CD-MSCGLQ75X120 - Unspecified Microchip - Free user manual and instructions

USER MANUAL CD-MSCGLQ75X120 Microchip

Microchip's Integrated Actuation Solution is a highly integrated, scalable, reliable, cost-effective, compact, and easy-to-use solution targeting electric motor drives and solenoids on actuator systems in aviation applications and designed in accordance with aviation standards. It is designed to be driven with external PWM signals.

Safety

Before touching the device, ensure that you are free of electrostatic charge.

Before commencing the installation:

• Disconnect all external power supply.
• Ensure that external power supply cannot be accidentally restarted.
• Deviations of the input voltage from the rated value must not exceed the tolerance limits given in the specifications, otherwise this may cause malfunction and dangerous operation.
• Never touch live parts or cable connections.

Warning

THE DEVICE SHOULD BE INSTALLED BY QUALIFIED PERSONNEL ONLY.

DO NOT INSTALL THE UNIT IF THE UNIT IS VISIBLY DAMAGED.

CARRY OUT WIRING WORK ONLY IF THE UNIT AND CABLES ARE DE-ENERGIZED.

CARRY OUT WIRING WORK ONLY AFTER THE UNIT HAS BEEN CORRECTLY MOUNTED AND SECURED.

DO NOT PERFORM ANY MODIFICATIONS WHEN THE UNIT IS CONNECTED TO A POWER SUPPLY

TERMINALS J1 TO J13 ARE LIVE WHEN THEY ARE CONNECTED TO POWER, EVEN IF THE LOAD IS NOT OPREATING. CONTACT WITH THIS VOLTAGE IS EXTREMELY DANGEROUS AND MAY CAUSE DEATH OR SEVERE INJURY.

DURING OPERATION THE DEVICE CAN EMIT ELECTROMAGNETIC INTERFERENCE (EMI).

FAILURE TO FOLLOW THESE PRECAUTIONS MAY CAUSE DEATH OR SEVERE INJURY.

Avoiding Electrostatic Discharge (ESD)

Any handling of electronic devices must be subject to specific procedures for protecting electrostatic-sensitive devices. This unit must be handled accordingly.

In order to ensure a ESD safe environment in which the work on electronics components or subassemblies such as printed circuit boards are carried out, an ESD Protected Area (ESD PA or EPA) must be set up and correctly used every time the product is handled or processed. An ESD PA or EPA or is designed to minimize the generation and retention of ESD which prevents failures when handling and processing the device.

Overall ESD protection is required starting from incoming inspection up to final assembly including all intermediate stations in order to avoid possible damage to the units.

The product must not be handled or touched without ESD protection. Neglect of this condition may lead to product damage or reduced product reliability. Note that the packaging materials used provide reliable ESD protection.

This user manual gives the main recommendations to appropriately mount Microchip Integrated Actuation Solution onto the mounting location. Follow the mounting instructions to limit both thermal and mechanical stresses. Hazard-related notes are also included.

Figure 1. Integrated Actuation Solution

3D CAD model of a green printed circuit board with various electronic components and mounting hardware (no text or symbols visible)

Table of Contents

Introduction....1

1. Handling and Storage....4
2. Integrated Actuation Solution Mounting Instruction....5
3. Wire Connection from Connectors....8
4. Recommendations for DC-Link Capacitor Connections....9

4.1. DC-Link PCB Assembly....9

1. Flammability.... 11
2. Disposal Consideration....12
3. Revision History....13

Microchip Information....14

The Microchip Website....14
Product Change Notification Service....14
Customer Support....14
Microchip Devices Code Protection Feature....14
Legal Notice....14
Trademarks....15
Quality Management System....16
Worldwide Sales and Service....17

1. Handling and Storage

The unit is recommended to be stored in its original packaging. The unit should be stored in a cool and dry place, away from direct sunlight.

The weight of Microchip Integrated Actuation Solution is approximately 380 g. The total weight including the packaging is about 405 g.

The correct handling of units is based on two fundamental principles:

1. No excessive mechanical force must be applied to Printed Circuit Board (PCB) components.
2. No excessive mechanical force causing bending must be applied to PCBs.

It is recommended that no large steady-state or temporary mechanical force be applied to the PCB components or terminals. Applying excessive mechanical force to the PCB components could lead to potential pre-damage. This increases the probability of cracks at the solder points of the assembled components.

Adequate handling is to hold the edges of the driver board gently and stably shown in Figure 1-1.

Figure 1-1. Adequate Handling Positions

3D CAD model of a green circuit board with various electronic components and connectors (no visible text or symbols)

2. Integrated Actuation Solution Mounting Instruction

Proper mounting of the module base plate onto the mounting location is essential to guarantee good thermal conductivity. The mounting location and the power module contact surface must be flat (recommended flatness should be less than 50 m for 100 mm continuous, recommended roughness Rz 10) and clean (no dirt, corrosion, or damage) to avoid mechanical stress when power module is mounted, and to avoid an increase in thermal resistance. The four standoffs provided by Microchip are required to withstand variant dynamic environments and provide cooling paths.

It is recommended to use the mechanical mounting hardware provided by Microchip, to ensure proper fixation of the PCB and power module.

Step 1: Install the four standoffs onto a heat sink using a proper thread lock compound such as LOCTITE 222.

Step 2: Thermal interface application: A thin layer of thermal interface grease must be applied between the power module and the mounting location. It is recommended to use a screen printing technique to ensure a uniform deposition of the minimum thickness of 100 m on the mounting location. The thermal interface between the module and the mounting location can also be made with other types of conductive thermal interface material, such as gap filler material (screen-printed or adhesive layer).

Figure 2-1. Thermal Grease on the Mounting Location Before Assembly

Blank white rectangular object mounted on a dark metal frame with four corner holes (no text or symbols visible)

Step 3: Mounting the power module onto the mounting location: Place the power module above mounting location holes, aligning PCB holes with 4 standoffs and applying a small pressure to it. Insert the M6 screw with flat washers in each mounting hole with thread lock compound and mounting hole. The screw length must be at least 16 mm. First, lightly tighten the four mounting screws. Alternatively tighten the screws until their final torque value is reached (see the product datasheet for the maximum torque allowed). It is recommended to use a screwdriver with controlled torque for this operation. These 4x M6 screws as well as washers are not provided as part of the deliverables.

The quantity of thermal grease is correct when a small amount of grease appears around the power module after it has been bolted down onto the mounting location with the appropriate mounting torque. In any case, the module bottom surface must be wet with thermal grease. Refer to Figure 2-2 and Figure 2-3.

While doing this step, ensure that no foreign objects (like screws, washers, tools, and so on) fall on the PCB and its components.

Figure 2-2. Thermal Grease on the Mounting Location After Removing the Module

Microscopic view of a biological tissue sample with visible cellular structures and two dark circular markers (no text or symbols)

Figure 2-3. Thermal Grease on the Module After Disassembling

Close-up of a transparent rectangular plate with textured surface and small circular holes (no visible text or symbols)

Step 4: Insert one M3 washer and M3 screw into the four locations (see Figure 2-4). Alternatively tighten the screws until their final torque value is reached (see the product datasheet for the maximum torque allowed).

While doing this step, ensure that no foreign objects (like screws, washers, tools and so on) fall on the PCB and its components.

Figure 2-4. Mounting Screws

M3 Screw M3 Washer M6 Screw M6 Washer M3 Standoff

3. Wire Connection from Connectors

It is important to properly secure the wires connected to all power terminals listed in Figure 3-1 and Table 3-1 to avoid high pull force generated in dynamic environments. It is recommended to arrange the wires properly to keep the minimum stress on the wires.

It is mandatory to screw the mating male signal connector to the available screw jacks on the female signal connector J11 on the PCB.

It is recommended to use shielded cable/wires for J11 connections for better signal integrity.

Figure 3-1. Power Terminal and Signal Connector Locations

Table 3-1. Power Terminal and Signal Connector Information

Connector Reference Maker Type No.
J1 HV_IN+ BROXING SN09R4M-H8
J2 BUS+ BROXING SN09R4M-H8
J3 SSRES+ KEYSTONE ELECTRONICS 9-7837-M3
J4 SOL+ KEYSTONE ELECTRONICS 9-7837-M3
J5 REGEN BROXING SN09R4M-H8
J6 HV_IN- BROXING SN09R4M-H8
J7 BUS- BROXING SN09R4M-H8
J8 PHU	BROXING SN09R4M-H8
J9 PHV	BROXING SN09R4M-H8
J10	PHW BROXING SN09R4M-H8
J11	LVCONNECTOR	NICOMATIC	221Y46F22HW
J12	SOL-	KEYSTONE ELECTRONICS 9-7837-M3
J13	SSRES- KEYSTONE ELECTRONICS 9-7837-M3

4. Recommendations for DC-Link Capacitor Connections

Connect DC-link capacitors with low inductive connections to terminals J2 and J7 on the unit, to have clean switching of power modules and to avoid overheating of MLCC DC-link capacitors present on the PCB board.

Connect the DC-link capacitors through low inductive busbar or PCB assembly. Alternatively, DC-link capacitors can also be connected through cables if a low inductive path can be ensured.

Limit the stray inductance of low inductive connections to <50 nH.

4.1 DC-Link PCB Assembly

If a DC-link PCB is used for DC-link capacitor connections proper mechanical assembly and fixation is essential. The spacers' placement must be evaluated on a case-by-case basis.

1. Terminals J2 and J7 should be used for electrical connections of DC-link capacitors.
2. Terminal J5 can also be used for additional mechanical support. In that case, the functionality of terminal J5 should be looped through the DC-link capacitor PCB.
3. If the four mounting holes used to assemble the driver board and the power module are required, the corresponding four M2.5 screws and washers can be unscrewed, and the unthreaded spacers and new and longer M2.5 screws can be used to provide additional support. The material of the spacers is supposed to be stainless steel, and the outer diameter should be less than 5.8 mm to maintain the electric insulation. The thread lock compound should be applied when installing new screws.

Figure 4-1. DC-Link PCB Assembly

M2.5 Screw M2.5 Washer

5. Flammability

Incorrect operation or improper storage may evolve fumes in a fire. Microchip Integrated Actuation Solution meets flammability UL94 V-0 and is RoHS compliant.

Note: The flammability of silicone gel filled in the power module is UL94 HB. There are no suitable alternatives that could comply with UL94 V-0. An exemption for the gel may be required for UL94 V-0 certification.

6. Disposal Consideration

The primary and secondary packaging should be disposed of in accordance with local regulations. When a decision is made to discard this product, disposal of electronic waste must be in accordance with local regulations.

7. Revision History

The revision history describes the changes that were implemented in the document. The changes are listed by revision, starting with the most current publication.

Revision Date Description
A 02/2024 Initial Revision

Microchip Information

The Microchip Website

Microchip provides online support via our website at www.microchip.com/. This website is used to make files and information easily available to customers. Some of the content available includes:

• Product Support – Data sheets and errata, application notes and sample programs, design resources, user's guides and hardware support documents, latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip design partner program member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives

Product Change Notification Service

Microchip's product change notification service helps keep customers current on Microchip products. Subscribers will receive email notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest.

To register, go to www.microchip.com/pcn and follow the registration instructions.

Customer Support

Users of Microchip products can receive assistance through several channels:

• Distributor or Representative
- Local Sales Office
- Embedded Solutions Engineer (ESE)
- Technical Support

Customers should contact their distributor, representative or ESE for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in this document.

Technical support is available through the website at: www.microchip.com/support

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip products:

• Microchip products meet the specifications contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and under normal conditions.
• Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not mean that we are guaranteeing the product is "unbreakable". Code protection is constantly evolving. Microchip is committed to continuously improving the code protection features of our products.

Legal Notice

This publication and the information herein may be used only with Microchip products, including to design, test, and integrate Microchip products with your application. Use of this information in any other manner violates these terms. Information regarding device applications is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure

that your application meets with your specifications. Contact your local Microchip sales office for additional support or, obtain additional support at www.microchip.com/en-us/support/design-help/client-support-services.

THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS". MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF NON-INFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A PARTICULAR PURPOSE, OR WARRANTIES RELATED TO ITS CONDITION, QUALITY, OR PERFORMANCE.

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Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated.

Trademarks

The Microchip name and logo, the Microchip logo, Adaptec, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, CryptoMemory, CryptoRF, dsPIC, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

AgileSwitch, ClockWorks, The Embedded Control Solutions Company, EtherSynch, Flashtec, HyperSpeed Control, HyperLight Load, Libero, motorBench, mTouch, Powermite 3, Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire, SmartFusion, SyncWorld, TimeCesium, TimeHub, TimePictra, TimeProvider, and ZL are registered trademarks of Microchip Technology Incorporated in the U.S.A.

Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky, BodyCom, Clockstudio, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, Espresso T1S, EtherGREEN, EyeOpen, GridTime, IdealBridge, IGaT, In-Circuit Serial Programming, ICSP, INICnet, Intelligent Paralleling, IntelliMOS, Inter-Chip Connectivity, JitterBlocker, Knob-on-Display, MarginLink, maxCrypto, maxView, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mSiC, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, Power MOS IV, Power MOS 7, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP, SimpliPHY, SmartBuffer, SmartHLS, SMART-I.S., storClad, SQL, SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total Endurance, Trusted Time, TSHARC, Turing, USBCheck, VariSense, VectorBlox, VeriPHY, ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.

The Adaptec logo, Frequency on Demand, Silicon Storage Technology, and Symmcom are registered trademarks of Microchip Technology Inc. in other countries.

GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries.

All other trademarks mentioned herein are property of their respective companies.

© 2024, Microchip Technology Incorporated and its subsidiaries. All Rights Reserved.

ISBN: 978-1-6683-3441-6

Quality Management System

For information regarding Microchip's Quality Management Systems, please visit www.microchip.com/quality.

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