ProLiant BL680c G7 - Server HP - Free user manual and instructions

Product Type	Server Blade
Model	HP ProLiant BL680c G7
Height	10.72 cm (4.22 in)
Depth	51.28 cm (20.09 in)
Width	36.73 cm (14.46 in)
Weight (maximum)	21.8 kg (47.9 lb)
Weight (minimum)	15.9 kg (35.1 lb)
Processor Support	Up to 4 Intel Xeon 7500 series processors
Memory Support	Up to 64 DDR3 RDIMMs, up to 1 TB
Hard Drive Support	4 hot-plug SAS or SATA drives
Embedded Controller	Smart Array P410i with RAID 0, 1, 1+0, 5, 6 (cache module required for 1+0, 5, 6)
Expansion Slots	7 mezzanine connectors for networking or Fibre Channel
Management	iLO 3 Standard Blade Edition
Power Supply	Via HP BladeSystem c-Class enclosure
Operating Temperature	10°C to 35°C (50°F to 95°F)
Non-Operating Temperature	-30°C to 60°C (-22°F to 140°F)
Relative Humidity (operating)	10% to 90% @ 28°C (82.4°F)
Maintenance	Hot-plug drives, replaceable DIMMs, processors, mezzanine cards, battery/capacitor pack, system battery
Safety Features	ESD grounding, hot surface warnings, battery handling precautions
Regulatory Compliance	FCC Class A, CE, BSMI, Korean EMC, etc.

Frequently Asked Questions - ProLiant BL680c G7 HP

How do I power up the HP ProLiant BL680c G7 server blade?

How do I power down the server blade safely?

What is the maximum memory capacity?

How do I install additional processors?

What RAID levels are supported?

How do I interpret the hard drive LEDs?

Can I mix SAS and SATA drives in a RAID volume?

How do I replace the system battery?

What is the HP c-Class Blade SUV Cable used for?

How do I clear the system configuration?

USER MANUAL ProLiant BL680c G7 HP

HP ProLiant BL680c G7 Server Blade User Guide

© Copyright 2010 Hewlett-Packard Development Company, L.P.

The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.

Microsoft, Windows, and Windows Server are U.S. registered trademarks of Microsoft Corporation.

Intended audience

This document is for the person who installs, administers, and troubleshoots servers and storage systems. HP assumes you are qualified in the servicing of computer equipment and trained in recognizing hazards in products with hazardous energy levels.

Contents

Component identification....7

Front panel components and LEDs....7

SAS and SATA hard drive LEDs 8

SAS and SATA hard drive LED combinations 8

System board components (A-side)....9

System board components (B-side)....10

System maintenance switch....11

System maintenance switch procedures ....11

Interposer board components 13

DIMM slot locations (A-side) 14

DIMM slot locations (B-side) 15

HP c-Class Blade SUV Cable 15

Operations.... 17

Power up the server blade....17

Power down the server blade 17

Remove the server blade....18

Remove the access panel (A-side)....19

Remove the access panel (B-side)....19

Remove a hot-plug SAS or SATA hard drive....19

Remove the left DIMM baffle ....20

Remove the right DIMM baffle ....21

Remove the front panel/hard drive cage assembly (A-side)....22

Remove the front panel/hard drive cage assembly (B-side) 23

Remove the interposer board....24

Remove the battery pack....25

Setup 27

Overview 27

Installing an HP BladeSystem c-Class enclosure 27

Preparing the enclosure 27

Installing interconnect modules 31

Connecting to the network....33

Installing server blade options 33

Installing a server blade....33

Completing the configuration....34

Hardware options installation.... 35

Introduction 35

Processor option....35

Installing a processor option (A-side) 35

Installing a processor option (B-side)....40

Memory option 45

Memory overview 45

Dual- and quad-rank DIMMs....46

DIMM identification....47

DIMM installation guidelines 47

Memory subsystem architecture ....48

Hemisphere mode 50

Memory performance optimization ....51

Memory RAS 52

Advanced ECC memory population guidelines....53

Online Spare memory population guidelines....53

Mirrored Memory population guidelines....54

Installing DIMMs (A-side) 54

Installing DIMMs (B-side) 55

Hot-plug SAS or SATA hard drive option 56

Mezzanine card option 58

Installing a mezzanine card option (A-side)....58

Installing a mezzanine card option (B-side)....60

Controller options....61

Installing a cache module....62

Installing a capacitor pack....63

HP Trusted Platform Module option 64

Installing the Trusted Platform Module board 65

Retaining the recovery key/password....66

Enabling the Trusted Platform Module....66

Cabling 68

Using the HP c-Class Blade SUV Cable....68

Connecting locally to a server blade with video and USB devices 68

Accessing a server blade with local KVM 68

Accessing local media devices 69

Software and configuration utilities 71

Server blade deployment tools....71

HP BladeSystem c-Class Advanced management....71

Network-based PXE deployment 71

Deployment methods 73

Configuration tools....77

SmartStart software 77

HP ROM-Based Setup Utility 78

Array Configuration Utility 80

Option ROM Configuration for Arrays....80

Re-entering the server serial number and product ID....81

Management tools....81

Automatic Server Recovery....81

ROMPaq utility....81

iLO 3 Standard Blade Edition technology 82

Erase Utility 82

HP Systems Insight Manager 83

Management Agents 83

Redundant ROM support....83

USB support and functionality....83

Internal SD support....84

Diagnostic tools 84

HP Insight Diagnostics 84

HP Insight Diagnostics survey functionality 84

Integrated Management Log....85

Remote support and analysis tools 85

HP Insight Remote Support software 85

Keeping the system current....86

Drivers 86

Version control....86

ProLiant Support Packs....87

Operating System Version Support 87

Firmware 87

HP Smart Update Manager....87

Change control and proactive notification 88

Care Pack 88

Troubleshooting 89

Troubleshooting resources 89

Pre-diagnostic steps 89

Important safety information 89

Symptom information....91

Prepare the server for diagnosis....91

Service notifications....92

Loose connections 92

Troubleshooting flowcharts....92

Start diagnosis flowchart....93

General diagnosis flowchart....94

Server blade power-on problems flowchart 95

POST problems flowchart....97

OS boot problems flowchart....99

Server fault indications flowchart 101

POST error messages and beep codes 103

Introduction to POST error messages....103

Processor X Unsupported Wattage....104

System battery 105

Regulatory compliance notices 106

Regulatory compliance identification numbers 106

Federal Communications Commission notice 106

FCC rating label 106

Class A equipment 106

Class B equipment....106

Declaration of conformity for products marked with the FCC logo, United States only....107

Modifications....107

Cables 107

Canadian notice (Avis Canadien)....108

European Union regulatory notice 108

Disposal of waste equipment by users in private households in the European Union 109

Japanese notice 109

BSMI notice 109

Korean notice 110

Chinese notice 110

Laser compliance 110

Battery replacement notice 110

Taiwan battery recycling notice 111

Wireless devices....111

Brazilian notices 112

Canadian notices....112

Japanese notices....112

Taiwan notices....112

Electrostatic discharge 113

Preventing electrostatic discharge 113

Grounding methods to prevent electrostatic discharge....113

Specifications.... 114

Environmental specifications....114

Server blade specifications....114

Technical support.... 115

Before you contact HP 115

HP contact information....115

Customer Self Repair 115

Acronyms and abbreviations.... 123

Index....126

Component identification

Front panel components and LEDs

1 2 3 4 5 6 7 8 9 10 11 12 13 14 16 15

Item Description
1 Local I/O connector
2 UID LED
3 Health LED
4 Flex 1 LED
5 Flex 2 LED
6 Flex 3 LED
7 Flex 4 LED
8 Flex 5 LED
9 Flex 6 LED
10	Power On/Standby button and system power LED
11 Hard drive bay	1
12 Hard drive bay	2
13 Server release	ever button
14 Server release	ever
15 Hard drive bay	4
16 Hard drive bay	3

SAS and SATA hard drive LEDs

Technical diagram of a device rear panel with labeled components 1 and 2

Item Description
1 Fault/UID	LED (amber/blue)
2 Online LED	(green)

SAS and SATA hard drive LED combinations

Online/activity LED (green)	Fault/UID LED (amber/blue)	Interpretation
On, off, or flashing	Alternating amber and blue	The drive has failed, or a predictive failure alert has been received for this drive; it also has been selected by a management application.
On, off, or flashing	Steadily blue	The drive is operating normally, and it has been selected by a management application.
On	Amber, flashing regularly (1 Hz)	A predictive failure alert has been received for this drive. Replace the drive as soon as possible.
On	Off	The drive is online, but it is not active currently.
Flashing regularly (1 Hz)	Amber, flashing regularly (1 Hz)	Do not remove the drive. Removing a drive may terminate the current operation and cause data loss.The drive is part of an array that is undergoing capacity expansion or stripe migration, but a predictive failure alert has been received for this drive. To minimize the risk of data loss, do not replace the drive until the expansion or migration is complete.
Flashing regularly (1 Hz)	Off	Do not remove the drive. Removing a drive may terminate the current operation and cause data loss.The drive is rebuilding, erasing, or it is part of an array that is undergoing capacity expansion or stripe migration.
Flashing irregularly	Amber, flashing regularly (1 Hz)	The drive is active, but a predictive failure alert has been received for this drive. Replace the drive as soon as possible.
Flashing irregularly	Off	The drive is active, and it is operating normally.
Off Steadily amber		A critical fault condition has been identified for this drive, and the controller has placed it offline. Replace the drive as soon as possible.
Off	Amber, flashing regularly (1 Hz)	A predictive failure alert has been received for this drive.Replace the drive as soon as possible.
Off Off		The drive is offline, a spare, or not configured as part of an array.

System board components (A-side)

Technical diagram of a computer motherboard with numbered components and zoomed-in insets highlighting specific areas.

Item Description
1 Processor 2 DIMM slots (16)
2 USB connector
3 Micro SDHC card connector
4 TPM connector
5 Mezzanine connector 2 (Type I or Type II)
6 Mezzanine connector 1 (Type I only)
7 System board thumbscrews (3)
8 Enclosure connectors (2)
9 Embedded FlexFabric adapter
10 SAS/SATA signal connector
11	Mezzanine connector 3 (Type I or Type II) ◆ ◆
12	Cache module connector
13 Processor 1 DIMM slots (16)
14 Processor 1
15 System battery
16	SAS/SATA backplane power connector
17 Processor 2

The symbols correspond to the symbols located on the interconnect bays. For more information, see the HP ProLiant BL680c G7 Server Blade Installation Instructions that ship with the server blade.

System board components (B-side)

Diagram of a computer rack with numbered components for identification and assembly reference.

Item Description
1 System board thumbscrews (8)
2 Processor 4 DIMM slots (16)
3 SAS/SATA backplane power connector
4 Interposer board connector
5 SAS/SATA signal connector
6 Lift handle
7 Processor 3 DIMM slots (16)
8 Processor 3
9 Ejector handle
10 Processor 4

System maintenance switch

Position Function Default
1* iLO 3 security override Off
2 Configuration lock Off
3 Reserved Off
4 Reserved Off
5*	Password disabled	Off
6* Reset configuration Off
7 Reserved Off
8 Reserved Off
9 Reserved Off
10	Reserved	Off

*To access redundant ROM, set S1, S5, and S6 to ON.

System maintenance switch procedures

When you perform troubleshooting steps, this guide may instruct you to perform the following procedures:

• Clear the system configuration ("Clearing the system configuration" on page 11).
• Access the redundant ROM ("Accessing the redundant ROM" on page 12).

To complete these procedures, you must change physical settings on the system maintenance switch.

Clearing the system configuration

RBSU can be used to restore the factory default configuration. For more information, see "HP ROM-Based Setup Utility (on page 78)." If the system is unable to boot into RBSU, use the following steps to clear the system configuration:

1. Power down the server blade (on page 17).
2. Remove the server blade (on page 18).
3. Remove the access panel.
4. Change position 6 of the system maintenance switch to on.
5. Install the access panel.

6. Install the server blade in the enclosure and power up the server blade.

7. Wait for the POST message that prompts you to change the switch setting: Maintenance switch detected in the "On" position. Power off the server and turn switch to the "Off" position.

8. Repeat steps 1 through 3.
9. Change position 6 of the system maintenance switch to off.
10. Repeat steps 5 and 6.

IMPORTANT: When the server blade boots after NVRAM is cleared, a delay of up to 2 minutes is normal. During this delay, the system appears non-functional. Do not attempt any procedures during the delay.

Accessing the redundant ROM

If the system ROM is corrupted, the system automatically switches to the redundant ROM in most cases. If the system does not automatically switch to the redundant ROM, perform the following steps:

1. Power down the server blade (on page 17).
2. Remove the server blade (on page 18).
3. Remove the access panel.
4. Change positions 1, 5, and 6 of the system maintenance switch to on.
5. Install the access panel.
6. Install the server blade in the enclosure and power up the server blade.
7. After the system beeps, repeat steps 1 through 3.
8. Change positions 1, 5, and 6 of system maintenance switch to off.
9. Repeat steps 5 and 6.

If both the current and backup versions of the ROM are corrupt, return the system board for a service replacement.

To switch to the backup ROM when the System ROM is not corrupt, use RBSU.

Interposer board components

Technical diagram of a device rear panel with numbered components for identification

Item Description
1	Mezzanine connector 6 (Type I dual-port Ethernet only) [IMAGE]
2 Mezzanine connector 4 (Type I or II) [IMAGE]
3 Enclosure connectors (2)
4 Embedded FlexFabric adapter [IMAGE]
5 Mezzanine connector 5 (Type I only) [IMAGE]
6 Mezzanine connector 7 (Type I or II) [IMAGE]
7 B-side system board connector

DIMM slot locations (A-side)

DIMM slots are numbered sequentially (1 through 16) for each processor. The supported AMP modes use the letter assignments for population guidelines.

16B 15F 14D 13H 12B 11F 10D 9H PROC 2 8G 7C 6E 5A 4A 3E 2C 1G PROC 1 1G 2C 3E 4A 5A 6E 7C 8G 13H 14D 15F 16B 9H 10D 11F 12B

DIMM slot locations (B-side)

DIMM slots are numbered sequentially (1 through 16) for each processor. The supported AMP modes use the letter assignments for population guidelines.

16B 15F 14D 13H 12B 11F 10D 9H PROC 4 8G 7C 6E 5A 4A 3E 2C 1G PROC 3 1G 2C 3E 4A 5A 6E 7C 8G 13H 14D 15F 16B 9H 10D 11F 12B

HP c-Class Blade SUV Cable

Diagram showing four connected VGA connectors with numbered labels pointing to each connection.

Item Connector Description
1 Server blade		For connecting to the SUV connector on the server blade front panel
2 Video For connecting a video monitor
3 USB For connecting up to two USB devices
4 Serial		For trained personnel to connect a null modem serial cable and perform advanced diagnostic procedures

Operations

Power up the server blade

The Onboard Administrator initiates an automatic power-up sequence when the server blade is installed. If the default setting is changed, use one of the following methods to power up the server blade:

• Use a virtual power button selection through iLO 3.
- Press and release the Power On/Standby button.

When the server blade goes from the standby mode to the full power mode, the system power LED changes from amber to green.

For more information about the Onboard Administrator, see the enclosure setup and installation guide on the HP website (http://www.hp.com/support).

For more information about iLO 3, see "iLO 3 Standard Blade Edition technology (on page 82)."

Power down the server blade

Before powering down the server blade for any upgrade or maintenance procedures, perform a backup of critical server data and programs.

Depending on the Onboard Administrator configuration, use one of the following methods to power down the server blade:

• Use a virtual power button selection through iLO 3.
This method initiates a controlled remote shutdown of applications and the OS before the server blade enters standby mode.
- Press and release the Power On/Standby button.
This method initiates a controlled shutdown of applications and the OS before the server blade enters standby mode.
- Press and hold the Power On/Standby button for more than 4 seconds to force the server blade to enter standby mode.
This method forces the server blade to enter standby mode without properly exiting applications and the OS. It provides an emergency shutdown method if an application stops responding.

- Execute one of the following commands using the Onboard Administrator CLI: poweroff server [bay number]

or

poweroff server [bay number] force

The first command initiates a controlled shutdown of applications and the OS before the server blade enters standby mode. The second form of the command forces the server blade to enter standby mode without exiting applications and the OS. This emergency method forces a shutdown if an application stops responding.

• Use the Onboard Administrator GUI to initiate a shutdown:

a. Select the Enclosure Information tab, and then select the Overall checkbox in the Device Bays item.

b. Initiate a shutdown from the Virtual Power menu:

— Select Momentary Press to initiate a controlled shutdown of applications and the OS.

— Select Press and Hold to initiate an emergency shutdown of applications and the OS.

IMPORTANT: When the server blade is in standby mode, auxiliary power is still being provided. To remove all power from the server blade, remove the server blade from the enclosure.

After initiating a virtual power down command, be sure that the server blade is in standby mode by observing that the system power LED is amber.

Remove the server blade

CAUTION: Do not use the server blade release lever to lift or carry the server blade. Always support the weight of the server blade by handling the chassis directly. Improper use can damage the release lever and the server blade.

1. Identify the proper server blade.
2. Power down the server blade (on page 17).
3. Remove the server blade.

Diagram of a refrigerator door with labeled parts and directional arrows indicating movement or assembly.

Diagram of a mechanical or electrical component with labeled parts 1, 2, and 3, showing directional arrows indicating flow or movement.

1. Place the server blade on a flat, level work surface.

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

CAUTION: To prevent damage to electrical components, properly ground the server blade before beginning any installation procedure. Improper grounding can cause ESD.

Remove the access panel (A-side)

To remove the component:

1. Power down the server blade (on page 17).
2. Remove the server blade (on page 18).
3. Place the server blade on a flat, level surface with the correct side of the server blade facing up. To determine the correct side, see the label attached to the access panel.
4. Press the access panel release button, and then slide the access panel to the rear.
5. Remove the access panel.

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

CAUTION: To prevent damage to electrical components, properly ground the server blade before beginning any installation procedure. Improper grounding can cause ESD.

Remove the access panel (B-side)

To remove the component:

1. Power down the server blade (on page 17).
2. Remove the server blade (on page 18).
3. Place the server blade on a flat, level surface with the correct side of the server blade facing up. To determine the correct side, see the label attached to the access panel.
4. Press the access panel release button, and then slide the access panel to the rear.
5. Remove the access panel.

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

CAUTION: To prevent damage to electrical components, properly ground the server blade before beginning any installation procedure. Improper grounding can cause ESD.

Remove a hot-plug SAS or SATA hard drive

CAUTION: To prevent improper cooling and thermal damage, do not operate the server blade or the enclosure unless all hard drive and device bays are populated with either a component or a blank.

1. Determine the status of the hard drive from the hot-plug SAS hard drive LED combinations ("SAS and SATA hard drive LED combinations" on page 8).

2. Back up all server data.

3. Remove the hard drive.

Technical diagram of a device rear panel with numbered components and directional arrows indicating movement or assembly.

To replace the component, reverse the removal procedure.

Remove the left DIMM baffle

To remove the component:

1. Power down the server blade (on page 17).
2. Remove the server blade (on page 18).
3. Place the server blade on a flat, level surface with the correct side of the server blade facing up. To determine the correct side, see the label attached to the access panel.
4. Remove the access panel (A-side) (on page 19).
5. If installed, remove the battery pack (on page 25).

You do not need to disconnect the cable from the battery pack.

1. Disconnect the SAS/SATA signal cable from the SAS backplane.

2. Unroute the SAS/SATA cable.

Technical diagram showing a train track with numbered annotations indicating directional flow or movement.

1. Remove the left DIMM baffle.

Isometric technical diagram of an electronic circuit board with a highlighted component (no text or symbols present)

Remove the right DIMM baffle

To remove the component:

1. Power down the server blade (on page 17).
2. Remove the server blade (on page 18).
3. Place the server blade on a flat, level surface with the correct side of the server blade facing up. To determine the correct side, see the label attached to the access panel.
4. Remove the access panel (B-side) (on page 19).

5. If installed, remove the battery pack (on page 25).
   You do not have to disconnect the cable from the battery.

6. Remove the right DIMM baffle.

Isometric technical diagram of a server room with labeled components and an arrow indicating a specific area (no text or symbols present)

Remove the front panel/hard drive cage assembly (A-side)

To remove the component:

1. Power down the server blade (on page 17).
2. Remove the server blade (on page 18).
3. Place the server blade on a flat, level surface with the correct side of the server blade facing up. To determine the correct side, see the label attached to the access panel.
4. Remove the access panel (A-side) (on page 19).
5. Disconnect the signal cable and the power cable from the SAS backplane.

6. Loosen the thumbscrews.

7. Remove the front panel/hard drive cage assembly.

Technical diagram of an energy storage module with numbered components and a close-up of the component's internal structure.

Remove the front panel/hard drive cage assembly (B-side)

To remove the component:

1. Power down the server blade (on page 17).
2. Remove the server blade (on page 18).
3. Place the server blade on a flat, level surface with the correct side of the server blade facing up. To determine the correct side, see the label attached to the access panel.
4. Remove the access panel (B-side) (on page 19).
5. Disconnect the signal cable and power cable from the SAS backplane.

6. Loosen the thumbscrews.

7. Remove the front panel/hard drive cage assembly.

Technical diagram of an internal hard drive with numbered components and a close-up of the component's internal structure.

Remove the interposer board

To remove the component:

1. Power down the server blade (on page 17).
2. Remove the server blade (on page 18).
3. Place the server blade on a flat, level surface with the B-side of the server blade facing up. To determine which side is the B-side, see the label attached to the access panel.
4. Remove the access panel (B-side) (on page 19).

5. Loosen the thumbscrews.

6. Remove the interposer board.

Technical diagram of an electronic device with numbered components and directional arrows indicating motion or assembly steps.

To install the interposer board, reverse the removal procedure.

Remove the battery pack

CAUTION: To prevent a server blade malfunction or damage to the equipment, do not add or remove the battery pack while an array capacity expansion, RAID level migration, or stripe size migration is in progress.

CAUTION: After the server blade is powered down, wait 15 seconds and then check the amber LED before unplugging the cable from the cache module. If the amber LED blinks after 15 seconds, do not remove the cable from the cache module. The cache module is backing up data, and data is lost if the cable is detached.

IMPORTANT: The battery pack might have a low charge when installed. In this case, a POST error message is displayed when the server blade is powered up, indicating that the battery pack is temporarily disabled. No action is necessary on your part. The internal circuitry automatically recharges the batteries and enables the battery pack. This process might take up to four hours. During this time, the cache module functions properly, but without the performance advantage of the battery pack.

To remove the component:

1. Power down the server blade (on page 17).

2. Remove the server blade (on page 18).

3. Place the server blade on a flat, level surface with the A-side of the server blade facing up. To determine which side is the A-side, see the label attached to the access panel.

4. Remove the access panel (A-side) (on page 19).

5. Do one of the following:

- Remove the battery pack from the left DIMM baffle.

Isometric technical diagram of a mechanical assembly with no visible text or symbols

- Remove the battery pack from the right DIMM baffle.

Technical line drawing of an electronic device assembly with no visible text or symbols

Setup

Overview

Installation of a server blade requires the following steps:

1. Install and configure an HP BladeSystem c-Class enclosure.
2. Install any server blade options.
3. Install interconnect modules in the enclosure.
4. Connect the interconnect modules to the network.
5. Install a server blade.
6. Complete the server blade configuration.

Installing an HP BladeSystem c-Class enclosure

Before performing any server blade-specific procedures, install an HP BladeSystem c-Class enclosure.

The most current documentation for server blades and other HP BladeSystem components is available at the HP website (http://www.hp.com/go/bladesystem/documentation).

Documentation is also available in the following locations:

• Documentation CD that ships with the enclosure
• HP Business Support Center website (http://www.hp.com/support)

Preparing the enclosure

HP BladeSystem enclosures ship with device bay dividers to support half-height devices. To install a full-height device, remove the blanks and the corresponding device bay divider.

CAUTION: To prevent improper cooling and thermal damage, do not operate the server blade or the enclosure unless all hard drive and device bays are populated with either a component or a blank.

IMPORTANT: For optimal cooling and system performance, configure the c7000 enclosure with ten fans and configure the c3000 enclosure with six fans.

1. Remove the device bay blank.

Diagram of a device with labeled parts, showing internal components and directional arrows

Diagram of a device with labeled parts and directional arrows indicating movement or assembly

1. Remove the three adjacent blanks.

Removing a c7000 device bay divider

1. Slide the device bay shelf locking tab to the left to open it.

Technical line drawing of an internal server or computer chassis with a magnified inset showing internal components (no text or symbols)

1. Push the device bay shelf back until it stops, lift the right side slightly to disengage the two tabs from the divider wall, and then rotate the right edge downward (clockwise).

Technical diagram of an internal device with numbered annotations indicating components for file access or repair.

1. Lift the left side of the device bay shelf to disengage the three tabs from the divider wall, and then remove it from the enclosure.

Technical diagram showing a computer drive with labeled components and an inset magnified view of the component being inserted.

Removing a c3000 device bay mini-divider or device bay divider

1. Slide the locking tab down.

Technical line drawing showing structural components with magnified insets (no text or symbols)

1. Remove the mini-divider or divider:

c3000 mini-divider:

Push the divider toward the back of the enclosure until the divider drops out of the chassis.

Technical diagram of a server rack with an internal device and a warning arrow indicating shock (no text or symbols present)

c3000 divider:

a. Push the divider toward the back of the enclosure until it stops.

b. Slide the divider to the left to disengage the tabs from the wall.

c. Rotate the divider clockwise.

d. Remove the divider from the enclosure.

Technical diagram showing server rack with labeled components and directional arrows indicating assembly or movement.

Installing interconnect modules

For specific steps to install interconnect modules, see the documentation that ships with the interconnect module.

Interconnect bay numbering and device mapping

HP BladeSystem c7000 Enclosure

1 2 3 4 5 6 7 8 FAN 1 FAN 2 FAN 3 FAN 4 FAN 5 FAN 6 FAN 7 FAN 8 FAN 9 FAN 10

HP BladeSystem c3000 Enclosure

1 2 3 3 4 4 SAN 1 SAN 2 SAN 3 SAN 4 SAN 5

To support network connections for specific signals, install an interconnect module in the bay corresponding to the embedded adapter or mezzanine signals.

Server blade signal	c7000 interconnect bay	c3000 interconnect bay	Interconnect bay labels
FlexFabric adapter 1 (Embedded)	1 1
FlexFabric adapter 2 (Embedded)	2 1
FlexFabric adapter 3 (Embedded)	1 1
FlexFabric adapter 4 (Embedded)	2 1
FlexFabric adapter 5 (Embedded)	1 1
FlexFabric adapter 6 (Embedded)	2 1
Mezzanine 1 3 and 4	2
Mezzanine 2 5 and 6*	3 and 4
	7 and 8** 3 and 4
Mezzanine 3 5 and 6**	3 and 4
	7 and 8* 3 and 4
Mezzanine 4 5 and 6**	3 and 4
	7 and 8* 3 and 4
Mezzanine 5 3 and 4	2
Mezzanine 6 1 and 2	†	1
Mezzanine 7 5 and 6*	3 and 4
	7 and 8** 3 and 4

* Dual port mezzanine card ports and four-port mezzanine card ports 1 and 2

** Four-port mezzanine card ports 3 and 4

^† Dedicated dual-port Ethernet mezzanine

For detailed port mapping information, see the HP BladeSystem enclosure installation poster or the HP BladeSystem enclosure setup and installation guide on the HP website

(http://www.hp.com/go/bladesystem/documentation).

Connecting to the network

To connect the HP BladeSystem to a network, each enclosure must be configured with network interconnect devices to manage signals between the server blades and the external network.

Two types of interconnect modules are available for HP BladeSystem c-Class enclosures: Pass-Thru modules and switch modules. For more information about interconnect module options, see the HP website (http://www.hp.com/go/bladesystem/interconnects).

IMPORTANT: To connect to a network with a Pass-Thru module, always connect the Pass-Thru module to a network device that supports Gigabit speed.

Installing server blade options

Before installing and initializing the server blade, install any server blade options, such as an additional processor, hard drive, or mezzanine card.

Installing a server blade

1. Remove the connector covers.

Technical line drawing of a mechanical assembly with multiple components and directional arrows indicating movement (no text or symbols)

1. Prepare the server blade for installation.

Technical diagram showing a mechanical assembly with labeled components and directional arrows indicating motion or force.

1. Install the server blade.

Diagram of a door panel with labeled parts and directional arrows indicating movement or assembly.

Technical diagram of a mechanical assembly with labeled components 1 and 2, showing directional arrows indicating movement or flow.

Completing the configuration

To complete the server blade and HP BladeSystem configuration, see the overview card that ships with the enclosure.

Hardware options installation

Introduction

If more than one option is being installed, read the installation instructions for all the hardware options and identify similar steps to streamline the installation process.

!

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

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CAUTION: To prevent damage to electrical components, properly ground the server before beginning any installation procedure. Improper grounding can cause electrostatic discharge.

Processor option

The base configuration for an HP ProLiant BL680c G7 Server Blade is two processors, one installed in processor socket 1 (A-side) and one installed in processor socket 3 (B-side). When installing a third optional processor and heatsink, HP requires installing it in processor socket 2 (B-side).

When installing two optional processors in a BL680c G7 server blade to create a four-processor configuration, observe the following guidelines:

• You must order two processor option kits.
• All processors must be identical.
- You must first install the optional processor in socket 2, and then install the second optional processor in socket 4.

HP recommends that all installed processors have at least two identical DIMMs installed in the associated DIMM sockets. For more information, see "DIMM installation guidelines (on page 47)."

Installing a processor option (A-side)

!

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

△

CAUTION: To avoid damage to the system board:

• Do not touch the processor socket contacts.
  • Always install the processor socket cover after removing the processor from the socket.
• Do not tilt or slide the processor when lowering the processor into the socket.

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CAUTION: To avoid damage to the processor:

• Handle the processor only by the edges.
• Do not touch the bottom of the processor, especially the contact area.

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CAUTION: To prevent possible server blade malfunction and damage to the equipment, multiprocessor configurations must contain processors with the same part number.

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CAUTION: The heatsink thermal interface media is not reusable and must be replaced if the heatsink is removed from the processor after it has been installed.

!

IMPORTANT: Processor socket 1 must be populated at all times or the server blade does not function.

To install the component:

1. Locate and download the latest ROM version from the HP website (http://www.hp.com/support). Follow the instructions on the website to update the system ROM.
2. Power down the server blade (on page 17).
3. Remove the server blade (on page 18).
4. Place the server blade on a flat, level surface with the correct side of the server blade facing up. To determine the correct side, see the label attached to the access panel.
5. Remove the access panel (A-side) (on page 19).
6. Remove the hard drives.

Diagram of a computer drive showing labeled components and directional arrows indicating movement or flow.

1. Remove the front panel/hard drive cage assembly (A-side) (on page 22).
2. Remove the heatsink blank.

3D diagram of a mechanical component with an upward arrow, showing layered structure (no text or symbols)

1. Open the processor retaining latch and the processor socket retaining bracket.

2. Remove the processor socket protective cover.

Diagram of a computer processor with numbered parts and directional arrows indicating assembly or operation

IMPORTANT: Be sure the processor remains inside the processor installation tool.

1. If the processor has separated from the installation tool, carefully re-insert the processor in the tool.

Technical diagram showing a mechanical assembly with four labeled components and directional arrows indicating motion or assembly.

1. Align the processor installation tool with the socket and install the processor.

Mechanical assembly diagram showing a disassembly or assembly process with a central component and arrow indicating direction (no text or symbols present)

1. Press down firmly until the processor installation tool clicks and separates from the processor, and then remove the processor installation tool.

Technical diagram of a mechanical device with numbered components and directional arrows indicating assembly or operation.

1. Close the processor socket retaining bracket and the processor retaining latch.

Diagram of a computer processor component with labeled parts and directional arrows indicating assembly or movement.

1. Remove the heatsink protective cover.

3D diagram of a mechanical component with an upward arrow indicating force or direction (no text or symbols)

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CAUTION: Orient the heatsink as indicated in the procedure. Otherwise, you cannot install the hard drive cage.

△

CAUTION: When tightening the heatsink screws, first tighten the front screw four to five turns, tighten the back screw completely, and then finish tightening the front screw.

1. Orient and install the heatsink as shown in the illustration.

Technical diagram of a computer motherboard with numbered components and directional arrows indicating assembly or movement.

1. Install the front panel/hard drive cage assembly (A-side).
2. Install the access panel (A-side).
3. Install the hard drives ("Hot-plug SAS or SATA hard drive option" on page 56).
4. Install the server blade ("Installing a server blade" on page 33).
5. Power up the server blade (on page 17).

Installing a processor option (B-side)

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

CAUTION: To avoid damage to the system board:

• Do not touch the processor socket contacts.
  • Always install the processor socket cover after removing the processor from the socket.
• Do not tilt or slide the processor when lowering the processor into the socket.

CAUTION: To avoid damage to the processor:

• Handle the processor only by the edges.
• Do not touch the bottom of the processor, especially the contact area.

CAUTION: To prevent possible server blade malfunction and damage to the equipment, multiprocessor configurations must contain processors with the same part number.

CAUTION: The heatsink thermal interface media is not reusable and must be replaced if the heatsink is removed from the processor after it has been installed.

IMPORTANT: Processor socket 1 must be populated at all times or the server blade does not function.

To install the component:

1. Locate and download the latest ROM version from the HP website (http://www.hp.com/support). Follow the instructions on the website to update the system ROM.

2. Power down the server blade (on page 17).

3. Remove the server blade (on page 18).

4. Place the server blade on a flat, level surface with the correct side of the server blade facing up. To determine the correct side, see the label attached to the access panel.

5. Remove the access panel (B-side) (on page 19).

6. Remove the hard drives.

Diagram of a device rear panel with labeled components and directional arrows indicating movement or assembly.

1. Remove the front panel/hard drive cage assembly (B-side) (on page 23).

2. Remove the heatsink blank.

3D diagram of a mechanical component with an upward arrow, showing layered structure (no text or symbols)

1. Open the processor retaining latch and the processor socket retaining bracket.

2. Remove the processor socket protective cover.

Diagram of a computer processor with labeled parts and directional arrows indicating assembly or operation steps

IMPORTANT: Be sure the processor remains inside the processor installation tool.

1. If the processor has separated from the installation tool, carefully re-insert the processor in the tool.

Technical diagram showing a mechanical assembly with four labeled components and directional arrows indicating motion or assembly.

1. Align the processor installation tool with the socket and install the processor.

Mechanical assembly diagram showing a disassembly or assembly process with a central component and arrow indicating direction (no text or symbols present)

1. Press down firmly until the processor installation tool clicks and separates from the processor, and then remove the processor installation tool.

Technical diagram of a mechanical device with numbered components and directional arrows indicating assembly or operation.

1. Close the processor socket retaining bracket and the processor retaining latch.

Diagram of a computer processor component with labeled parts and directional arrows indicating motion or assembly.

1. Remove the heatsink protective cover.

3D diagram of a mechanical component with an upward arrow indicating direction (no text or symbols)

△

CAUTION: Orient the heatsink as indicated in the procedure. Otherwise, you cannot install the hard drive cage.

△

CAUTION: When tightening the heatsink screws, first tighten the front screw four to five turns, tighten the back screw completely, and then finish tightening the front screw.

1. Orient and install the heatsink as shown in the illustration.

Technical diagram of a computer motherboard with numbered components and circuit connections

1. Install the front panel/hard drive cage assembly (B-side).

2. Install the access panel (B-side).

3. Install the hard drives ("Hot-plug SAS or SATA hard drive option" on page 56).

4. Install the server blade ("Installing a server blade" on page 33).

5. Power up the server blade (on page 17).

Memory option

To expand server memory, install DDR3 RDIMMs. Dual-rank and quad-rank DIMMs are supported. Up to 1 TB of memory is possible using 64 16-GB DIMMs (16 DIMMs per processor).

The server blade supports the following DIMM speeds:

• Dual-rank PC3-10600 (DDR-1333) DIMMs operating up to 1066 MHz
• Quad-rank PC3-8500 (DDR-1067) DIMMs operating up to 1066 MHz

Depending on the processor model, the memory clock speed may be reduced to 978 or 800 MHz. For more information, see "Memory subsystem architecture (on page 48)."

NOTE: The Advanced Memory Protection option in RBSU provides additional memory protection beyond Advanced ECC. By default, the server is set to Advanced ECC Support. For more information, refer to "HP ROM-Based Setup Utility (on page 78)."

For DIMM slot locations, see the following:

• "DIMM slot locations (A-side) (on page 14)"
• "DIMM slot locations (B-side) (on page 15)"

Memory overview

The HP ProLiant BL680c G7 Server Blade uses the next generation Intel® Xeon® 7500 series processor. This processor's architecture departs radically from previous Intel Xeon front-side-bus-based architectures.

In front-side bus architectures, the memory controller was incorporated in the northbridge, which produced a common sharepoint for memory accesses for all processors. Similar to the dual-socket Intel Xeon 5500 processors, the Intel Xeon 7500 processors employ a NUMA architecture incorporating QPI links for point-to-point connectivity between processors and provides dedicated local memory for each processor.

To enable greater memory expansion capability, The DIMMs are not directly connected to the processor through the memory controller. In the Intel Xeon 7500 memory subsystem, each memory controller uses a dedicated scalable memory interconnect (SMI) to connect to a memory buffer. The memory buffer is connected to two DDR3 memory channels that support four DIMM sockets.

To provide greater memory bandwidth over previous Intel Xeon multiprocessor architectures, each Intel Xeon 7500 processor includes two integrated memory controllers. Each memory controller contains two SMIs. Therefore, four SMIs per processor connect to four memory buffers. Because each buffer supports 4 DIMM sockets, a single processor provides a total of 16 DIMMs. Each DIMM may be up to 16 GB for 256 GB per processor (16 DIMMs x 16 GB).

Dual- and quad-rank DIMMs

To understand and configure memory protection modes properly, an understanding of dual- and quad-rank DIMMs is helpful. Some DIMM configuration requirements are based on these classifications.

A single-rank DIMM has one set of memory chips that is accessed while writing to or reading from the memory. A dual-rank DIMM is similar to having two single-rank DIMMs on the same module, with only one rank accessible at a time. A quad-rank DIMM is, effectively, two dual-rank DIMMs on the same module. Only one rank is accessible at a time. The server blade memory control subsystem selects the proper rank within the DIMM when writing to or reading from the DIMM.

Dual- and quad-rank DIMMs provide the greatest capacity with the existing memory technology. For example, if current DRAM technology supports 2-GB single-rank DIMMs, a dual-rank DIMM would be 4-GB, and a quad-rank DIMM would be 8-GB.

DIMM identification

To determine DIMM characteristics, use the label attached to the DIMM and the following illustration and table.

HP 8GB 2Rx8 PC3L-10600R-9-08 HP 8GB 2Rx8 PC3L-0600R-7-08

Item	Description Definition
1 Size	—
2 Rank		1R = Single-rank2R = Dual-rank4R = Quad-rank
3 Data width		x4 = 4-bitx8 = 8-bit
4 Voltage rating		L = Low voltage (1.35v)Blank or omitted = Standard
5 Memory speed		10600 = 1333-MHz8500 = 1066-MHz
6 DIMM type		R = RDIMM (registered)E = UDIMM (unbuffered with ECC)

For the latest supported memory information, see the QuickSpecs on the HP website (http://www.hp.com).

DIMM installation guidelines

Each supported processor contains two memory controllers per processor. Each memory controller can support up to eight DIMMs. Four memory controllers across four processors provide a total of 64 DIMMs per system.

When installing DIMMs, observe the following minimum guidelines:

• Install only DDR3-1333 DIMMs.
• DIMMs must be installed for processor 1.
• Populate DIMM slots for a processor only if the processor is installed.

• To maximize performance in multi-processor configurations, distribute the total memory capacity between all processors as evenly as possible.
  • The minimum configuration is two DIMMs installed on processor 1.
• DIMMs must be installed in pairs with identical characteristics. When possible, for configuration simplicity, HP recommends using DIMMs with identical part numbers throughout the system.
• For best performance, HP recommends that DIMM pairs be populated in sequence by letter designation. Install DIMM pair 4A/5A first, followed by DIMM pair 12B/16B, DIMM pair 2C/7C, DIMM pair 10D/14D, DIMM pair 3E/6E, DIMM pair 11F/15F, and DIMM pair 1G/8G.
• When installing mixed rank DIMMs for any processor, DIMMs with the highest number of ranks must be installed in the white DIMM connector locations. This guarantees proper electrical signaling on the DDR3 channel since DIMMs with higher rank counts present larger electrical loading on the DDR3 channel and must be populated at the end point of the channel.

CAUTION: Failure to follow these guidelines may result in the inability to recognize memory, memory errors, or reduced memory performance.

Examples:

If the configuration is eight quad-rank 8-GB DIMMs and eight dual-rank 8-GB DIMMs installed in a single-processor configuration, the quad-rank DIMMs must be installed in the white DIMM connectors 4A/5A, 12B/16B, 2C/7C, and 10D/14D. The dual-rank DIMMs must be installed in the black DIMM connectors 3E/6E, 11F/15F, 1G/8G and 9H/13H. For illustrations of the connections between the processor, memory controllers, and DIMMs, see "Memory subsystem architecture (on page 48)."
If the configuration is six quad-rank 8-GB DIMMs and ten dual-rank 8-GB DIMMs in a single processor configuration, the quad-rank DIMMs can be located in any of the corresponding white DIMM pairs (4A/5A, 12B/16B, 2C/7C and 10D/14D), as long as they are installed at the end point of the DDR3 channel.

AMP modes Advanced ECC, Online Spare, and Mirrored Memory have further requirements beyond the ones listed here. For additional memory configuration requirements, see the corresponding AMP sections:

• Advanced ECC memory population guidelines (on page 53)
• Online Spare memory population guidelines (on page 53)
• Mirrored Memory population guidelines (on page 54)

Memory subsystem architecture

The Intel® Xeon® 7500 processor memory architectures are designed to take advantage of multiple stages of memory interleaving to reduce latency and increase bandwidth.

Each Intel Xeon 7500 processor contains two memory controllers as shown in the illustration below. Each memory controller has two SMI buses operating in Lockstep mode. Each SMI bus connects to a memory buffer. The buffer converts SMI to DDR3 and expands the memory capacity of the system. Each buffer has two DDR3 channels and can support up to four DIMMs for a total of sixteen DIMMs per processor or sixty-four DIMMs per HP ProLiant BL680c G7 Server Blade with four processors installed.

Memory speed is not affected by number of DIMMs or ranks. All DIMMs run at the highest possible speed for a given processor.

DDR3 memory speed is a function of the QPI bus speed supported by the processor:

• Processors with a QPI speed of 6.4 GT/s run memory at 1066 MT/s.
• Processors with a QPI speed of 5.6 GT/s run memory at 978 MT/s.
• Processors with a QPI speed of 4.8 GT/s run memory at 800 MT/s.

Successive cache lines are interleaved between the DIMMs and the Lockstep SMI channels of the two memory controllers in the processor such that adjacent cache lines reside on different memory controllers, SMIs, DIMMs, and DIMM ranks for better performance. To take advantage of this feature, DIMMs should be populated evenly between all SMI channels. If an SMI channel pair has more DIMMs than others, the extra memory on that SMI channel pair does not benefit from the interleaving mechanism across memory controllers.

Memory architecture for processor 1 and 3

Channel Slot Slot number
1	AE	43
2	CG	21
3	AE	56
4	CG	78
5	BF	1211
6	DH	109
7	BF	1615
8	DH	1413

graph TD
    A["4A"] --> B["3E"]
    C["2C"] --> D["1G"]
    E["5A"] --> F["6E"]
    G["7C"] --> H["8G"]
    I["12B"] --> J["11F"]
    K["10D"] --> L["9H"]
    M["16B"] --> N["15F"]
    O["14D"] --> P["13H"]
    B --> Q["Buffer 1"]
    D --> R["Buffer 2"]
    F --> S["Buffer 2"]
    H --> T["Buffer 1"]
    L --> U["Buffer 2"]
    N --> V["Buffer 2"]
    P --> W["Buffer 2"]
    Q --> X["Memory controller 1"]
    R --> Y["Memory controller 2"]
    X --> Z["Processor 1 and Processor 3"]
    Y --> Z

Memory architecture for processor 2 and 4

Channel Slot Slot number
1	B	16
	F	15
2	D 14
	H 13
3	BF	1211
4	DH	109
5	AE	56
6	CG	78
7	AE	43
8	CG	21

graph TD
    A["16B"] --> B["15F"]
    C["14D"] --> D["13H"]
    E["12B"] --> F["11F"]
    G["10D"] --> H["9H"]
    I["5A"] --> J["6E"]
    K["7C"] --> L["8G"]
    M["4A"] --> N["3E"]
    O["2C"] --> P["1G"]
    Q["Buffer 1"] --> R["Buffer 2"]
    S["Buffer 1"] --> T["Buffer 2"]
    U["Buffer 2"] --> V["Buffer 1"]
    W["Memory controller 1"] --> X["Memory controller 2"]
    Y["Processor 2 and Processor 4"]

Hemisphere mode

The Intel® Xeon® 7500 series processor architecture incorporates Hemisphere mode, a high-performance interleaving technology. Hemisphere mode combines the tracking resources of both memory controllers within each processor for a more aggressive cache line pipelining.

Hemisphere mode is enabled when processors in the system have identical DIMM populations behind both of their memory controllers. Observe the following guidelines:

• Hemisphere mode is controlled via an RBSU option, enabling the user to select either automatic (default) or disable.
• In automatic mode, the BIOS enables Hemisphere mode if the system memory configuration is compatible with Hemisphere mode.
• Hemisphere mode should produce the best overall performance for a variety of applications. However, Hemisphere mode can be disabled if it produces lower performance for a particular application.
  • To enable each processor to enter Hemisphere mode, all memory controllers must be installed and populated with equal memory capacities based on the DIMM installation guidelines (on page 47).
• Greater performance is obtained when all memory controllers are populated with either four or eight dual- or quad-rank DIMMs.

- Mirrored Memory mode is not supported when Hemisphere mode is enabled.

The following illustration shows examples of Hemisphere mode and non-Hemisphere mode populations.

graph TD
    subgraph Optimal Hemisphere
        A1["Processor 1"] --> B1["Mem Cont 1"]
        A2["Processor 1"] --> B2["Mem Cont 2"]
        A3["Processor 1"] --> B3["Mem Cont 1"]
        A4["Processor 1"] --> B4["Mem Cont 2"]
        A5["Processor 1"] --> B5["Processor 2"]
    end

    subgraph Improved Hemisphere
        C1["Processor 1"] --> D1["Mem Cont 1"]
        C2["Processor 1"] --> D2["Mem Cont 2"]
        C3["Processor 1"] --> D3["Processor 2"]
    end

    subgraph Non-Hemisphere
        E1["Processor 1"] --> F1["Mem Cont 1"]
        E2["Processor 1"] --> F2["Mem Cont 2"]
        E3["Processor 1"] --> F3["Processor 2"]
    end

    A1 --> B1 --> B2 --> B3 --> D1 --> D2 --> D3 --> E1
    A2 --> B2 --> B3 --> D1 --> D2 --> D3 --> E2
    A3 --> B3 --> D1 --> D2 --> D3 --> E3
    A4 --> B4 --> D1 --> D2 --> D3 --> E4
    A5 --> B5 --> D1 --> D2 --> D3 --> E4
    A6 --> B6 --> D1 --> D2 --> D3 --> E5
    A7 --> B7 --> D1 --> D2 --> D3 --> E6
    A8 --> B8 --> D1 --> D2 --> D3 --> E7
    A9 --> B9 --> D1 --> D2 --> D3 --> E8
    A10 --> B10 --> D1 --> D2 --> D3 --> E9
    A11 --> B11 --> D1 --> D2 --> D3 --> E10
    A12 --> B12 --> D1 --> D2 --> D3 --> E11
    A13 --> B13 --> D1 --> D2 --> D3 --> E12
    A14 --> B14 --> D1 --> D2 --> D3 --> E13
    A15 --> B15 --> D1 --> D2 --> D3 --> E14
    A16 --> B16 --> D1 --> D2 --> D3 --> E15
    A17 --> B17 --> D1 --> D2 --> D3 --> E16
    A18 --> B18 --> D1 --> D2 --> D3 --> E17
    A19 --> B19 --> D1 --> D2 --> D3 --> E18
    A20 --> B20 --> D1 --> D2 --> D3 --> E19
    A21 --> B21 --> D1 --> D2 --> D3 --> E20
    A22 --> B22 --> D1 --> D2 --> D3 --> E21
    A23 --> B23 --> D1 --> D2 --> D3 --> E22
    A24 --> B24 --> D1 --> D2 --> D3 --> E23
    A25 --> B25 --> D1 --> D2 --> D3 --> E24
    A26 --> B26 --> D1 --> D2 --> D3 --> E25
    A27 --> B27 --> D1 --> D2 --> D3 --> E26
    A28 --> B28 --> D1 --> D2 --> D3 --> E27
    A29 --> B29 --> D1 --> D2 --> D3 --> E28
    A30 --> B30 --> D1 --> D2 --> D3 --> E29
    A31 --> B31 --> D1 --> D2 --> D3 --> E30
    A32 --> B32 --> D1 --> D2 --> D3 --> E31
    A33 --> B33 --> D1 --> D2 --> D3 --> E32
    A34 --> B34 --> D1 --> D2 --> D3 <--> E33
    A35 --> B35 --> D1 <--> E34
    A36 --> B36 --> D1 <--> E35
    A37 --> B37 <--> E36
    A38 --> B38 <--> E37
    A39 <--> E39
    A40 <--> B40 <--> E39
    A41 <--> B41 <--> E40
    A42 <--> B42 <--> E41
    A43 <--> B43 <--> E42
    A44 <--> B44 <--> E43
    A45 <--> B45 <--> E44
    A46 <--> B46 <--> E45
    A47 <--> B47 <--> E46
    A48 <--> B48 <--> E47
    A49 <--> B49 <--> E48
    A50 <--> B50 <--> E49
    A51 <--> B51 <--> E50
    A52 <--> B52 <--> E51
    A53 <--> B53 <--> E52
    A54 <--> B54 <--> E53
    A55 <--> B55 <--> E54
    A56 <--> B56 <--> E55
    A57 <--> B57 <--> E56
    A58 <--> B58 <--> E57
    A59 <--> B59 <--> E58
    A60 <--> B60 <--> E59
    A61 <--> B61 <--> E60
    A62 <--> B62 <--> E61
    A63 <--> B63 <--> E62
    A64 <--> B64 <--> E63
    A65 <--> B65 <--> E64
    A66 <--> B66 <--> E65
    A67 <--> B67 <--> E66
    A68 <--> B68 <--> E67
    A69 <--> B69 <--> E68
    A70 <--> B70 <--> E70
    A71 <--> B71 <--> E71
    A72 <--> B72 <--> E72
    A73 <--> B73 <--> E73
    A74 <--> B74 <--> E74
    A75 <--> B75 <--> E75
    A76 <--> B76 <--> E76
    A77 <--> B77 <--> E77
    A78 <--> B78 <--> E78
    A79 <--> B79 <--> E79
    A80 <--> B80 <--> E80

The two non-Hemisphere examples show the following:

• Each memory controller within a processor must have memory installed.
The DIMM configurations of each memory controller of a processor must be identical.

Memory performance optimization

The HP ProLiant BL680c G7 Server Blade supports up to 64 DIMMs installed on four multi-core processors. Optimal performance is achieved when the DIMMs are populated to make best use of the Intel® Xeon® 7500-series processor architecture.

To achieve the best performance for a given memory processor configuration, observe the following guidelines:

• The largest contributor to maximum memory bandwidth performance is to use both memory controllers that are integrated in each processor. To achieve maximum memory bandwidth performance, populate both memory controllers for each installed processor.

• The second largest contributor to performance is to populate each DDR3 channel for each installed processor. To achieve this, the minimum recommended DIMM count is eight DIMMs installed in DIMM pair locations A, B, C, and D on each installed processor.
  The third largest contributor to memory subsystem performance is the number of ranks per DIMM. Dual-rank DIMMs perform well, but quad-rank DIMMs offer a further performance boost.

• The best performance is obtained when all installed processors are enabled for Hemisphere mode. Hemisphere mode is optimum when four or eight DIMMs are installed per memory controller. Hemisphere mode can be achieved with two or six DIMMs per memory controller, but this configuration is not optimal for Hemisphere mode.
  • Maximum throughput is achieved when all DIMM slots are fully populated with the maximum number of eight quad-rank DIMMs per memory controller.

• Memory speed is a function of the processor QPI bus speed. Selecting a processor that supports a higher QPI speed enables the memory to operate at a higher performance level:
• Processors that support a QPI speed of 6.4 GT/s enable the memory to operate at 1066 MT/s, the maximum memory speed supported by the Intel Xeon 7500 processor.
• Processors that support a QPI speed of 5.8 GT/s operate memory at 978 MT/s.
• Processors that support a QPI speed of 4.8 GT/s operate memory at 800 MHz.
  o Memory performance degrades less when going from 1066 MHz to 984 MHz than it does when going from 978 MHz to 800 MHz.

Plan the memory configurations using identical DIMMs to achieve the memory size target, taking into account that 32- and 64-DIMM count configurations result in the highest performance. Using a four-processor configuration as an example, do the following:

• If the initial memory target is 64 GB, populate each processor with eight 2-GB DIMMs for a total of 32 DIMMs. The maximum expansion target using 2-GB DIMMs is 128 GB with 64 DIMMs.
• If the initial memory target is 128 GB, populate each processor with eight 4-GB DIMMs for a total of 16 DIMMs. The maximum expansion target using 4-GB DIMMs is 256 GB with 64 DIMMs.
• If the initial memory target is 256 GB, populate each processor with eight 8-GB DIMMs for a total of 16 DIMMs. The maximum expansion target using 8-GB DIMMs is 512 GB with 64 DIMMs.

The maximum system memory capability is 1 TB with 64 x 16-GB DIMMs (16 DIMMs per processor).

Memory RAS

The server supports the following AMP modes:

• Advanced ECC memory mode provides the greatest memory capacity for a given DIMM size and provides x4 and x8 SDDC. This mode is the default option for this server. For more information, see "Advanced ECC memory population guidelines (on page 53)."
• Online Spare memory mode provides protection against persistent DRAM failure. Rank-sparing is more efficient than DIMM-sparing since only a portion of a DIMM is set aside for memory protection. For more information, see "Online Spare memory population guidelines (on page 53)."
• Mirrored Memory mode provides the maximum protection against failed DIMMs. Uncorrectable errors in the DIMMs of one memory controller are corrected by the DIMMs in the mirrored memory controller. The two memory controllers of each processor form a mirrored pair. For more information, see "Mirrored Memory population guidelines (on page 54)."

AMP modes are configured in RBSU. If the requested AMP mode is not supported by the installed DIMM configuration, the server boots in Advanced ECC mode. For more information, see "HP ROM-Based Setup Utility (on page 78)."

For the latest memory configuration information, see the QuickSpecs on the HP website (http://www.hp.com/go/Proliant).

Advanced ECC memory population guidelines

Advanced ECC memory is the default memory protection mode for the server. Up to 1 TB of active memory using 16-GB DIMMs is supported in this AMP mode.

Advanced ECC can correct single-bit and multi-bit memory errors on a single x8 or two adjacent x4 DRAM devices.

The server provides notification when correctable error events have exceeded a pre-defined threshold rate. When uncorrectable errors are detected using Advanced ECC, the server notifies the user and shuts down the operating system.

Online Spare memory population guidelines

Online spare memory provides protection against persistent DRAM failure. It monitors DIMMs for excessive correctable errors and copies the content of an unhealthy rank to an available spare rank in advance of multi-bit or persistent single-bit failures that may result in uncorrectable faults. Rank-sparing is more efficient than DIMM-sparing since only a portion of a DIMM is set aside for memory protection.

When Online Spare memory is enabled, the first ranks of DIMM pair 4A/5A are set aside as the sparing ranks. Therefore, the available memory is reduced by the size of the first ranks of DIMM pair 4A/5A.

If a DIMM rank on either of the SMI buses exceeds its correctable ECC threshold, then the contents of the failing DIMM ranks are copied to the spare DIMM ranks. Once the copy is complete, all memory accesses to the previous failing DIMM ranks go to the spare DIMM ranks.

No performance penalty occurs for rank-sparing, other than the time it takes to copy the data from the failing rank to the spare rank upon an error condition.

The following population rules apply to each memory cartridge. Begin with the DIMM installation guidelines (on page 47) with these additional constraints:

• All installed processors must contain a valid sparing configuration.
• If installing mixed rank DIMMs in a memory controller, follow the mixed rank installation rules of the DIMM installation guidelines (on page 47).
• Rank sparing requires that the spare ranks of the DIMM pair 4A/5A be at least as large as any other DIMM rank on the DDR3 channels of a memory controller. To determine the size of a single rank in a DIMM, divide the total DIMM size by the number of ranks.

For example, the rank size of a dual-rank 2-GB DIMM is 1 GB and the rank size of a dual-rank 4-GB DIMM is 2 GB. Therefore, it is possible to support rank sparing with mixed DIMM pair sizes on a memory controller if the 4A/5A pair is populated with the 4-GB DIMMs and the other pairs are populated with either the identical 4-GB or 2-GB DIMMs (all pairs on a memory controller are not required to be populated). In this case, the 2-GB rank size of the 4-GB DIMMs in the 4A/5A pair is equal to or greater than the rank size of the other installed DIMMs.

However, the server cannot support DIMM sparing in this example if the 2-GB DIMMs are populated in the 4A/5A pair locations and the 4-GB DIMMs are populated in any of the remaining DIMM pair locations on the same memory controller. This configuration violates the rule requiring that the spare rank size of DIMM pair 4A/5A (1 GB) be equal to or larger than the single rank size of the other DIMM pair locations, since the rank size of a 4-GB DIMM in pairs B, C, D, E, F, or G would be larger (2 GB) than the spare rank size of the 2-GB DIMM pair in 4A/5A (1 GB).

Mirrored Memory population guidelines

Errors that are not corrected by ECC or SDDC cannot be corrected by Online Spare memory. By providing added redundancy in the memory sub-system, Mirrored Memory provides the greatest protection against memory failure beyond ECC, SDDC, and Online Spare memory.

In Mirrored Memory mode, each Lockstep DIMM pair of a memory controller has a mirrored DIMM pair on the other memory controller of the same processor.

Upon detecting an uncorrectable memory error from a DIMM pair of a memory controller, the processor avoids a system crash by reading the mirrored DIMM pairs from the other memory controller. In this case, the system management routine disables the failed DIMM. Further memory reads and writes will only occur on the mirrored DIMM pairs.

The exceptions to Mirrored Memory mode are the following:

• In Mirrored Memory mode, half of the memory is allocated to memory protection.
The available memory bandwidth is reduced by up to 50% in this mode.
- Mirrored Memory mode, Online Spare mode, Hemisphere mode, and interleaving cannot be enabled simultaneously.

To configure memory for Mirrored Memory mode, observe these additional constraints:

• For the server to support Mirrored Memory, all processors must have a valid mirroring configuration.
• The minimum allowable configuration is four DIMMs per processor.
• Both memory controllers for each processor must be populated with the same DIMM configurations.
  Although this configuration requirement is the same for Hemisphere mode and Mirrored Memory mode, only one of the two modes can be enabled at a given time.

Installing DIMMs (A-side)

To install the component:

1. Power down the server blade (on page 17).
2. Remove the server blade (on page 18).
3. Place the server blade on a flat, level surface with the correct side of the server blade facing up. To determine the correct side, see the label attached to the access panel.
4. Remove the access panel (A-side) (on page 19).
5. Do one of the following:
6. If installing processor 1 DIMMs, remove the right DIMM baffle (on page 21).
7. If installing processor 2 DIMMs, remove the left DIMM baffle (on page 20).

8. Open the DIMM slot latches.

9. Install the DIMM.

Diagram illustrating the process of a computer RAM module, showing two steps: adding a slot to a memory card and adding a slide to a track.

1. Do one of the following:

○ Install the right DIMM baffle.
- Install the left DIMM baffle.

1. Install the access panel (A-side).

2. Install the server blade ("Installing a server blade" on page 33).

3. Power up the server blade (on page 17).

Installing DIMMs (B-side)

To install the component:

1. Power down the server blade (on page 17).
2. Remove the server blade (on page 18).
3. Place the server blade on a flat, level surface with the correct side of the server blade facing up. To determine the correct side, see the label attached to the access panel.
4. Remove the access panel (B-side) (on page 19).

5. Do one of the following:

6. If installing processor 3 DIMMs, remove the right DIMM baffle (on page 21).

7. If installing processor 4 DIMMs, remove the left DIMM baffle (on page 20).

8. Open the DIMM slot latches.

9. Install the DIMM.

Diagram illustrating the process of a computer RAM module, showing two steps with directional arrows indicating rotation or assembly.

1. Do one of the following:

○ Install the right DIMM baffle.
- Install the left DIMM baffle.

1. Install the access panel (B-side).

2. Install the server blade ("Installing a server blade" on page 33).

3. Power up the server blade (on page 17).

Hot-plug SAS or SATA hard drive option

IMPORTANT: To avoid improper operation, install only hot-plug hard drives in this server blade.

IMPORTANT: The following configurations are not supported:

• Installation of both SAS and SATA hard drives in a single RAID volume
• Installation of SSD and rotating media hard drives in a single RAID volume

A Smart Array P410i controller supports either four hot-plug SAS or four hot-plug SATA hard drives. Hard drive activity is indicated by the hard drive LEDs on the hard drives.

RAID 0 and 1 are supported and do not require a cache module to be installed.

RAID 1+0, 5, and 6 require a cache module. In addition, RAID 6 is supported by adding a cache option and the SmartArray Advanced Pack.

CAUTION: To prevent improper cooling and thermal damage, do not operate the server blade or the enclosure unless all hard drive and device bays are populated with either a component or a blank.

To install the component:

1. Remove the hard drive blank.

Technical diagram of a mechanical fan assembly with numbered components and directional arrows indicating parts of the frame.

1. Prepare the hard drive.

Technical diagram of a device showing internal components and directional arrows labeled 1 and 2

1. Install the hard drive.

Technical diagram of a server rack with labeled components and directional arrows indicating assembly steps

1. Determine the status of the hard drive from the hot-plug hard drive LEDs ("SAS and SATA hard drive LEDs" on page 8).

2. Resume normal server blade operations.

Mezzanine card option

Optional mezzanine cards provide additional network connectivity or provide Fibre Channel support.

• The A-side of the server blade contains mezzanine connectors 1, 2, and 3. For A-side mezzanine card locations, see "System board components (A-side) (on page 9)."
• The B-side of the server blade contains mezzanine connectors 4, 5, 6, and 7. For B-side mezzanine card locations, see "Interposer board components (on page 13)."

For mezzanine card signal mapping, see "Interconnect bay numbering and device mapping (on page 31)" and the installation instructions that ship with the server blade.

Optional mezzanine cards are classified as Type I mezzanine cards and Type II mezzanine cards. The card type determines where it can be installed in the server blade:

• Install a Type I mezzanine card on any mezzanine connector.
• Install a Type II mezzanine card on Mezzanine 2, 3, 4, and 6 connectors only.

Because mezzanine cards are supported on multiple server blade models, the mezzanine card may have captive screws that are not required to secure it to the server blade. When installing a mezzanine card in this server blade, only two captive screws are required.

Installing a mezzanine card option (A-side)

!

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

△

CAUTION: Always wear an antistatic wrist strap when working inside the server.

To install the component:

1. Power down the server blade (on page 17).
2. Remove the server blade (on page 18).
3. Place the server blade on a flat, level surface with the correct side of the server blade facing up. To determine the correct side, see the label attached to the access panel.
4. Remove the access panel (A-side).
5. Remove the mezzanine connector cover.

Isometric line drawing of a mechanical component with an upward arrow indicating force or direction (no text or symbols)

1. Align the mezzanine connector on the optional mezzanine card with the mezzanine connector on the system board.

△

CAUTION: To prevent damage to the server blade, apply pressure over the mezzanine connector when installing the mezzanine card. Do not apply pressure to the edges of the card.

1. Install the mezzanine card. Press down on the connector to seat the card.

Diagram illustrating a mechanical assembly with labeled components and directional arrows indicating motion or movement.

1. Install the access panel (A-side).
2. Install the server blade ("Installing a server blade" on page 33).
3. Power up the server blade (on page 17).

Installing a mezzanine card option (B-side)

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

CAUTION: Always wear an antistatic wrist strap when working inside the server.

To install the component:

1. Power down the server blade (on page 17).
2. Remove the server blade (on page 18).
3. Place the server blade on a flat, level surface with the correct side of the server blade facing up. To determine the correct side, see the label attached to the access panel.
4. Remove the access panel (B-side) (on page 19).
5. Remove the interposer board (on page 24).
6. Remove the mezzanine connector cover.

Isometric line drawing of a mechanical component with an upward arrow indicating force or movement (no text or symbols)

1. Align the mezzanine connector on the optional mezzanine card with the mezzanine connector on the interposer board.

CAUTION: To prevent damage to the server blade, apply pressure over the mezzanine connector when installing the mezzanine card. Do not apply pressure to the edges of the card.

1. Install the mezzanine card. Press down on the connector to seat the card.

Diagram illustrating a mechanical assembly with labeled components and directional arrows indicating motion or force.

1. Install the interposer board.

2. Install the access panel (B-side).

3. Install the server blade ("Installing a server blade" on page 33).

4. Power up the server blade (on page 17).

Controller options

The server blade ships with an embedded Smart Array P410i Controller. RAID 0 and 1 are supported and do not require a cache module to be installed. RAID 1+0, 5, and 6 require a cache module. In addition, RAID 6 is supported by adding a cache option and the SmartArray Advanced Pack. Upgrade options exist for the integrated array controller. For a list of supported options, see the QuickSpecs on the HP website (http://www.hp.com/support).

The server blade supports both of the following options. You can install up to two cache modules in any combination.

• Battery-backed write cache (BBWC) options

BBWC consists of a cache module and a battery pack (also called a BBWC enabler). The DDR cache module buffers and stores data being written by the controller. When the system power is on, the battery pack continuously recharges through a trickle-charging process lasting 15 minutes to 2 hours, depending on the original charge. In the event of system power failure, a fully charged battery pack can maintain the cached data for up to 72 hours.

• Flash-backed write cache (FBWC) options

FBWC consists of a cache module and a capacitor pack. The DDR cache module buffers and stores data being written by the controller. When the system power is on, the capacitor pack charges fully in about 5 minutes. In the event of a system power failure, a fully charged capacitor pack provides power for up to 80 seconds. During that interval, the controller transfers the cached data from DDR memory to flash memory, where the data remains indefinitely or until a controller retrieves the data.

CAUTION: Do not use this controller with cache modules designed for other controller models, because the controller can malfunction and you can lose data. Also, do not transfer this cache module to a different controller module, because you can lose data.
CAUTION: To prevent a server blade malfunction or damage to the equipment, do not add or remove the battery pack while an array capacity expansion, RAID level migration, or stripe size migration is in progress.
CAUTION: After the server blade is powered down, wait 15 seconds and then check the amber LED before unplugging the cable from the cache module. If the amber LED blinks after 15 seconds, do not remove the cable from the cache module. The cache module is backing up data, and data is lost if the cable is detached.
IMPORTANT: The battery pack might have a low charge when installed. In this case, a POST error message is displayed when the server blade is powered up, indicating that the battery pack is temporarily disabled. No action is necessary on your part. The internal circuitry automatically recharges the batteries and enables the battery pack. This process might take up to four hours. During this time, the cache module functions properly, but without the performance advantage of the battery pack.
NOTE: The data protection and the time limit also apply if a power outage occurs. When power is restored to the system, an initialization process writes the preserved data to the hard drives.

Installing a cache module

CAUTION: To prevent a server blade malfunction or damage to the equipment, do not add or remove the battery pack while an array capacity expansion, RAID level migration, or stripe size migration is in progress.
CAUTION: After the server blade is powered down, wait 15 seconds and then check the amber LED before unplugging the cable from the cache module. If the amber LED blinks after 15 seconds, do not remove the cable from the cache module. The cache module is backing up data, and data is lost if the cable is detached.
IMPORTANT: The battery pack might have a low charge when installed. In this case, a POST error message is displayed when the server blade is powered up, indicating that the battery pack is temporarily disabled. No action is necessary on your part. The internal circuitry automatically recharges the batteries and enables the battery pack. This process might take up to four hours. During this time, the cache module functions properly, but without the performance advantage of the battery pack.

To install the component:

1. Close all applications, and power down the server blade (on page 17). This procedure flushes all data from the cache.
2. Remove the server blade (on page 18).
3. Place the server blade on a flat, level surface with the A-side of the server blade facing up. To determine which side is the A-side, see the label attached to the access panel.

4. Remove the access panel (A-side) (on page 19).

5. Locate the cache module connector ("System board components (A-side)" on page 9).

6. Install the cache module.

Diagram showing a mechanical or structural component with labeled parts and directional arrows indicating movement or force.

1. Install the capacitor pack ("Installing a capacitor pack" on page 63).
2. Install the access panel (A-side).
3. Install the server blade ("Installing a server blade" on page 33).
4. Power up the server blade (on page 17).

Installing a capacitor pack

CAUTION: To prevent a server blade malfunction or damage to the equipment, do not add or remove the battery pack while an array capacity expansion, RAID level migration, or stripe size migration is in progress.

CAUTION: After the server blade is powered down, wait 15 seconds and then check the amber LED before unplugging the cable from the cache module. If the amber LED blinks after 15 seconds, do not remove the cable from the cache module. The cache module is backing up data, and data is lost if the cable is detached.

IMPORTANT: The battery pack might have a low charge when installed. In this case, a POST error message is displayed when the server blade is powered up, indicating that the battery pack is temporarily disabled. No action is necessary on your part. The internal circuitry automatically recharges the batteries and enables the battery pack. This process might take up to four hours. During this time, the cache module functions properly, but without the performance advantage of the battery pack.

To install the component:

1. Close all applications, and power down the server blade (on page 17). This procedure flushes all data from the cache.
2. Remove the server blade (on page 18).

3. Place the server blade on a flat, level surface with the A-side of the server blade facing up. To determine the which side is the A-side, see the label attached to the access panel.

4. Remove the access panel (A-side) (on page 19).

5. Install the cache module ("Installing a cache module" on page 62).
6. Install the capacitor pack.

Isometric technical diagram of an electronic device with a central component and surrounding circuit boards (no text or labels)

1. Install the access panel (A-side).
2. Install the server blade ("Installing a server blade" on page 33).
3. Power up the server blade (on page 17).

HP Trusted Platform Module option

Use these instructions to install and enable a TPM on a supported server blade. This procedure includes three sections:

1. Installing the Trusted Platform Module board.
2. Retaining the recovery key/password (on page 66).
3. Enabling the Trusted Platform Module (on page 66).

Enabling the TPM requires accessing the ROM-Based Setup Utility (RBSU) ("HP ROM-Based Setup Utility" on page 78). For more information about RBSU, see the HP website (http://www.hp.com/support/smartstart/documentation).

TPM installation requires the use of drive encryption technology, such as the Microsoft® Windows® BitLocker™ Drive Encryption feature. For more information on BitLocker™, see the Microsoft website (http://www.microsoft.com).

CAUTION: Always observe the guidelines in this document. Failure to follow these guidelines can cause hardware damage or halt data access.

When installing or replacing a TPM, observe the following guidelines:

• Do not remove an installed TPM. Once installed, the TPM becomes a permanent part of the system board.

• When installing or replacing hardware, HP service providers cannot enable the TPM or the encryption technology. For security reasons, only the customer can enable these features.

• When returning a system board for service replacement, do not remove the TPM from the system board. When requested, HP Service provides a TPM with the spare system board.

• Any attempt to remove an installed TPM from the system board breaks or disfigures the TPM security rivet. Upon locating a broken or disfigured rivet on an installed TPM, administrators should consider the system compromised and take appropriate measures to ensure the integrity of the system data.
• When using BitLocker™, always retain the recovery key/password. The recovery key/password is required to enter Recovery Mode after BitLocker™ detects a possible compromise of system integrity.
  HP is not liable for blocked data access caused by improper TPM use. For operating instructions, see the encryption technology feature documentation provided by the operating system.

Installing the Trusted Platform Module board

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

IMPORTANT: To avoid damage to the server blade, support the riser board when installing the TPM board and rivet.

1. Power down the server blade (on page 17).
2. Remove the server blade (on page 18).
3. Place the server blade on a flat, level surface with the A-side of the server blade facing up. To determine the A-side, see the label attached to the access panel.
4. Remove the access panel (A-side) (on page 19).

CAUTION: Any attempt to remove an installed TPM from the system board breaks or disfigures the TPM security rivet. Upon locating a broken or disfigured rivet on an installed TPM, administrators should consider the system compromised and take appropriate measures to ensure the integrity of the system data.

1. Install the TPM board. Press down on the connector to seat the board ("System board components (A-side)" on page 9).

Technical illustration of a mechanical assembly showing a component being inserted into a housing and then placed on top, with no visible text or symbols.

1. Install the TPM security rivet by pressing the rivet firmly into the system board.

Diagram showing a mechanical assembly with labeled parts and directional arrows indicating motion or force

1. Install the access panel (A-side).

2. Install the server blade ("Installing a server blade" on page 33).

3. Power up the server blade (on page 17).

Retaining the recovery key/password

The recovery key/password is generated during BitLocker™ setup, and can be saved and printed after BitLocker™ is enabled. When using BitLocker™, always retain the recovery key/password. The recovery key/password is required to enter Recovery Mode after BitLocker™ detects a possible compromise of system integrity.

To help ensure maximum security, observe the following guidelines when retaining the recovery key/password:

• Always store the recovery key/password in multiple locations.
• Always store copies of the recovery key/password away from the server blade.
• Do not save the recovery key/password on the encrypted hard drive.

Enabling the Trusted Platform Module

1. When prompted during the start-up sequence, access RBSU by pressing the F9 key.
2. From the Main Menu, select Server Security.
3. From the Server Security Menu, select Trusted Platform Module.
4. From the Trusted Platform Module Menu, select TPM Functionality.
5. Select Enable, and then press the Enter key to modify the TPM Functionality setting.
6. Press the Esc key to exit the current menu, or press the F10 key to exit RBSU.
7. Reboot the server blade.
8. Enable the TPM in the OS. For OS-specific instructions, see the OS documentation.

△

CAUTION: When a TPM is installed and enabled on the server blade, data access is locked if you fail to follow the proper procedures for updating the system or option firmware, replacing the system board, replacing a hard drive, or modifying OS application TPM settings.

For more information on firmware updates and hardware procedures, see the HP Trusted Platform Module Best Practices White Paper on the HP website (http://www.hp.com/support).

For more information on adjusting TPM usage in BitLocker™, see the Microsoft website (http://technet.microsoft.com/en-us/library/cc732774.aspx).

Cabling

Using the HP c-Class Blade SUV Cable

The HP c-Class Blade SUV Cable enables the user to perform server blade administration, configuration, and diagnostic procedures by connecting video and USB devices directly to the server blade. For SUV cable connectors, see "HP c-Class Blade SUV Cable (on page 15)."

Connecting locally to a server blade with video and USB devices

Use the local I/O cable to connect a monitor and any of the following USB devices:

• USB hub
• USB keyboard
  USB mouse
  • USB CD/DVD-ROM drive
• USB diskette drive
• USB drive key

Numerous configurations are possible. This section offers two possible configurations. For more information, see "USB support and functionality (on page 83)."

Accessing a server blade with local KVM

CAUTION: Before disconnecting the SUV cable from the connector, always squeeze the release buttons on the sides of the connector. Failure to do so can result in damage to the equipment.

NOTE: For this configuration, a USB hub is not necessary. To connect additional devices, use a USB hub.

1. Connect the SUV cable to the server blade.
2. Connect the video connector to a monitor.

3. Connect a USB mouse to one USB connector.

4. Connect a USB keyboard to the second USB connector.

Diagram showing connections between a desktop computer and server rack via cable, labeled with numbered components.

Item Description
1 Monitor
2 USB mouse
3 HP c-Class Blade	SUV Cable
4 Video connector
5 Server blade
6 USB keyboard

Accessing local media devices

Use the following configuration when configuring a server blade or loading software updates and patches from a USB CD/DVD-ROM or a USB diskette.

1. Connect the SUV cable to the server blade.
2. Connect the video connector to a monitor.
3. Connect a USB hub to one USB connector.
4. Connect the following to the USB hub:

USB CD/DVD-ROM drive
- USB keyboard
- USB mouse
- USB diskette drive

NOTE: Use a USB hub when connecting a USB diskette drive and/or USB CD-ROM drive to the server blade. The USB hub provides additional connections.

Diagram of a network device with labeled components including computer, keyboard, USB drive, and server rack

Item Description
1 Monitor
2 USB mouse
3 HP c-Class Blade	SUV Cable
4 Server blade
5 USB hub
6 USB keyboard
7 USB CD/DVD-ROM drive or diskette drive

Software and configuration utilities

Server blade deployment tools

HP BladeSystem c-Class Advanced management

iLO 3 is a standard component of ProLiant c-Class server blades that provides server health and remote server blade manageability. Its features are accessed from a network client device using a supported web browser. In addition to other features, iLO 3 provides keyboard, mouse, and video (text and graphics) capability for a server blade, regardless of the state of the host OS or host server blade.

iLO 3 includes an intelligent microprocessor, secure memory, and a dedicated network interface. This design makes iLO 3 independent of the host server blade and its OS. iLO 3 provides remote access to any authorized network client, sends alerts, and provides other server blade management functions.

Using a supported web browser, you can:

• Remotely access the console of the host server blade, including all text mode and graphics mode screens with full keyboard and mouse controls.
• Remotely power up, power down, or reboot the host server blade.
• Remotely boot a host server blade to a virtual media image to perform a ROM upgrade or install an OS.
• Send alerts from iLO 3 regardless of the state of the host server blade.
• Access advanced troubleshooting features provided by iLO 3.
• Launch a web browser, use SNMP alerting, and diagnose the server blade with HP SIM.
• Configure static IP bay settings for the dedicated iLO 3 management NICs on each server blade in an enclosure for faster deployment.

To connect to the server blade using iLO 3, install the server blade in an enclosure. Onboard Administrator assigns an IP address to enable iLO 3 connectivity to the server blade.

The c-Class tab enables you to control specific settings for the HP BladeSystem. iLO 3 also provides web-based status for the HP BladeSystem configuration.

For detailed information about iLO 3, refer to the HP Integrated Lights-Out User Guide on the HP website (http://www.hp.com/servers/lights-out).

Network-based PXE deployment

PXE is a component of the Intel® WfM specification. The PXE model enables server blades to load and execute an NBP from a PXE server and to execute a pre-configured image. The image can be an OS image created by software utilities or a boot diskette image. This feature enables a user to configure a server blade and install an OS over a network.

Deployment overview

When a PXE-enabled target server blade boots, it obtains an IP address from a DHCP server. The target server blade obtains the name of the NBP from the appropriate boot server. Then, the target server blade uses TFTP to download the NBP from the boot server and executes the image.

IMPORTANT: To connect to a network with a Pass-Thru module, always connect the Pass-Thru module to a network device that supports Gigabit speed.

For each server blade being deployed, the PXE server must be connected to the NIC designated for PXE. The server blade defaults PXE functions to NIC 1, but any of the NC series NICs in the server blade can be designated for PXE in RBSU. For NIC connector locations, refer to the documentation included with the server blade.

NOTE: Actual NIC numeration depends on several factors, including the OS installed on the server blade.

To deploy an OS to multiple server blades, install a PXE deployment server on a network.

Deployment infrastructure

IMPORTANT: To connect to a network with a Pass-Thru module, always connect the Pass-Thru module to a network device that supports Gigabit speed.

To establish a network-based PXE deployment infrastructure, provide the following software and minimum hardware:

- Client PC (administrative workstation)

AMD Athlon™ XP processor (700 MHz or greater recommended), AMD Athlon™ 64 processor, or Intel® Pentium® III or higher processor (700 MHz or greater recommended)
- 128 MB of RAM
- Microsoft® Windows® 2000 Professional or Microsoft® Windows® XP OS
- Microsoft® Internet Explorer 5.5 or above with 128-bit encryption
- Ethernet NIC with 10/100 RJ-45 connector
- TCP/IP networking and an IP address compatible with one of the following: the iLO 3 Diagnostic Port IP address or an assigned DHCP or static IP address
- CD-ROM drive, CD/DVD-ROM drive, and/or diskette drive
- Any of the following Java™ Runtime Environment versions:

1.3.1_02

1.3.1_07

1.3.1_08

1.4.1 for Windows® users only

1.4.2 for Linux users only

Access the Java™ Runtime Environment versions at the HP website (http://java.sun.com/products/archive/index.html).

• DHCP server (IP address assignment)

AMD Athlon™ XP processor (700 MHz or greater recommended), AMD Athlon™ 64 processor, or Intel® Pentium® or Pentium® II 200-MHz or faster processor

• 64 MB of RAM
• 64 MB of free hard drive space
• 10-Mb/s network adapter

• PXE deployment server (storing boot images)

AMD Athlon™ XP processor (700 MHz or greater recommended), AMD Athlon™ 64 processor, or Intel® Pentium® III or higher processor (500 MHz recommended)
- 256 MB of RAM
- 10-Mb/s network adapter
- CD-ROM drive

- Windows® repository server (Windows® or Linux deployment)

• Windows® 2000 or Windows Server® 2003 OS installed
• Network connection
• CD-ROM drive
• 1.5 GB of available disk space
• TCP/IP networking and an IP address compatible with one of the following: the iLO 3 Diagnostic Port IP address or an assigned DHCP or static IP address
• CD-ROM drive and/or diskette drive
• Any of the following Java™ Runtime Environment versions:

1.3.1_02

1.3.1_07

1.3.1_08

1.4.1 for Windows® users only

1.4.2 for Linux users only

Access the Java™ Runtime Environment versions at the HP website (http://java.sun.com/products/archive/index.html).

• Network server with an OS installed

Deployment methods

Four primary deployment methods are supported:

IMPORTANT: To deploy a server blade without the HP Insight Control server deployment, create a bootable diskette or image of a bootable diskette.

• PXE deployment (on page 73)
• CD-ROM deployment (on page 74)
• Diskette image deployment (on page 75)
• SAN configuration (on page 76)

PXE deployment

PXE enables server blades to load an image over the network from a PXE server, and then execute it in memory. The first NIC on the server blade is the default PXE boot NIC, but any of the other NC series

NICs can be configured to boot PXE. For more information, see "Network-based PXE deployment (on page 71)."

Actual NIC numeration depends on several factors, including the OS installed on the server blade.

HP recommends using one of the following methods for PXE deployment:

• HP Insight Control server deployment (formerly Rapid Deployment Pack)

HP Insight Control is essential server management that unlocks the management capabilities built into HP ProLiant servers. Insight Control delivers powerful capabilities that enable customers to proactively manage ProLiant server health - whether physical or virtual, deploy ProLiant servers quickly, optimize power consumption, and control ProLiant servers from anywhere.

HP Insight Control server deployment is a key component of Insight Control which provides an automated, simple-to-use solution for bare-metal deployment and configuration of HP ProLiant servers with an operating system or virtualization platform. Insight Control server deployment includes an unaltered Altiris Deployment Solution while providing optimization for deployment of HP ProLiant servers using HP ProLiant Integration Module.

HP Insight Control facilitates the installation, configuration, and deployment of high-volumes of servers through an intuitive, comprehensive console, using either scripting or imaging technology. It makes deploying a server as easy as selecting one, a few, or hundreds of target servers, selecting predefined images or scripts, and clicking Run.

For more information about HP Insight Control, see the HP website (http://www.hp.com/go/insightcontrol).

SmartStart Scripting Toolkit

The SmartStart Scripting Toolkit is a server deployment product that allows you to build an unattended automated installation for high-volume server blade deployments. The SmartStart Scripting Toolkit is designed to support ProLiant BL, ML, DL, and SL servers. The toolkit includes a modular set of utilities and important documentation that describes how to apply these tools to build an automated server deployment process.

The Scripting Toolkit provides a flexible way to create standard server configuration scripts. These scripts are used to automate many of the manual steps in the server configuration process. This automated server configuration process cuts time from each deployment, making it possible to scale rapid, high-volume server blade deployments.

For more information, and to download the SmartStart Scripting Toolkit, see the HP website (http://www.hp.com/servers/sstoolkit).

CD-ROM deployment

CD-ROM deployment involves using a bootable CD that executes scripts to configure the hardware and install the OS. After the OS is configured, the server blade can access the network to locate the scripts and files necessary for deployment. Before beginning the deployment process, connect the server blade to the network.

NOTE: For more information about hardware and cabling configurations, see the documents that ship with the enclosure.

Two methods are available for CD-ROM deployment:

• iLO virtual CD-ROM (on page 75)

• USB CD-ROM (on page 75)

iLO virtual CD-ROM

To deploy with a boot CD:

1. Do one of the following:

2. Insert the boot CD into the client PC using the iLO 3 Remote Console.

3. Use iLO 3 to create an image file of the boot CD.

4. Copy the image of the boot CD to a location on the network or the client PC hard drive.

5. Remotely access the server blade through iLO 3. See "HP BladeSystem c-Class advanced management (on page 71)."

6. Open Integrated Remote console or Java Remote console.
7. Select the local CD-ROM or image file from the Virtual Drives menu, located at the top of the screen.
8. Connect the Virtual CD-ROM to the server blade.
9. Use the iLO 3 power switch feature to reboot the server blade.
10. After the server blade boots, follow the normal network installation procedure for the OS.

USB CD-ROM

This method uses SmartStart to facilitate loading the OS. However, SmartStart also allows for manual loading of the OS and drivers.

To deploy with a boot CD:

1. Use the HP c-Class Blade SUV Cable to connect a USB CD-ROM drive to the server blade. Refer to "Connecting locally to a server blade with video and USB devices (on page 68)."
2. Insert the boot CD into the USB CD-ROM drive.
3. Reboot the server blade.
4. After the server blade boots, follow the normal installation procedure for an OS.

Windows Server® 2003 cannot be installed from a USB CD-ROM on the HP c-Class Blade SUV Cable if the hard drive is completely blank (no partitions defined). To install Windows Server® 2003, use one of the following methods:

Make a partition on the hard drive that Windows Server® 2003 will be loaded on.
• Use the SmartStart CD 7.60 or later.
- Use the Rapid Deployment Pack. For instructions, see the HP website (http://h18013.www1.hp.com/products/servers/management/rdp.html?jumpid=reg_R1002_USE_N).

Diskette image deployment

To deploy with a diskette image, the user creates a DOS-based network-enabled boot diskette that executes a script that configures the hardware and installs the OS. The diskette enables the server blade to access the required deployment scripts and files on the network.

This method implies a deployment infrastructure that may include an administrator workstation, PXE server, Microsoft® Windows® file share, or a Linux file share. For more information, refer to "Deployment infrastructure (on page 72)."

Before beginning the deployment process, connect the server blade to the network.

NOTE: For more information about hardware and cabling configurations, see the documents that ship with the enclosure.

Two methods are available for diskette image deployment:

• iLO virtual floppy (on page 76)
- PXE ("PXE deployment" on page 73)

Creating a boot diskette

The SmartStart Scripting Toolkit provides the tools and information for creating a boot diskette. For details, refer to the SmartStart Scripting Toolkit User Guide and download the latest version of the software from the HP website (http://www.hp.com/servers/sstoolkit).

As an alternative method, configure the hardware manually with RBSU and the iLO 3 remote console. With this method, the disk is more generic and integrates with an existing network OS installation process. For more information, refer to "HP BladeSystem c-Class advanced management (on page 71)."

To operate properly, the server blade must have a supported OS. For the latest information on a supported OS, refer to the HP website (http://www.hp.com/go/supportos).

iLO virtual floppy

To deploy with a boot diskette:

1. Do one of the following:

2. Insert the boot diskette into the client PC using the iLO 3 Remote Console.

3. Use iLO 3 to create an image file of the boot diskette.

4. Copy the image of the boot diskette to a location on the network or the client PC hard drive.

5. Remotely access the server blade through iLO 3. See "HP BladeSystem c-Class advanced management (on page 71)."

6. Open Integrated Remote Console or Java Remote Console.
7. Select the local diskette or image file from the Virtual Drives menu, located at the top of the screen.
8. Connect the Virtual floppy to the server blade.
9. Use the iLO 3 power switch feature to reboot the server blade.
10. After the server blade boots, follow the normal network installation procedure for the OS.

SAN configuration

The server blade provides FC support for SAN implementations. This solution uses an optional FCA that offers redundant SAN connectivity and optimization for HP StorageWorks products. The server blade is also compatible with certain third-party SAN products. For more information, refer to the documentation that ships with the FCA option.

For optimal SAN connectivity, observe the following guidelines:

• The FCA option is installed correctly in the server blade. Refer to the documentation that ships with the FCA option.

• An FC-compatible interconnect is installed in the enclosure. Refer to the documentation that ships with the interconnect option.

• The server blade enclosure management module firmware is up-to-date. Refer to the HP Business Support Center website (http://www.hp.com/support).
  • The server blade is cabled properly to a supported SAN.
  • SAN storage drivers are loaded. Refer to supporting white papers and the HP website (http://www.hp.com/servers/rdp).

For SAN configuration information for the server blade, refer to the HP StorageWorks SAN Design Reference Guide on the HP website (http://h18000.www1.hp.com/products/storageworks/san/documentation.html).

Configuration tools

SmartStart software

SmartStart is a collection of software that optimizes single-server setup, providing a simple and consistent way to deploy server configuration. SmartStart has been tested on many ProLiant server products, resulting in proven, reliable configurations.

SmartStart assists the deployment process by performing a wide range of configuration activities, including:

• Preparing the system for installing "off-the-shelf" versions of leading operating system software
• Installing optimized server drivers, management agents, and utilities automatically with every assisted installation
- Testing server hardware using the Insight Diagnostics Utility ("HP Insight Diagnostics" on page 84)
- Installing software drivers directly from the CD. With systems that have Internet connection, the SmartStart Autorun Menu provides access to a complete list of ProLiant system software.
• Enabling access to the Array Configuration Utility (on page 80) and Erase Utility (on page 82)

SmartStart is included in the HP Insight Foundation suite for ProLiant. For more information about SmartStart software, see the HP Insight Foundation suite for ProLiant or the HP website (http://www.hp.com/go/foundation).

SmartStart Scripting Toolkit

The SmartStart Scripting Toolkit is a server deployment product that allows you to build an unattended automated installation for high-volume server blade deployments. The SmartStart Scripting Toolkit is designed to support ProLiant BL, ML, DL, and SL servers. The toolkit includes a modular set of utilities and important documentation that describes how to apply these tools to build an automated server deployment process.

The Scripting Toolkit provides a flexible way to create standard server configuration scripts. These scripts are used to automate many of the manual steps in the server configuration process. This automated server configuration process cuts time from each deployment, making it possible to scale rapid, high-volume server blade deployments.

For more information, and to download the SmartStart Scripting Toolkit, see the HP website (http://www.hp.com/servers/sstoolkit).

HP ROM-Based Setup Utility

RBSU is a configuration utility embedded in ProLiant servers that performs a wide range of configuration activities that can include the following:

• Enabling and disabling system features
• Displaying system information
• Selecting the primary boot controller
- Configuring memory options
- Language selection

- Configuring system devices and installed options

For more information on RBSU, see the HP ROM-Based Setup Utility User Guide on the Documentation CD or the HP website (http://www.hp.com/support/smartstart/documentation).

Using RBSU

To use RBSU, use the following keys:

• To access RBSU, press the F9 key during power-up when prompted.
• To navigate the menu system, use the arrow keys.
• To make selections, press the Enter key.
• To access Help for a highlighted configuration option, press the F1 key.

IMPORTANT: RBSU automatically saves settings when you press the Enter key. The utility does not prompt you for confirmation of settings before you exit the utility. To change a selected setting, you must select a different setting and press the Enter key.

Default configuration settings are applied to the server at one of the following times:

• Upon the first system power-up
• After defaults have been restored

Default configuration settings are sufficient for proper typical server operation, but configuration settings can be modified using RBSU. The system will prompt you for access to RBSU with each power-up.

Auto-configuration process

The auto-configuration process automatically runs when you boot the server for the first time. During the power-up sequence, the system ROM automatically configures the entire system without needing any intervention. During this process, the ORCA utility, in most cases, automatically configures the array to a default setting based on the number of drives connected to the server.

NOTE: The server may not support all the following examples.

NOTE: If the boot drive is not empty or has been written to in the past, ORCA does not automatically configure the array. You must run ORCA to configure the array settings.

Drives installed	Drives used	RAID level
1 1 RAID 0
2 2 RAID 1
3, 4, 5, or 6	3, 4, 5, or 6	RAID 5
More than 6 0 None

To change any ORCA default settings and override the auto-configuration process, press the F8 key when prompted.

For more information on RBSU, see the HP ROM-Based Setup Utility User Guide on the Documentation CD or the HP website (http://www.hp.com/support/smartstart/documentation).

Boot options

Near the end of the boot process, the boot options screen is displayed. This screen is visible for several seconds before the system attempts to boot from a supported boot device. During this time, you can do the following:

• Access RBSU by pressing the F9 key.
- Access the System Maintenance Menu (which enables you to launch ROM-based Diagnostics or Inspect) by pressing the F10 key.
- Access the boot menu by pressing the F11 key.
• Force a PXE Network boot by pressing the F12 key.

BIOS Serial Console

BIOS Serial Console allows you to configure the serial port to view POST error messages and run RBSU remotely through a serial connection to the server COM port. The server that you are remotely configuring does not require a keyboard and mouse.

For more information about BIOS Serial Console, see the BIOS Serial Console User Guide on the Documentation CD or the HP website (http://www.hp.com/support/smartstart/documentation).

Configuring AMP modes

Not all ProLiant servers support all AMP modes. RBSU provides menu options only for the modes supported by the server. Advanced memory protection within RBSU enables the following advanced memory.

• Advanced ECC Mode—Provides memory protection beyond Standard ECC. All single-bit failures and some multi-bit failures can be corrected without resulting in system downtime.
• Online Spare Mode—Provides protection against failing or degraded DIMMs. Certain memory is set aside as spare, and automatic failover to spare memory occurs when the system detects a degraded DIMM. DIMMs that are likely to receive a fatal/uncorrectable memory error are removed from operation automatically, resulting in less system downtime.

See the server-specific user guide for DIMM population requirements.

- Mirrored Memory Mode—Provides protection against uncorrectable memory errors that would otherwise result in system failure. In this mode, the system maintains two copies of all data. If an uncorrectable memory error occurs, the system automatically retrieves the good data from the

mirrored copy. The system continues to operate normally without any user intervention. If the system supports hot-plug memory, the failed memory can be replaced while the system continues to operate.

- RAID Memory Mode—Provides protection levels similar to Mirrored Memory Mode, and it requires less memory allocation than full redundancy.

Array Configuration Utility

ACU is a browser-based utility with the following features:

• Runs as a local application or remote service
  • Supports online array capacity expansion, logical drive extension, assignment of online spares, and RAID or stripe size migration
• Suggests the optimum configuration for an unconfigured system
• Provides different operating modes, enabling faster configuration or greater control over the configuration options
  • Remains available any time that the server is on
  • Displays on-screen tips for individual steps of a configuration procedure
• Beginning with ACU version 8.28.13.0, provides diagnostic functionality on the Diagnostics tab (formerly known as Array Diagnostics Utility).

For optimum performance, the minimum display settings are 1024 × 768 resolution and 16-bit color. Servers running Microsoft® operating systems require one of the following supported browsers:

• Internet Explorer 6.0 or later
- Mozilla Firefox 2.0 or later

For Linux servers, see the README.TXT file for additional browser and support information.

For more information, see the Configuring Arrays on HP Smart Array Controllers Reference Guide on the Documentation CD or the HP website (http://www.hp.com).

Option ROM Configuration for Arrays

Before installing an operating system, you can use the ORCA utility to create the first logical drive, assign RAID levels, and establish online spare configurations.

The utility also provides support for the following functions:

• Reconfiguring one or more logical drives
• Viewing the current logical drive configuration
• Deleting a logical drive configuration
- Setting the controller to be the boot controller

If you do not use the utility, ORCA will default to the standard configuration.

For more information regarding array controller configuration, refer to the controller user guide.

For more information regarding the default configurations that ORCA uses, refer to the HP ROM-Based Setup Utility User Guide on the Documentation CD.

Re-entering the server serial number and product ID

After you replace the system board, you must re-enter the server blade serial number and the product ID.

1. During the server blade startup sequence, press the F9 key to access RBSU.
2. Select the Advanced Options menu.
3. Select Service Options.
4. Select Serial Number. The following warnings appear:

WARNING! WARNING! WARNING! The serial number is loaded into the system during the manufacturing process and should NOT be modified. This option should only be used by qualified service personnel. This value should always match the serial number sticker located on the chassis.

Warning: The serial number should ONLY be modified by qualified personnel. This value should always match the serial number located on the chassis.

1. Press the Enter key to clear the warning.
2. Enter the serial number and press the Enter key.
3. Select Product ID. The following warning appears:

Warning: The Product ID should ONLY be modified by qualified personnel. This value should always match the Product ID on the chassis.

1. Enter the product ID and press the Enter key.
2. Press the Esc key to close the menu.
3. Press the Esc key to exit RBSU.
4. Press the F10 key to confirm exiting RBSU. The server blade automatically reboots.

Management tools

Automatic Server Recovery

ASR is a feature that causes the system to restart when a catastrophic operating system error occurs, such as a blue screen, ABEND, or panic. A system fail-safe timer, the ASR timer, starts when the System Management driver, also known as the Health Driver, is loaded. When the operating system is functioning properly, the system periodically resets the timer. However, when the operating system fails, the timer expires and restarts the server.

ASR increases server availability by restarting the server within a specified time after a system hang or shutdown. At the same time, the HP SIM console notifies you by sending a message to a designated pager number that ASR has restarted the system. You can disable ASR from the HP SIM console or through RBSU.

ROMPaq utility

The ROMPaq utility enables you to upgrade the system firmware (BIOS). To upgrade the firmware, insert a ROMPaq USB Key into an available USB port and boot the system. In addition to ROMPaq, Online Flash Components for Windows and Linux operating systems are available for updating the system firmware.

The ROMPaq utility checks the system and provides a choice (if more than one exists) of available firmware revisions.

For more information, see the Download drivers and software page for the server blade. To access the server-specific page, enter the following web address into the browser:

http://www.hp.com/support/

For example:

http://www.hp.com/support/dl360g6

iLO 3 Standard Blade Edition technology

The iLO 3 subsystem is a standard component of selected ProLiant servers that provides server health and remote server manageability. The iLO 3 subsystem includes an intelligent microprocessor, secure memory, and a dedicated network interface. This design makes iLO 3 independent of the host server and its operating system.

In addition to remote management features, iLO 3 is also responsible for managing the health of the ProLiant server. The intelligence of iLO 3 manages the Sea of Sensors thermal control, directs the Dynamic Power Capping technology, and monitors the health of server components.

The iLO 3 subsystem provides secure remote access from any authorized network client. The enhancements to iLO 3 enable customers to get work done faster by providing turbo-charged remote access performance, a streamlined user experience, and enhanced standards support.

Using iLO 3, you can do the following:

• Access a high-performance and secure Remote Console to the server from anywhere in the world.
  • Use the shared iLO 3 Remote Console to collaborate with up to six server administrators.
  • Remotely mount high-performance Virtual Media devices to the server.
• Securely and remotely control the power state of the managed server.
• Send alerts from iLO 3 regardless of the state of the host server.
• Access advanced troubleshooting features through the iLO 3 interface.

For more information about iLO 3 features (which may require an iLO Advanced Pack or iLO Advanced for BladeSystem license), see the iLO 3 documentation on the Documentation CD or on the HP website (http://www.hp.com/go/ilo).

Erase Utility

CAUTION: Perform a backup before running the System Erase Utility. The utility sets the system to its original factory state, deletes the current hardware configuration information, including array setup and disk partitioning, and erases all connected hard drives completely. Refer to the instructions for using this utility.

Run the Erase Utility if you must erase the system for the following reasons:

• You want to install a new operating system on a server blade with an existing operating system.
- You encounter an error when completing the steps of a factory-installed operating system installation.

To access the Erase Utility, use the System Erase button on the home screen of the SmartStart CD ("SmartStart software" on page 77).

HP Systems Insight Manager

HP SIM is a web-based application that allows system administrators to accomplish normal administrative tasks from any remote location, using a web browser. HP SIM provides device management capabilities that consolidate and integrate management data from HP and third-party devices.

IMPORTANT: You must install and use HP SIM to benefit from the Pre-Failure Warranty for processors, SAS and SATA hard drives, and memory modules.

For additional information, refer to the Management CD in the HP ProLiant Essentials Foundation Pack or the HP SIM website (http://www.hp.com/go/hpsim).

Management Agents

Management Agents provide the information to enable fault, performance, and configuration management. The agents allow easy manageability of the server through HP SIM software, and third-party SNMP management platforms. Management Agents are installed with every SmartStart assisted installation or can be installed through the HP PSP. The Systems Management homepage provides status and direct access to in-depth subsystem information by accessing data reported through the Management Agents. For additional information, refer to the Management CD in the HP ProLiant Essentials Foundation Pack or the HP website (http://www.hp.com/servers/manage).

Redundant ROM support

The server blade enables you to upgrade or configure the ROM safely with redundant ROM support. The server blade has a single ROM that acts as two separate ROM images. In the standard implementation, one side of the ROM contains the current ROM program version, while the other side of the ROM contains a backup version.

NOTE: The server ships with the same version programmed on each side of the ROM.

Safety and security benefits

When you flash the system ROM, ROMPaq writes over the backup ROM and saves the current ROM as a backup, enabling you to switch easily to the alternate ROM version if the new ROM becomes corrupted for any reason. This feature protects the existing ROM version, even if you experience a power failure while flashing the ROM.

USB support and functionality

USB support

HP provides both standard USB 2.0 support and legacy USB 2.0 support. Standard support is provided by the OS through the appropriate USB device drivers. Before the OS loads, HP provides support for USB devices through legacy USB support, which is enabled by default in the system ROM.

Legacy USB support provides USB functionality in environments where USB support is not available normally. Specifically, HP provides legacy USB functionality for the following:

POST

RBSU
• Diagnostics
• DOS
- Operating environments which do not provide native USB support

Internal USB functionality

An internal USB connector is available for use with security key devices and USB drive keys. This solution provides for use of a permanent USB key installed in the internal connector, avoiding issues of clearance on the front of the rack and physical access to secure data.

External USB functionality

HP provides external USB support to enable local connection of USB devices for server blade administration, configuration, and diagnostic procedures. For more information, see "Using the HP c-Class Blade SUV Cable (on page 68)."

For additional security, external USB functionality can be disabled through RBSU. Disabling external USB support in RBSU disables the USB connectors on the HP c-Class Blade SUV Cable.

Internal SD support

An internal SD connector is available for use with embedded Hypervisors. This solution provides for use of a permanently installed SD card in the internal connector, decreasing the possibility of tampering or loss.

Diagnostic tools

HP Insight Diagnostics

HP Insight Diagnostics is a proactive server blade management tool, available in both offline and online versions, that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify server blade installations, troubleshoot problems, and perform repair validation.

HP Insight Diagnostics Offline Edition performs various in-depth system and component testing while the OS is not running. To run this utility, launch the SmartStart CD.

HP Insight Diagnostics Online Edition is a web-based application that captures system configuration and other related data needed for effective server blade management. Available in Microsoft® Windows® and Linux versions, the utility helps to ensure proper system operation.

For more information or to download the utility, refer to the HP website (http://www.hp.com/servers/diags).

HP Insight Diagnostics survey functionality

HP Insight Diagnostics (on page 84) provides survey functionality that gathers critical hardware and software information on ProLiant server blades.

This functionality supports operating systems that may not be supported by the server blade. For operating systems supported by the server blade, see the HP website (http://www.hp.com/go/supportos).

If a significant change occurs between data-gathering intervals, the survey function marks the previous information and overwrites the survey data files to reflect the latest changes in the configuration.

Survey functionality is installed with every SmartStart-assisted HP Insight Diagnostics installation, or it can be installed through the HP PSP ("ProLiant Support Packs" on page 87).

NOTE: The current version of SmartStart provides the memory spare part numbers for the server blade. To download the latest version, see the HP website (http://www.hp.com/support).

Integrated Management Log

The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each event with 1-minute granularity.

You can view recorded events in the IML in several ways, including the following:

• From within HP SIM ("HP Systems Insight Manager" on page 83)
• From within operating system-specific IML viewers:
- For Windows®: IML Viewer
- For Linux: IML Viewer Application
• From within the iLO 3 user interface
• From within HP Insight Diagnostics (on page 84)
• From within the Onboard Administrator GUI
For more information, see the HP BladeSystem Onboard Administrator User Guide on the HP website (http://www.hp.com/go/bladesystem/documentation).
• From the Onboard Administrator CLI
See the HP BladeSystem Onboard Administrator Command Line Interface User Guide for information on accessing the CLI.

For more information, see the Management CD in the HP ProLiant Essentials Foundation Pack.

Remote support and analysis tools

HP Insight Remote Support software

HP strongly recommends that you install HP Insight Remote Support software to complete the installation or upgrade of your product and to enable enhanced delivery of your HP Warranty, HP Care Pack Service or HP contractual support agreement. HP Insight Remote Support supplements your monitoring, 24 x 7 to ensure maximum system availability by providing intelligent event diagnosis, and automatic, secure submission of hardware event notifications to HP, which will initiate a fast and accurate resolution, based on your product's service level. Notifications may be sent to your authorized HP Channel Partner for on-site service, if configured and available in your country. The software is available in two variants:

- HP Insight Remote Support Standard: This software supports server and storage devices and is optimized for environments with 1–50 servers. Ideal for customers who can benefit from proactive notification, but do not need proactive service delivery and integration with a management platform.

- HP Insight Remote Support Advanced: This software provides comprehensive remote monitoring and proactive service support for nearly all HP servers, storage, network, and SAN environments, plus selected non-HP servers that have a support obligation with HP. It is integrated with HP Systems Insight Manager. A dedicated server is recommended to host both HP Systems Insight Manager and HP Insight Remote Support Advanced.

Details for both versions are available on the HP website (http://www.hp.com/go/insightremotesupport).

To download the software for free, go to Software Depot (http://www.software.hp.com).

Select Insight Remote Support from the menu on the right.

Keeping the system current

Drivers

IMPORTANT: Always perform a backup before installing or updating device drivers.

The server blade includes new hardware that may not have driver support on all OS installation media.

If you are installing a SmartStart-supported OS, use the SmartStart software (on page 77) and its Assisted Path feature to install the OS and latest driver support.

If you are installing drivers from the SmartStart CD, be sure that you are using the latest SmartStart version that your server blade supports. To verify that your server blade is using the latest supported version, see the HP website (http://www.hp.com/support). For more information, see the documentation provided with the SmartStart CD.

If you do not use the SmartStart CD to install an OS, drivers for some of the new hardware are required. These drivers, as well as other option drivers, ROM images, and value-add software can be downloaded from the HP website (http://www.hp.com/support).

To directly locate the OS drivers for a particular server blade, enter the following web address into the browser:

http://www.hp.com/support/

In place of , enter the server name.

For example:

http://www.hp.com/support/dl360g6 (http://www.hp.com/support/dl360g6)

Version control

The VCRM and VCA are Web-enabled Insight Management Agents tools that HP SIM uses to facilitate and schedule software update tasks to the entire enterprise.

• VCRM manages the repository for Windows and Linux PSPs as well as online firmware.

Administrators can browse a graphical view of the PSPs or configure VCRM to automatically update the repository with Internet downloads of the latest software from HP.

- VCA compares installed software versions and available updates. Administrators can configure VCA to point to a repository managed by VCRM.

For more information about version control tools, see the HP Systems Insight Manager Help Guide and the Version Control User Guide on the HP Systems Insight Manager website (http://www.hp.com/go/hpsim).

ProLiant Support Packs

PSPs represent operating system-specific bundles of ProLiant optimized drivers, utilities, and management agents. Refer to the PSP website

(http://h18000.www1.hp.com/products/servers/management/psp.html).

Operating System Version Support

For information about specific versions of a supported operating system, refer to the operating system support matrix (http://www.hp.com/go/supportos).

Firmware

The Smart Update Firmware DVD is an organized firmware collection for ProLiant servers and options powered by HP Smart Update Manager (on page 87). The Smart Update Firmware DVD combines the following resources on a single DVD:

• Firmware Maintenance CD
• HP BladeSystem Firmware Deployment Tool (FDT)
• The HP BladeSystem online firmware bundles
• The ProLiant BladeSystem Release Sets
• Offline, automatic mode for HP ProLiant BL, DL, ML, and 100 Series servers
• Firmware deployment support for HP ProLiant 100 Series servers

HP Smart Update Manager

The HP Smart Update Manager provides intelligent and flexible firmware and software deployment. This technology assists in reducing the complexity of provisioning and updating HP ProLiant Servers, options, and Blades within the datacenter. HP SUM is delivered on The Smart Update Firmware DVD, ProLiant Support Packs, and Easy Setup CDs.

HP SUM enables system administrators to upgrade ROM images efficiently across a wide range of server blades and options. This tool has the following features:

• Enables GUI and a command-line, scriptable interface
  • Enables scriptable, command-line deployment
• Requires no agent for remote installations
• Enables dependency checking, which ensures appropriate install order and dependency checking between components
• Deploys software and firmware on Windows and Linux operating systems
  • Performs local or remote (one-to-many) online deployment

• Deploys firmware and software together
• Supports offline and online deployment
- Deploys necessary component updates only (except Linux RPMs)
• Downloads the latest components from Web (except Linux RPMs)
- Enables direct update of BMC firmware (iLO and LO100i)

For more information about HP Smart Update Manager and to access the HP Smart Update Manager User Guide, see the HP website (http://www.hp.com/go/foundation).

Change control and proactive notification

HP offers Change Control and Proactive Notification to notify customers 30 to 60 days in advance of upcoming hardware and software changes on HP commercial products.

For more information, refer to the HP website (http://www.hp.com/go/pcn).

Care Pack

HP Care Pack Services offer upgraded service levels to extend and expand bundled services with easy-to-buy, easy-to-use support packages that help you make the most of your server investments. For more information, see the HP website (http://www.hp.com/services/carepack).

Troubleshooting

Troubleshooting resources

The HP ProLiant Servers Troubleshooting Guide provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, error message interpretation, issue resolution, and software maintenance on ProLiant servers and server blades. This guide includes problem-specific flowcharts to help you navigate complex troubleshooting processes. To view the guide, select a language:

• English (http://www.hp.com/support/ProLiant_TSG_en)
French (http://www.hp.com/support/ProLiant_TSG_fr)
• Italian (http://www.hp.com/support/ProLiant_TSG_it)
• Spanish (http://www.hp.com/support/ProLiant TSG sp)
• German (http://www.hp.com/support/ProLiant_TSG_gr)
• Dutch (http://www.hp.com/support/ProLiant_TSG_nl)
• Japanese (http://www.hp.com/support/ProLiant_TSG_jp)

The HP BladeSystem c-Class Enclosure Troubleshooting Guide provides procedures and solutions for troubleshooting HP BladeSystem c-Class enclosures. This guide explains how to use the Insight Display to troubleshoot enclosures, and it includes a flowchart to help you navigate the troubleshooting process. To view the guide, see the HP website (http://www.hp.com/support/BladeSystem_Enclosure_TSG_en).

Pre-diagnostic steps

WARNING: To avoid potential problems, ALWAYS read the warnings and cautionary information in the server documentation before removing, replacing, reseating, or modifying system components.

IMPORTANT: This guide provides information for multiple servers. Some information may not apply to the server you are troubleshooting. Refer to the server documentation for information on procedures, hardware options, software tools, and operating systems supported by the server.

1. Review the important safety information (on page 89).
2. Gather symptom information (on page 91).
3. Prepare the server for diagnosis (on page 91).
4. Use the Start diagnosis flowchart (on page 93) to begin the diagnostic process.

Important safety information

Familiarize yourself with the safety information in the following sections before troubleshooting the server.

Important safety information

Before servicing this product, read the Important Safety Information document provided with the server.

Symbols on equipment

The following symbols may be placed on equipment to indicate the presence of potentially hazardous conditions.

	This symbol indicates the presence of hazardous energy circuits or electric shock hazards. Refer all servicing to qualified personnel.WARNING: To reduce the risk of injury from electric shock hazards, do not open this enclosure. Refer all maintenance, upgrades, and servicing to qualified personnel.
	This symbol indicates the presence of electric shock hazards. The area contains no user or field serviceable parts. Do not open for any reason.WARNING: To reduce the risk of injury from electric shock hazards, do not open this enclosure.
	This symbol on an RJ-45 receptacle indicates a network interface connection.WARNING: To reduce the risk of electric shock, fire, or damage to the equipment, do not plug telephone or telecommunications connectors into this receptacle.
	This symbol indicates the presence of a hot surface or hot component. If this surface is contacted, the potential for injury exists.WARNING: To reduce the risk of injury from a hot component, allow the surface to cool before touching.
	This symbol indicates that the component exceeds the recommended weight for one individual to handle safely.WARNING: To reduce the risk of personal injury or damage to the equipment, observe local occupational health and safety requirements and guidelines for manual material handling.
	These symbols, on power supplies or systems, indicate that the equipment is supplied by multiple sources of power.WARNING: To reduce the risk of injury from electric shock, remove all power cords to completely disconnect power from the system.

Warnings

WARNING: Only authorized technicians trained by HP should attempt to repair this equipment. All troubleshooting and repair procedures are detailed to allow only subassembly/module-level repair. Because of the complexity of the individual boards and subassemblies, no one should attempt to make repairs at the component level or to make modifications to any printed wiring board. Improper repairs can create a safety hazard.

!

WARNING: To reduce the risk of personal injury or damage to the equipment, be sure that:

• The leveling feet are extended to the floor.
• The full weight of the rack rests on the leveling feet.
- The stabilizing feet are attached to the rack if it is a single-rack installation.
- The racks are coupled together in multiple-rack installations.
- Only one component is extended at a time. A rack may become unstable if more than one component is extended for any reason.

Symptom information

Before troubleshooting a server problem, collect the following information:

• What events preceded the failure? After which steps does the problem occur?
• What has been changed since the time the server was working?
- Did you recently add or remove hardware or software? If so, did you remember to change the appropriate settings in the server setup utility, if necessary?
• How long has the server exhibited problem symptoms?
• If the problem occurs randomly, what is the duration or frequency?

To answer these questions, the following information may be useful:

• Run HP Insight Diagnostics (on page 84) and use the survey page to view the current configuration or to compare it to previous configurations.
  • Refer to your hardware and software records for information.
  • Refer to server LEDs and their statuses.

Prepare the server for diagnosis

1. Be sure the server is in the proper operating environment with adequate power, air conditioning, and humidity control. For required environmental conditions, see the server documentation.
2. Record any error messages displayed by the system.
3. Remove all diskettes, CD-ROMs, DVD-ROMs, and USB drive keys.

4. Power down the server and peripheral devices if you will be diagnosing the server offline. If possible, always perform an orderly shutdown:
   a. Exit any applications.
   b. Exit the operating system.
   c. Power down the server ("Power down the server blade" on page 17).

5. Disconnect any peripheral devices not required for testing (any devices not necessary to power up the server). Do not disconnect the printer if you want to use it to print error messages.

6. Collect all tools and utilities, such as a Torx screwdriver, loopback adapters, ESD wrist strap, and software utilities, necessary to troubleshoot the problem.

- You must have the appropriate Health Drivers and Management Agents installed on the server. To verify the server configuration, connect to the System Management homepage and select Version Control Agent. The VCA gives you a list of names and versions of all installed HP drivers, Management Agents, and utilities, and whether they are up-to-date.

• HP recommends you have access to the server documentation for server-specific information.
• HP recommends you have access to the SmartStart CD for value-added software and drivers required during the troubleshooting process. Download the current version of SmartStart from the HP website (http://www.hp.com/servers/smartstart).

Service notifications

To view the latest service notifications, refer to the HP website (http://www.hp.com/go/bizsupport). Select the appropriate server model, and then click the Troubleshoot a Problem link on the product page.

Loose connections

Action:

• Be sure all power cords are securely connected.
• Be sure all cables are properly aligned and securely connected for all external and internal components.
• Remove and check all data and power cables for damage. Be sure no cables have bent pins or damaged connectors.
• If a fixed cable tray is available for the server, be sure the cords and cables connected to the server are routed correctly through the tray.
• Be sure each device is properly seated. Avoid bending or flexing circuit boards when reseating components.
  • If a device has latches, be sure they are completely closed and locked.
• Check any interlock or interconnect LEDs that may indicate a component is not connected properly.
• If problems continue to occur, remove and reinstall each device, checking the connectors and sockets for bent pins or other damage.

Troubleshooting flowcharts

To effectively troubleshoot a problem, HP recommends that you start with the first flowchart in this section, "Start diagnosis flowchart (on page 93)," and follow the appropriate diagnostic path. If the other flowcharts do not provide a troubleshooting solution, follow the diagnostic steps in "General diagnosis flowchart (on page 94)." The General diagnosis flowchart is a generic troubleshooting process to be used when the problem is not server-specific or is not easily categorized into the other flowcharts.

The available flowcharts include:

• Start diagnosis flowchart (on page 93)
• General diagnosis flowchart (on page 94)
• Server blade power-on problems flowchart (on page 95)
• POST problems flowchart (on page 97)
• OS boot problems flowchart (on page 99)
• Server fault indications flowchart (on page 101)

Start diagnosis flowchart

Use the following flowchart to start the diagnostic process.

Item Refer to
1	"General diagnosis flowchart (on page 94)"
2	"Power-on problems flowchart ("Server blade power-on problems flowchart" on page 95)"
3	"POST problems flowchart (on page 97)"
4	"OS boot problems flowchart (on page 99)"
5	"Server fault indications flowchart (on page 101)"

graph TD
    A["Start diagnosis"] --> B{Do you want to perform the General Diagnosis?}
    B -->|Yes| C["(1) Go to General diagnosis"]
    B -->|No| D{Does server power on?}
    D -->|No| E["(2) Go to Power-on problems"]
    D -->|Yes| F{Does server complete POST OK?}
    F -->|No| G["(3) Go to POST problems"]
    F -->|Yes| H{Does server boot to OS OK?}
    H -->|No| I["(4) Go to OS boot problems"]
    H -->|Yes| J{Does server have Insight Management Agent fault or LED fault indication?}
    J -->|Yes| K["(5) Go to Server fault indications"]
    J -->|No| L["(1) Go to General diagnosis"]

General diagnosis flowchart

The General diagnosis flowchart provides a generic approach to troubleshooting. If you are unsure of the problem, or if the other flowcharts do not fix the problem, use the following flowchart.

Item See
1	"Symptom information (on page 91)"
2	"Loose connections (on page 92)"
3	"Service notifications (on page 92)"
4	The most recent version of a particular server blade or option firmware is available on the HP Support website (http://www.hp.com/support).
5	"General memory problems are occurring" in the HP ProLiant Servers Troubleshooting Guide located on the Documentation CD or on the HP website (http://www.hp.com/support)
6	Maintenance and service guides for p-Class server blades, located on the Documentation CD or the HP website (http://www.hp.com/products/servers/proliant-bl/p-class/info)Maintenance and service guides for c-Class server blades, located on the Documentation CD or the HP website (http://www.hp.com/go/bladesystem/documentation)
7	Maintenance and service guides for p-Class server blades, located on the Documentation CD or the HP website (http://www.hp.com/products/servers/proliant-bl/p-class/info)Maintenance and service guides for c-Class server blades, located on the Documentation CD or the HP website (http://www.hp.com/go/bladesystem/documentation)"Hardware problems" in the HP ProLiant Servers Troubleshooting Guide located on the Documentation CD or on the HP website (http://www.hp.com/support)
8	"Server information you need" in the HP ProLiant Servers Troubleshooting Guide located on the Documentation CD or on the HP website (http://www.hp.com/support)"Operating system information you need" in the HP ProLiant Servers Troubleshooting Guide located on the Documentation CD or on the HP website (http://www.hp.com/support)
9	"HP contact information (on page 115)"

graph TD
    A["Start General diagnosis"] --> B["(1) Record symptom information."]
    B --> C["Reboot server to see if condition still exists."]
    C --> D{Is this a newly installed server?}
    D -->|Yes| E["(2) Reseat any components that may have come loose during shipping and reboot the server."]
    E --> F{Does condition still exist?}
    F -->|No| G["End"]
    F -->|Yes| H["(3) Check for Service Notifications."]
    H --> I["(4) Download the latest software and firmware from the HP website."]
    I --> J{Does condition still exist?}
    J -->|No| K["End"]
    J -->|Yes| L["(5) Isolate and minimize the memory configuration."]
    L --> M{Does condition still exist?}
    M -->|No| N["End"]
    M -->|Yes| O["(6) Isolate what has changed. Verify it was installed correctly. Restore server to last known working state or original shipped configuration."]
    O --> P{Does condition still exist?}
    P -->|No| Q["End"]
    P -->|Yes| R["(7) Troubleshoot or replace basic server spare parts."]
    R --> S{Does condition still exist?}
    S -->|Yes| T["End"]
    S -->|No| U["(8) Ensure the following information is available: Survey configuration snapshots OS event log file Full crash dump"]
    U --> V["(9) Call HP Service Provider"]
    V --> W["End"]
    V --> X["(1) Record action taken."]

Server blade power-on problems flowchart

Symptoms:

• The server does not power on.
• The system power LED is off or amber.

• The health LED is red or amber.

NOTE: For the location of server LEDs and information on their statuses, refer to the server documentation.

Possible causes:

• Improperly seated or faulty power supply
- Loose or faulty power cord
• Power source problem
• Power on circuit problem
- Improperly seated component or interlock problem
• Faulty internal component

Item See
1	"Component identification (on page 7)"
2	Maintenance and service guides for c-Class server blades, located on the HP website (http://www.hp.com/go/bladesystem/documentation)
3	Integrated Lights-Out User Guide located on the HP website (http://www.hp.com/servers/lights-out)

graph TD
    A["Start"] --> B{Does the server blade automatically power on?}
    B -->|Yes| C["End"]
    B -->|No| D{What color is the server blade power LED?}
    D -->|Off| E["Green"]
    D -->|Yes| F["Amber"]
    F --> G["Wait 45 seconds."]
    G --> H{Does condition still exist?}
    H -->|No| I["Call HP Service Provider"]
    H -->|Yes| J{Is the server blade health LED on?}
    J -->|No| K{Is the "Automatically PowerOn sever" choice selected in iLO?}
    K -->|No| L["Change the setting in iLO."]
    K -->|Yes| M{Is the Insight Display background green?}
    M -->|No| N["Check the Insight Display/Onboard Administrator error message and perform the suggested ation."]
    M -->|Yes| O{Does condition still exist?}
    O -->|No| P["Reseat the server blade."]
    O -->|Yes| Q["(2) Replace or troubleshoot the server blade internal components."]
    Q --> R{Does condition still exist?}
    R -->|No| S["End"]
    R -->|Yes| T["End"]

POST problems flowchart

Symptoms:

• Server does not complete POST

NOTE: The server has completed POST when the system attempts to access the boot device.

• Server completes POST with errors

Possible problems:

• Improperly seated or faulty internal component
• Faulty KVM device
  • Faulty video device

Item Refer to
1	Server blade power-on problems flowchart (on page 95)
2	"POST error messages and beep codes (on page 103)"
3	"Video problems" in the HP ProLiant Servers Troubleshooting Guide located on the Documentation CD or on the HP website (http://www.hp.com/support)
4	"Symptom information (on page 91)"
5	"General memory problems are occurring" in the HP ProLiant Servers Troubleshooting Guide located on the Documentation CD or on the HP website (http://www.hp.com/support)
6	"Hardware problems" in the HP ProLiant Servers Troubleshooting Guide located on the Documentation CD or on the HP website (http://www.hp.com/support)Maintenance and service guides for c-Class server blades, located on the Documentation CD or the HP website (http://www.hp.com/go/bladesystem/documentation)
7	"Server information you need" in the HP ProLiant Servers Troubleshooting Guide located on the Documentation CD or on the HP website (http://www.hp.com/support)"Operating system information you need" in the HP ProLiant Servers Troubleshooting Guide located on the Documentation CD or on the HP website (http://www.hp.com/support)

graph TD
    A["Start POST Problems"] --> B{Are you connected to the server blade with local I/O cable?}
    B -->|No| C{Are you able to remotely connect using iLO?}
    C -->|Yes| D{POST errors messages displayed?}
    C -->|No| E["(1) Go to server blade power-on problems flowchart."]
    D -->|Yes| F["Do you have video output?"]
    D -->|No| G["(2) See "Post Error Messages.""]
    G --> H{What color is the server blade health LED?}
    H -->|Yes| I["Break server blade down to minimum configuration."]
    H -->|No| J["(3) Verify local I/O cable is connected correctly."]
    I --> K{Does condition still exist?}
    K -->|No| L["Call HP Service Provider"]
    K -->|Yes| M{Does condition still exist?}
    M -->|Yes| N["Add one part at a time back to configuration to isolate component."]
    M -->|No| O{Does condition still exist?}
    O -->|Yes| P["Record symptom & error information on repair tag if sending back a failed part."]
    O -->|No| Q["(4) Record action taken."]
    Q --> R{Does condition still exist?}
    R -->|Yes| S["End"]
    R -->|No| T["Record action taken."]
    S --> U["End"]
    T --> U
    U --> V["End"]
    V --> W["End"]
    style A fill:#f9f,stroke:#333
    style U fill:#f9f,stroke:#333

OS boot problems flowchart

There are two ways to use SmartStart when diagnosing OS boot problems on a server blade:

• Use iLO to remotely attach virtual devices to mount the SmartStart CD onto the server blade.
• Use a local I/O cable and drive to connect to the server blade, and then restart the server blade.

Symptoms:

• Server does not boot a previously installed OS
• Server does not boot SmartStart

Possible causes:

• Corrupted OS
  • Hard drive subsystem problem
  • Incorrect boot order setting in RBSU

Item See
1	HP ROM-Based Setup Utility User Guide(http://www.hp.com/servers/smartstart)
2	"POST problems flowchart (on page 97)"
3	"Hard drive problems" in the HP ProLiant Servers Troubleshooting Guide located on the Documentation CD or on the HP website (http://www.hp.com/support)Controller documentation
4	"HP Insight Diagnostics (on page 84)" or in the HP ProLiant Servers Troubleshooting Guide located on the Documentation CD or on the HP website (http://www.hp.com/support)
5	"Loose connections (on page 92)""CD-ROM and DVD drive problems" in the HP ProLiant Servers Troubleshooting Guide located on the Documentation CD or on the HP website (http://www.hp.com/support)Controller documentation
6	"General memory problems are occurring" in the HP ProLiant Servers Troubleshooting Guide located on the Documentation CD or on the HP website (http://www.hp.com/support)
7	"Operating system problems" in the HP ProLiant Servers Troubleshooting Guide located on the Documentation CD or on the HP website (http://www.hp.com/support)"HP contact information (on page 115)"
8	"Hardware problems" in the HP ProLiant Servers Troubleshooting Guide located on the Documentation CD or on the HP website (http://www.hp.com/support)Maintenance and service guides for p-Class server blades, located on the Documentation CD or the HP website (http://www.hp.com/products/servers/proliant-bl/p-class/info)Maintenance and service guides for c-Class server blades, located on the Documentation CD or the HP website (http://www.hp.com/go/bladesystem/documentation)
9	"General diagnosis flowchart (on page 94)"

graph TD
    A["Start OS boot problems"] --> B{Does the server boot SmartStart CD?*}
    B -->|No| C["(1) Disable Fast Boot in RBSU and check server boot order."]
    C --> D{Does server still boot with errors?}
    D -->|Yes| E["(2) Go to POST Problems"]
    D -->|No| F{Does server still fail to boot SmartStart?}
    F -->|No| G["End"]
    F -->|Yes| H{Is this a known good copy of SmartStart?}
    H -->|No| I["Still fail with known good copy?"]
    H -->|Yes| J["(5) Check CD/DVD-ROM, controller, and cable."]
    J --> K{Does condition still exist?}
    K -->|Yes| L["Add parts back to configuration to isolate component."]
    K -->|No| M{Does condition still exist?}
    M -->|No| N["End"]
    M -->|Yes| O["(9) Go to General Diagnosis"]
    B -->|Yes| P{Does SmartStart recognize default boot device?}
    P -->|No| Q["(3) Troubleshoot possible hard drive subsystem problem."]
    P -->|Yes| R["(4) Run Insight Diagnostics."]
    R --> S{Did Diagnostics run without errors?}
    S -->|No| T["Troubleshoot problem found by Diagnostics."]
    S -->|Yes| U["(7) Troubleshoot possible corrupted system disk or OS."]
    U --> V{Does condition still exist?}
    V -->|Yes| W["Add parts back to configuration to isolate component."]
    V -->|No| X["End"]

* See the server blade OS boot problems flowchart (on page 99)

Server fault indications flowchart

Symptoms:

• Server boots, but a fault event is reported by Insight Management Agents (on page 83)
- Server boots, but the internal health LED, external health LED, or component health LED is red or amber

NOTE: For the location of server LEDs and information on their statuses, refer to the server documentation.

Possible causes:

• Improperly seated or faulty internal or external component
  • Unsupported component installed
• Redundancy failure
  • System overtemperature condition

Item See
1	"Management agents (on page 83)" or in the HP ProLiant Servers Troubleshooting Guide located on the Documentation CD or on the HP website (http://www.hp.com/support)
2	• "Integrated Management Log (on page 85)" or in the HP ProLiant Servers Troubleshooting Guide located on the Documentation CD or on the HP website (http://www.hp.com/support)• "Event list error messages" in the HP ProLiant Servers Troubleshooting Guide located on the Documentation CD or on the HP website (http://www.hp.com/support)
3	"Component identification (on page 7)"
4 System	Management Homepage (https://localhost:2381)____
5	"Power-on problems flowchart ("Server blade power-on problems flowchart" on page 95)"
6	• "Hardware problems" in the HP ProLiant Servers Troubleshooting Guide located on the Documentation CD or on the HP website (http://www.hp.com/support)• Maintenance and service guides for c-Class server blades, located on the Documentation CD or the HP website (http://www.hp.com/go/bladesystem/documentation)• "HP contact information (on page 115)"
7	• "Hardware problems" in the HP ProLiant Servers Troubleshooting Guide located on the Documentation CD or on the HP website (http://www.hp.com/support)• Maintenance and service guides for c-Class server blades, located on the Documentation CD or the HP website (http://www.hp.com/go/bladesystem/documentation)

graph TD
    A["Start server fault indications"] --> B["Select an appropriate fault indicator"]
    B --> C{(1) Insight Management Agents}
    C --> D{Was event reported by Insight Management Agents?}
    D -->|No| E{Is there an IML entry identifying the problem?}
    D -->|Yes| F{(2) IML}
    E --> G{What color is the server blade health LED?}
    G -->|Green| H["Check the Insight Display/Cnboard Administrator error message and perform the suggested action."]
    G -->|Red| I{What color is the Insight Display background?}
    I -->|Green| J["(5) Go to server blade power-on problems flowchart."]
    I -->|Amber| K["Check the Insight Display/Cnboard Administrator error message and perform the suggested action."]
    K --> L{Is a hard drive fault LED on?}
    L -->|No| M{Are not satisfied information to identify failing component?}
    L -->|Yes| N["Replace or reseat component identified as failed or about to fail."]
    M --> O{Is there sufficient information to identify failing component?}
    O -->|No| P["Obtain failure information from IML entry, if available."]
    O -->|Yes| Q["(7) Replace or reseat component identified as failed or about to fail."]
    P --> R["Mark the corresponding IML entry as repaired, if present."]
    Q --> S["End"]
    R --> T["You may need to replace the hard drive."]
    S --> T
    T --> U["(6) Flashing"]
    U --> V["A predictive failure alert has been received for this drive."]

POST error messages and beep codes

Introduction to POST error messages

The error messages and codes in this section include all new messages generated by this server blade. Some messages are informational and do not indicate an error. A server blade generates only the codes that are applicable to its configuration and options.

For a complete listing of error messages, refer to the "POST error messages" in the HP ProLiant Servers Troubleshooting Guide located on the Documentation CD or on the HP website (http://www.hp.com/support).

WARNING: To avoid potential problems, ALWAYS read the warnings and cautionary information in the server documentation before removing, replacing, reseating, or modifying system components.

Processor X Unsupported Wattage.

Audible beeps: 1 long, 1 short

Possible cause: Processor not supported by current server blade.

Action: Refer to the server blade documentation for supported processors. If the processor is supported, remove the processor, update the system to latest ROM, and then reinstall the processor.

System battery

If the server blade no longer automatically displays the correct date and time, you may need to replace the battery that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years.

WARNING: The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not properly handled. To reduce the risk of personal injury:

• Do not attempt to recharge the battery.
- Do not expose the battery to temperatures higher than 60^ (140°F).
- Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water.
- Replace only with the spare designated for this product.

To remove the component:

1. Power down the server blade (on page 17).
2. Remove the server blade (on page 18).
3. Place the server blade on a flat, level surface with the A-side of the server blade facing up. To determine the A-side, see the label attached to the access panel.
4. Remove the access panel (A-side) (on page 19).
5. Identify the battery location ("System board components (A-side)" on page 9).
6. Remove the battery.

Technical diagram of a mechanical component with labeled parts (1, 2), showing internal structure and directional arrows (no text or symbols beyond labels)

IMPORTANT: Replacing the system board battery resets the system ROM to its default configuration. After replacing the battery, reconfigure the system through RBSU.

To replace the component, reverse the removal procedure.

Regulatory compliance notices

Regulatory compliance identification numbers

For the purpose of regulatory compliance certifications and identification, this product has been assigned a unique regulatory model number. The regulatory model number can be found on the product nameplate label, along with all required approval markings and information. When requesting compliance information for this product, always refer to this regulatory model number. The regulatory model number is not the marketing name or model number of the product.

Federal Communications Commission notice

Part 15 of the Federal Communications Commission (FCC) Rules and Regulations has established Radio Frequency (RF) emission limits to provide an interference-free radio frequency spectrum. Many electronic devices, including computers, generate RF energy incidental to their intended function and are, therefore, covered by these rules. These rules place computers and related peripheral devices into two classes, A and B, depending upon their intended installation. Class A devices are those that may reasonably be expected to be installed in a business or commercial environment. Class B devices are those that may reasonably be expected to be installed in a residential environment (for example, personal computers). The FCC requires devices in both classes to bear a label indicating the interference potential of the device as well as additional operating instructions for the user.

FCC rating label

The FCC rating label on the device shows the classification (A or B) of the equipment. Class B devices have an FCC logo or ID on the label. Class A devices do not have an FCC logo or ID on the label. After you determine the class of the device, refer to the corresponding statement.

Class A equipment

This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference, in which case the user will be required to correct the interference at personal expense.

Class B equipment

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference

to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit that is different from that to which the receiver is connected.
- Consult the dealer or an experienced radio or television technician for help.

Declaration of conformity for products marked with the FCC logo, United States only

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

For questions regarding this product, contact us by mail or telephone:

Hewlett-Packard Company P. O. Box 692000, Mail Stop 530113 Houston, Texas 77269-2000

1-800-HP-INVENT (1-800-474-6836). (For continuous quality improvement, calls may be recorded or monitored.)

For questions regarding this FCC declaration, contact us by mail or telephone:

Hewlett-Packard Company P. O. Box 692000, Mail Stop 510101 Houston, Texas 77269-2000

1-281-514-3333

To identify this product, refer to the part, series, or model number found on the product.

Modifications

The FCC requires the user to be notified that any changes or modifications made to this device that are not expressly approved by Hewlett-Packard Company may void the user's authority to operate the equipment.

Cables

Connections to this device must be made with shielded cables with metallic RFI/EMI connector hoods in order to maintain compliance with FCC Rules and Regulations.

Canadian notice (Avis Canadien)

Class A equipment

This Class A digital apparatus meets all requirements of the Canadian Interference-Causing Equipment Regulations.

This Class B digital apparatus meets all requirements of the Canadian Interference-Causing Equipment Regulations.

European Union regulatory notice

Products bearing the CE marking comply with the following EU Directives:

• Low Voltage Directive 2006/95/EC
• EMC Directive 2004/108/EC
• Ecodesign Directive 2009/125/EC, where applicable

CE compliance of this product is valid if powered with the correct CE-marked AC adapter provided by HP.

Compliance with these directives implies conformity to applicable harmonized European standards (European Norms) that are listed in the EU Declaration of Conformity issued by HP for this product or product family and available (in English only) either within the product documentation or at the following HP website (http://www.hp.eu/certificates) (type the product number in the search field).

The compliance is indicated by one of the following conformity markings placed on the product:

For non-telecommunications products and for EU harmonized telecommunications products, such as Bluetooth® within power class below 10mW.

CE

For EU non-harmonized telecommunications products (If applicable, a 4-digit notified body number is inserted between CE and !).

CE!

Please refer to the regulatory label provided on the product.

The point of contact for regulatory matters is Hewlett-Packard GmbH, Dept./MS: HQ-TRE, Herrenberger Strasse 140, 71034 Boeblingen, GERMANY.

Disposal of waste equipment by users in private households in the European Union

This symbol on the product or on its packaging indicates that this product must not be disposed of with your other household waste. Instead, it is your responsibility to dispose of your waste equipment by handing it over to a designated collection point for the recycling of waste electrical and electronic equipment. The separate collection and recycling of your waste equipment at the time of disposal will help to conserve natural resources and ensure that it is recycled in a manner that protects human health and the environment. For more information about where you can drop off your waste equipment for recycling, please contact your local city office, your household waste disposal service or the shop where you purchased the product.

Japanese notice

This product may be provided with an optical storage device (that is, CD or DVD drive) and/or fiber optic transceiver. Each of these devices contains a laser that is classified as a Class 1 Laser Product in accordance with US FDA regulations and the IEC 60825-1. The product does not emit hazardous laser radiation.

Each laser product complies with 21 CFR 1040.10 and 1040.11 except for deviations pursuant to Laser Notice No. 50, dated May 27, 2001; and with IEC 60825-1:1993/A2:2001.

WARNING: Use of controls or adjustments or performance of procedures other than those specified herein or in the laser product's installation guide may result in hazardous radiation exposure. To reduce the risk of exposure to hazardous radiation:

• Do not try to open the module enclosure. There are no user-serviceable components inside.
• Do not operate controls, make adjustments, or perform procedures to the laser device other than those specified herein.
• Allow only HP Authorized Service technicians to repair the unit.

The Center for Devices and Radiological Health (CDRH) of the U.S. Food and Drug Administration implemented regulations for laser products on August 2, 1976. These regulations apply to laser products manufactured from August 1, 1976. Compliance is mandatory for products marketed in the United States.

Battery replacement notice

!

WARNING: The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not properly handled. To reduce the risk of personal injury:

• Do not attempt to recharge the battery.
- Do not expose the battery to temperatures higher than 60^ (140°F).
- Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water.

Batteries, battery packs, and accumulators should not be disposed of together with the general household waste. To forward them to recycling or proper disposal, use the public collection system or return them to HP, an authorized HP Partner, or their agents.

For more information about battery replacement or proper disposal, contact an authorized reseller or an authorized service provider.

Taiwan battery recycling notice

The Taiwan EPA requires dry battery manufacturing or importing firms in accordance with Article 15 of the Waste Disposal Act to indicate the recovery marks on the batteries used in sales, giveaway or promotion. Contact a qualified Taiwanese recycler for proper battery disposal.

廢電池請回收

Wireless devices

You can install one or more integrated wireless devices. In some environments, the use of wireless devices might be restricted. Such restrictions might apply on airplanes, in hospitals, near explosives, or in other hazardous locations. Before you turn on this product, be sure that you understand local policies and have proper authorization.

Do not co-locate or operate this device in conjunction with any other antenna or transmitter.

To avoid the possibility of exceeding the FCC radio frequency exposure limits, human proximity to the antennae should be greater than 20 cm (8 in).

!

WARNING: Exposure to Radio Frequency Radiation—The radiated output power of this device is below the FCC radio frequency exposure limits. Nevertheless, human contact during normal operation should be minimized.

Brazilian notices

Wireless operation is subject to two conditions. The first is that the wireless device may not cause interference. The second is that the wireless device must accept any interference, including interference that may cause undesired operation of the device.

Japanese notices

To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts. A discharge of static electricity from a finger or other conductor may damage system boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device.

To prevent electrostatic damage:

• Avoid hand contact by transporting and storing products in static-safe containers.
• Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations.
• Place parts on a grounded surface before removing them from their containers.
• Avoid touching pins, leads, or circuitry.
  • Always be properly grounded when touching a static-sensitive component or assembly.

Grounding methods to prevent electrostatic discharge

Several methods are used for grounding. Use one or more of the following methods when handling or installing electrostatic-sensitive parts:

• Use a wrist strap connected by a ground cord to a grounded workstation or computer chassis. Wrist straps are flexible straps with a minimum of 1 megohm ±10 percent resistance in the ground cords. To provide proper ground, wear the strap snug against the skin.
• Use heel straps, toe straps, or boot straps at standing workstations. Wear the straps on both feet when standing on conductive floors or dissipating floor mats.
  • Use conductive field service tools.
  • Use a portable field service kit with a folding static-dissipating work mat.

If you do not have any of the suggested equipment for proper grounding, have an authorized reseller install the part.

For more information on static electricity or assistance with product installation, contact an authorized reseller.

Specifications

Environmental specifications

Specification Value
Temperature range*	—
Operating	10°C to 35°C (50°F to 95°F)
Non-operating	-30°C to 60°C (-22°F to 140°F)
Relative humidity (noncondensing)**	—
Operating	10% to 90% @ 28°C (82.4°F)
Non-operating	5% to 95% @ 38.7°C (101.7°F)
Altitude† —
Operating 3050 m (10,000 ft)
Non-operating	9144 m (30,000 ft)

* The following temperature conditions and limitations apply:
- All temperature ratings shown are for sea level.
- An altitude derating of 1^ C per 304.8 m (1.8°F per 1,000 ft) up to 3048 m (10,000 ft) applies.
- No direct sunlight is allowed.
-The maximum permissible rate of change is 10^ C/hr ( 18^ F/hr).
- The type and number of options installed may reduce the upper temperature and humidity limits.
- Operating with a fan fault or above 30^ C ( 86^ F) may reduce system performance.
** Storage maximum humidity of 95% is based on a maximum temperature of 45°C (113°F).
Maximum storage altitude corresponds to a minimum pressure of 70 kPa (10.1 psia).

Server blade specifications

Specification Value
Height 10.72 cm (4.22 in)
Depth 51.28 cm (20.09 in)
Width 36.73 cm (14.46 in)
Weight (maximum) 21.8 kg (47.9 lb)
Weight (minimum) 15.9 kg (35.1 lb)

Technical support

Before you contact HP

Be sure to have the following information available before you call HP:

• Technical support registration number (if applicable)
• Product serial number
• Product model name and number
• Product identification number
• Applicable error messages
- Add-on boards or hardware
• Third-party hardware or software
• Operating system type and revision level

HP contact information

For the name of the nearest HP authorized reseller:

• See the Contact HP worldwide (in English) webpage (http://welcome.hp.com/country/us/en/wwcontact.html).

For HP technical support:

• In the United States, for contact options see the Contact HP United States webpage (http://welcome.hp.com/country/us/en/contact_us.html). To contact HP by phone:
• Call 1-800-HP-INVENT (1-800-474-6836). This service is available 24 hours a day, 7 days a week. For continuous quality improvement, calls may be recorded or monitored.
  If you have purchased a Care Pack (service upgrade), call 1-800-633-3600. For more information about Care Packs, refer to the HP website (http://www.hp.com/hps).
• In other locations, see the Contact HP worldwide (in English) webpage (http://welcome.hp.com/country/us/en/wwcontact.html).

Customer Self Repair

HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will ship that part directly to you for replacement. There are two categories of CSR parts:

- Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be charged for the travel and labor costs of this service.

- Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If, however, you require that HP replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product.

NOTE: Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty, HP requires that an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts Catalog.

Based on availability and where geography permits, CSR parts will be shipped for next business day delivery. Same day or four-hour delivery may be offered at an additional charge where geography permits. If assistance is required, you can call the HP Technical Support Center and a technician will help you over the telephone. HP specifies in the materials shipped with a replacement CSR part whether a defective part must be returned to HP. In cases where it is required to return the defective part to HP, you must ship the defective part back to HP within a defined period of time, normally five (5) business days. The defective part must be returned with the associated documentation in the provided shipping material. Failure to return the defective part may result in HP billing you for the replacement. With a customer self repair, HP will pay all shipping and part return costs and determine the courier/carrier to be used.

For more information about HP's Customer Self Repair program, contact your local service provider. For the North American program, refer to the HP website (http://www.hp.com/go/selfrepair).

Customer Self Repair

Customer Self Repair

Array Configuration Utility

AMP

Advanced Memory Protection

ASR

Automatic Server Recovery

BBWC

battery-backed write cache

BMC

baseboard management controller

CSR

Customer Self Repair

ESD

electrostatic discharge

FBWC

flash-backed write cache

IEC

International Electrotechnical Commission

iLO 3

Integrated Lights-Out 3

IML

Integrated Management Log

KVM

keyboard, video, and mouse

NUMA

Non-Uniform Memory Architecture

ORCA

Option ROM Configuration for Arrays

POST

Power-On Self Test

PSP

ProLiant Support Pack

PXE

Preboot Execution Environment

QPI

QuickPath Interconnect

RBSU

ROM-Based Setup Utility

RPM

Red Hat Package Manager

SAS

serial attached SCSI

SATA

serial ATA

SD

Secure Digital

SDDC

Single Device Data Correction

SDHC

Secure Digital High-Capacity

SIM

Systems Insight Manager

SMI

scalable memory interconnect

SUV

serial, USB, video

TPM

trusted platform module

UID

unit identification

USB

universal serial bus

VCA

Version Control Agent

Index

A

access panel 19

accessing a server blade with local KVM 68, 69

ACU (Array Configuration Utility) 80

additional information 89

Advanced ECC memory 79

Advanced ECC population guidelines 53

Advanced Memory Protection (AMP) 53

AMP (Advanced Memory Protection) 79

AMP modes 79

Array Configuration Utility (ACU) 80

ASR (Automatic Server Recovery) 81

authorized reseller 115

auto-configuration process 78

Automatic Server Recovery (ASR) 81

B

Basic Input/Output System (BIOS) 79, 81

batteries, replacing 105, 110

battery 105,110

battery disposal 108, 110

battery pack, removing 25

battery replacement notice 110

battery-backed write cache battery pack 62

beep codes 103

before you contact HP 115

BIOS (Basic Input/Output System) 79, 81

BIOS Serial Console 79

BIOS upgrade 81

blade blank 27

boot diskette 76

boot options 79

Brazilian notice 112

BSMI notice 109

buttons 7

C

cables 68, 92, 107

cables, FCC compliance 107

cables, troubleshooting 92

cabling 68

Canadian notice 107, 112

Canadian notices 107

Care Pack 88

CD-ROM deployment 74

Change Control 88

change control and proactive notification 88

Chinese notice 110

class A equipment 106

class B equipment 106

compliance 106

components 7, 90, 113

components, identification 7, 8

configuration 34

configuration of system 34, 71, 77

configuration tools 77

configuration, completing 34

configuration, network 71

configuring AMP modes 79

connecting to the network 33

connection problems 92

connectors 7

contact information 115

contacting HP 115

controller options 61, 62, 63

creating a disk image 75, 76

CSR (customer self repair) 115

customer self repair (CSR) 115

D

Declaration of Conformity 107

default settings 11

deployment infrastructure 72

deployment methods 71, 73

deployment overview 72

device bay shelf, removing 28, 30

DHCP server 71

diagnosing problems 89, 94

diagnostic tools 81, 84

diagnostics utility 84

DIMM baffles 20, 21

DIMM identification 46

DIMM installation guidelines 47

DIMM slot locations 14, 15

DIMMs 46

disposal, battery 108, 110

disposal, waste 108

documentation 76

downloading files 115

drivers 71, 86

drives, installing 56

E

electrostatic discharge 113

enabling the Trusted Platform Module 66

enabling, Trusted Platform Module (TPM) 66

enclosure, installing 27

environmental specifications 114

Erase Utility 82

error messages 103

error messages, POST 103

European Union notice 108

European Union regulatory notice 108

external USB functionality 84

F

FCC (Federal Communications Commission) notice 106, 107

FCC rating label 106

features 7

Federal Communications Commission (FCC) notice 106, 107

firmware 87

Firmware Maintenance CD 87

firmware upgrade utility, troubleshooting 89

flowcharts 92, 93, 94, 95, 97, 99, 101

front panel components 7

front panel LEDs 7

front panel/hard drive cage assembly 22, 23

G

general diagnosis flowchart 94

grounding methods 113

H

hard drive LEDs 8

hard drives 8

hard drives, determining status of 8

hard drives, installing 56

hardware options 35

hardware options installation 35

health driver 81

health LEDs 8

help resources 115

hemisphere mode 50

HP BladeSystem Firmware Deployment Tool 87

HP Care Pack Services 88

HP contact information 115

HP Insight Diagnostics 84

HP Insight Diagnostics survey functionality 84

HP Insight Remote Support software 85

HP Management Packs 1.1 for MOM 2005, troubleshooting 89

HP Management Packs 1.2 for MOM 2005, troubleshooting 89

HP ProLiant Essentials Foundation Pack 83

HP Smart Update Manager overview 87

HP Systems Insight Manager overview 83

HP technical support 115

HP website 115

HP, contacting 115

|

identification number 106

iLO (Integrated Lights-Out) 71, 82

iLO 2 (Integrated Lights-Out 2) 17, 71

iLO 3 (Integrated Lights-Out 3) 71, 82

iLO 3 advanced features 71

IML (Integrated Management Log) 85

Important Safety Information document 89

Insight Diagnostics 84, 86

installation overview 27

installation, enclosure 27

installation, server blade 33

installation, server options 35

installing DIMMs 54, 55

installing hardware 35

installing operating system 73

installing server blade options 35

installing server options 35

installing the Trusted Platform Module board 65

Integrated Lights-Out (iLO) 82

Integrated Lights-Out 2 (iLO 2) 17, 71

Integrated Lights-Out 3 (iLO 3) 71, 82

Integrated Management Log (IML) 85

interconnect bay numbering 31

interconnect module 31

interconnect modules 31

interconnect modules, installing 31

internal SD support 84

internal USB connector 11

internal USB functionality 84

interposer board 13, 24

interposer board, removing 24

J

Japanese notice 109, 112

K

Korean notices 110

L

laser compliance 110

laser devices 110

LED, health 8

LEDs 7,8

LEDs, front panel 8

LEDs, hard drive 8

LEDs, troubleshooting 89

Lights-Out network-based deployment 71, 73

loose connections 92

M

maintenance guidelines 86

Management Agents 83

management tools 71, 81

memory 46

memory options 35, 45

memory overview 45

memory performance optimization 51

memory RAS 52

memory subsystem architecture 48

memory, Advanced ECC 79

memory, mirrored 54, 79, 80

memory, online spare 79

memory, RAID 79

mezzanine card 58, 60

Mezzanine card option 58

mirrored memory 79, 80

modifications, FCC notice 107

N

network connections 33

network-based PXE deployment 71

O

online spare memory 53,79

operating system version support 87

operating systems 87

operating systems supported 87

operations 17

Option ROM Configuration for Arrays (ORCA) 80

options 33

options installation 33, 35

ORCA (Option ROM Configuration for Arrays) 80

OS boot problems flowchart 99

overview 27

P

passwords 66

phone numbers 115

POST error messages 103

POST problems flowchart 97

powering down 17

powering up 17,78

power-on problems flowchart 95

preboot execution environment (PXE) 71, 73

pre-diagnostic steps 89

preparation procedures 17, 91

preparing the server for diagnosis 91

pro-active notification 88

problem diagnosis 89

processor installation (A-side) 35

processor installation (B-side) 40

processor option 35, 40

processors 104

Product ID 81

ProLiant BladeSystem Release sets 87

ProLiant Support Pack (PSP) 87

ProLiant Support Packs 87

PSP (ProLiant Support Pack) 87

PSPs, overview 87

PXE (preboot execution environment) 71, 73

PXE deployment 71, 73

R

RAID memory 79

RBSU (ROM-Based Setup Utility) 78, 79

RBSU configuration 78

recovery key 66

redundant ROM 83

regulatory compliance identification numbers 106

regulatory compliance notices 106, 108, 111

remote support and analysis tools 85

removing a hot-plug SAS hard drive 19

removing the access panel 19

removing the interposer board 24

removing the server blade 18

required information 115

resources 76, 89

resources, troubleshooting 89

retaining the recovery key/password 66

ROM legacy USB support 83

ROM redundancy 12, 83

ROM-Based Setup Utility (RBSU) 66, 78

ROMPaq utility 81, 83

s

safety considerations 89

safety information 83

SAN configuration 80

SAS drives 8

SAS hard drive LEDs 8

SATA hard drive 8

SATA hard drive LEDs 8

scripted installation 77

SD support 84

serial connector 15

serial number 81

series number 106

server blade options, installing 35

server fault indications flowchart 101

server features and options 35

server options, installing 35

server specifications 114

servers, setup and configuration 27

service notifications 92

setting up a network 71

Setup 27, 31

Smart Update Firmware DVD 87

Smart Update Manager 87

SmartStart autorun menu 77

SmartStart Scripting Toolkit 77

SmartStart, overview 77

software components 71

specifications 114

specifications, environmental 114

standards 106

start diagnosis flowchart 93

static electricity 113

support 85, 115

support packs 77

supported operating systems 87

supported servers 89

supported targets 89

switches, interconnect 31

symbols on equipment 90

symptom information 91

system board battery 110

system board components 9, 10, 11, 12

system configuration settings 77

System Erase Utility 82

system maintenance switch 11

system, keeping current 86

Systems Insight Manager 83

T

Taiwan battery recycling notice 111

Taiwan notice 112

technical support 115

telephone numbers 115

TPM (Trusted Platform Module) 64, 66

troubleshooting 89, 92

troubleshooting flowcharts 92

troubleshooting resources 89

troubleshooting, firmware upgrade utility 89

Trusted Platform Module (TPM) 64, 66

U

unsupported wattage 104

updating the system ROM 83

USB CD-ROM drive 75

USB connectors 15

USB devices 68

USB support 83

utilities 71

utilities, deployment 77, 78

V

Version Control 86

Version Control Agent (VCA) 86

Version Control Repository Manager (VCRM) 86

video connector cabling 15

virtual CD/DVD-ROM 75

virtual floppy 76

W

warnings 90

website, HP 115

wireless devices 111, 112