G	128 GB	M.2 2230-S2 1) -B-M	Non-SED
KBG30ZMS256G	256 GB
KBG30ZMS512G	512 GB	M.2 2230-S3 2) -B-M
KBG3AZMS128G	128 GB	M.2 2230-S2 1) -B-M	SED 3)
KBG3AZMS256G	256 GB
KBG3AZMS512G	512 GB	M.2 2230-S3 2) -B-M

Note: 1) Single Sided/Top side 1.35mm Maximum Thickness

2) Single Sided/Top side 1.5 mm Maximum Thickness

3) Availability of the SED model line-up may vary by region.

CAPACITY

Capacity	Total Number of User Addressable Sectors in LBA Mode
	512 bytes sector	4,096 bytes sector
128 GB1)	250,069,680	31,258,710
256 GB1)	500,118,192	62,514,774
512 GB1)	1,000,215,216	125,026,902

Note: 1) 1 GB (Gigabyte) = 1,000,000,000 bytes

PERFORMANCE

Standard Models	(Non-SED)	KBG30ZPZ128G KBG30ZMS128G	KBG30ZPZ256G KBG30ZMS256G	KBG30ZPZ512G KBG30ZMS512G
	(SED)	KBG3AZPZ128G KBG3AZMS128G	KBG3AZPZ256G KBG3AZMS256G	KBG3AZPZ512G KBG3AZMS512G
Interface Speed		16 GT/s (Gen3x2 Lane), 8 GT/s (Gen3x1 Lane)10 GT/s (Gen2x2 Lane), 5 GT/s (Gen2x1 Lane)5 GT/s (Gen1x2 Lane), 2.5 GT/s (Gen1x1 Lane)
Sequential Read 1) (Up to)	(Non-SED)	1,300 MB/s {1,240 MiB/s}	1,400 MB/s {1,330 MiB/s}	1,500 MB/s {1,430 MiB/s}
	(SED)	1,200 MB/s {1,140 MiB/s}	1,250 MB/s {1,190 MiB/s}	1,300 MB/s {1,240 MiB/s}
Sequential Write 1) (Up to)	(Non-SED)	600 MB/s {570 MiB/s}	800 MB/s {760 MiB/s}	1,000 MB/s {950 MiB/s}
	(SED)	550 MB/s {520 MiB/s}	750 MB/s {710 MiB/s}	950 MB/s {900 MiB/s}

Note: 1) Under the condition of measurement with 128 KiB unit sequential access and 4KiB align. Queue depth is 32, and access range is 16GiB. 1KiB (Kibibyte) = 2¹⁰ bytes = 1024 bytes

Products and specicaons discussed herein are for reference purposes only and are subject to change without noce. All informaon discussed herein is provided on an "as is" basis, without warranes of any kind. Before creang and producing designs and using, customers must refer to and comply with the latest versions of the product specicaons.

SUPPLY VOLTAGE

Standard Models	M.2 1620 Single Package	M.2 2280 Module
Allowable voltage	3.3 V ±5 %1.8 V ±5 %1.2 V ±5 %	3.3 V ±5 %
Allowable noise/ripple	100 mV p-p, 0-10MHz
Allowable supply rise time	Comply to the PCI-SIG specification of Power Up/Down Sequence	2 –100 ms

POWER CONSUMPTION

Operation(Ta1)=25°C)	M.2 1620 Single Package
	KBG30ZPZ128GKBG3AZPZ128G	KBG30ZPZ256GKBG3AZPZ256G	KBG30ZPZ512GKBG3AZPZ512G
Read2)	2.7 W typ.	2.8 W typ.	2.8 W typ.
Write2)	2.1 W typ.	2.4 W typ.	2.8 W typ.
Power State33)	50 mW typ.
Power State43)	5 mW typ.

Operation(Ta1)=25°C)	M.2 2230 Module
	KBG30ZMS128GKBG3AZMS128G	KBG30ZMS256GKBG3AZMS256G	KBG30ZMS512GKBG3AZMS512G
Read2)	3.2 W typ.	3.3 W typ.	3.3 W typ.
Write2)	2.5 W typ.	2.8 W typ.	3.2 W typ.
Power State 33)	50 mW typ.
Power State 43)	5 mW typ.

Note: 1) Ambient Temperature
2) The values are specified at the condition causing maximum power consumption and Power State 0.
3) PCIe Link state L1.2
Power consumption during the Admin command processing is excluded.

ENVIRONMENTAL CONDITIONS

> TEMPERATURE

Condition	Range		Gradient
	M.2 1620 Single Package	M.2 2280 Module
Operating1)	0 °C (Tc) – 80 °C (Tc)(Package Temperature)	0 °C (Tc) – 80 °C (Tc)(Components Temperature)	30 °C (Ta) / h maximum
Non-operating	-40 °C – 85 °C		30 °C / h maximum
Under Shipment 2)	-40 °C – 85 °C		30 °C / h maximum

Note: 1) Ta: Ambient Temperature, Tc: Package Surface or Components Temperature
2) Packaged in Toshiba Memory Corporation's original shipping package.

HUMIDITY

Condition	Range
Operating	8 % – 90 % R.H. (No condensation)
Non-operating	8 % – 95 % R.H. (No condensation)
Under Shipment1)	5 % – 95 % R.H.
Max. wet bulb	32.5 °C (Operating)40.0 °C (Non-operating / Shipping)

Note: 1) Packaged in Toshiba Memory Corporation's original shipping package.

> SHOCK

Condition	Range
Operating1)	14.709 km/s 2 {1,500 G}, 0.5 ms half sine wave
Non-operating1)
Under Shipment2)	100 cm free drop

Note: 1) Apply shocks in each direction of the drive's three mutually perpendicular axes, one axis at a time.
2) Packaged in Toshiba Memory Corporation's original shipping package.

VIBRATION

Condition	Range
Operating	196 m/s 2 {20 G} Peak, 10 - 2,000 Hz(20 minutes per axis) x 3 axis
Non-operating

Products and specicaons discussed herein are for reference purposes only and are subject to change without noce. All informaon discussed herein is provided on an "as is" basis, without warranes of any kind. Before creang and producing designs and using, customers must refer to and comply with the latest versions of the product specicaons.

COMPLIANCE

SAFETY / EMI STANDARDS

Title	Description	Region
UL1)(Underwriters Laboratories)	UL 60950-1	USA2)
cUL1)(Underwriters Laboratories of Canada)	CSA-C22.2 No.60950-1-07	Canada
TÜV1)(Technischer Überwachungs Verein)	EN 60950-1	EURO
KC1)	KN32, KN35	Korea
FCC1)	FCC part 15 Subpart B	USA
BSMI1)(Bureau of Standards, Metrology and Inspection)	CNS13438 (CISPR Pub. 22)	Taiwan
CE1)	EN 55032, EN 55024	EURO
RCM1)	AS/NZS CISPR 32	Australia, New Zealand
ISED1)	ICES-003	Canada
Moroccan conformity mark1)	NM EN 55032, NM EN 22024	Morocco
VCCI1)	VCCI-CISPR32	Japan

Note: 1) The Safety/EMI Standard is supported for KBG3xZMSxxxx only.
2) UL certification is basically on a voluntary basis.

RELIABILITY

Parameter	Value
Mean Time to Failure	1,500,000 hours
Product Life	Approximately 5 years

MECHANICAL SPECIFICATIONS

M.2 1620 SINGLE PACKAGE

Model Number	Weight	Width	Height	Length
KBG30ZPZ128G	0.85 g typ.	16.00 mm	1.30 mm	20.00 mm
KBG3AZPZ128G
KBG30ZPZ256G
KBG3AZPZ256G
KBG30ZPZ512G	1.00 g typ.		1.50 mm
KBG3AZPZ512G

Unit:mm

Dimension	Description	KBG30ZPZ128GKBG3AZPZ128GKBG30ZPZ256GKBG3AZPZ256G	KBG30ZPZ512GKBG3AZPZ512G
c	Thickness of BGA Package	1.30 mm Max.	1.50 mm Max.

Figure 1: Dimensions of KBG3xZPZxxxx (Single Package)

Products and speciaons discussed herein are for reference purposes only and are subject to change without noce. All informaon discussed herein is provided on an “as is” basis, without warranes of any kind. Before creang and producing designs and using, customers must refer to and comply with the latest versions of the product speciaons.

M.2 2230 MODULE

Model Number	Weight	Width	Height	Length
KBG30ZMS128GKBG3AZMS128G	2.42 g typ.	22.00 mm	2.18 mm	30.00 mm
KBG30ZMS256GKBG3AZMS256G
KBG30ZMS512GKBG3AZMS512G	2.60 g typ.		2.38 mm

Unit:mm

Dimension	Description	KBG30ZMS128GKBG3AZMS128GKBG30ZMS256GKBG3AZMS256G	KBG30ZMS512GKBG3AZMS512G
A	Thickness of BGA Package (without label)	1.30 mm Max.	1.50 mm Max.

Figure 2: Dimensions of KBG3xZMSxxxx (M.2 2230 Module)

Products and specicaons discussed herein are for reference purposes only and are subject to change without noce. All informaon discussed herein is provided on an "as is" basis, without warranes of any kind. Before creang and producing designs and using, customers must refer to and comply with the latest versions of the product specicaons.

INTERFACE CONNECTOR

M.2 1620 SINGLE PACKAGE

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

A

DNU

DNU

DNU

DNU

DNU

DNU

DNU

DNU

DNU

DNU

B

DNU

DNU

DNU

NC

DNU

DNU

DNU

DNU

DNU

DNU

C

GND

GND

GND

GND

GND

DNU

NC

NC

DNU

NC

DNU

DNU

RFU

RFU

GND

DNU

DNU

DNU

D

REFCLKP

REFCLKN

GND

PERST#

CLKREQ#

PWR1

PWR1

GND

DNU

DIAG1

NC

RFU

E

GND

GND

GND

GND

GND

GND

GND

NC

PWR1

PWR1

GND

NC

DIAG0

GND

GND

DNU

DNU

DNU

F

PERp0

PERn0

GND

PEDET

RFU

G

GND

GND

GND

GND

GND

PWR3

PWR3

GND

GND

PWR3

PWR3

GND

GND

DNU

DNU

DNU

H

PETp0

PETn0

PWR3

PWR3

GND

GND

PWR3

PWR3

RFU

RFU

J

GND

GND

GND

GND

GND

PWR3

PWR3

GND

GND

PWR3

PWR3

GND

GND

DNU

DNU

DNU

K

PERp1

PERn1

GND

GND

GND

GND

GND

GND

RFU

RFU

L

GND

GND

GND

GND

GND

RFU

RFU

RFU

RFU

RFU

RFU

GND

GND

DNU

DNU

NC

M

PETp1

PETn1

RFU

RFU

GND

GND

RFU

RFU

RFU

RFU

N

GND

GND

GND

GND

GND

RFU

RFU

RFU

RFU

RFU

RFU

GND

GND

DNU

NC

NC

P

NC

NC

GND

GND

GND

GND

GND

GND

RFU

RFU

R

GND

GND

GND

GND

GND

PWR2

PWR2

GND

GND

PWR2

PWR2

GND

GND

DNU

NC

NC

T

NC

NC

PWR2

PWR2

GND

GND

PWR2

PWR2

RFU

RFU

U

GND

GND

GND

GND

GND

PWR2

PWR2

GND

GND

PWR2

PWR2

GND

GND

DNU

NC

NC

V

NC

NC

RFU

RFU

W

GND

GND

GND

GND

GND

GND

LED1#

RFU

PWR1

PWR1

GND

RFU

RFU

GND

GND

DNU

DNU

NC

Y

NC

NC

GND

DNU

DNU

PWR1

PWR1

GND

DNU

GND

DNU

DNU

AA

GND

GND

GND

GND

GND

DNU

DNU

DNU

DNU

NC

DNU

DNU

DNU

GND

GND

DNU

DNU

DNU

AB

DNU

DNU

DNU

DNU

DNU

DNU

DNU

DNU

DNU

DNU

AC

DNU

DNU

DNU

DNU

DNU

DNU

DNU

DNU

DNU

DNU

Note: 1) The total ball number is 291.
2) The voltage powers must be supplied to each ball on all power rails.
3) NC is not used in KBG3xZPZxxxx. But NC ball function is assigned in PCI-SiG specification.
4) NC, DNU and RFU must be connected to independent OPEN land, and can't be connected between each other on host board.
5) DIAG0 and DIAG1 are engineering diagnosis balls. Toshiba Memory Corporation requests to enable access to DIAG0 and DIAG1 on host board.

Figure 3: Ball Map of KBG3xZPZxxxx (Single Package)

Products and speciaons discussed herein are for reference purposes only and are subject to change without noce. All informaon discussed herein is provided on an “as is” basis, without warranes of any kind. Before creang and producing designs and using, customers must refer to and comply with the latest versions of the product speciaons.

SINGLE PACKAGE INTERFACE SIGNALS

Interface	Signal Name	Description	Location
Power and Grounds	PWR_1	3.3 V Source	D9, D10, E9, E10, W9, W10, Y9, Y10
	PWR_2	1.8 V Source	R7, R8, R11, R12, T7, T8, T11, T12, U7, U8, U11, U12
	PWR_3	1.2 V Source	G7, G8, G11, G12, H7, H8, H11, H12, J7, J8, J11, J12
Power and Grounds	GND	GND	C1-C5, C15, D6, D11, E1-E7, E11, E14, E15, F6, G1-G5, G9, G10, G14, G15, H9, H10, J1-J5, J9, J10, J14, J15, K7-K12, L1-L5, L14, L15, M9, M10, N1-N5, N14, N15, P7-P12, R1-R5, R9, R10, R14, R15, T9, T10, U1-U5, U9, U10, U14, U15, W1-W6, W11, W14, W15, Y6, Y11, Y13, AA1-AA5, AA14, AA15
PCIe	PERp0, PERn0	PCIe 0Device Receiver	F4, F5
	PETp0, PETn0	PCIe 0Device Transfer	H4, H5
	PERp1, PERn1	PCIe 1Device Receiver	K4, K5
	PETp1, PETn1	PCIe 1Device Transfer	M4, M5
	REFCLKp, REFCLKn	PCIe Reference Clock	D4, D5
	PERST#	PE-Reset	D7
	CLKREQ#	Clock Request	D8
SSD Specific Signals	LED1#	Device Activity	W7
	PEDET	Host I/F Indication (PCIe:OPEN / SATA:GND)	F14
Optional Signals	DIAG0, DIAG1	Diagnosis, option for engineering	D13, E13

Products and specicaons discussed herein are for reference purposes only and are subject to change without noce. All informaon discussed herein is provided on an "as is" basis, without warranes of any kind. Before creang and producing designs and using, customers must refer to and comply with the latest versions of the product specicaons.

Interface	Signal Name	Description	Location
Other Signals	RFU	Reserved; OPEN	C13, C14, D15, F15, H14, H15, K14, K15, L7, L8, L9, L10, L11, L12, M7, M8, M11, M12, M14, M15, N7, N8, N9, N10, N11, N12, P14, P15, T14, T15, V14, V15, W8, W12, W13
	DNU	Manufacturing purpose only;OPEN	A1, A2, A4, A6, A8, A11, A13, A15, A17, A18, B1, B2, B4, B8, B11, B13, B15, B17, B18, C6, C9, C11, C12, C16-C18, D12, E16-E18, G16-G18, J16-J18, L16, L17, N16, R16, U16, W16, W17, Y7, Y8, Y12, Y14, Y15, AA6-AA9, AA11-AA13, AA16-AA18, AB1, AB2, AB4, AB6, AB8, AB11, AB13, AB15, AB17, AB18, AC1, AC2, AC4, AC6, AC8, AC11, AC13, AC15, AC17, AC18
	NC	Not used; OPEN	B6, C7, C8, C10, D14, E8, E12, L18, N17, N18, P4, P5, R17, R18, T4, T5, U17, U18, V4, V5, W18, Y4, Y5, AA10

Products and specicaons discussed herein are for reference purposes only and are subject to change without noce. All informaon discussed herein is provided on an “as is” basis, without warranes of any kind. Before creang and producing designs and using, customers must refer to and comply with the latest versions of the product specicaons.

M.2 2230 MODULE

Unit:mm
Figure 4: Interface Dimensions of KBG3xZMSxxxx (M.2 2230 Module)

Products and specicaons discussed herein are for reference purposes only and are subject to change without noce. All informaon discussed herein is provided on an “as is” basis, without warranes of any kind. Before creang and producing designs and using, customers must refer to and comply with the latest versions of the product specicaons.

M.2 2230 MODULE CONNECTOR PIN ASSIGNMENT

Pin #	Signal Name	Description
1	CONFIG_3	GND
3	GND	GND
5	Reserved	NC
7	Reserved	NC
9	Reserved	NC
11	Reserved	NC
Notch
21	CONFIG_0	GND
23	Reserved	NC
25	Reserved	NC
27	GND	GND
29	PETn1	PCIe 1Device Transfer
31	PETp1
33	GND	GND
35	PERn1	PCIe 1Device Receiver
37	PERp1
39	GND	GND
41	PETn0	PCIe 0Device Transfer
43	PETp0
45	GND	GND
47	PERn0	PCIe 0Device Receiver
49	PERp0
51	GND	GND
53	REFCLKn	PCIe Reference Clock
55	REFCLKp	PCIe Reference Clock
57	GND	GND
Notch
67	Reserved	NC
69	PEDET	Host I/F Indication (PCIe:OPEN / SATA:GND)
71	GND	GND
73	GND	GND
75	GND	GND

Pin #	Name	Description
2	+3.3V	3.3 V Source
4	+3.3V	3.3 V Source
6	Reserved	NC
8	Reserved	NC
10	LED1#	Device Activity
Notch
20	Reserved	NC
22	Reserved	NC
24	Reserved	NC
26	Reserved	NC
28	Reserved	NC
30	Reserved	NC
32	Reserved	NC
34	Reserved	NC
36	Reserved	NC
38	Reserved	NC
40	Reserved	NC
42	Reserved	NC
44	Reserved	NC
46	Reserved	NC
48	Reserved	NC
50	PERST#	PE-Reset
52	CLKREQ#	Clock Request
54	PEWAKE#	NC
56	MFG DATA	Manufacturing pin. Must NOT be connected on host board.
58	MFG CLOCK
Notch
68	SUSCLK	NC
70	+3.3V	3.3 V Source
72	+3.3V	3.3 V Source
74	+3.3V	3.3 V Source

COMMAND TABLE

ADMIN Command set

Op-Code	Command Name
00h	Delete I/O Submission Queue
01h	Create I/O Submission Queue
02h	Get Log Page
04h	Delete I/O Completion Queue
05h	Create I/O Completion Queue
06h	Identify
08h	Abort
09h	Set Features
0Ah	Get Features
0Ch	Asynchronous Event Request
10h	Firmware Commit
11h	Firmware Image Download
14h	Device Self-Test (DST)
80h	Format NVM
81h	Security Send
82h	Security Receive

Set Features / Get Features Set

Op-Code	Feature Name
01h	Arbitration
02h	Power Management
04h	Temperature Threshold
05h	Error Recovery
06h	Volatile Write Cache
07h	Number of Queues
08h	Interrupt Coalescing
09h	Interrupt Vector Configuration
0Ah	Write Atomicity
0Bh	Asynchronous Event Configuration
0Ch	Autonomous Power State Transition
0Dh	Host Memory Buffer (HMB)
10h	Host Controlled Thermal Management (HCTM)

Products and specicaons discussed herein are for reference purposes only and are subject to change without noce. All informaon discussed herein is provided on an "as is" basis, without warranes of any kind. Before creang and producing designs and using, customers must refer to and comply with the latest versions of the product specicaons.

NVMe Command Set

Op-Code	Command Name
00h	Flush
01h	Write
02h	Read
04h	Write Uncorrectable
05h	Compare
09h	Dataset Management

Products and specicaons discussed herein are for reference purposes only and are subject to change without noce. All informaon discussed herein is provided on an “as is” basis, without warranes of any kind. Before creang and producing designs and using, customers must refer to and comply with the latest versions of the product specicaons.

> RESTRICTIONS ON PRODUCT USE

Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as "TOSHIBA".

Hardware, software and systems described in this document are collectively referred to as "Product".

• TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.

- PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA sales representative.

- Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.

- Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations.

- The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.

- ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

- Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.

- Product may include products subject to foreign exchange and foreign trade control laws.

- Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.