ProLiant DL180 Gen9 - NAS HP - Free user manual and instructions

Product Type	NAS (Network Attached Storage)
Form Factor	2U Rackmount
Processor	Intel Xeon E5-2600 v4 series (up to 2 per system)
Memory	DDR4 ECC, up to 512 GB (16 slots)
Drive Bays	12 x 3.5" LFF or 25 x 2.5" SFF (SAS/SATA)
Dimensions (H x W x D)	8.7 x 44.8 x 67.9 cm (3.4 x 17.6 x 26.7 in)
Weight (max)	Approximately 23 kg (50.7 lbs)
Power Supply	Dual redundant 800W or 1200W hot-plug
Network Connectivity	Dual Gigabit Ethernet (10GbE optional)
RAID Support	HPE Smart Array P440ar or P840 (RAID 0/1/5/6/10)
Operating System	Windows Server, Linux, or HPE iLO management
Cooling	Hot-plug redundant fans
Expansion Slots	2 x PCIe 3.0 (x8) or 1 x PCIe 3.0 (x16)
Management	HPE iLO 4 (remote management)
Maintenance	Tool-less access for drives, power supplies, and fans
Safety	Hot-plug components, front bezel lock, tamper-proof screws
Spare Parts & Repairability	Customer self-replaceable units (CRUs): drives, PSU, fans, memory
Environmental	Operating temperature 10-35°C (50-95°F)
Warranty	3-year limited warranty (extendable)

Frequently Asked Questions - ProLiant DL180 Gen9 HP

How do I access the HPE iLO interface?

You can access the iLO interface by entering the iLO IP address in a web browser. The default username is Administrator and the password is printed on the iLO service label.

What is the maximum storage capacity?

With 12 x 3.5" LFF drives at 14TB each, the maximum raw capacity is 168TB. Using 2.5" drives allows up to 25 x 2.5" SFF drives.

Can I use SATA drives in this NAS?

Yes, the drive bays support both SAS and SATA drives. However, mixing SAS and SATA in the same RAID array is not recommended.

How do I configure RAID?

RAID can be configured via the HPE Smart Storage Administrator utility during boot (F5 key) or through the iLO interface. The supported levels include RAID 0, 1, 5, 6, 10, 50, 60.

Is the power supply hot-swappable?

Yes, the dual power supplies are hot-pluggable and redundant. You can replace one without powering down the system.

What operating systems are supported?

The ProLiant DL180 Gen9 supports Windows Server 2012 R2/2016, various Linux distributions (RHEL, SLES, Ubuntu), and VMware ESXi. HPE provides drivers for all.

How do I reset the iLO password?

You can reset the iLO password by powering on the server and pressing F8 during POST. Alternatively, use the iLO recovery switches on the system board.

What is the noise level of this server?

Under normal load, the noise level is approximately 55 dB. It can increase under heavy load or in high ambient temperatures.

Can I add a 10GbE network card?

Yes, you can install a 10GbE PCIe card in the expansion slot. HPE offers optional FlexFabric adapters.

How do I replace a failed hard drive?

Simply pull the drive handle to unlock and remove the failing drive. Insert a new drive of same or larger capacity. The RAID controller will automatically rebuild the array.

USER MANUAL ProLiant DL180 Gen9 HP

Maintenance and Service Guide

Abstract

This guide describes identification and maintenance procedures, diagnostic tools, specifications and requirements for hardware components and software. This guide is for an experienced service technician. Hewlett Packard Enterprise assumes that you are qualified in the servicing of computer equipment, trained in recognizing hazards in products, and are familiar with weight and stability precautions.

© Copyright 2014, 2015 Hewlett Packard Enterprise Development LP

The information contained herein is subject to change without notice. The only warranties for Hewlett Packard Enterprise products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. Hewlett Packard Enterprise shall not be liable for technical or editorial errors or omissions contained herein.

Links to third-party websites take you outside the Hewlett Packard Enterprise website. Hewlett Packard Enterprise has no control over and is not responsible for information outside the Hewlett Packard Enterprise website.

Linux® is the registered trademark of Linus Torvalds in the U.S. and other countries.

Microsoft® and Windows® are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries.

microSD is a trademark or a registered trademark of SD-3C in the United States, other countries or both.

Red Hat® is a registered trademark of Red Hat, Inc. in the United States and other countries.

VMware® is a registered trademark of VMware, Inc. in the United States and/or other jurisdictions.

Contents

Customer self repair 6

Parts only warranty service 6

Illustrated parts catalog....16

Mechanical components....16

System components....19

Removal and replacement procedures 24

Required tools....24

Safety considerations....24

Preventing electrostatic discharge....24

Symbols on equipment....24

Server warnings and cautions....25

Rack warnings....25

Preparation procedures....26

Remove the security bezel (optional)....27

Power down the server....27

Extend the server from the rack....27

Access the product rear panel....30

Remove the server from the rack 30

Remove the PCI riser cages....31

Remove the air baffle 32

Non-hot-plug drive carrier....34

Non-hot-plug drive....34

Hot-plug drive blanks....35

Hot-plug drive 36

Access panel....37

4-bay and 8-bay LFF non-hot-plug drive cable assemblies ....38

4-bay and 8-bay LFF hot-plug drive backplanes....40

8-bay SFF hot-plug drive backplane 42

HPE Smart Storage Battery 43

FBWC module 44

M.2 SSD enablement kit....46

Optical drive 48

Fan and fan blank....49

Fan population guidelines....49

Fan blank....50

Hot-swap fan ....51

DIMM 52

Heatsink 53

Processor 55

Expansion board 59

Two-slot and three-slot PCIe riser boards....60

FlexibleLOM riser board....61

System battery 63

Dedicated iLO management module....65

Enabling the dedicated iLO management module 66

Front I/O assemblies for LFF and SFF chassis using thumbscrew rack ears....67

Quick-release latch rack ear assembly 69

Pull tab cage for SFF chassis using quick-release latch rack ears 71

System board 72

HPE 550-W Power Supply (non-hot plug)......81

Hot-plug power input module 82

RPS backplane....83

HP Trusted Platform Module 85

Troubleshooting 86

Troubleshooting resources....86

Diagnostic tools 87

Product QuickSpecs....87

HPE iLO 87

Active Health System 87

HPE ProLiant Pre-boot Health Summary 88

Integrated Management Log 89

HPE UEFI System Utilities 89

Using UEFI System Utilities....89

Embedded Diagnostics option....90

Re-entering the server serial number and product ID 90

HPE Insight Diagnostics....90

HPE Insight Diagnostics survey functionality ....91

HPE Insight Remote Support 91

USB support....91

External USB functionality....92

HPE Smart Storage Administrator....92

Automatic Server Recovery....92

Component identification 93

Front panel components....93

Serial label pull tab information....94

Front panel LEDs and buttons....94

Front panel LED power fault codes....96

Rear panel components 97

Rear panel LEDs....97

PCIe riser board slot definitions 98

System board components....100

DIMM slot locations....101

System maintenance switch....101

NMI functionality....102

Drive numbering....102

HPE SmartDrive LED definitions....103

Fan locations 104

Cabling 105

Cabling overview....105

Storage cabling 105

4-bay LFF non-hot-plug SATA drive cabling 106

8-bay LFF non-hot-plug SATA drive cabling 106

8-bay LFF hot-plug SATA drive cabling 107

8-bay LFF hot-plug SAS/SATA drive cabling 107

8-bay SFF hot-plug SATA drive cabling 108

8-bay SFF hot-plug SAS/SATA drive cabling....109

16-bay SFF hot-plug SAS/SATA drive cabling....110

M.2 SSD cabling....111

FBWC module backup power cabling 111

HPE Smart Storage Battery cabling....112

Optical drive cabling....113

Fan cabling....113

GPU power drive cabling....114

FlexibleLOM sideband signal cabling....114

Power supply cabling 115

HPE 550-W Power Supply cabling (non-hot-plug)....115

HPE Redundant Power Supply cabling (hot-plug)....115

Front panel cabling....116

Specifications 118

Environmental specifications....118

Mechanical specifications....118

Power supply specifications 119

Hot-plug power supply calculations....119

Acronyms and abbreviations....120

Documentation feedback 123

Index....124

Customer self repair

Hewlett Packard Enterprise products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period Hewlett Packard Enterprise (or Hewlett Packard Enterprise service providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, Hewlett Packard Enterprise will ship that part directly to you for replacement. There are two categories of CSR parts:

• Mandatory—Parts for which customer self repair is mandatory. If you request Hewlett Packard Enterprise to replace these parts, you will be charged for the travel and labor costs of this service.
• Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If, however, you require that Hewlett Packard Enterprise replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product.

NOTE: Some Hewlett Packard Enterprise parts are not designed for customer self repair. In order to satisfy the customer warranty, Hewlett Packard Enterprise requires that an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts Catalog.

Based on availability and where geography permits, CSR parts will be shipped for next business day delivery. Same day or four-hour delivery may be offered at an additional charge where geography permits. If assistance is required, you can call the Hewlett Packard Enterprise Support Center and a technician will help you over the telephone. Hewlett Packard Enterprise specifies in the materials shipped with a replacement CSR part whether a defective part must be returned to Hewlett Packard Enterprise. In cases where it is required to return the defective part to Hewlett Packard Enterprise, you must ship the defective part back to Hewlett Packard Enterprise within a defined period of time, normally five (5) business days. The defective part must be returned with the associated documentation in the provided shipping material. Failure to return the defective part may result in Hewlett Packard Enterprise billing you for the replacement. With a customer self repair, Hewlett Packard Enterprise will pay all shipping and part return costs and determine the courier/carrier to be used.

For more information about the Hewlett Packard Enterprise CSR program, contact your local service provider. For the North American program, go to the Hewlett Packard Enterprise CSR website (http://www.hpe.com/support/selfrepair).

Parts only warranty service

Your Hewlett Packard Enterprise Limited Warranty may include a parts only warranty service. Under the terms of parts only warranty service, Hewlett Packard Enterprise will provide replacement parts free of charge.

For parts only warranty service, CSR part replacement is mandatory. If you request Hewlett Packard Enterprise to replace these parts, you will be charged for the travel and labor costs of this service.

Customer Self Repair

Customer Self Repair

Illustrated parts catalog

Mechanical components

Hewlett Packard Enterprise continually improves and changes product parts. For complete and current supported parts information, see the Hewlett Packard Enterprise PartSurfer website (http://www.hpe.com/info/partssurfer).

Item	Description	Spare part number	Customer self repair (on page 6)
1	Access panel	779087-001	Mandatory 1
2	Pull tab cage for SFF drive models with quick-release latch rack ears	785787-001	Optional 2
3	Fan blank	779092-001	Mandatory 1

¹ Mandatory—Parts for which customer self repair is mandatory. If you request Hewlett Packard Enterprise to replace these parts, you will be charged for the travel and labor costs of this service.

² Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If, however, you require that Hewlett Packard Enterprise replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product.

³ No—Some Hewlett Packard Enterprise parts are not designed for customer self repair. In order to satisfy the customer warranty, Hewlett Packard Enterprise requires that an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts Catalog.

Hewlett Packard Enterprise continually improves and changes product parts. For complete and current supported parts information, see the Hewlett Packard Enterprise PartSurfer website (http://www.hpe.com/info/partssurfer).

Item	Description	Spare part number	Customer self repair (on page 6)
4	System battery	234556-001	Mandatory 1
5	Three-slot PCIe riser board	779085-001	Mandatory 1
6	Two-slot PCIe riser board	779084-001	Mandatory 1
7	FlexibleLOM riser board	794360-001	Mandatory 1
8	Dedicated iLO management module	779095-001	Mandatory 1
9	SATA M.2 SSD single module enablement kit	797907-001	Optional 2
	a) M.2 SSD enablement board	—	—
	b) M.2 SSD module	—	—
	c) SATA cable*	—	—
	d) Low-profile board bracket*	—	—
10	SATA M.2 SSD dual module enablement kit	797908-001	Optional2
	a) M.2 SSD enablement board	—	—
	b) M.2 SSD modules (2)	—	—
	c) SATA cables (2)	—	—
	d) Low-profile board bracket*	—	—
11	HPE RPS backplane	784636-001	Optional2
12	HPE 800-W/900-W Gold AC Power Input Module	754376-001	Mandatory1
13	HPE 550-W Power Supply (non-hot-plug)	766879-001	Optional2
14	Hot-swap fan	779093-001	Mandatory1
15	8-bay LFF hot-plug drive backplane	779083-001	Optional2
16	4-bay LFF hot-plug drive backplane	779096-001	Optional2
17	8-bay SFF hot-plug drive backplane	780971-001	Optional2
18	Front I/O assembly for LFF chassis using thumbscrew rack ears	779088-001	Optional2
19	Front I/O assembly for SFF chassis using thumbscrew rack ears	779089-001	Optional2
20	Quick-release latch rack ear assembly	779090-001	Optional2
21	4-bay LFF non-hot-plug drive cable assembly (includes Mini-SAS and drive power cables)	782466-001	Mandatory1
22	8-bay LFF non-hot-plug drive cable assembly (includes Mini-SAS and drive power cables)	782458-001	Mandatory1
23	HPE Smart Storage Battery	750450-001	Mandatory1
24	System board (include alcohol pad and thermal compound)	779094-001	Optional2
25	DIMMs	—	—
	a) 4 GB, single-rank x8 PC4-2133P-R*	804842-001	Mandatory1
	b) 4 GB, single-rank x8 PC4-2133R-15	774169-001	Mandatory1
	c) 8 GB, single-rank x4 PC4-2133R-15*	774170-001	Mandatory1
	d) 8 GB, single-rank x8 PC4-2133P-R*	804843-001	Mandatory1
	e) 8 GB, dual-rank x8 PC4-2133P-R*	774171-001	Mandatory1
	f) 16 GB, dual-rank x4 PC4-2133R-15*	774172-001	Mandatory1
	g) 16 GB, dual-rank x4 PC4-2133P-L*	774173-001	Mandatory1
	h) 32 GB, dual-rank x4 PC4-2133P-R*	774175-001	Mandatory1
	i) 32 GB, quad-rank x4 PC4-2133P-L*	774174-001	Mandatory1
26	Processors (include alcohol pad and thermal compound)	—	—
	a) 1.60-GHz Intel Xeon E5-2603 v3, 6C, 85 W	762441-001	Optional2
	b) 1.80-GHz Intel Xeon E5-2630L v3, 8C, 55 W*	762459-001	Optional2
	c) 1.80-GHz Intel Xeon E5-2650L v3, 12C, 65 W*	762461-001	Optional2
	d) 1.90-GHz Intel Xeon E5-2609 v3, 6C, 85 W*	762443-001	Optional2
	e) 2.30-GHz Intel Xeon E5-2650 v3, 10C, 105 W*	762448-001	Optional2
	f) 2.40-GHz Intel Xeon E5-2620 v3, 6C, 85 W*	762445-001	Optional2
	g) 2.40-GHz Intel Xeon E5-2630 v3, 8C, 85 W*	762446-001	Optional2
	h) 2.60-GHz Intel Xeon E5-2640 v3, 8C, 90 W*	762447-001	Optional2
	i) 2.60-GHz Intel Xeon E5-2660 v3, 10C, 105 W*	762449-001	Optional2
	j) 3.00-GHz Intel Xeon E5-2623 v3, 4C, 105 W*	780762-001	Optional2
27	Heatsink	779091-001	Optional2
28	System cables	—	—
	a) 4-bay LFF hot-plug Mini-SAS cable for connection to the onboard storage controller or to an HPE H-series Host Bus Adapter*	782464-001	Mandatory1
	b) 4-bay or 12-bay LFF hot-plug Mini-SAS cable for an HPE Smart Array P-series Controller*	782465-001	Mandatory1
	c) 8-bay LFF hot-plug Mini-SAS cable assembly*	782459-001	Mandatory1
	d) 8-bay LFF hot-plug Mini-SAS Y-cable*	782460-001	Mandatory1
	e) 12-bay LFF drive identification signal cable*	782467-001	Mandatory1
	f) 8-bay SFF hot-plug Mini-SAS cables*	782461-001	Mandatory1
	g) 8-bay SFF hot-plug Mini-SAS Y-cable*	782462-001	Mandatory1
	h) 20-pin power cable for LFF drive models*	782455-001	Mandatory1
	i) 20-pin power cable for SFF drive models*	782453-001	Mandatory1
	j) Optical drive SATA cable*	782457-001	Mandatory1
	k) GPU power cable*	782456-001	Mandatory1
	l) FlexibleLOM sideband signal cable*	789801-001	Mandatory1
29	Trusted Platform Module*	505836-001	No3

Removal and replacement procedures

Required tools

You need the following items for some procedures:

• T-25 Torx screwdriver (to loosen the shipping screws located inside the server quick-release latch rack ears) • T-10/T-15 Torx screwdriver
• Flathead screwdriver (for replacing the system battery) • HPE Insight Diagnostics (on page 90)

Safety considerations

Before performing service procedures, review all the safety information.

Preventing electrostatic discharge

To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts. A discharge of static electricity from a finger or other conductor may damage system boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device.

To prevent electrostatic damage:

• Avoid hand contact by transporting and storing products in static-safe containers.
• Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations.
• Place parts on a grounded surface before removing them from their containers.
• Avoid touching pins, leads, or circuitry. • Always be properly grounded when touching a static-sensitive component or assembly.

Symbols on equipment

The following symbols may be placed on equipment to indicate the presence of potentially hazardous conditions.

This symbol indicates the presence of hazardous energy circuits or electric shock hazards. Refer all servicing to qualified personnel.

WARNING: To reduce the risk of injury from electric shock hazards, do not open this enclosure. Refer all maintenance, upgrades, and servicing to qualified personnel.

This symbol indicates the presence of electric shock hazards. The area contains no user or field serviceable parts. Do not open for any reason.

WARNING: To reduce the risk of injury from electric shock hazards, do not open this enclosure.

This symbol on an RJ-45 receptacle indicates a network interface connection. WARNING: To reduce the risk of electric shock, fire, or damage to the equipment, do not plug telephone or telecommunications connectors into this receptacle.

This symbol indicates the presence of a hot surface or hot component. If this surface is contacted, the potential for injury exists. WARNING: To reduce the risk of injury from a hot component, allow the surface to cool before touching.

This symbol indicates that the component exceeds the recommended weight for one individual to handle safely. WARNING: To reduce the risk of personal injury or damage to the equipment, observe local occupational health and safety requirements and guidelines for manual material handling.

These symbols, on power supplies or systems, indicate that the equipment is supplied by multiple sources of power. WARNING: To reduce the risk of injury from electric shock, remove all power cords to completely disconnect power from the system.

Server warnings and cautions

WARNING: This server is very heavy. To reduce the risk of personal injury or damage to the equipment: - Observe local occupational health and safety requirements and guidelines for manual material handling. - Get help to lift and stabilize the product during installation or removal, especially when the product is not fastened to the rails. Hewlett Packard Enterprise recommends that a minimum of two people are required for all rack server installations. A third person may be required to help align the server if the server is installed higher than chest level. - Use caution when installing the server in or removing the server from the rack; it is unstable when not fastened to the rails. WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: Protect the server from power fluctuations and temporary interruptions with a regulating uninterruptible power supply. This device protects the hardware from damage caused by power surges and voltage spikes and keeps the system in operation during a power failure. CAUTION: Protect the server from power fluctuations and temporary interruptions with a regulating uninterruptible power supply. This device protects the hardware from damage caused by power surges and voltage spikes and keeps the system in operation during a power failure. CAUTION: Do not operate the server for long periods with the access panel open or removed. Operating the server in this manner results in improper airflow and improper cooling that can lead to thermal damage.

Rack warnings

WARNING: To reduce the risk of personal injury or damage to the equipment, be sure that: - The leveling jacks are extended to the floor. - The full weight of the rack rests on the leveling jacks. - The stabilizing feet are attached to the rack if it is a single-rack installation. - The racks are coupled together in multiple-rack installations. - Only one component is extended at a time. A rack may become unstable if more than one component is extended for any reason. WARNING: To reduce the risk of personal injury or equipment damage when unloading a rack: - At least two people are needed to safely unload the rack from the pallet. An empty 42U rack can weigh as much as 115 kg (253 lb), can stand more than 2.1 m (7 ft) tall, and might become unstable when being moved on its casters. - Never stand in front of the rack when it is rolling down the ramp from the pallet. Always handle the rack from both sides. WARNING: To reduce the risk of personal injury or damage to the equipment, adequately stabilize the rack before extending a component outside the rack. Extend only one component at a time. A rack may become unstable if more than one component is extended. WARNING: When installing a server in a telco rack, be sure that the rack frame is adequately secured at the top and bottom to the building structure.

Preparation procedures

To access some components and perform certain service procedures, you must perform one or more of the following procedures:

• Access the product front panel ("Remove the security bezel (optional)" on page 27). • Power down the server (on page 27).

If you must remove a server from a rack or a non-hot-plug component from a server, power down the server.

- Extend the server from the rack (on page 27).

If you are performing service procedures in a Hewlett Packard Enterprise, Compaq branded, Telco, or third-party rack cabinet, you can use the locking feature of the rack rails to support the server and gain access to internal components.

For more information about Telco rack solutions, see the RackSolutions website (http://www.racksolutions.com/hp-dl180-g9-rails.html).

• Access the product rear panel (on page 30).
• Remove the server from the rack (on page 30).

If the rack environment, cabling configuration, or the server location in the rack creates awkward conditions, remove the server from the rack.

• Remove the PCI riser cages (on page 31).
• Remove the air baffle (on page 32).
• Remove the fan cage (on page 33).

Remove the security bezel (optional)

To access the front panel components, unlock and then remove the security bezel. The security bezel is only supported in servers that are using the quick-release latch rack ears.

Power down the server

Before powering down the server for any upgrade or maintenance procedures, perform a backup of critical server data and programs.

IMPORTANT: When the server is in standby mode, auxiliary power is still being provided to the system.

To power down the server, use one of the following methods:

- Press and release the Power On/Standby button. This method initiates a controlled shutdown of applications and the OS before the server enters standby mode.

- Press and hold the Power On/Standby button for more than 4 seconds to force the server to enter standby mode.

This method forces the server to enter standby mode without properly exiting applications and the OS. If an application stops responding, you can use this method to force a shutdown.

• Use a virtual power button selection through iLO 4.

This method initiates a controlled remote shutdown of applications and the OS before the server enters standby mode.

Before proceeding, verify the server is in standby mode by observing that the system power LED is amber.

Extend the server from the rack

WARNING: To reduce the risk of personal injury or equipment damage, be sure that the rack is adequately stabilized before extending a component from the rack.

1. If the rear panel cables are not secured by a cable management arm, do the following:

a. Power down the server (on page 27).

b. Disconnect all peripheral cables from the server.

c. Disconnect each power cord from the server.

1. In a server that uses thumbscrew rack ears, loosen the captive thumbscrews that secure the server faceplate to the front of the rack, and then slide the server out of the rack.

1. In a server that uses quick-release latch rack ears:

a. Open the latches on both sides of the server.

b. If necessary, use a T-25 Torx screwdriver to loosen the shipping screws.

c. Slide the server out of the rack.

1. After performing the installation or maintenance procedure, slide the server back into the rack, and then press the server firmly into the rack to secure it in place.

1. Do one of the following:

o In a server that uses thumbscrew rack ears, tighten the captive thumbscrews.

o In a server that uses quick-release latch rack ears, if necessary, tighten the shipping screws.

1. If the rear panel cables were disconnected because a cable management arm is not in use, do the following:

a. Connect each power cord to the server.

b. Connect all peripheral cables to the server.

c. Power up the server.

Access the product rear panel

Opening the cable management arm

To access the server rear panel:

1. Release the cable management arm.

1. Open the cable management arm. The cable management arm can be right-mounted or left-mounted.

Remove the server from the rack

WARNING: This server is very heavy. To reduce the risk of personal injury or damage to the equipment:

• Observe local occupational health and safety requirements and guidelines for manual material handling.
• Get help to lift and stabilize the product during installation or removal, especially when the product is not fastened to the rails. Hewlett Packard Enterprise recommends that a minimum of two people are required for all rack server installations. A third person may be required to help align the server if the server is installed higher than chest level.
• Use caution when installing the server in or removing the server from the rack; it is unstable when not fastened to the rails.

To remove the server from a Hewlett Packard Enterprise, Compaq-branded, Telco, or a third-party rack:

1. Power down the server (on page 27).
2. Extend the server on the rack rails until the server rail-release latches engage.
3. Disconnect all peripheral cables from the server.
4. Disconnect each power cord from the server.
5. Remove the server from the rack.

For instructions on how to extend or remove the server from the rack, see the documentation that ships with the rack rail system.

1. Place the server on a sturdy, level surface.

Remove the PCI riser cages

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

CAUTION: To prevent damage to the server or expansion boards, power down the server, and disconnect all power cords before removing or installing the PCI riser cage.

To remove the component:

1. Power down the server (on page 27).
2. Remove all power:

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

1. Do one of the following:

o Extend the server from the rack (on page 27). o Remove the server from the rack (on page 30).

1. Remove the access panel ("Access panel" on page 37).
2. If the server was just extended from the rack and expansion boards with external cabling are installed on the PCI riser cage, disconnect all cables from the expansion boards to completely remove the cage from the server.
3. Lift the release tab, and then rotate it 180 degrees counterclockwise.
4. Grasp the PCI riser cage at the touch points and lift it out of the chassis.

Primary PCI riser cage

Secondary PCI riser cage

1. If expansion boards with internal cabling are installed on the PCI riser cage, disconnect all internal cables from the expansion boards to completely remove the cage from the server.

Remove the air baffle

CAUTION: For proper cooling, do not operate the server without the access panel, baffles, expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize the amount of time the access panel is open.

To remove the component:

1. Power down the server (on page 27).
2. Remove all power:

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

1. Do one of the following:

Extend the server from the rack (on page 27).

Remove the server from the rack (on page 30).

1. Remove the access panel ("Access panel" on page 37).
2. If a full-length expansion board is installed on a PCI riser cage, remove the riser cage ("Remove the PCI riser cages" on page 31).
3. Remove the air baffle.

Remove the fan cage.

To remove the component:

1. Power down the server (on page 27).
2. Remove all power:

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

1. Do one of the following:

- Extend the server from the rack (on page 27). - Remove the server from the rack (on page 30).

1. Remove the access panel ("Access panel" on page 37).
2. Remove the air baffle (on page 32).
3. Disconnect the fan cables.
4. Remove the fan cage.

Non-hot-plug drive carrier

△

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.

To remove the component:

1. Power down the server (on page 27).
2. Remove all power:

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

1. If installed, remove the security bezel ("Remove the security bezel (optional)" on page 27).
2. Remove the drive carrier.

To replace the component, slide the component into the bay until it clicks.

Non-hot-plug drive

△

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.

To remove the component:

1. Back up all server data on the drive.
2. Power down the server (on page 27).
3. Remove all power:

a. Disconnect each power cord from the power source.

b. Disconnect each power cord from the server.

1. If installed, remove the security bezel ("Remove the security bezel (optional)" on page 27).
2. Remove the non-hot-plug drive.

1. Remove the drive from the carrier.

To replace the component, reverse the removal procedure.

Hot-plug drive blanks

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.

To remove the component:

1. If installed, remove the security bezel ("Remove the security bezel (optional)" on page 27).
2. Remove the drive blank.

o Hot-plug LFF drive blank

To replace the LFF drive blank, slide the component into the bay until it clicks. oHot-plug SFF drive blank

To replace the SFF drive blank, while pressing the release latch, slide the component into the bay until it is fully seated.

Hot-plug drive

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.

To remove the component:

1. Back up all server data on the drive.
2. If installed, remove the security bezel ("Remove the security bezel (optional)" on page 27).
3. Determine the status of the drive from the drive LED definitions ("HPE SmartDrive LED definitions" on page 103).
4. Remove the hot-plug drive.

- Hot-plug LFF drive

- Hot-plug SFF drive

To replace the component, reverse the removal procedure.

Access panel

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge.

CAUTION: Do not operate the server for long periods with the access panel open or removed. Operating the server in this manner results in improper airflow and improper cooling that can lead to thermal damage.

To remove the component:

1. Power down the server (on page 27).
2. If you are performing a non-hot-plug procedure, remove all power:

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

1. Do one of the following:

o Extend the server from the rack (on page 27).

- Remove the server from the rack (on page 30).

1. If the locking latch is locked, use a T-15 Torx screwdriver to unlock the latch.
2. Open the locking latch.

The access panel slides back, releasing it from the chassis.

1. Lift and remove the access panel.

To replace the component, reverse the removal procedure.

4-bay and 8-bay LFF non-hot-plug drive cable assemblies

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge.

To remove the component:

1. Power down the server (on page 27).
2. Remove all power:

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

1. If installed, remove the security bezel ("Remove the security bezel (optional)" on page 27).
2. Remove all drives ("Non-hot-plug drive" on page 34) and drive carriers ("Non-hot-plug drive carrier" on page 34).
3. Do one of the following:

o Extend the server from the rack (on page 27). o Remove the server from the rack (on page 30).

1. Remove the access panel ("Access panel" on page 37).
2. If an expansion board is installed in the primary PCI riser cage, then remove the PCI riser cage ("Remove the PCI riser cages" on page 31).
3. Remove the air baffle (on page 32).
4. Remove the fan cage (on page 33).
5. Prepare the non-hot-plug drive cable assembly for removal:

a. Disconnect the Mini-SAS and drive power cables from the system board.

b. Release the Mini-SAS and drive power cables from the front chassis cable clips.

— 4-bay LFF non-hot-plug drive cable disconnections

— 8-bay LFF non-hot-plug drive cable disconnections

1. Remove the non-hot-plug drive cable assembly.

- 4-bay LFF non-hot-plug drive cable assembly removal

- 8-bay LFF non-hot-plug drive cable assembly removal

To replace the component, reverse the removal procedure.

4-bay and 8-bay LFF hot-plug drive backplanes

This procedure shows the removal of the 4-bay and 8-bay LFF drive backplanes from a 12-bay LFF hot-plug drive configuration.

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge.

To remove the component:

1. Power down the server (on page 27).
2. Remove all power:

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

1. If installed, remove the security bezel ("Remove the security bezel (optional)" on page 27).
2. Remove all drives ("Hot-plug drive" on page 36).
3. Do one of the following:

- Extend the server from the rack (on page 27). - Remove the server from the rack (on page 30).

1. Remove the access panel ("Access panel" on page 37).
2. Remove the air baffle (on page 32).
3. Remove the fan cage (on page 33).
4. Disconnect all cables from the drive backplane.
5. Remove the drive backplane.

o 4-bay LFF hot-plug drive backplane removal

- 8-bay LFF hot-plug drive backplane removal

To replace the component, reverse the removal procedure.

8-bay SFF hot-plug drive backplane

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge.

To remove the component:

1. Power down the server (on page 27).
2. Remove all power:

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

1. If installed, remove the security bezel ("Remove the security bezel (optional)" on page 27).
2. Remove all drives ("Hot-plug drive" on page 36).
3. Do one of the following:

o Extend the server from the rack (on page 27). o Remove the server from the rack (on page 30).

1. Remove the access panel ("Access panel" on page 37).
2. Disconnect all cables from the drive backplane.
3. Remove the drive backplane.

To replace the component, reverse the removal procedure.

HPE Smart Storage Battery

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge.

To remove the component:

1. Power down the server (on page 27).
2. Remove all power:

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

1. Do one of the following:

Extend the server from the rack (on page 27). Remove the server from the rack (on page 30).

1. Remove the access panel ("Access panel" on page 37).
2. Slightly pull up the battery holder from the chassis to access the battery cable connection underneath it, and then disconnect the HPE Smart Storage Battery cable.

1. Remove the Smart Storage Battery from its holder.

To replace the component, reverse the removal procedure.

FBWC module

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

CAUTION: In systems that use external data storage, be sure that the server is the first unit to be powered down and the last to be powered back up. Taking this precaution ensures that the system does not erroneously mark the drives as failed when the server is powered up.

CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge.

To remove the component:

1. Power down the server (on page 27).
2. Remove all power:

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

1. Do one of the following:

o Extend the server from the rack (on page 27). o Remove the server from the rack (on page 30).

1. Remove the access panel ("Access panel" on page 37).

CAUTION: When connecting or disconnecting the cache module cable, the connectors on the cache module and cable are susceptible to damage. Avoid excessive force and use caution to avoid damage to these connectors.

1. If necessary for easier access to the cache module connector and/or removal of an air scoop, remove the storage controller from the PCI riser cage or from the system board ("Expansion board" on page 59).
2. If the cache module is covered by an air scoop, remove the air scoop.
3. Disconnect the cache module backup power cable from the cache module.

1. Remove the cache module.

To replace the component, reverse the removal procedure.

M.2 SSD enablement kit

For more information about product features, specifications, options, configurations, and compatibility, see the product QuickSpecs on the Hewlett Packard Enterprise website (http://www.hpe.com/info/qs).

To remove the component:

1. Power down the server (on page 27).
2. Remove all power:

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

1. Do one of the following:

o Extend the server from the rack (on page 27). o Remove the server from the rack (on page 30).

1. Remove the access panel ("Access panel" on page 37).
2. Disconnect the SATA cables from the system board.

- Disconnecting the SATA cables from the system board when the M.2 SSD enablement board is installed in the primary PCI riser cage

- Disconnecting the SATA cables from the system board when the M.2 SSD enablement board is installed in the secondary PCI riser cage

1. Remove the PCI riser cage ("Remove the PCI riser cages" on page 31).
2. Disconnect the SATA cables from the M.2 SSD enablement board.

1. Remove the M.2 SSD enablement board.

To replace the component, reverse the removal procedure.

Optical drive

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge. CAUTION: To prevent improper cooling and thermal damage, do not operate the chassis unless all bays are populated with a component or a blank.

To remove the component:

1. Power down the server (on page 27).
2. Remove all power:

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

1. Do one of the following:

o Extend the server from the rack (on page 27).

- Remove the server from the rack (on page 30).

1. If installed, remove the security bezel ("Remove the security bezel (optional)" on page 27).
2. Remove the access panel ("Access panel" on page 37).
3. Disconnect the optical drive cable from the drive.
4. Remove the optical drive.

To replace the component, reverse the removal procedure.

Fan and fan blank

Fan population guidelines

Configuration	Fan bay 1	Fan bay 2	Fan bay 3	Fan bay 4	Fan bay 5
One processor, non-redundant	Blank	Fan	Blank	Blank	Fan
One processor, redundant	Blank	Fan	Fan	Fan	Fan
Two processors, non-redundant	Fan	Fan	Blank	Fan	Fan
Two processors, redundant	Fan	Fan	Fan	Fan	Fan

• In a redundant fan mode:

o If one fan fails, the system continues to operate without redundancy. This condition is indicated by a flashing amber Health LED.

o If two fans fail, the system shuts down.

- The minimum fan requirement to make this server bootable is:

o Two fans (fans 2 and 5) for a single processor configuration

o Four fans (fans 1, 2, 4, and 5) for dual processor configuration

Fan blank

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge.

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.

To remove the component:

1. If a full-length expansion board is installed in the server, do the following:

a. Power down the server (on page 27). b. Disconnect each power cord from the power source. c. Disconnect each power cord from the server.

1. Do one of the following:

Extend the server from the rack (on page 27) or remove the server from the rack (on page 30).

1. Remove the access panel ("Access panel" on page 37).
2. Remove the air baffle (on page 32).
3. Remove the fan blank.

To replace the component, reverse the removal procedure.

Hot-swap fan

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge.

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.

To remove the component:

1. If a full-length expansion board is installed in the server, do the following:

a. Power down the server (on page 27). b. Disconnect each power cord from the power source. c. Disconnect each power cord from the server.

1. Do one of the following:

o Extend the server from the rack (on page 27). o Remove the server from the rack (on page 30).

1. Remove the access panel ("Access panel" on page 37).
2. Remove the air baffle (on page 32).
3. Disconnect the fan cable.
4. Remove the fan.

To replace the component, reverse the removal procedure.

DIMM

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge.

To remove the component:

1. Power down the server (on page 27).
2. Remove all power:

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

1. Do one of the following:

o Extend the server from the rack (on page 27). o Remove the server from the rack (on page 30).

1. Remove the access panel ("Access panel" on page 37).
2. Remove the air baffle (on page 32).
3. Open the DIMM slot latches.
4. Remove the DIMM.

To replace the component, reverse the removal procedure.

Heatsink

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge.

To remove the component:

1. Power down the server (on page 27).
2. Remove all power:

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

1. Do one of the following:

- Extend the server from the rack (on page 27). - Remove the server from the rack (on page 30).

1. Remove the access panel ("Access panel" on page 37).
2. Remove the air baffle (on page 32).
3. Remove the heatsink:

a. Loosen one pair of diagonally opposite screws halfway, and then loosen the other pair of screws. b. Completely loosen all screws in the same sequence.

c. Remove the heatsink from the processor backplate.

To replace the component:

1. Clean the old thermal grease from the processor with the alcohol swab. Allow the alcohol to evaporate before continuing.
2. Remove the thermal interface protective cover from the heatsink.

1. Install the heatsink:

a. Position the heatsink on the processor backplate.

b. Tighten one pair of diagonally opposite screws halfway, and then tighten the other pair of screws.

c. Finish the installation by completely tightening the screws in the same sequence.

1. Install the air baffle.
2. Install the access panel.
3. Do one of the following:

Slide the server into the rack.

Install the server into the rack.

1. Connect each power cord to the server.
2. Connect each power cord to the power source.
3. Press the Power On/Standby button.

The server exits standby mode and applies full power to the system. The system power LED changes from amber to green.

Processor

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To avoid damage to the processor and system board, only authorized personnel should attempt to replace or install the processor in this server. CAUTION: To prevent possible server malfunction and damage to the equipment, multiprocessor configurations must contain processors with the same part number. CAUTION: To prevent possible server overheating, always populate processor socket 2 with a processor and a heatsink or a processor socket cover and a heatsink blank. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge.

IMPORTANT: If installing a processor with a faster speed, update the system ROM before installing the processor.

IMPORTANT: Processor socket 1 must be populated at all times or the server does not function.

To remove the component:

1. Power down the server (on page 27).
2. Remove all power:

a. Disconnect each power cord from the power source.

b. Disconnect each power cord from the server.

1. Do one of the following:

o Extend the server from the rack (on page 27).

o Remove the server from the rack (on page 30).

1. Remove the access panel ("Access panel" on page 37).
2. Remove the air baffle (on page 32).
3. Remove the heatsink ("Heatsink" on page 53).
4. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket.

CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board, do not touch the processor or the processor socket contacts.

1. Remove the processor from the processor retaining bracket.

To replace the component:

1. Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.

CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board, do not touch the processor or the processor socket contacts.

CAUTION: Do not press down on the processor. Pressing down on the processor may cause damage to the processor socket and the system board. Press only in the area indicated on the processor retaining bracket.

1. Close the processor retaining bracket. When the processor is installed properly inside the processor retaining bracket, the processor retaining bracket clears the flange on the front of the socket.
2. Press and hold the processor retaining bracket in place, and then close each processor locking lever. Press only in the area indicated on the processor retaining bracket.

1. Clean the old thermal grease from the heatsink with the alcohol swab. Allow the alcohol to evaporate before continuing.
2. Apply all the grease to the top of the processor in the following pattern to ensure even distribution.

1. Install the heatsink:

a. Position the heatsink on the processor backplate.

b. Tighten one pair of diagonally opposite screws halfway, and then tighten the other pair of screws.

c. Finish the installation by completely tightening the screws in the same sequence.

1. Install the air baffle.
2. Install the access panel.
3. Do one of the following:

o Slide the server into the rack.

o Install the server into the rack.

1. Connect each power cord to the server.
2. Connect each power cord to the power source.
3. Press the Power On/Standby button.

The server exits standby mode and applies full power to the system. The system power LED changes from amber to green.

Expansion board

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge.

To remove the component:

1. Power down the server (on page 27).
2. Remove all power:

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

1. Do one of the following:

o Extend the server from the rack (on page 27). o Remove the server from the rack (on page 30).

1. Remove the access panel ("Access panel" on page 37).
2. Remove the PCI riser cage ("Remove the PCI riser cages" on page 31).
3. Disconnect any internal cables that are connected to the expansion board.
4. If you are removing a storage controller board with a cache module installed, remove the cache module ("FBWC module" on page 44).
5. Remove the expansion board.

To replace the component, reverse the removal procedure.

Two-slot and three-slot PCIe riser boards

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge.

To remove the component:

1. Power down the server (on page 27).
2. Remove all power:

a. Disconnect each power cord from the power source.

b. Disconnect each power cord from the server.

1. Do one of the following:

o Extend the server from the rack (on page 27).

o Remove the server from the rack (on page 30).

1. Remove the access panel ("Access panel" on page 37).
2. Remove the PCI riser cage ("Remove the PCI riser cages" on page 31).
3. If an expansion board is installed in the PCI riser cage, remove the board ("Expansion board" on page 59).
4. Remove the PCIe riser board.

- Two-slot PCIe riser board

oThree-slot PCIe riser board

To replace the component, reverse the removal procedure.

FlexibleLOM riser board

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge.

To remove the component:

1. Power down the server (on page 27).
2. Remove all power:

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

1. Do one of the following:

o Extend the server from the rack (on page 27). o Remove the server from the rack (on page 30).

1. Remove the access panel ("Access panel" on page 37).
2. Disconnect the FlexibleLOM sideband signal cable from the riser board.

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all PCI slots have either an expansion slot cover or an expansion board installed.

1. Remove the FlexibleLOM riser cage.

1. If an expansion board is installed in the PCI riser cage, remove the board ("Expansion board" on page 59).
2. Remove the FlexibleLOM riser board.

To replace the component, reverse the removal procedure.

System battery

If the server no longer automatically displays the correct date and time, replace the battery that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years.

WARNING: The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not properly handled. To reduce the risk of personal injury:

• Do not attempt to recharge the battery.
• Do not expose the battery to temperatures higher than 60°C (140°F).
• Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water.
• Replace only with the spare designated for this product.

To remove the component:

1. Power down the server (on page 27).
2. Remove all power:

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

1. Do one of the following:

o Extend the server from the rack (on page 27). o Remove the server from the rack (on page 30).

1. Remove the access panel ("Access panel" on page 37).
2. If there is a secondary PCI riser cage installed and an expansion board is installed on it, remove the secondary PCI riser cage ("Remove the PCI riser cages" on page 31).
3. Locate the battery on the system board.
4. If the system battery is secured by a metal tab, do the following:

a. Use your finger or a small flat-bladed, nonconductive tool to press the metal tab. This will partially release the battery from the socket.

b. Remove the battery.

1. If the system battery is secured by a plastic outer lip, do the following:

a. Use a small flat-bladed, nonconductive tool to carefully lift the front of the battery from the socket. b. Remove the battery.

IMPORTANT: Replacing the system board battery resets the system ROM to its default configuration. After replacing the battery, use BIOS/Platform Configuration (RBSU) in the UEFI System Utilities ("HPE UEFI System Utilities" on page 89) to reconfigure the system.

To install the component:

1. If the battery socket design uses a metal tab to secure the battery, insert the battery with the "+" side facing up on the socket, and then press the battery down to secure it in place.

1. If the battery socket design has a plastic outer lip to secure the battery, insert the battery with the "+" side facing up underneath the outer lip of the socket, and then press the battery down to secure it in place.

1. If removed, install the secondary PCI riser cage.
2. Install the access panel.
3. Do one of the following:

Slide the server into the rack.

Install the server into the rack.

1. Power up the server.

For more information about battery replacement or proper disposal, contact an authorized reseller or an authorized service provider.

Dedicated iLO management module

!

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

△

CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge.

To remove the component:

1. Power down the server (on page 27).
2. Remove all power:

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

1. Do one of the following:

Extend the server from the rack (on page 27). Remove the server from the rack (on page 30).

1. Remove the access panel ("Access panel" on page 37).
2. If an expansion board is installed in the primary PCI riser cage, then remove the PCI riser cage ("Remove the PCI riser cages" on page 31).
3. Remove the dedicated iLO management module.

To replace the component, reverse the removal procedure. After installing the new dedicated iLO management module, enable the dedicated iLO connector ("Enabling the dedicated iLO management module" on page 66).

Enabling the dedicated iLO management module

The onboard NIC 1/shared iLO connector is set as the default system iLO connector. To enable the dedicated iLO management module, use the iLO 4 Configuration Utility accessible within the HPE UEFI System Utilities.

For more information on the UEFI System Utilities, see the UEFI documentation on the Hewlett Packard Enterprise website (http://www.hpe.com/info/ProLiantUEFI/docs).

IMPORTANT: If the iLO configuration settings are reset to the default values, remote access to the machine will be lost. Access the physical machine and repeat the procedure described in this section to re-enable the dedicated iLO management connector.

To enable the dedicated iLO management module:

1. During the server startup sequence after installing the module, press F9 in the POST screen. The System Utilities screen appears.
2. Select System Configuration | iLO 4 Configuration Utility. The iLO 4 Configuration Utility screen appears.
3. Select Network Options, and then press Enter. The Network Options screen appears.
4. Set the Network Interface Adapter field to ON, and then press Enter.
5. Press F10 to save your changes. A message prompt to confirm the iLO settings reset appears.
6. Press Enter to reboot the iLO settings.
7. Press Esc until the main menu is displayed.
8. Select Reboot the System to exit the utility and resume the boot process. The IP address of the enabled dedicated iLO connector appears on the POST screen on the subsequent boot-up. Access the Network Options screen again to view this IP address for later reference.

Front I/O assemblies for LFF and SFF chassis using thumbscrew rack ears

CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge.

To remove the component:

1. Power down the server (on page 27).
2. Remove all power:

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

1. Do one of the following:

o Extend the server from the rack (on page 27). o Remove the server from the rack (on page 30).

1. If installed, remove the security bezel ("Remove the security bezel (optional)" on page 27).
2. Remove the access panel ("Access panel" on page 37).
3. Release the front I/O cabling from the server:

a. Detach the ambient thermal sensor cable from its clip. b. Release the ambient thermal sensor cable from the front chassis cable clip. c. Disconnect the front I/O assembly cable.

— Front I/O cabling disconnection in an LFF chassis

— Front I/O cabling disconnection in an SFF chassis

1. Remove the front I/O assembly from the chassis: oFront I/O assembly removal in an LFF chassis

• Front I/O assembly removal in an SFF chassis

To replace the component, reverse the removal procedure.

Quick-release latch rack ear assembly

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge.

To remove the component:

1. Power down the server (on page 27).
2. Remove all power:

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

1. Remove the server from the rack (on page 30).
2. If installed, remove the security bezel ("Remove the security bezel (optional)" on page 27).
3. Remove the access panel ("Access panel" on page 37).
4. If an expansion board is installed in the primary PCI riser cage, then remove the PCI riser cage ("Remove the PCI riser cages" on page 31).
5. Release the front I/O cabling from the server:

a. Detach the ambient thermal sensor cable from its clip. b. Release the ambient thermal sensor cable from the front chassis cable clip. c. Disconnect the USB 3.0 cable. d. Disconnect the front I/O assembly cable.

e. Release the front I/O cabling from the side chassis metal clip.

1. Remove the cable cover behind the right quick-release latch rack ear.

1. Remove the right quick-release latch rack ear assembly.

1. Remove the left quick-release latch rack ear.

To replace the component, reverse the removal procedure.

Pull tab cage for SFF chassis using quick-release latch rack ears

CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge.

To remove the component:

1. Power down the server (on page 27).
2. Remove all power:

a. Disconnect each power cord from the power source.

b. Disconnect each power cord from the server.

1. Remove the server from the rack (on page 30).
2. If installed, remove the security bezel ("Remove the security bezel (optional)" on page 27).
3. Remove the right quick-release latch rack ear screws, and then move the ear away from the right side of the pull tab cage.

1. Remove the pull tab cage.

To replace the component, reverse the removal procedure.

System board

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge.

CAUTION: To avoid ESD damage, when removing electrostatic-sensitive components from the failed system board, place the components on a static-dissipating work surface or inside separate antistatic bags.

To remove the system board:

1. Power down the server (on page 27).
2. Remove all power:

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

1. Do one of the following:

- Extend the server from the rack (on page 27). - Remove the server from the rack (on page 30).

1. Remove the access panel ("Access panel" on page 37).
2. Remove the PCI riser cages (on page 31).
3. Remove the air baffle (on page 32).
4. Remove the fan cage (on page 33).
5. Remove all DIMMs ("DIMM" on page 52).
6. Remove the heatsink:

a. Loosen one pair of diagonally opposite screws halfway, and then loosen the other pair of screws. b. Completely loosen all screws in the same sequence. c. Remove the heatsink from the processor backplate.

1. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket.

CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board, do not touch the processor or the processor socket contacts.

1. Remove the processor from the processor retaining bracket.

1. If installed, remove the dedicated iLO module ("Dedicated iLO management module" on page 65).
2. Disconnect all cables connected to the system board.
3. Remove the failed system board.

1. Remove the DIMM guard from the failed system board.

To replace the system board:

1. Install the DIMM guard removed from the failed system board on the system board replacement.

1. Install the system board.

1. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket.

1. Remove the clear processor socket cover. Retain the processor socket cover for future use.

1. Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.

CAUTION: Do not press down on the processor. Pressing down on the processor may cause damage to the processor socket and the system board. Press only in the area indicated on the processor retaining bracket.

CAUTION: Close and hold down the processor cover socket while closing the processor locking levers. The levers should close without resistance. Forcing the levers closed can damage the processor and socket, requiring system board replacement.

1. Close the processor retaining bracket. When the processor is installed properly inside the processor retaining bracket, the processor retaining bracket clears the flange on the front of the socket.
2. Press and hold the processor retaining bracket in place, and then close each processor locking lever. Press only in the area indicated on the processor retaining bracket.

1. Install the processor socket cover on the failed system board.
2. Clean the old thermal grease from the heatsink and the top of the processor with the alcohol swab. Allow the alcohol to evaporate before continuing.
3. Apply all the grease to the top of the processor in the following pattern to ensure even distribution.

1. Install the heatsink:

a. Position the heatsink on the processor backplate.

b. Tighten one pair of diagonally opposite screws halfway, and then tighten the other pair of screws.

c. Finish the installation by completely tightening the screws in the same sequence.

1. Install all components removed from the failed system board.
2. Connect all cables disconnected from the failed system board.
3. Install the fan cage.
4. Install the air baffle.
5. Install the PCI riser cages.
6. Install the access panel.
7. Do one of the following:

Slide the server into the rack.

Install the server into the rack.

1. Connect each power cord to the server.
2. Connect each power cord to the power source.
3. Press the Power On/Standby button.

The server exits standby mode and applies full power to the system. The system power LED changes from amber to green.

IMPORTANT: Install all components with the same configuration that was used on the failed system board.

After you replace the system board, you must re-enter the server serial number and the product ID.

1. During the server startup sequence, press the F9 key to access UEFI System Utilities.
2. Select the System Configuration > BIOS/Platform Configuration (RBSU) > Advanced Options > Advanced System ROM Options > Serial Number, and then press the Enter key.
3. Enter the serial number and press the Enter key. The following message appears:

The serial number should only be modified by qualified service personnel. This value should always match the serial number located on the chassis.

1. Press the Enter key to clear the warning.
2. Enter the serial number and press the Enter key.
3. Select Product ID. The following warning appears:

Warning: The Product ID should ONLY be modified by qualified service personnel. This value should always match the Product ID located on the chassis.

1. Enter the product ID and press the Enter key.
2. Press the F10 key to confirm exiting System Utilities. The server automatically reboots.

HPE 550-W Power Supply (non-hot plug)

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge.

To remove the component:

1. Power down the server (on page 27).
2. Access the product rear panel (on page 30).
3. Release the power cord from the strain relief clip.

1. Remove all power:

a. Disconnect the power cord from the power source. b. Disconnect the power cord from the server.

1. Remove the server from the rack (on page 30).
2. Remove the access panel ("Access panel" on page 37).
3. If installed, remove the secondary PCI riser cage ("Remove the PCI riser cages" on page 31).
4. Remove the Smart Storage Battery holder.

1. Disconnect all power supply cables from the system board and any associated component (drive backplane, GPU, etc.).
2. Remove the non-hot-plug power supply.

To replace the component, reverse the removal procedure.

Hot-plug power input module

To remove the component:

1. If the server is using a single hot-plug power input module only, power down the server (on page 27).
2. Access the product rear panel (on page 30).
3. Release the power cord from the hook-and-loop strap.

1. Disconnect the power cord from the power source.
2. Remove the power input module.

To replace the component, reverse the removal procedure.

RPS backplane

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge.

To remove the component:

1. Power down the server (on page 27).
2. Access the product rear panel (on page 30).
3. Remove all power:

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

1. Remove all installed power input modules ("Hot-plug power input module" on page 82).
2. Remove the server from the rack (on page 30).
3. Place the server on a sturdy, level surface.
4. Remove the access panel ("Access panel" on page 37).
5. If installed, remove the secondary PCI riser cage ("Remove the PCI riser cages" on page 31).
6. Remove the Smart Storage Battery holder.

1. Disconnect the RPS backplane cables.
2. Release the RPS backplane cables from the cable clips.

1. Remove the RPS backplane.

To replace the component, reverse the removal procedure.

HP Trusted Platform Module

The TPM is not a customer-removable part.

CAUTION: Any attempt to remove an installed TPM from the system board breaks or disfigures the TPM security rivet. Upon locating a broken or disfigured rivet on an installed TPM, administrators should consider the system compromised and take appropriate measures to ensure the integrity of the system data.

If you suspect a TPM board failure, leave the TPM installed and remove the system board. Contact a Hewlett Packard Enterprise authorized service provider for a replacement system board and TPM board.

Troubleshooting

Troubleshooting resources

The HPE ProLiant Gen9 Troubleshooting Guide, Volume I: Troubleshooting provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, issue resolution, and software maintenance on ProLiant servers and server blades. To view the guide, select a language:

• English (http://www.hpe.com/support/Gen9_TSG_en) - French (http://www.hpe.com/support/Gen9_TSG_fr) • Spanish (http://www.hpe.com/support/Gen9_TSG_es) • German (http://www.hpe.com/support/Gen9_TSG_de) • Japanese (http://www.hpe.com/support/Gen9_TSG_ja) - Simplified Chinese (http://www.hpe.com/support/Gen9_TSG_zh_cn)

The HPE ProLiant Gen9 Troubleshooting Guide, Volume II: Error Messages provides a list of error messages and information to assist with interpreting and resolving error messages on ProLiant servers and server blades. To view the guide, select a language:

• English (http://www.hpe.com/support/Gen9_EMG_en) • French (http://www.hpe.com/support/Gen9_EMG_fr) • Spanish (http://www.hpe.com/support/Gen9_EMG_es) • German (http://www.hpe.com/support/Gen9_EMG_de) • Japanese (http://www.hpe.com/support/Gen9_EMG_ja) • Simplified Chinese (http://www.hpe.com/support/Gen9_EMG_zh_cn)

Diagnostic tools

Product QuickSpecs

For more information about product features, specifications, options, configurations, and compatibility, see the product QuickSpecs on the Hewlett Packard Enterprise website (http://www.hpe.com/info/qs).

HPE iLO

The iLO 4 subsystem is a standard component of ProLiant servers that simplifies initial server setup, server health monitoring, power and thermal optimization, and remote server administration. The iLO 4 subsystem includes an intelligent microprocessor, secure memory, and a dedicated network interface. This design makes iLO 4 independent of the host server and its operating system.

iLO 4 enables and manages the Active Health System (on page 87) and also features Agentless Management. All key internal subsystems are monitored by iLO 4. If enabled, SNMP alerts are sent directly by iLO 4 regardless of the host operating system or even if no host operating system is installed.

Embedded remote support software is available on ProLiant Gen8 and later servers with iLO 4, regardless of the operating system software and without installing OS agents on the server.

Using iLO 4, you can do the following:

• Access a high-performance and secure Integrated Remote Console to the server from anywhere in the world if you have a network connection to the server.
• Use the shared .NET Integrated Remote Console to collaborate with up to four server administrators.
• Remotely mount high-performance Virtual Media devices to the server.
• Securely and remotely control the power state of the managed server.
• Implement true Agentless Management with SNMP alerts from iLO, regardless of the state of the host server.
• Download the Active Health System log. Register for Insight Remote Support.
• Use iLO Federation to manage multiple servers from one system running the iLO web interface.
• Use Virtual Power and Virtual Media from the GUI, the CLI, or the iLO scripting toolkit for many tasks, including the automation of deployment and provisioning. Control iLO by using a remote management tool.

For more information about iLO features, see the iLO documentation on the Hewlett Packard Enterprise website (http://www.hpe.com/info/ilo/docs).

The iLO 4 hardware and firmware features and functionality, such as NAND size and embedded user partition, vary depending on the server model. For a complete list of supported features and functionality, see the iLO 4 QuickSpecs on the Hewlett Packard Enterprise website

(http://www.hpe.com/info/Quickspecs-iLO).

Active Health System

The HPE Active Health System provides the following features:

• Combined diagnostics tools/scanners • Always on, continuous monitoring for increased stability and shorter downtimes - Rich configuration history • Health and service alerts - Easy export and upload to Service and Support

The Active Health System monitors and records changes in the server hardware and system configuration. The Active Health System assists in diagnosing problems and delivering rapid resolution if server failures occur.

The Active Health System collects the following types of data:

• Server model
• Serial number
• Processor model and speed • Storage capacity and speed • Memory capacity and speed
• Firmware/BIOS

Active Health System does not collect information about Active Health System users' operations, finances, customers, employees, partners, or data center, such as IP addresses, host names, user names, and passwords. Active Health System does not parse or change operating system data from third-party error event log activities, such as content created or passed through by the operating system.

The data that is collected is managed according to the Hewlett Packard Enterprise Data Privacy policy. For more information see the Hewlett Packard Enterprise website (http://www.hpe.com/info/privacy).

The Active Health System, in conjunction with the system monitoring provided by Agentless Management or SNMP Pass-thru, provides continuous monitoring of hardware and configuration changes, system status, and service alerts for various server components.

The Agentless Management Service is available in the SPP, which can be downloaded from the Hewlett Packard Enterprise website (http://www.hpe.com/servers/spp/download). The Active Health System log can be downloaded manually from iLO 4 or HPE Intelligent Provisioning and sent to Hewlett Packard Enterprise.

For more information, see the following documents:

• iLO User Guide on the Hewlett Packard Enterprise website (http://www.hpe.com/info/enterprise/docs)
• Intelligent Provisioning User Guide on the Hewlett Packard Enterprise website (http://www.hpe.com/info/enterprise/docs)

HPE ProLiant Pre-boot Health Summary

If the server will not start up, you can use iLO to display diagnostic information on an external monitor. This feature is supported on servers that support external video and have a UID button or an SUV connector. When power is available to the server but the server is not powered on, iLO runs on auxiliary power and can take control of the server video adapter to display the HPE ProLiant Pre-boot Health Summary.

For additional information, see the following documents:

• iLO 4 User Guide — See the Hewlett Packard Enterprise website (http://www.hpe.com/info/ilo/docs).
• ProLiant Gen9 Troubleshooting Guide, Volume I: Troubleshooting — See "Troubleshooting Resources (on page 86)."

Integrated Management Log

The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each event with 1-minute granularity.

You can view recorded events in the IML in several ways, including the following:

• From within HPE SIM • From within UEFI System Utilities ("HPE UEFI System Utilities" on page 89) • From within the Embedded UEFI shell • From within operating system-specific IML viewers: oFor Windows: IML Viewer oFor Linux: IML Viewer Application • From within the iLO 4 web interface • From within Insight Diagnostics ("HPE Insight Diagnostics" on page 90)

HPE UEFI System Utilities

The HPE UEFI System Utilities is embedded in the system ROM. The UEFI System Utilities enable you to perform a wide range of configuration activities, including:

• Configuring system devices and installed options
• Enabling and disabling system features • Displaying system information
• Selecting the primary boot controller
• Configuring memory options
• Selecting a language
• Launching other pre-boot environments such as the Embedded UEFI Shell and Intelligent Provisioning

For more information on the UEFI System Utilities, see the UEFI System Utilities User Guide for HPE ProLiant Gen9 Servers on the Hewlett Packard Enterprise website (http://www.hpe.com/info/ProLiantUEFI/docs).

Scan the QR code located at the bottom of the screen to access mobile-ready online help for the UEFI System Utilities and UEFI Shell. For on-screen help, press F1.

Using UEFI System Utilities

To use the UEFI System Utilities, use the following keys.

Action Key
Access System Utilities	F9 during server POST
Navigate menus	Up and Down arrows
Select items	Enter
Save selections	F10
Access Help for a highlighted configuration option*	F1

*Scan the QR code on the screen to access online help for the UEFI System Utilities and UEFI Shell.

Default configuration settings are applied to the server at one of the following times:

• Upon the first system power-up • After defaults have been restored

Default configuration settings are sufficient for typical server operations; however, you can modify configuration settings as needed. The system prompts you for access to the System Utilities each time the system is powered up.

Embedded Diagnostics option

The system BIOS in all ProLiant Gen9 servers includes an Embedded Diagnostics option in the ROM. The Embedded Diagnostics option can run comprehensive diagnostics of the server hardware, including processors, memory, drives, and other server components.

For more information on the Embedded Diagnostics option, see the UEFI System Utilities User Guide for ProLiant Gen9 Servers on the Hewlett Packard Enterprise website (http://www.hpe.com/info/ProLiantUEFI/docs).

Re-entering the server serial number and product ID

After you replace the system board, you must re-enter the server serial number and the product ID.

1. During the server startup sequence, press the F9 key to access UEFI System Utilities.
2. Select the System Configuration > BIOS/Platform Configuration (RBSU) > Advanced Options > Advanced System ROM Options > Serial Number, and then press the Enter key.
3. Enter the serial number and press the Enter key. The following message appears: The serial number should only be modified by qualified service personnel. This value should always match the serial number located on the chassis.
4. Press the Enter key to clear the warning.
5. Enter the serial number and press the Enter key.
6. Select Product ID. The following warning appears: Warning: The Product ID should ONLY be modified by qualified service personnel. This value should always match the Product ID located on the chassis.
7. Enter the product ID and press the Enter key.
8. Press the F10 key to confirm exiting System Utilities. The server automatically reboots.

HPE Insight Diagnostics

The Insight Diagnostics is a proactive server management tool, available in both offline and online versions, that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify server installations, troubleshoot problems, and perform repair validation.

The Insight Diagnostics Offline Edition performs various in-depth system and component testing while the OS is not running. To run this utility, boot the server using Intelligent Provisioning.

The Insight Diagnostics Online Edition is a web-based application that captures system configuration and other related data needed for effective server management. Available in Microsoft Windows and Linux versions, the utility helps to ensure proper system operation.

For more information or to download the utility, see the Hewlett Packard Enterprise website (http://www.hpe.com/servers/diags). The Insight Diagnostics Online Edition is also available in the SPP.

HPE Insight Diagnostics survey functionality

HPE Insight Diagnostics (on page 90) provides survey functionality that gathers critical hardware and software information on ProLiant servers.

This functionality supports operating systems that are supported by the server. For operating systems supported by the server, see the Hewlett Packard Enterprise website (http://www.hpe.com/info/supportos).

If a significant change occurs between data-gathering intervals, the survey function marks the previous information and overwrites the survey data files to reflect the latest changes in the configuration.

Survey functionality is installed with every Intelligent Provisioning-assisted Insight Diagnostics installation, or it can be installed through the SPP.

HPE Insight Remote Support

Hewlett Packard Enterprise strongly recommends that you register your device for remote support to enable enhanced delivery of your Hewlett Packard Enterprise warranty, HP Care Pack Service, or Hewlett Packard Enterprise contractual support agreement. Insight Remote Support supplements your monitoring continuously to ensure maximum system availability by providing intelligent event diagnosis, and automatic, secure submission of hardware event notifications to Hewlett Packard Enterprise, which will initiate a fast and accurate resolution, based on your product's service level. Notifications can be sent to your authorized Hewlett Packard Enterprise Channel Partner for onsite service, if configured and available in your country.

For more information, see Insight Remote Support and Insight Online Setup Guide for ProLiant Servers and BladeSystem c-Class Enclosures on the Hewlett Packard Enterprise website (http://www.hpe.com/info/insightremotesupport/docs). Insight Remote Support is available as part of Warranty, HP Care Pack Service, or contractual support agreement.

USB support

Hewlett Packard Enterprise servers support both USB 2.0 ports and USB 3.0 ports. Both types of ports support installing all types of USB devices (USB 1.0, USB 2.0, and USB 3.0), but may run at lower speeds in specific situations:

• USB 3.0 capable devices operate at USB 2.0 speeds when installed in a USB 2.0 port. - When the server is configured for UEFI Boot Mode, Hewlett Packard Enterprise provides legacy USB support in the pre-boot environment prior to the operating system loading for USB 1.0, USB 2.0, and USB 3.0 speeds. - When the server is configured for Legacy BIOS Boot Mode, Hewlett Packard Enterprise provides legacy USB support in the pre-boot environment prior to the operating system loading for USB 1.0 and USB 2.0 speeds. While USB 3.0 ports can be used with all devices in Legacy BIOS Boot Mode, they are not available at USB 3.0 speeds in the pre-boot environment. Standard USB support (USB support from within the operating system) is provided by the OS through the appropriate USB device drivers. Support for USB 3.0 varies by operating system.

For maximum compatibility of USB 3.0 devices with all operating systems, Hewlett Packard Enterprise provides a configuration setting for USB 3.0 Mode. Auto is the default setting. This setting impacts USB 3.0 devices when connected to USB 3.0 ports in the following manner:

- Auto (default)—If configured in Auto Mode, USB 3.0 capable devices operate at USB 2.0 speeds in the pre-boot environment and during boot. When a USB 3.0 capable OS USB driver loads, USB 3.0 devices transition to USB 3.0 speeds. This mode provides compatibility with operating systems that do not support USB 3.0 while still allowing USB 3.0 devices to operate at USB 3.0 speeds with state-of-the-art operating systems.

• Enabled—If Enabled, USB 3.0 capable devices operate at USB 3.0 speeds at all times (including the pre-boot environment) when in UEFI Boot Mode. This mode should not be used with operating systems that do not support USB 3.0. If operating in Legacy Boot BIOS Mode, the USB 3.0 ports cannot function in the pre-boot environment and are not bootable.
• Disabled—If configured for Disabled, USB 3.0 capable devices function at USB 2.0 speeds at all times.

The pre-OS behavior of the USB ports is configurable in System Utilities, so that the user can change the default operation of the USB ports. For more information, see the UEFI System Utilities User Guide for ProLiant Gen9 Servers on the Hewlett Packard Enterprise website (http://www.hpe.com/info/ProLiantUEFI/docs).

External USB functionality

Hewlett Packard Enterprise provides external USB support to enable local connection of USB devices for server administration, configuration, and diagnostic procedures.

For additional security, external USB functionality can be disabled through USB options in UEFI System Utilities.

HPE Smart Storage Administrator

The HPE SSA is a configuration and management tool for Smart Array controllers. Starting with ProLiant Gen8 servers, HPE SSA replaces ACU with an enhanced GUI and additional configuration features.

The HPE SSA exists in three interface formats: the HPE SSA GUI, the HPE SSA CLI, and HPE SSA Scripting. Although all formats provide support for configuration tasks, some of the advanced tasks are available in only one format.

Some HPE SSA features include the following:

• Supports online array capacity expansion, logical drive extension, assignment of online spares, and RAID or stripe size migration
• Suggests the optimal configuration for an unconfigured system
• Provides diagnostic and SmartSSD Wear Gauge functionality on the Diagnostics tab
• For supported controllers, provides access to additional features.

For more information about HPE SSA, see the Hewlett Packard Enterprise website (http://www.hpe.com/info/hpessa).

Automatic Server Recovery

ASR is a feature that causes the system to restart when a catastrophic operating system error occurs, such as a blue screen, ABEND (does not apply to HPE ProLiant DL980 Servers), or panic. A system fail-safe timer, the ASR timer, starts when the System Management driver, also known as the Health Driver, is loaded. When the operating system is functioning properly, the system periodically resets the timer. However, when the operating system fails, the timer expires and restarts the server.

ASR increases server availability by restarting the server within a specified time after a system hang. At the same time, the SIM console notifies you by sending a message to a designated pager number that ASR has restarted the system. You can disable ASR from the System Management Homepage or through RBSU.

Component identification

Front panel components

• 4-bay LFF non-hot-plug drive model

Item Description
1	LFF non-hot-plug drives
2	USB 2.0 connector

• 8-bay LFF hot-plug drive model

Item D	escription
1	Box 1 LFF hot-plug drives
2	Box 2 LFF hot-plug drives
3	USB 3.0 connector

• 8-bay SFF hot-plug drive model

Item	Description
1	HPE Universal Media Bay (box 1, for the optical drive cage option)
2	8-bay SFF drive cage bay (box 2, for the second 8-bay SFF drive cage option)
3	Box 3 SFF hot-plug drives
4	Serial label pull tab
5	USB 2.0 connector (in servers using thumbscrew rack ears)
6	USB 3.0 connector (in servers using quick-release latch rack ears)

Serial label pull tab information

The vertically oriented serial label pull tab in the SFF chassis is double-sided. The following server labels are attached to this pull tab:

• Left side—Server serial number label and the customer asset tag label
• Right side—Default iLO account information label and the QR code label

Use your mobile device to scan the QR code label to display the server mobile product page (http://www.hpe.com/qref/dl180gen9). This page contains links to server setup information, spare part numbers, QuickSpecs, troubleshooting resources, and other useful product links.

In the LFF chassis, these server labels are attached on the front edge of the access panel instead.

Front panel LEDs and buttons

- Front panel LEDs and buttons in an LFF chassis with thumbscrew rack ears

- Front panel LEDs and buttons in an LFF chassis with quick-release latch rack ears

- Front panel LEDs and buttons in an SFF chassis with thumbscrew rack ears

- Front panel LEDs and buttons in an SFF chassis with quick-release latch rack ears

Item	Description	Status
1	UID button/LED*	Solid blue = ActivatedFlashing blue:1 Hz/cycle per sec = Remote management or firmware upgrade in progress4 Hz/cycle per sec = iLO manual reboot sequence initiated8 Hz/cycle per sec = iLO manual reboot sequence in progressOff = Deactivated
2	Health LED*	Solid green = NormalFlashing green (1 Hz/cycle per sec) = iLO is rebootingFlashing amber = System degraded**Flashing red (1 Hz/cycle per sec) = System critical**
3	NIC status LED*	Solid green = Link to networkFlashing green (1 Hz/cycle per sec) = Network activeOff = No network activity
4	Power On/Standby button and system power LED*	Solid green = System onFlashing green (1 Hz/cycle per sec) = Performing power on sequenceSolid amber = System in standbyOff = No power present†

* When all four LEDs described in this table flash simultaneously, a power fault has occurred. For more information, see "Front panel LED power fault codes (on page 96)." ** If the health LED indicates a degraded or critical state, review the system IML or use iLO to review the system health status. † Facility power is not present, power cord is not attached, no power supplies are installed, power supply failure has occurred, or the front I/O cable is disconnected.

Front panel LED power fault codes

The following table provides a list of power fault codes, and the subsystems that are affected. Not all power faults are used by all servers.

Subsystem F	ront panel LED behavior
System board	1 flash
Processor	2 flashes
Memory	3 flashes
Riser board PCIe slots	4 flashes
FlexibleLOM	5 flashes
Removable HPE Flexible Smart Array controller/Smart SAS HBA controller	6 flashes
System board PCIe slots	7 flashes
Power backplane or storage backplane	8 flashes
Power supply	9 flashes

For more information, see "Front panel LEDs and buttons (on page 94)."

Rear panel components

Item	Description
1	PCIe3 riser slots 1-3 (primary, associated with processor 1)
2	PCIe3 riser slots 4-6 (secondary, associated with processor 2)
3	Non-hot plug power supply
4	Hot-plug power supply bay 2
5	Hot-plug power supply 1
6	NIC connector 2
7	NIC 1/shared iLO connector
8	Video connector
9	USB 3.0 connectors
10	Dedicated iLO management connector (optional)

Rear panel LEDs

Item	Description	Status
1	UID LED	Solid blue = ActivatedFlashing blue:1 Hz/cycle per sec = Remote management or firmware upgrade in progress4 Hz/cycle per sec = iLO manual reboot sequence initiated8 Hz/cycle per sec = iLO manual reboot sequence in progressOff = Deactivated
2	NIC link LED	Green = Network linkOff = No network link
3	NIC activity LED	Solid green = Link to networkFlashing green = Network activeOff = No network activity
4	Power supply LED	Solid green = NormalOff = One or more of the following conditions exists:Power is unavailablePower supply failedPower supply is in standby modePower supply error

PCIe riser board slot definitions

The server ships with a primary PCI riser cage installed and a secondary PCI riser cage blank. A second processor is required to support installation in the secondary PCIe riser location.

- Two-slot PCI riser cage assembly: Install in either the primary or secondary PCIe riser board connector.

Item F	orm factor Slot description
1	Full-height, full-length	PCIe3 x16 (16, 8, 4, 1)
2	Full-height, half-length	PCIe3 x8 (8, 4, 1)

- Three-slot PCI riser cage assembly: Install in either the primary or secondary PCIe riser board connector.

Item	Form factor	Slot description
1	Full-height, full-length	PCIe3 x8 (8, 4, 1)
2	Full-height, half-length	PCIe3 x8 (8, 4, 1)
3	Full-height, half-length	PCIe3 x8 (8, 4, 1)

- FlexibleLOM riser cage assembly: Install in the secondary PCIe riser board connector.

Item F	orm factor Slot description
1	Full-height, full-length	PCIe3 x8 (8, 4, 1)
2	Full-height, half-length	PCIe3 x8 (8, 4, 1)
3	FlexibleLOM	PCIe3 x8

PCIe slot description

System board components

Item	Description
1	FlexibleLOM sideband signal connector
2	System battery
3	Primary PCIe riser board connectors
4	Dedicated iLO module connector
5	microSD card slot
6	SATA connector 5 (for M.2 SSD 2)
7	SATA connector 4 (for M.2 SSD 1 or optical drive)
8	Internal USB 3.0 connector (for USB flash devices)
9	Front USB 3.0 connector (for the USB 3.0 connector on the right quick-release latch rack ear)
10	Mini-SAS connector 1
11	Mini-SAS connector 2
12	Front I/O connector
13	Processor 1
14	Processor 1 DIMM slots
15	Fan connector 5
16	Fan connector 4
17	Reserved
18	Processor 2 DIMM slots
19	Fan connector 3
20	Fan connector 2
21	Fan connector 1
22	Reserved
23	12-bay LFF drive identification signal connector
Item Description
24	GPU power connector
25	24-pin power supply connector
26	HPE Smart Storage Battery connector
27	20-pin drive power connector
28	16-pin power supply sideband signal connector
29	10-pin RPS connector
30	Processor 2
31	NMI header
32	TPM connector
33	Secondary PCIe riser board connectors
34	System maintenance switch

DIMM slot locations

DIMM slots are numbered sequentially (1 through 8) for each processor. The supported AMP modes use the letter assignments for population guidelines.

The arrow points to the front of the server.

System maintenance switch

Position Default Function
S1	Off	Off = iLO 4 security is enabled.On = iLO 4 security is disabled.
S2	Off	Off = System configuration can be changed.On = System configuration is locked.
S3	Off	Reserved
S4	Off	Reserved
S5	Off	Off = Power-on password is enabled.On = Power-on password is disabled.
S6	Off	Off = No functionOn = ROM reads system configuration as invalid.
Position	Default	Function
S7	Off	Off = Set default boot mode to UEFI. On = Set default boot mode to legacy.
S8	—	Reserved
S9	—	Reserved
S10	—	Reserved
S11	—	Reserved
S12	—	Reserved

To access the redundant ROM, set S1, S5, and S6 to on.

When system maintenance switch S6 is set to the On position, the system is prepared to erase all system configuration settings from both CMOS and NVRAM.

IMPORTANT: Before using the S7 switch to change to Legacy BIOS Boot Mode, be sure the HPE Dynamic Smart Array B140i Controller is disabled. Do not use the B140i controller when the server is in Legacy BIOS Boot Mode.

NMI functionality

An NMI crash dump creates a crash dump log before resetting a system which is not responding.

Crash dump log analysis is an essential part of diagnosing reliability problems, such as failures of operating systems, device drivers, and applications. Many crashes freeze a system, and the only available action for administrators is to restart the system. Resetting the system erases any information which could support problem analysis, but the NMI feature preserves that information by performing a memory dump before a system reset.

To force the system to invoke the NMI handler and generate a crash dump log, do one of the following:

• Use the iLO Virtual NMI feature. - Short the NMI header.

For more information, see the Hewlett Packard Enterprise website (http://www.hpe.com/support/NMI).

Drive numbering

The following images show the drive numbering for each of the supported drive configurations. For drive box numbering information, see "Front panel components (on page 93)."

• 4-bay LFF non-hot-plug drive model

• 8-bay LFF hot-plug drive model

• 12-bay LFF hot-plug drive model

• 8-bay SFF hot-plug drive model

• 16-bay SFF hot-plug drive model

HPE SmartDrive LED definitions

HPE SmartDrives are the latest Hewlett Packard Enterprise drive technology, and they are supported beginning with ProLiant Gen8 servers and server blades. The SmartDrive is not supported on earlier generation servers and server blades. Identify a SmartDrive by its carrier, shown in the following illustration.

When a drive is configured as a part of an array and connected to a powered-up controller, the drive LEDs indicate the condition of the drive.

Item	LED	Status	Definition
1	Locate	Solid blue	The drive is being identified by a host application.
		Flashing blue	The drive carrier firmware is being updated or requires an update.
2	Activity ring	Rotating green	Drive activity
		Off	No drive activity
3	Do not remove	Solid white	Do not remove the drive. Removing the drive causes one or more of the logical drives to fail.
		Off	Removing the drive does not cause a logical drive to fail.
4	Drive status	Solid greenFlashing green	The drive is a member of one or more logical drives.The drive is rebuilding or performing a RAID migration, strip size migration, capacity expansion, or logical drive extension, or is erasing.
		Flashing amber/green	The drive is a member of one or more logical drives and predicts the drive will fail.
		Flashing amber	The drive is not configured and predicts the drive will fail.
		Solid amber	The drive has failed.
		Off	The drive is not configured by a RAID controller.

The blue Locate LED is behind the release lever and is visible when illuminated.

IMPORTANT: The Dynamic Smart Array B140i Controller is only available in UEFI Boot Mode. It cannot be enabled in Legacy BIOS Boot Mode. If the B140i controller is disabled, drives connected to the system board Mini-SAS connectors operate in AHCI or Legacy mode. Under this condition:

• The drives cannot be a part of a hardware RAID or a logical drive.
• The Locate, Drive status, and Do not remove LEDs of the affected drives are disabled. Use BIOS/Platform Configuration (RBSU) in the UEFI System Utilities ("HPE UEFI System Utilities" on page 89) to enable or disable the B140i controller (System Configuration → BIOS/Platform Configuration (RBSU) → System Options → SATA Controller Options → Embedded SATA Configuration).

Fan locations

Cabling

Cabling overview

This section provides guidelines that help you make informed decisions about cabling the server and hardware options to optimize performance.

For information on cabling peripheral components, refer to the white paper on high-density deployment at the Hewlett Packard Enterprise website (http://www.hpe.com/products/servers/platforms).

CAUTION: When routing cables, always be sure that the cables are not in a position where they can be pinched or crimped.

Storage cabling

The storage cabling illustrations in this section show both the drive data and power cables.

The LFF and SFF drive models each has their own preinstalled 20-pin multi-output drive power cable.

The LFF drive power cable has the following connections:

• Common end connector—System board • BP1 cable connector—4-bay LFF backplane • BP2 cable connector—8-bay LFF backplane

The SFF drive power cable has the following connections:

• Common end connector—System board • BP3 cable connector—8-bay SFF backplane in box 3 - BP2 cable connector—8-bay SFF backplane in box 2 (16-bay SFF drive configuration) - ODD cable connector—Power connector in the SATA optical drive cable (if an optical drive is installed)

4-bay LFF non-hot-plug SATA drive cabling

Item Description
1	Drive power cable
2	Mini-SAS cable

8-bay LFF non-hot-plug SATA drive cabling

Item Description
1	Drive power cable
2	Mini-SAS cable 2
3	Mini-SAS cable 1

8-bay LFF hot-plug SATA drive cabling

Item Description
1	Drive power cable
2	Mini-SAS X-cable

8-bay LFF hot-plug SAS/SATA drive cabling

• Drives connected to an HBA option

Item D	escription
1	Drive power cable
2	Mini-SAS X-cable

- Drives connected to an HPE Smart Array Controller option

Item	Description
1	Drive power cable
2	Mini SAS Y-cable

8-bay SFF hot-plug SATA drive cabling

Item	Description
1	Drive power cable
2	Mini-SAS cable 2
3	Mini-SAS cable 1

8-bay SFF hot-plug SAS/SATA drive cabling

• Drives connected to an HBA option

Item Description
1	Drive power cable
2	Mini-SAS cable 2
3	Mini-SAS cable 1

- Drives connected to an HPE Smart Array Controller option

Item	Description
1	Drive power cable
2	Mini-SAS Y-cable

16-bay SFF hot-plug SAS/SATA drive cabling

- Drives connected to two HPE Smart Array P440 Controllers

Item Description
1	Drive power cable
2	Mini-SAS Y-cable to the box 3 drives
3	Mini-SAS Y-cable to the box 2 drives

- Drives connected to an HPE Smart Array P840 Controller

Item	Description
1	Drive power cables
2	Mini-SAS Y-cable to the box 3 drives
3	Mini-SAS Y-cable to the box 2 drives

M.2 SSD cabling

• M.2 SSD cabling from the primary PCIe riser location

Item Description
1	M.2 SSD 2 SATA cable
2	M.2 SSD 1 SATA cable

• M.2 SSD cabling from the secondary PCIe riser location

Item	Description
1	M.2 SSD 2 SATA cable
2	M.2 SSD 1 SATA cable

FBWC module backup power cabling

The FBWC solution is a separately purchased option. This server only supports FBWC module installation when a Smart Array P-Series controller is installed.

Depending on the controller option installed, the actual storage controller connectors might look different from what is shown in this section.

HPE Smart Storage Battery cabling

Optical drive cabling

Item	Description
1	Optical drive power cable
2	Optical drive SATA cable

Fan cabling

Item	Description
1	Fan 1 cable
2	Fan 2 cable
3	Fan 3 cable
4	Fan 4 cable
5	Fan 5 cable

GPU power drive cabling

FlexibleLOM sideband signal cabling

Power supply cabling

HPE 550-W Power Supply cabling (non-hot-plug)

Item	Description
1	24-pin power supply cable
2	16-pin power supply sideband signal cable

HPE Redundant Power Supply cabling (hot-plug)

Item	Description
1	24-pin power supply cable
2	16-pin power supply sideband signal cable
3	10-pin RPS cable

Front panel cabling

- Front panel cabling in an LFF chassis with thumbscrew rack ears

Item	Description
1	Ambient temperature sensor cable
2	USB 2.0 connector cable
3	Front I/O cable

- Front panel cabling in an LFF chassis with quick-release latch rack ears

Item	Description
1	Ambient temperature sensor cable
2	Front I/O cable
3	USB 3.0 connector cable

- Front panel cabling in an SFF chassis with thumbscrew rack ears

Item	Description
1	Ambient temperature sensor cable
2	Front I/O cable

- Front panel cabling in an SFF chassis with quick-release latch rack ears

Item D	escription
1	Ambient temperature sensor cable
2	Front I/O cable
3	USB 3.0 connector cable

Specifications

Environmental specifications

Specification	Value
Temperature range*	—
Operating	10°C to 35°C (50°F to 95°F)
Nonoperating	-30°C to 60°C (-22°F to 140°F)
Relative humidity (noncondensing)	—
Operating	Minimum to be the higher (more moisture) of -12°C (10.4°F) dew point or 8% relative humidityMaximum to be 24°C (75.2°F) dew point or 90% relative humidity
Nonoperating	5% to 95%38.7°C (101.7°F), maximum wet bulb temperature

* All temperature ratings shown are for sea level. An altitude derating of 1.0°C per 304.8 m (1.8°F per 1000 ft) to 3048 m (10,000 ft) is applicable. No direct sunlight allowed. Maximum rate of change is 20°C per hour (36°F per hour). The upper limit and rate of change might be limited by the type and number of options installed.

For certain approved hardware configurations, the supported system inlet temperature range is extended:

• 5°C to 10°C (41°F to 50°F) and 35°C to 40°C (95°F to 104°F) at sea level with an altitude derating of 1.0°C per every 175 m (1.8°F per every 574 ft) above 900 m (2953 ft) to a maximum of 3048 m (10,000 ft).
• 40°C to 45°C (104°F to 113°F) at sea level with an altitude derating of 1.0°C per every 125 m (1.8°F per every 410 ft) above 900 m (2953 ft) to a maximum of 3048 m (10,000 ft).

The approved hardware configurations for this system are listed on the Hewlett Packard Enterprise website (http://www.hpe.com/servers/ASHRAE).

Mechanical specifications

Dimension Value
Height*	8.75 cm (3.44 in)
Depth*	60.70 cm (23.90 in)
Width*	44.54 cm (17.50 in)
Weight (full load, approximate values)	—
4-bay LFF drive model	16.59 kg (36.58 lb)
8-bay LFF drive model	19.19 kg (42.31 lb)
12-bay LFF drive model	21.59 kg (47.60 lb)
8-bay SFF drive model with optical drive	16.09 kg (35.48 lb)
8-bay SFF drive model without optical drive	15.95 kg (35.17 lb)
16-bay SFF drive model with optical drive	17.95 kg (39.60 lb)
16-bay SFF drive model without optical drive	17.87 kg (39.40 lb)

* These dimensions apply to all server models.

Power supply specifications

Depending on the installed options and/or the regional location where the server was purchased, the server is configured with one of the following power supplies:

• 550-W Power Supply (PN 730941-B21) • 800-W/900-W Gold AC Power Input Module (PN 744689-B21) This is supported when the two-bay RPS Backplane option (PN 745813-B21) is installed.

These are Entry Level Power Supply products for ProLiant servers. For more information about the power supply features, specifications, and compatibility, see the Hewlett Packard Enterprise website (http://www.hpe.com/info/proliant/powersupply).

CAUTION: Check the system and power supply input ratings before powering up the server.

Hot-plug power supply calculations

For hot-plug power supply specifications and calculators to determine electrical and heat loading for the server, see the Hewlett Packard Enterprise Power Advisor website (http://www.hpe.com/info/rackandpower).

Acronyms and abbreviations

ABEND

abnormal end

AMP

Advanced Memory Protection

API

application program interface

ASHRAE

American Society of Heating, Refrigerating and Air-Conditioning Engineers

ASR

Automatic Server Recovery

BP

backplane

CSR

Customer Self Repair

FAT

file allocation table

FBWC

flash-backed write cache

GPU

graphics processing unit

HBA

host bus adapter

HPE SIM

HPE Systems Insight Manager

HPE SSA

HPE Smart Storage Administrator

iLO

Integrated Lights-Out

IML

Integrated Management Log

LFF

large form factor

LOM

Lights-Out Management

NAND

Not AND

NMI

nonmaskable interrupt

NVRAM

nonvolatile memory

ODD

Optical Disk Drive

PCIe

Peripheral Component Interconnect Express

POST

Power-On Self Test

QR code

quick response code

RBSU

ROM-Based Setup Utility

REST

representational state transfer

RPS

redundant power supply

SAS

serial attached SCSI

SATA

serial ATA

SD

Secure Digital

SFF

small form factor

SIM

Systems Insight Manager

SPP

Service Pack for ProLiant

SSD

solid-state drive

SUV

serial, USB, video

TPM

Trusted Platform Module

UEFI

Unified Extensible Firmware Interface

UID

unit identification

USB

universal serial bus

Documentation feedback

Hewlett Packard Enterprise is committed to providing documentation that meets your needs. To help us improve the documentation, send any errors, suggestions, or comments to Documentation Feedback (mailto:[e-mail]). When submitting your feedback, include the document title, part number, edition, and publication date located on the front cover of the document. For online help content, include the product name, product version, help edition, and publication date located on the legal notices page.

Index

A

access panel, removing 37

Active Health System 87

ACU (Array Configuration Utility) 92

air baffle, removing 32

air scoop 44

ambient temperature 118

Automatic Server Recovery (ASR) 92

B

battery pack, removing 43

bezel, removing 27

boot options 89, 90

C

cable management arm 30

cabling 105, 115

cabling, battery pack 112

cabling, drive 105

cabling, FlexibleLOM 114

cabling, GPU 114

cache module battery pack 43

Care Pack 91

clearing NVRAM 101

CMOS 101

components, front panel 93

components, rear panel 97

crash dump analysis 102

customer self repair (CSR) 6

D

dedicated iLO management module, removing 65

diagnosing problems 86

diagnostic tools 87, 89, 90, 92

dimensions and weight 118

DIMM slot locations 101

DIMMs, removing 52

documentation feedback 123

drive backplane 40, 42

drive blank 35, 36

drive cabling 105

drive carrier 34

drive LEDs 103

drives, determining status of 102, 103

E

electrostatic discharge 24

embedded UEFI diagnostics 90

environmental specifications 118

error messages 86

expansion board 59

extending server from rack 27

external USB functionality 92

F

fan blank 50

fan cage 33

fan location 104

fan population guidelines 49

fans, removing 51

FBWC cabling 111

FBWC module 44

FlexibleLOM riser board 61

FlexibleLOM riser cage 61

FlexibleLOM sideband signal cabling 114

front I/O assembly 67

front panel buttons 94

front panel components 93

front panel LED power fault codes 96

front panel LEDs 94

G

GPU power cabling 114

grounding methods 24

grounding requirements 24

H

health driver 92

health LED 94

heatsink 53

Hewlett Packard Enterprise Technical Support 6

hot-plug drive backplane 40, 42

hot-plug drive blank 35

hot-plug drive, removing 36

hot-plug power supply 82, 83, 119

hot-plug power supply calculations 119

hot-swap fan 51

HPE iLO 87

HPE Insight Diagnostics 90, 91

HPE Insight Diagnostics survey functionality 90, 91

HPE Insight Online 91

HPE Insight Remote Support software 91

HPE ProLiant Pre-boot Health Summary 88

HPE Smart Storage Battery 43

HPE Smart Storage Battery cabling 112

HPE SmartDrive LED definitions 103

HPE SSA (HPE Smart Storage Administrator) 92

HPE Systems Insight Manager (SIM) 90

HP Trusted Platform Module option 85

HPE Universal Media bay 93

humidity 118

illustrated parts catalog 16

Insight Diagnostics 90, 91

Integrated Lights-Out (iLO) 87

Intelligent Provisioning 89, 90

internal USB connector 91

L

LED, health 94

LED, system power 94

LEDs, drive 103

LEDs, front panel 94

LEDs, NIC 94

LEDs, power fault 94, 96

LEDs, rear panel 97

LEDs, unit identification (UID) 94

legacy USB support 91

M

M.2 SATA SSD enablement board 46

management tools 87

mechanical components 16

mechanical specifications 118

memory dump 102

N

NIC activity LED 94, 97

NIC connectors 97

NIC link LED 94, 97

NMI functionality 102

non-hot-plug drive cable assembly 38

non-hot-plug drive carrier 34

non-hot-plug drives 34

non-hot-plug power supply 81, 119

0

operating system crash 92, 102

operating systems supported 91

optical drive 48

P

PCI riser board 60

PCI riser cage, removing 31

POST error messages 86

power calculator 119

power fault 96

Power On/Standby button 94

power supply 81, 119

power supply cabling 115

power supply specifications 119

power supply, hot-plug 82, 83, 119

power supply, non-hot-plug 81, 119

powering down 27

power-on password 101

preparation procedures 26

problem diagnosis 86, 87

processor 55

Product ID 90

pull tab cage 71

Q

QR code label 89

quick-release latch rack ears 69

QuickSpecs 87

R

rack ears 27, 69

rack warnings 25

RAID configuration 92

rear panel components 97

rear panel LEDs 97

rear panel, accessing 30

redundant power supply 83, 119

redundant power supply cabling 115

re-entering the server serial number 90

remote support and analysis tools 91

removal and replacement procedures 24

removing server from rack 30

removing the security bezel 27

required tools 24

requirements, environmental 118

ROM legacy USB support 91

ROM-Based Setup Utility (RBSU) 89

s

safety considerations 24

security bezel, removing 27

serial label pull tab 94

serial number 90

server specifications 118

server warnings and cautions 25

SmartStart, overview 87

solid state device 46

specifications, environmental 118

specifications, mechanical 118

specifications, power supply 119

specifications, server 118

SPP 90

static electricity 24

symbols on equipment 24

system board 72

system board components 100

system components 19

system configuration settings 101

system maintenance switch 101

T

technical support 6

temperature requirements 118

three-slot PCI riser cage 31

troubleshooting resources 86, 87, 93, 105, 118

Trusted Platform Module (TPM) 85

two-slot PCI riser cage 31

U

UEFI System Utilities 89

UID (unit identification) 94

UID button 94

UID LED 94

USB connector 93, 97

USB support 91

W

warnings 25

warranty information 6

weight 118