M391A2K43DB1-CWE - Flash Memory SAMSUNG - Free user manual and instructions

Product Type	DDR4 Registered DIMM (RDIMM) Flash Memory Module
Model	M391A2K43DB1-CWE
Capacity	32 GB
Speed	3200 MHz (PC4-25600)
Form Factor	288-pin DIMM
Voltage	1.2 V
Dimensions	133.35 x 31.25 x 1.18 mm
Weight	Approx. 20 g
Operating Temperature	0°C to 85°C
Storage Temperature	-40°C to 100°C
Main Functions	High-speed data storage and retrieval for server and enterprise applications
Handling Precautions	Use anti-ESD wrist strap, wear gloves, hold module by edges only
Installation Method	Socketing with both hands, press down evenly until latches close
Maintenance	Keep in anti-static tray, avoid bending or twisting, do not drop
Cleaning	Do not clean with liquids; use dry, lint-free cloth if needed
Safety Precautions	Prevent ESD damage, avoid metal tools, insert only when system is off
Spare Parts & Repairability	Not user-serviceable; replace module if defective
Compatibility	Systems supporting DDR4 RDIMM, PC4-25600
Warranty	Limited lifetime warranty (check Samsung for details)
Manufacturer	Samsung Electronics Co., Ltd.

Frequently Asked Questions - M391A2K43DB1-CWE SAMSUNG

How should I handle the M391A2K43DB1-CWE module to avoid damage?

Always use an anti-ESD wrist strap connected to your body. Wear gloves, hold the module only by the edges of the PCB, and avoid touching the components. Do not bend or twist the module.

What is ESD and why is it important?

ESD stands for Electro Static Discharge. It can damage sensitive electronic components. Proper grounding and handling procedures are essential to prevent ESD.

What is the correct way to insert the module into the socket?

Ensure the socket latches are fully open. Align the module notch with the socket, grip both edges, and press down evenly with both hands until the latches close automatically. Do not insert one end first.

Can I install multiple modules at the same time?

No, install modules one by one to avoid improper seating and potential damage.

What should I do if the module does not fit?

Check that the notch is aligned correctly. Do not force it. If it still doesn't fit, verify compatibility with your system.

Is it safe to touch the gold contacts on the module?

No, avoid touching the contacts to prevent contamination and corrosion. Hold the module only by the edges.

What type of DIMM is the M391A2K43DB1-CWE?

It is a Registered DIMM (RDIMM) designed for server systems requiring high memory reliability and capacity.

Can I use this module in a desktop computer?

RDIMMs are typically not compatible with standard desktop motherboards; they require a server or workstation platform that supports registered memory.

What is the voltage requirement for this module?

It operates at 1.2V standard for DDR4 memory.

How should I store the module if not in use?

Keep it in an anti-static tray or bag, away from metal objects, moisture, and extreme temperatures.

USER MANUAL M391A2K43DB1-CWE SAMSUNG

Module Handling Guide

How to handle the module

Recently, module failures related to Active/Passive/Component cracks have increased.

The main root causes are wrong handling methods and mechanical damage.

Current products have more capacitors and resistors, and the sizes of those passives are reduced, and most of them are located around the edge area.

These characteristics require a more cautious module handling method.

This guide book tries to find out the tendency and range of module crack patterns based on experiments from several aspects. The main purpose is to reinforce Samsung's process control and help customers effectively control the module handling process.

Test methods are PCB Bow, Twist, Drop Test, UTM (Universal Testing Machine) Test for DRAM, Resistor & Capacitor. We observed crack phenomena and tendencies through the data and pictures. Tested products are limited to Registered DIMM [RDIMM], Unbuffered DIMM [UDIMM], and BOC PKG based modules, therefore test results might be different when applied to other products.

Memory Module Introduction

Unbuffered DIMM

Load Reduced DIMM

Registered DIMM

SODIMM

• Anti-ESD * straps should be used. • The strap should be linked to your body.

*ESD : Electro Static Discharge

• Modules should be picked up from packing trays only one-by-one. • Product should be handled at the conductive mat.
• Do not grab packages. Hold only the edge of the PCB with both hands.
• Wear gloves when handling.

- Tray must be covered when handling module tray.

- Do not twist or bow a module.

- Do not drop modules on the floor.

- Do not grip several modules using one hand.

- Do not touch module without gloves. It can cause tab contamination.

- Do not detach H/S * or clip. (FDHS product) *H/S : Heat Spreader

- Handling modules near tools is prohibited because hard metal objects can damage Module.

- Do not insert the module by seating one end first then seating the other. (This is called zippering or rock)

- Do not insert module upper side.

- Do not insert module between sockets.

- Do not insert key notch reverse.

- Do not insert several modules at the same time.

- Do not use metal tools when socketing.

1. Socketing must be conducted before turn-on.
2. Ensure that both latch ejectors of connector are fully opened.
3. Grip the module edge side with both hands. (avoid touching component area)
4. Align module to socket notch & side guide.

1. Press down both edge side of module at the same time.
2. Confirm latch ejectors closed properly.

We validated the possibility of cracking tendencies through various tests. Various products, environments, and characteristics of tools can cause errors and affect test results.

However, the most important conclusion that can be deduced from the tests is that special caution against mechanical damage and handling errors should be taken from the point of unpacking modules to inserting them into the sockets on system boards.

Recent memory module products are structurally weak to external damage due to the increasing numbers of ICs and passive components and the unit's diminishing size.

It's difficult to predict and find out clear root causes of failures related with BOC PKG passive components due to many variances and circumstances. However, the above guidelines for memory module handling based on test results should help with crack-related problems and make more effective process control possible.

About Samsung Electronics Co., Ltd.

Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI and LED solutions. For the latest news, please visit the Samsung Newsroom at news.samsung.com.

Copyright © 2018 Samsung Electronics Co., Ltd. All rights reserved. Samsung is a registered trademark of Samsung Electronics Co., Ltd. Specifications and designs are subject to change without notice. Nonmetric weights and measurements are approximate. All data were deemed correct at time of creation. Samsung is not liable for errors or omissions. All brand, product, service names and logos are trademarks and/or registered trademarks of their respective owners and are hereby recognized and acknowledged.

Fio is a registered trademark of Fio Corporation. Intel is a trademark of Intel Corporation in the U.S. and/or other countries. Linux is a registered trademark of Linus Torvalds. PCI Express and PCIe are registered trademarks of PCI-SIG. Toggle is a registered trademark of Toggle, Inc.