SuperServer SYS-730A-I - Server Supermicro - Free user manual and instructions

USER MANUAL SuperServer SYS-730A-I Supermicro

Interior view of a Supermic device with hexagonal lattice panel and control panel (no visible text or symbols)

USER'S MANUAL

Revision 1.0

The information in this User's Manual has been carefully reviewed and is believed to be accurate. The vendor assumes no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update or to keep current the information in this manual, or to notify any person or organization of the updates. Please Note: For the most up-to-date version of this manual, please see our website at www.supermicro.com.

Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual at any time and without notice. This product, including software and documentation, is the property of Supermicro and/or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except as expressly permitted by the terms of said license.

IN NO EVENT WILL Super Micro Computer, Inc. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL, SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER MICRO COMPUTER, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING, INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.

Any disputes arising between manufacturer and customer shall be governed by the laws of Santa Clara County in the State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution of any such disputes. Supermicro's total liability for all claims will not exceed the price paid for the hardware product.

FCC Statement: This equipment has been tested and found to comply with the limits for a Class A or Class B digital device pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in industrial environment for Class A device or in residential environment for Class B device. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the manufacturer's instruction manual, may cause harmful interference with radio communications. Operation of this equipment in a residential area is likely to cause harmful interference, in which case you will be required to correct the interference at your own expense.

California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only to products containing CR (Manganese Dioxide) Lithium coin cells. "Perchlorate Material-special handling may apply. See www.dtsc.ca.gov/hazardouswaste/perchlorate".

WARNING: This product can expose you to chemicals including lead, known to the State of California to cause cancer and birth defects or other reproductive harm. For more information, go to www.P65Warnings.ca.gov.

The products sold by Supermicro are not intended for and will not be used in life support systems, medical equipment, nuclear facilities or systems, aircraft, aircraft devices, aircraft/emergency communication devices or other critical systems whose failure to perform be reasonably expected to result in significant injury or loss of life or catastrophic property damage. Accordingly, Supermicro disclaims any and all liability, and should buyer use or sell such products for use in such ultra-hazardous applications, it does so entirely at its own risk. Furthermore, buyer agrees to fully indemnify, defend and hold Supermicro harmless for and against any and all claims, demands, actions, litigation, and proceedings of any kind arising out of or related to such ultra-hazardous use or sale.

Manual Revision 1.0

Release Date: November 05, 2021

Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this document. Information in this document is subject to change without notice. Other products and companies referred to herein are trademarks or registered trademarks of their respective companies or mark holders.

Copyright © 2021 by Super Micro Computer, Inc.

All rights reserved.

Printed in the United States of America

Preface

About this Manual

This manual is written for professional system integrators and PC technicians. It provides information for the installation and use of the system. Installation and maintenance should be performed by experienced technicians only.

Please refer to the SYS-730A-I system specifications page on our website for updates on supported memory, processors and operating systems (http://www.supermicro.com).

Notes

For your system to work properly, please follow the links below to download all necessary drivers/utilities and the user's manual for your system.

• Supermicro product manuals: http://www.supermicro.com/support/manuals/
• Product drivers and utilities: https://www.supermicro.com/wdl/driver/
• Product safety info: http://www.supermicro.com/about/policies/safety_information.cfm

If you have any questions, please contact our support team at:

[e-mail]

This manual may be periodically updated without notice. Please check the Supermicro website for possible updates to the manual revision level.

Secure Data Deletion

A secure data deletion tool designed to fully erase all data from storage devices can be found on our website: https://www.supermicro.com/about/policies/disclaimer.cfm?url=/wdl/utility/Lot9_Secure_Data_Deletion_Utility/

Warnings

Special attention should be given to the following symbols used in this manual.

Warning! Indicates important information given to prevent equipment/property damage or personal injury.

Warning! Indicates high voltage may be encountered when performing a procedure.

Contents

Chapter 1 Introduction

1.1 Overview....8
1.2 System Features 9

Front View 9

Control Panel....10

Rear View....11

1.3 Motherboard Layout....12

Quick Reference Table....13

Motherboard Block Diagram ....15

Chapter 2 System Installation

2.1 Overview....16
2.2 Unpacking the System 16
2.3 Preparing for Setup....16

Choosing a Setup Location....16

Workstation Precautions ....16

Chapter 3 Maintenance and Component Installation

3.1 Removing Power ....18
3.2 Accessing the System....19
3.3 Motherboard Components....20

Processor and Heatsink Installation....20

ESD Precautions ......20

The 3rd Gen Intel Xeon Scalable Processor ....21
Overview of the CPU Socket 24
Overview of the Processor Carrier Assembly....25
Overview of the Processor Heatsink Module....26
Creating the Processor Carrier Assembly....27
Creating the Processor Heatsink Module (PHM)....29
Preparing the CPU Socket for Installation....30
Preparing to Install the Processor Heatsink Module (PHM) into the CPU Socket......31
Installing the Processor Heatsink Module (PHM) 32
Removing the Processor Heatsink Module from the CPU Socket 34
Removing the Carrier Assembly from the Processor Heatsink Module (PHM)....35
Removing the Processor from the Processor Carrier Assembly 36

3.4 Memory....37

DDR4 Memory Population Guideline....38

Intel Optane PMem 200 Series....39

DIMM Installation 40

DIMM Removal 41

3.5 Expansion Card Installation ....42

Installing an M.2 Solid State Drive....42

PCI Expansion Card Installation....43

3.6 Motherboard Battery....44

3.7 Storage Drives....45

3.8 System Cooling ....50

Fans 50

3.9 Power Supply ....52

Chapter 4 Motherboard Connections

4.1 Power Connections ....53

4.2 Headers and Connectors ....54

Control Panel....58

4.3 Input/Output Ports ....61

4.4 Jumpers....64

4.5 LED Indicators....66

Chapter 5 Software

5.1 Microsoft Windows OS Installation....68

5.2 Driver Installation....70

5.3 SuperDoctor ^® 5....71

5.4 BMC....72

BMC ADMIN User Password....72

Chapter 6 Optional Components

6.1 Optional Parts List....73

6.2 Additional Storage....73

6.3 TPM Security Module....73

Chapter 7 Troubleshooting and Support

7.1 Information Resources ....74

Website 74

Direct Links for the SYS-730A-I System....74

Direct Links for General Support and Information 74

7.2 BMC Interface 75
7.3 Troubleshooting Procedures ....76

No Power 76

No Video ....77

System Boot Failure ....77

Memory Errors ....78

Losing the System's Setup Configuration....78

When the System Becomes Unstable....78

7.4 BIOS Error Beep (POST) Codes ....80
Additional BIOS POST Codes ....80
7.5 Crash Dump Using BMC....81
7.6 UEFI BIOS Recovery ....82

Overview 82

Recovering the UEFI BIOS Image....82

Recovering the Main BIOS Block with a USB Device....82

7.7 CMOS Clear....87
7.8 Where to Get Replacement Components....88
7.9 Reporting an Issue....88

Technical Support Procedures....88

Returning Merchandise for Service....88

Vendor Support Filing System 89

7.10 Feedback....89

Appendix A Standardized Warning Statements for AC Systems Appendix B System Specifications

Contacting Supermicro

Headquarters

Address: Super Micro Computer, Inc.

980 Rock Ave.

San Jose, CA 95131 U.S.A.

Tel: [phone]

Fax: [phone]

Email: [e-mail] (General Information)

[e-mail] (Technical Support)

Website: www.supermicro.com

Europe

Address: Super Micro Computer B.V.

's-Hertogenbosch, The Netherlands

Tel: [phone]

Fax: [phone]

Email: [e-mail] (General Information)

[e-mail] (Technical Support)

[e-mail] (Customer Support)

Website: www.supermicro.nl

Asia-Pacific

Address: Super Micro Computer, Inc.

3F, No. 150, Jian 1st Rd.

Zhonghe Dist., New Taipei City 235

Taiwan (R.O.C)

Tel: [phone]

Fax: [phone]

Email: [e-mail]

Website: www.supermicro.com.tw

Chapter 1

Introduction

1.1 Overview

This chapter provides a brief outline of the functions and features of the SuperWorkstation SYS-730A-I. The following provides an overview of the specifications and capabilities.

System Overview
Motherboard	X12DAi-N6
Chassis	CSE-735D4-1K26B
Processor Support	Dual Intel Xeon 3rd Gen Intel Xeon Scalable Processors (Socket P+) with up to 40 cores and a thermal design power (TDP) of up to 270WNote: Refer to the motherboard specifications pages on our website for updates to supported processors. Certain CPU SKUs are conditionally supported. Please contact Supermicro Technical Support for additional information about specialized system optimization.
Chipset	Intel PCH C261A
Memory	Up to 4 TB of 3DS LRDIMM/LRDIMM/3DS RDIMM/RDIMM DDR4 (288-pin) ECC memory with speeds of 3200/2933/2666 MHz in 16 memory slots and up to 4 TB of Intel Optane PMem 200 Series with speeds of up to 3200 MHzNote: PMem 200 Series are supported on 3rd gen Intel Xeon Scalable Platinum, Gold and selected Silver processors.
Drive Support	Four fixed internal 3.5" SATA drive baysTwo onboard NVMe connectors (optional cables required for NVMe support)One onboard VROC key header
Expansion Slots	One PCIe 4.0 x8 slotFive PCIe 4.0 x16 slotsTwo PCIe 4.0 x4 M.2 slots in the 2280 and 22110 form factors
Networking	Two 1GbE ports
I/O Ports	Front: two USB 3.2 Gen 1 ports, one USB 3.2 Gen 2 Type-C port, one line-out port, one mic-in portRear: four USB 3.2 Gen 1 ports, one USB 3.2 Gen 2 port, 7.1 HD Audio ports, one VGA portOnboard: one serial COM header, one buzzer header, eight SATA headers
System Cooling	One rear fanOne front fanTwo CPU heatsinks (sold separately)
Power	One PS2 1200W Multi-output 80+ Platinum power supply
Form Factor	Mid-Tower (WxHxD) 7.6 x 16.7 x 21.2 in. (193 x 424 x 536 mm)

A Quick Reference Guide can be found on the product page of the Supermicro website.

1.2 System Features

The SYS-730A-I is a mid-tower system. It is useful for small/medium businesses, professional video editing, or 3D modeling. The following views of the system display the main features.

Front View

5.25" Drive Bays SuperMicro Lock Control Panel

Figure 1-1. Front View

System Features: Front
Feature Description
Lock Front Bezel Lock
5.25" Drive Bays For optional DVD-ROM drives or mobile rack module
Control Panel Front control panel with power button, LEDs, USB and audio ports

Control Panel

Power HDD LED USB 3.2 Gen 1 USB 3.2 Gen 1 USB 3.2 Gen 2 Type-C Audio Out Mic In

Figure 1-2. Control Panel

Control Panel Features
Feature Description
Power Button with LED	The main power switch applies or removes primary power from the power supply to the system but maintains standby power.
HDD LED Indicates activity	on the storage drives when flashing.
USB Ports Two front accessible	USB 3.2 Gen 1 ports and one USB 3.2 Gen 2 Type-C port
Audio out Audio out port
Mic in Mic in port

Rear View

Power Supply VGA Port Four USB 3.2 Gen 1 Ports 7.1 HD Audio Ports LAN Ports USB 3.2 Gen 2 Port Fan Expansion Slots

Figure 1-3. System: Rear View

System Features: Rear
Feature Description
Power Supply One PS2 1200W Multi-output 80+ Platinum power supply
Fan Internal cooling fan
Networking Two 1GbE LAN ports
USB Four rear USB 3.2 Gen 1 ports and one rear USB 3.2 Gen 2 port
VGA VGA port
Audio 7.1 HD Audio ports
Expansion Slots Six PCIe expansion slots

Expansion Slot Locations
Item Slot Name	Description
1,3,5	JPCIE1/3/5 PCIe 4.0 x16 slot (CPU1)
2,4	JPCIE2/4	PCIe 4.0 x16 slot (CPU2)
6	JPCIE6	PCIe 4.0 x8 slot (CPU2)

CPU1 CPU2

1.3 Motherboard Layout

Below is a layout of the X12DAi-N6 motherboard with jumper, connector and LED locations shown. See the table on the following page for descriptions. For detailed descriptions, pinout information and jumper settings, refer to Chapter 4 or the Motherboard Manual.

graph TD
    subgraph Computer Architecture
        A["CPU"] --> B["Memory 1"]
        B --> C["Memory 2"]
        C --> D["Memory 3"]
        D --> E["Memory 4"]
        E --> F["Memory 5"]
        F --> G["Memory 6"]
        G --> H["Memory 7"]
        H --> I["Memory 8"]
        I --> J["Memory 9"]
        J --> K["Memory 10"]
        K --> L["Memory 11"]
        L --> M["Memory 12"]
        M --> N["Memory 13"]
        N --> O["Memory 14"]
        O --> P["Memory 15"]
        P --> Q["Memory 16"]
        Q --> R["Memory 17"]
        R --> S["Memory 18"]
        S --> T["Memory 19"]
        T --> U["Memory 20"]
        U --> V["Memory 21"]
        V --> W["Memory 22"]
        W --> X["Memory 23"]
        X --> Y["Memory 24"]
        Y --> Z["Memory 25"]
        Z --> AA["Memory 26"]
        AA --> AB["Memory 27"]
        AB --> AC["Memory 28"]
        AC --> AD["Memory 29"]
        AD --> AE["Memory 30"]
        AE --> AF["Memory 31"]
        AF --> AG["Memory 32"]
        AG --> AH["Memory 33"]
        AH --> AI["Memory 34"]
        AI --> AJ["Memory 35"]
        AJ --> AK["Memory 36"]
        AK --> AL["Memory 37"]
        AL --> AM["Memory 38"]
        AM --> AN["Memory 39"]
        AN --> AO["Memory 40"]
        AO --> AP["Memory 41"]
        AP --> AQ["Memory 42"]
        AQ --> AR["Memory 43"]
        AR --> AS["Memory 44"]
        AS --> AT["Memory 45"]
        AT --> AU["Memory 46"]
        AU --> AV["Memory 47"]
        AV --> AW["Memory 48"]
        AW --> AX["Memory 49"]
        AX --> AY["Memory 50"]
        AY --> AZ["Memory 51"]
        AZ --> BA["Memory 52"]
        BA --> BB["Memory 53"]
        BB --> BC["Memory 54"]
        BC --> BD["Memory 55"]
        BD --> BE["Memory 56"]
        BE --> BF["Memory 57"]
        BF --> BG["Memory 58"]
        BG --> BH["Memory 59"]
        BH --> BI["Memory 60"]
        BI --> BJ["Memory 61"]
        BJ --> BK["Memory 62"]
        BK --> BL["Memory 63"]
        BL --> BM["Memory 64"]
        BM --> BN["Memory 65"]
        BN --> BO["Memory 66"]
        BO --> BP["Memory 67"]
        BP --> BQ["Memory 68"]
        BQ --> BR["Memory 69"]
        BR --> BS["Memory 70"]
        BS --> BT["Memory 71"]
        BT --> BU["Memory 72"]
        BU --> BV["Memory 73"]
        BV --> BW["Memory 74"]
        BW --> BX["Memory 75"]
        BX --> BY["Memory 76"]
        BY --> BZ["Memory 77"]
        BZ --> CA["Memory 78"]
        CA --> CB["Memory 79"]
        CB --> CC["Memory 80"]
        CC --> CD["Memory 81"]
        CD --> CE["Memory 82"]
        CE --> CF["Memory 83"]
        CF --> CG["Memory 84"]
        CG --> CH["Memory 85"]
        CH --> CI["Memory 86"]
        CI --> CJ["Memory 87"]
        CJ --> CK["Memory 88"]
        CK --> CL["Memory 89"]
        CL --> CM["Memory 90"]
        CM --> CN["Memory 91"]
        CN --> CO["Memory 92"]
        CO --> CP["Memory 93"]
        CP --> CQ["Memory 94"]
        CQ --> CR["Memory 95"]
        CR --> CS["Memory 96"]
        CS --> CT["Memory 97"]
        CT --> CU["Memory 98"]
        CU --> CV["Memory 99"]
    end

    subgraph Control Architecture
        D
    end

    subgraph External Components
            D1["JPRG1"] & D2["JPCIE1"] & D3["JPCIE2"] & D4["JPCIE3"] & D5["JPCIE4"] & D6["JA1"] & D7["JPCIE5"] & D8["JPCIE6"] & D9["JNVI2C"] & D10["JWD1"] & D11["JIPMB1"] & D12["JLE7"] & D13["JM2_2"] & D14["JNVME2"] & D15["JM2_1"] & D16["JL4"] & D17["JPMIE1"] & D18["JVRM2"] & D19["JVRM1"] & D20["JTPM1"] & D21["JRK1"] & D22["JP7"] & D23["JL1"] & D24["JD1"] & D25["I-SATA0"] & D26["I-SATA1"] & D27["JBT1"] & D28["I-SATA2"] & D29["I-SATA3"] & D30["I-SATA4"] & D31["I-SATA5"] & D32["BT1"] & D33["JSD1"] & D34["JSD1"] & D35["J37 FANA"] & D36["T-SGPIO2 T-SGPIO1 I-SATA6 I-SATA7 JUSB31_IJ JNVME1 FAN3 FAN4 CPU1 P1-DIMMG1 P1-DIMMH1 P1-DIMME1 P1-DIMMF1 CPU1 FAN2 P1-DIMMB1 P1-DIMMA1 P1-DIMMD1 P1-DIMMC1<br>    end<br><br>    subgraph External Components<br>            DC[PUPDIF_IN1 LEDM1 JNCSI"] & DC["FAN5"] & DC["FAN6"] & DC["FAN7"] & DC["FAN8"] & DC["FAN9"] & DC["FAN10"] & DC["FAN11"] & DC["FAN12"] & DC["FAN13"] & DC["FAN14"] & DC["FAN15"] & DC["FAN16"] & DC["FAN17"] & DC["FAN18"] & DC["FAN19"] & DC["FAN20"] & DC["FAN21"] & DC["FAN22"] & DC["FAN23"] & DC["FAN24"] & DC["FAN25"] & DC["FAN26"] & DC["FAN27"] & DC["FAN28"] & DC["FAN29"] & DC["FAN30"] & DC["FAN31"] & DC["FAN32"] & DC["FAN33"] & DC["FAN34"] & DC["FAN35"] & DC["FAN36"] & DC["FAN37"] & DC["FAN38"] & DC["FAN39"] & DC["FAN40"] & DC["FAN41"] & DC["FAN42"] & DC["FAN43"] & DC["FAN44"] & DC["FAN45"] & DC["FAN46"] & DC["FAN47"] & DC["FAN48"] & DC["FAN49"] & DC["FAN50"]

Figure 1-4. Motherboard Layout

Quick Reference Table

Jumper Description Default Setting

JBT1 CMOS Clear Open (Normal)

JPME1 ME Recovery Pins 1-2 (Normal)

JPL1 LAN1 Enable/Disable Pins 1-2 (Enabled)

JPL2 LAN2 Enable/Disable Pins 1-2 (Enabled)

JWD1 Watchdog Timer Pins 1-2 (Reset)

LED Description Status

LE4/LE7 M.2 LED Blinking Green: Device Working
LEDM1 BMC Heartbeat LED	Blinking Green: BMC Normal
PWRLED	Onboard Power LED Solid Green: Power On
Connector	Description
Audio (JA1)	HD Audio connector for front access
BT1	Onboard CMOS Battery
COM1	COM/Serial Port header for front access
FANA, FAN1 ~ FAN7,	CPU/System cooling fan headers
I-SATA0/1/2/3/4/5	SATA 3.0 connection headers supported by the Intel PCH
I-SATA6, I-SATA7	SATA 3.0 connection headers with SATA DOM Power supported by the Intel PCH
J37	Front-accessible USB 3.2 Gen1 type A connector (USB 5/6)
JAUDIO1	Audio port on the I/O back panel
JD1	Speaker/buzzer header (use in conjunction with an external speaker/buzzer) (optional)
JF1	Front Control Panel Header
JIPMB1	4-pin BMC External I^2C Header (for a BMC card)
JLAN1 (LAN1)	Gigabit LAN (1G) Ethernet port on the IO back panel supported by PCH and BMC
JLAN1 (LAN2)	Gigabit LAN (1G) Ethernet port on the IO back panel supported by PCH
JL1	Chassis Intrusion Header
JM2_1, JM2_2	M.2 PCIe 4.0 x4 Slot (Supports M-Key 2280 and 22110) supported by CPU1
JNCSI	NCSI header
JNVI2C	NVMe SMBus ( I^2C ) headers used for PCIe hot-plug SMBus clock & data connections
JNVME1, JNVME2	NVMe PCIe 4.0 x8 ports (Note: When installing an NVMe device on a motherboard, please be sure to connect JNVME1 first for your system to work properly.)
JP7	USB header for card reader
JPCIE1/2/3/4/5 (slot 1-5)	CPU PCIe 4.0 x16 slots (slot1/slot3/slot5 supported by CPU1, slot2/slot4 supported by CPU2)
JPCIE6 (slot 6)	CPU PCIe 4.0 x8 slot supported by CPU2
JPI2C1	Power System Management Bus (SMB) I^2C Header
JPRG1	Complex-programmable logical device (CPLD) header

Connector Description

JPWR1, JPWR2, JPWR4 8-pin Power Connector

JPWR3 24-pin ATX Power Connector

JSPDIF_IN, JSPDIF_OUT SPDIF (Sony/Philips Digital Interconnect Format) Audio In/Out connectors

JTPM1 Trusted Platform Module/Port 80 Connector

JUSB1 (USB0/1/2/3) Back panel USB 3.2 Gen 1 ports

JUSBA (USB4) Back panel USB 3.2 Gen 2 type A port

JUSB31_I1 (USB7) Front accessible USB 3.2 Gen 2 header

JVGA VGA port on the I/O back panel

JVRM1 VRM SMB clock to BMC

JVRM2 VRM SMB data to BMC

JSD1, JSD2 SATA DOM (Disk-on-Module) power connectors 1/2

MH15, MH16, MH17, MH18 M.2 Mounting Holes

T-SGPIO1, T-SGPIO2 General Purpose Serial I/O ports

VROC (JRK1) Intel VROC RAID Key header for NVMe SSD

Motherboard Block Diagram

X12DAi-N6

System architecture diagram showing CPU, PCH, and BMC AST2600 components with data flow between sensors, memory, and interfaces.

Figure 1-5. Motherboard Block Diagram

Chapter 2

System Installation

2.1 Overview

This chapter provides advice and instructions for unpacking and preparing your system for setup. If your system is not already fully integrated with processors, system memory etc., refer to Chapter 3 for details on installing those specific components.

Caution: Electrostatic Discharge (ESD) can damage electronic components. To prevent such damage to PCBs (printed circuit boards), it is important to use a grounded wrist strap, handle all PCBs by their edges and keep them in anti-static bags when not in use.

2.2 Unpacking the System

Inspect the box in which the SuperWorkstation SYS-730A-I was shipped, and note if it was damaged in any way. If any equipment appears damaged, file a damage claim with the carrier who delivered it.

The system should be situated in a clean, dust-free area that is well ventilated. Avoid areas where heat, electrical noise and electromagnetic fields are generated. It will also require a grounded AC power outlet nearby. Be sure to read the precautions and considerations noted in Appendix A.

2.3 Preparing for Setup

Please read this section in its entirety before you begin the installation.

Choosing a Setup Location

• The system should be situated in a clean, dust-free area that is well ventilated. Avoid areas where heat, electrical noise and electromagnetic fields are generated.
• This product is not suitable for use with visual display workplace devices according to §2 of the German Ordinance for Work with Visual Display Units.

Workstation Precautions

- Review the electrical and general safety precautions in Appendix A.

• Use a regulating uninterruptible power supply (UPS) to protect the workstation from power surges, voltage spikes and to keep your system operating in case of a power failure.
• Allow the power supply units and components to cool before touching them.
• To maintain proper cooling, always keep all chassis panels closed when not being serviced.

Chapter 3

Maintenance and Component Installation

This chapter provides instructions on installing and replacing main system components. To prevent compatibility issues, only use components that match the specifications and/or part numbers given.

Installation or replacement of most components require that power first be removed from the system. Please follow the procedures given in each section.

3.1 Removing Power

Use the following procedure to ensure that power has been removed from the system.

1. Use the operating system to power down the system.
2. After the system has completely shut down, disconnect the AC power cords from the power strip or outlet.
3. Disconnect the power cords from the power supply modules.

3.2 Accessing the System

The CSE-735D4-1K26B has removable side covers for interior access.

Removing the Side Cover

1. Remove the two screws securing the left side cover to the chassis.
2. Slide the left cover toward the rear of the chassis.
3. Lift the left cover from the chassis.
4. Remove the three screws securing the right side cover to the chassis.
5. Slide the right cover toward the rear of the chassis
6. Lift the right cover from the chassis.

Warning: Except for short periods of time, do not operate the system without the cover in place. The chassis cover must be in place to allow for proper airflow and to prevent overheating.

Left Side Cover Right Side Cover

Figure 3-1. Removing the Side Cover

3.3 Motherboard Components

Processor and Heatsink Installation

Note: The heatsink is sold separately and not included as part of the system.

The processor (CPU) and processor carrier should be assembled together first to form the processor carrier assembly. This will be attached to the heatsink to form the processor heatsink module (PHM) before being installed into the CPU socket. Before installation, be sure to perform the following steps below:

• Please carefully follow the instructions below given to avoid ESD-related damages.
• Unplug the AC power cords from all power supplies after shutting down the system.
• Check that the plastic protective cover is on the CPU socket and none of the socket pins are bent. If they are, contact your retailer.
• When handling the processor, avoid touching or placing direct pressure on the LGA lands (gold contacts). Improper installation or socket misalignment can cause serious damage to the processor or CPU socket, which may require manufacturer repairs.
  • Thermal grease is pre-applied on a new heatsink. No additional thermal grease is needed.
  • Refer to the Supermicro website for updates on processor and memory support.
• All graphics in this manual are for illustrations only. Your components may look different.

ESD Precautions

• Use a grounded wrist strap designed to prevent static discharge.
• Touch a grounded metal object before removing the board from the antistatic bag.
• Handle the motherboard by its edges only; do not touch its components, peripheral chips, memory modules or gold contacts.
• When handling chips or modules, avoid touching their pins.
• Put the motherboard and peripherals back into their antistatic bags when not in use.
• For grounding purposes, make sure that your computer chassis provides excellent conductivity between the power supply, the case, the mounting fasteners and the motherboard.
• Use only the correct type of onboard CMOS battery. Do not install the onboard battery upside down to avoid possible explosion.

The 3rd Gen Intel Xeon Scalable Processor

Isometric line drawing of a rectangular electronic component or enclosure with mounting holes and internal channels (no text or symbols)

Processor Top View

1. The 3rd Gen Intel Xeon Scalable Processor

= Cutout = CPUPKey ○

Processor Top View

2. The Processor Carrier

Isometric line drawing of a mechanical housing or bracket component (no text or symbols)

Pure technical line drawing of a mechanical or electrical component outline without any text, numbers, or symbols

Carrier Top View

Top-down schematic of a mechanical or electronic device with labeled components and directional arrows (no text or symbols)

Carrier Bottom View

3. Heatsink

Technical line drawing of a mechanical cooling unit with fan and cooling fins (no text or symbols)

Note: The heatsink is sold separately and not included as part of the system. Exercise extreme care when handling the heatsink. Pay attention to the edges of heatsink fins which can be sharp! To avoid damaging the heatsink, please do not apply excessive force on the fins when handling the heatsink.

Overview of the CPU Socket

The CPU socket is protected by a plastic protective cover.

Technical line drawing of a rectangular electronic component with mounting brackets and internal compartments (no text or symbols)

Plastic Protective Cover

Technical line drawing of a mechanical housing or enclosure with multiple cylindrical components and mounting points (no text or symbols)

CPU Socket

Overview of the Processor Carrier Assembly

The processor carrier assembly contains a 3rd Gen Intel Xeon Scalable processor and a processor carrier. Carefully follow the instructions given in the installation section to place a processor into the carrier to create a processor carrier.

1. The 3rd Gen Intel Xeon Scalable Processor

1. Processor Carrier

1. Processor Carrier Assembly

Isometric technical drawing of a rectangular electronic component with internal grid structure (no text or symbols)

(with Processor Seated inside the Carrier)

Overview of the Processor Heatsink Module

The Processor Heatsink Module (PHM) contains a heatsink, a processor carrier, and the 3rd Gen Intel Xeon Scalable Processor

1. Heatsink

Technical line drawing of a mechanical component with no visible text or symbols

1. Processor Carrier

Isometric line drawing of a mechanical or architectural component with no visible text, numbers, or symbols.

1. The 3rd Gen Intel Xeon Scalable Processor

Simple line drawing of a rectangular frame with a central oval and horizontal lines, no text or symbols present.

Bottom View

1. Processor Heatsink Module (PHM)

Architectural line drawing of a building interior with structural elements and ventilation grilles (no text or symbols)

Creating the Processor Carrier Assembly

The processor carrier assembly contains a 3rd Gen Intel Xeon Scalable processor and a processor carrier.

To create the processor carrier assembly, please follow the steps below:

Note: Before installation, be sure to follow the instructions given on page 31.

1. Hold the processor with the LGA lands (with Gold CPU contacts) facing down. Locate the small, gold triangle at the corner of the processor and the corresponding hollowed triangle on the processor carrier as shown in the graphics below. Please note that the triangle indicates Pin 1 location.

Isometric technical drawing of a layered mechanical or electronic component with no visible text or symbols

Pin 1

1. First, turn over the processor carrier and locate Pin 1 on the CPU and Pin 1 on the carrier. Then, turn the processor over with the processor reverse side (gold contacts) facing up and locate CPU keys on the processor. Finally, locate the CPU keys and four latches on the carrier as shown below.

Processor (Reverse Side Up) Latch Latch Carrier (Top Side Up) CPU Key Latch Latch CPU Key

1. Locate the lever on the CPU socket and press the lever down as shown below. Using

Technical diagram of a mechanical assembly with an inset showing a lever mechanism and a green arrow indicating rotation.

1. Using Pin 1 as a guide, carefully align the CPU keys (A & B) on the processor against the CPU keys on the carrier (a & b) as shown in the drawing below.
2. Once they are properly aligned, carefully place one end of the processor into the latch marked 1 on the carrier, and place the other end of processor into the latch marked 2

CPU Key (on the processor) CPU Key (on the carrier) b 1 Latch 2 a Latch CPU Key (on the processor) CPU Key (on the carrier)

Creating the Processor Heatsink Module (PHM)

After creating the processor carrier assembly, please follow the instructions below to mount the processor carrier into the heatsink to form the processor heatsink module (PHM).

Note: If this is a new heatsink, the thermal grease has been pre-applied on the underside. Otherwise, apply the proper amount of thermal grease.

1. Turn the heatsink over with the thermal grease, which is on the reverse side of the heatsink, facing up. Pay attention to the two triangle cutouts (A, B) located at the diagonal corners of the heatsink as shown in the drawing below.
2. Hold the processor carrier assembly top side (with thermal grease) facing up, and locate the triangle on the CPU and the triangle on the carrier. (Triangle indicates Pin 1.)
3. Using Pin 1 as a guide, turn the processor carrier assembly over with the gold contacts facing up. Locate Pin 1 (A) on the processor and Pin 1 (a) on the processor carrier assembly "a".
4. Align the corner marked "a" on the processor carrier assembly against the triangle cutout "A" on the heatsink, and align the corners marked "b", "c", "d" on processor assembly against the corners marked "B", "C", "D" on the heatsinks
5. Once they are properly aligned, place the corner marked "a" on the processor carrier assembly into the corner of the heatsink marked "A". Repeat the same step to place the corners marked "b", "c", "d" on the processor carrier assembly into the corners of the heatsink marked "B", "C", "D" making sure that all plastic clips are properly attached to the heatsink.

Pin1 a b c D A B C

Processor Carrier Assembly
(Reverse Side View)

Technical line drawing of a mechanical fan assembly with two circular insets highlighting internal components (no text or symbols present)

Heatsink
(Reverse Side View)

Preparing the CPU Socket for Installation

This motherboard comes with a plastic protective cover installed on the CPU socket. Remove it from the socket to install the Processor Heatsink Module (PHM). Gently pull up one corner of the plastic protective cover to remove it.

Technical line drawing of a mechanical component with red arrows indicating direction (no text or symbols)

1. Press the tabs inward.

Technical line drawing of a mechanical housing assembly with mounting holes and internal components (no text or symbols)

1. Pull up the protective cover from the socket.

Preparing to Install the Processor Heatsink Module (PHM) into the CPU Socket

After assembling the Processor Heatsink Module (PHM), you are ready to install it into the CPU socket. To ensure the proper installation, please follow the procedures below:

1. Locate four threaded fasteners (a, b, c, d) on the CPU socket.

CPU Socket a, b, c, d: Threaded Fasteners) (a, b, c, d: Threaded Fasteners) CPU Socket Pin1

1. Locate four peek nuts (A, B. C. D) and four rotating wires (1, 2, 3, 4) on the heatsink as shown in the graphics below.

Heatsink A, B, C, D: Peek Nut 1, 2, 3, 4: Rotating Wire a, b, c, d: Threaded Fastener Rotating Wire 4 Rotating Wire 3 Rotating Wire 1 Peek Nut CPU Socket Threaded Fastener (Unlatched) (Iatched)

1. Check the rotating wires (1, 2, 3, 4) to make sure that they are at unlatched positions as shown in the drawing below before installing the PHM into the CPU socket.

Installing the Processor Heatsink Module (PHM)

1. Align peek nut "A", which is next to the triangle (Pin 1) on the heatsink, against threaded fastener "a" on the CPU socket. Then align peek nuts "B", "C", "D" on the heatsink against threaded fasteners "b", "c", "d" on the CPU socket, making sure that all peek nuts on the heatsink are properly aligned with the correspondent threaded fasteners on the CPU socket.

2. Once they are aligned, gently place the heatsink on top the CPU socket, making sure that each peek nut is properly attached to its corresponding threaded fastener.

A, B, C, D: Peek Nut on the Heat-sink B D A C b d a c a, b, c, d: Threaded Fastener on the CPU socket

1. Press all four rotating wires outwards and make sure that the heatsink is securely latched unto the CPU socket.

Rotating Wire Rotating Wire

1. With a T30-bit screwdriver, tighten all peek nuts in the sequence of "A", "B", "C", and "D" with even pressure. To avoid damaging the processor or socket, do not use a force greater than 12 lbf-in when tightening the screws.

2. Examine all corners heatsink to ensure that the PHM is firmly attached to the CPU socket.

Technical diagram of a mechanical device with labeled components A, B, C, D and red arrows indicating motion or flow.

Removing the Processor Heatsink Module from the CPU Socket

Before removing the processor heatsink module (PHM) from the motherboard, unplug the AC power cord from all power supplies after shutting down the system. Then follow the steps below:

1. Use a T30-bit screwdriver to loosen the four peek nuts on the heatsink in the sequence of #A, #B, #C, and #D.

Technical diagram of a mechanical device with labeled components A, B, C, D and red directional arrows indicating motion or force vectors.

1. Once the peek nuts are loosened from the CPU socket, press the rotating wires inwards to unlatch the PHM from the socket as shown in the drawings below.

Technical line drawing of a computer fan assembly with cooling fans and heat exchangers (no text or symbols)

1. Gently lift the PHM upwards to remove it from the CPU socket.

Technical illustration of a mechanical cooling unit with fan and mounting base (no text or symbols)

Removing the Carrier Assembly from the Processor Heatsink Module (PHM)

To remove the processor carrier assembly from the PHM, please follow the steps below:

1. Detach four plastic clips (marked a, b, c, d) on the processor carrier assembly from the four corners of heatsink (marked A, B, C, D) in the drawings below.

Processor Carrier Assembly (Reverse Side View) b c a d B C D Heatsink A

1. When all plastic clips are detached from the heatsink, remove the processor carrier assembly from the heatsink

Technical diagram of a mechanical assembly with red arrows indicating force or movement, showing internal components and assembly steps (no text or symbols present)

Removing the Processor from the Processor Carrier Assembly

Once you have removed the processor carrier assembly from the PHM, you are ready to remove the processor from the processor carrier by following the steps below.

1. Unlock the lever from its locking position and push the lever upwards to disengage the processor from the processor carrier as shown in the right drawing below.

Lever

1. Once the processor is loosened from the carrier, carefully remove the processor from the processor carrier.

Note: To avoid damaging the processor and its pins, please handle the processor with care.

Isometric technical diagram of a computer motherboard with a highlighted component and red arrow indicating upward motion (no text or symbols)

3.4 Memory

The X12DAi-N6 motherboard has 16 DIMM slots. It supports up to

• 4TB (DDR4 only): 3DS LRDIMM/LRDIMM/3DS RDIMM/RDIMM DDR4 (288-pin) ECC memory with speeds of 3200/2933/2666 MHz.
• 4TB (PMem + DDR4): Intel Optane PMem 200 Series with speeds of up to 3200 MHz.

Notes: PMem 200 Series are supported on 3rd Gen Intel Xeon Scalable Platinum, Gold and selected Silver processors. Memory speed support depends on the processors used in the system.

DDR4 Memory Support for the 3rd Gen Intel Xeon Scalable Processors
Type	Ranks Per DIMM & Data Width	DIMM Capacity (GB)		Speed (MT/s); Voltage (V); Slots Per Channel (SPC) and DIMMs Per Channel (DPC)
				1DPC(1-DIMM Per Chan- nel)	2DPC(2-DIMM Per Channel)
		8Gb 16Gb	1.2 V 1.2 V
RDIMM	SRx8 8GB 16GB			3200 3200
	SRx4 16GB 32GB
	DRx8 16GB 32GB
	DRx4 32GB 64GB
RDIMM 3Ds (4R/8R) X4		2H- 64 GB4H-128 GB	2H- 128 GB4H-256 GB
LRDIMM QRx4 64GB 128GB		3200 3200
LRDIMM - 3Ds	(4R/8R) X4	4H-128 GB	2H- 128 GB4H-256 GB	3200 3200

Key Parameters for DIMM Configurations
Parameters	Possible Values
Number of Channels	8
Number of DIMMs per Channel	1DPC (1 DIMM Per Channel) or 2DPC (2 DIMMs Per Channel)
DIMM Type	RDIMM (w/ECC), 3DS RDIMM, LRDIMM, 3DS LRDIMM
DIMM Construction	non-3DS RDIMM Raw Cards: A/B (2Rx4), C (1Rx4), D (1Rx8), E (2Rx8)3DS RDIMM Raw Cards: A/B (4Rx4)non-3DS LRDIMM Raw Cards: D/E (4Rx4)3DS LRDIMM Raw Cards: A/B (8Rx4)

DDR4 Memory Population Guideline

DDR4 Memory Population Guideline
CPUs/DIMMs Memory Population Sequence
1 CPU & 1 DIMM	A1
1 CPU & 2 DIMMs*	A1, E1
1 CPU & 4 DIMMs*	A1, E1, C1, G1
1 CPU & 6 DIMM	A1, E1, C1, G1, B1, F1
1 CPU & 8 DIMMs*	A1, E1, C1, G1, B1, F1, D1, H1
2 CPUs & 2 DIMMs*	CPU1: A1
	CPU2: A1
2 CPUs & 4 DIMMs*	CPU1: A1, E1
	CPU2: A1, E1
2 CPUs & 6 DIMMs	CPU1: A1, E1, C1, G1
	CPU2: A1, E1
2 CPUs & 8 DIMMs*	CPU1: A1, E1, C1, G1
	CPU2: A1, E1, C1, G1
2 CPUs & 10 DIMMs	CPU1: A1, E1, C1, G1, B1, F1
	CPU2: A1, E1, C1, G1
2 CPUs & 12 DIMMs*	CPU1: A1, E1, C1, G1, B1, F1
	CPU2: A1, E1, C1, G1, B1, F1
2 CPUs & 14 DIMMs	CPU1: A1, E1, C1, G1, B1, F1, D1, H1
	CPU2: A1, E1, C1, G1, B1, F1
2 CPUs & 16 DIMMs*	CPU1: A1, E1, C1, G1, B1, F1, D1, H1
	CPU2: A1, E1, C1, G1, B1, F1, D1, H1

*recommended configurations shaded in orange and marked with an asterisk
Note: Memory DIMM capacities larger than 16GB are supported under certain conditions. Please contact Supermicro Technical Support for additional information about specialized system optimization.

Intel Optane PMem 200 Series

Note: PMem 200 Series are supported on 3rd Gen Intel Xeon Scalable Platinum, Gold and selected Silver processors. PMem may only be supported under certain conditions, please contact Supermicro technical support for additional information.

CPU1 PMem Population on 16-DIMM Motherboard
DDR4 and PMem	Mode	AD Interleave	F1	E1	H1	G1	C1	D1	A1	B1
4 DDR44 PMem	ADMM	One - x4	PMem	DDR4	PMem	DDR4	DDR4	PMem	DDR4	PMem
		One - x4	DDR4	PMem	DDR4	PMem	PMem	DDR4	PMem	DDR4
6 DDR41 PMem	AD	One - x1	DDR4	DDR4	-	DDR4	DDR4	PMem	DDR4	DDR4
			-	DDR4	DDR4	DDR4	DDR4	DDR4	DDR4	PMem
			DDR4	DDR4	PMem	DDR4	DDR4	-	DDR4	DDR4
			PMem	DDR4	DDR4	DDR4	DDR4	DDR4	DDR4	-
			DDR4	DDR4	DDR4	-	PMem	DDR4	DDR4	DDR4
			DDR4	-	DDR4	DDR4	DDR4	DDR4	PMem	DDR4
			DDR4	DDR4	DDR4	PMem	-	DDR4	DDR4	DDR4
			DDR4	PMem	DDR4	DDR4	DDR4	DDR4	-	DDR4

Validation Matrix (DDR4 DIMMS with PMem 200 Series)
DIMM Type	Ranks Per DIMM & Data Width (Stack)	DIMM Capacity (GB)
		DRAM Density
		8Gb 16Gb
RDIMM (up to 3200)	1Rx8 N/A N/A
	1Rx4 16GB 32GB
	2Rx8 16GB 32GB
	2Rx4 32GB 64GB
RDIMM 3DS (up to 3200)	4Rx4 (2H) N/A 128GB
	8Rx4 (4H) NA 256GB
LRDIMM (up to 3200) 4Rx4	64GB 128GB
LRDIMM 3DS (up to 3200)	4Rx4 (2H) N/A N/A
	8Rx4 (4H) N/A 256GB

• Mode definitions: AD = App Direct Mode, MM = Memory Mode, AD+MM = Mixed Mode
• No mixing of PMem and NVDIMMs within the platform.
• For MM, NM/FM ratio is between 1:4 and 1:16. The capacity not used for FM can be used for AD. (NM = Near Memory; FM = Far Memory).
• Matrix targets config for optimized PMem to DRAM cache ratio in MM and MM + AD modes.
• For each individual population, different PMem rearrangements among channels are permitted so long as the configuration doesn't break X12 DP Memory population rules.
• Ensure the same DDR4 DIMM type and capacity are used for each DDR4 + PMem population.
• If the system detects an unvalidated config, then the system issues a BIOS warning. The CLI functionality is limited in non POR configurations, and select commands will not be supported.

DIMM Installation

1. Insert the desired number of DIMMs into the memory slots based on the recommended DDR4-only population table on page 38 or the DDR4 and PMem table on page 39.

2. Push the release tabs outwards on both ends of the DIMM slot to unlock it.

Mechanical component diagram showing a rod with two curved arrows indicating rotational motion (no text or symbols)

Technical diagram of a computer motherboard with labeled components and connectors

1. Align the key of the DIMM module with the receptive point on the memory slot.

Key

1. Align the notches on both ends of the module against the receptive points on the ends of the slot.

Notches

1. Push both ends of the module straight down into the slot until the module snaps into place.

Diagram of a hand holding a mechanical component with blue arrows indicating motion or force direction (no text or symbols present)

1. Press the release tabs to the lock positions to secure the DIMM module into the slot.

DIMM Removal

Press both release tabs on the ends of the DIMM module to unlock it. Once the DIMM module is loosened, remove it from the memory slot.

Diagram of a mechanical component with two parts and directional arrows indicating rotation (no text or symbols)

Warning! Please do not use excessive force when pressing the release tabs on the ends of the DIMM socket to avoid causing any damage to the DIMM module or the DIMM socket. Please handle DIMM modules with care.

P2-DIMMF1 P2-DIMME1 P2-DIMMH1 P2-DIMMG1 P1-DIMMB1 P1-DIMMA1 P1-DIMMD1 P1-DIMMC1 P2-DIMMC1 P2-DIMMD1 P2-DIMMA1 P2-DIMMB1 P2-DIMMB1 P2-DIMMB1 P2-DIMMB1 P2-DIMMB1 P2-DIMMB1 P2-DIMMB1 P2-DIMMB1 P2-DIMMB1 P2-DIMMB1 P2-DIMMB1 P2-DIMMB1 P2-DIMMB1 P2-DIMMB1 P2-DIMMB1

Figure 3-2. DIMM Slots

3.5 Expansion Card Installation

Installing an M.2 Solid State Drive

The X12DAi-N6 can accommodate two M.2 solid state drives (SSDs). Each M.2 socket supports NVMe PCIe 4.0 x4 (32 Gb/s) SSD cards in the 2280 or 22110 form factors. The 22110 form factor is recommended because the appropriate standoff comes pre-installed on the motherboard.

Caution: Use industry-standard anti-static equipment, such as gloves or wrist strap, and follow precautions to avoid damage caused by ESD.

Rear CPU2 CPU1 Front JPM2_2 JM2_1

Figure 3-3. M.2 Locations

Note: JM2_2 cannot be used if a graphics card is installed in any of the PCIe slots 1-5.

PCI Expansion Card Installation

After the motherboard has been installed, expansion cards may be installed.

Installing Expansion Cards

1. Begin by removing power from the system as described in Section 3.1 and remove the side cover as described in Section 3.2.
2. Locate the release tab on the top of the PCI slot bracket.
3. Gently apply pressure in the middle of the release tab to unlock the PCI slot bracket.
4. Pull the release tab upward.
5. Remove the screw holding the bracket in place and pull the bracket from the chassis.
6. Install your PCI card or other add-on card into the PCI slot bracket and motherboard. To do this, slide the PCI card (with "L" bracket) into the PCI slot and secure the card to the motherboard.
7. Push the PCI bracket release tab down until it locks into place with an audible "click".
8. Secure the PCI card with the screw previously removed from the chassis.
9. Repeat this process with each PCI card you want to install into the chassis.

Technical line drawing of a computer tower case with internal components and ventilation ducts (no text or labels)

Figure 3-4. Installing Add-on Cards

3.6 Motherboard Battery

The motherboard uses non-volatile memory to retain system information when system power is removed. This memory is powered by a lithium battery residing on the motherboard.

Replacing the Battery

Begin by removing power from the system.

1. Push aside the small clamp that covers the edge of the battery. When the battery is released, lift it out of the holder.
2. To insert a new battery, slide one edge under the lip of the holder with the positive (+) side facing up. Then push the other side down until the clamp snaps over it.

Note: Handle used batteries carefully. Do not damage the battery in any way; a damaged battery may release hazardous materials into the environment. Do not discard a used battery in the garbage or a public landfill. Please comply with the regulations set up by your local hazardous waste management agency to dispose of your used battery properly.

LITHIUM BATTERY BATTERY HOLDER

Figure 3-5. Installing the Onboard Battery

Warning: There is a danger of explosion if the onboard battery is installed upside down (which reverses its polarities). This battery must be replaced only with the same or an equivalent type recommended by the manufacturer (CR2032).

3.7 Storage Drives

The SYS-730A-I supports four internal 3.5" SATA drives installed in a rotating cage. Additional drives are supported by an optional mobile rack or an optional internal hard drive cage.

Release Tab (A) HDD Cage (B)

Figure 3-6. Rotating the Internal Hard Drive Cage

Rotating the Hard Drive Cage

1. Begin by removing power from the system as described in Section 3.1 and remove the side cover as described in Section 3.2.

2. Lift the release tab located at the top of the hard drive cage.

3. Rotate the hard drive cage 90 degrees so the drive carriers are facing outward.

Transmission Release Tabs 4 5

Figure 3-7. Remove a Drive Carrier from the Cage

Removing and Installing 3.5" Hard Drives

1. Begin by removing power from the system as described in Section 3.1 and remove the side cover as described in Section 3.2.
2. Rotate the hard drive cage outward.
3. Disconnect all of the cables from the hard drive.
4. Press the release tab on the side of the hard drive carrier.
5. Slide the hard drive carrier out of the cage.

Technical diagram showing a device casing and its internal structure with numbered annotations indicating assembly steps.

Figure 3-8. Remove a Drive Carrier from the Cage

1. If a hard drive is already present, pull the sides of the carrier and remove the drive from the carrier.
2. Insert a new drive into the carrier and push the sides of the carrier together.
3. Insert the carrier into the cage. Slide the carrier towards the back of the cage until it clicks into place.
4. Rotate the cage 90 degrees inward.
5. Connect the hard drive cables.
6. Plug the power cord back into the power module, replace the chassis cover and power-up the system.

Thumbscrew

Figure 3-9. Removing/Installing a Hard Drive

Removing and Installing Optional HDD Cage

1. Begin by removing power from the system as described in Section 3.1 and remove the side cover as described in Section 3.2.
2. Loosen the thumbscrew securing the 2.5" hard drive cage to the chassis.
3. Disconnect all cables from the hard drive.
4. Slide the 2.5" hard drive cage out of the chassis.
5. If a hard drive is already present, remove it by carefully pulling the sides of the hard drive carrier outward.

6. Remove the hard drive from the hard drive carrier.

7. Insert the new hard drive into the hard drive carrier.

8. Insert the hard drive carrier into the hard drive cage, sliding it towards the back of the the hard drive cage until it clicks into a locked position.
9. Slide the 2.5" hard drive cage back into the chassis and tighten the thumb screw to secure the cage.
10. Connect the related cables to the hard drive.
11. Plug the power cord back into the power module, replace the chassis cover and power-up the system.

3.8 System Cooling

The cooling system for the SYS-730A-I includes a fan at the front and rear of the chassis.

Note: When using consumer grade GPUs, fan speed setting must be set to Heavy IO.

Fans

One 12-cm exhaust fan is mounted in the chassis rear below the power supply. One 12-cm fan is mounted at the chassis front.

Technical line drawing of a computer tower case with visible fan and drive components (no text or labels)

Figure 3-10. Installing the Rear Exhaust Fan

Replacing or Installing the Rear Fan

1. Begin by removing power from the system as described in Section 3.1 and remove the side cover as described in Section 3.2.
2. Insert the four rubber pins through mounting holes in the rear of the chassis and through the mounting holes in the rear fan.
3. Pull the rubber pins through the mounting holes of the fan to secure the fan to the chassis.
4. Connect the fan cable to the motherboard.

Technical line drawing of a computer tower case with visible internal components and fan assembly (no text or labels)

Figure 3-11. Installing the Front Fan

Replacing or Installing the Front Fan

1. Remove power from the system as described in Section 3.1 and remove the side cover as described in Section 3.2.
2. Insert the four rubber pins through the front fan bracket and into the mounting holes in the front fan.
3. Pull the rubber pins through the mounting holes of the system fan to secure the fan to the chassis.
4. Lower the fan into the chassis, aligning the holes at the top of the front fan bracket with the holes in the chassis.
5. Secure the fan to the chassis using the two screws provided.

3.9 Power Supply

The CSE-735D4-1K26B chassis includes a single 1200 Watt power supply. In the event that it becomes necessary to replace the power supply, follow the instructions below. Replacement units can be ordered directly from Supermicro.

Replacing the Power Supply

1. Remove power as described in Section 3.1 and remove the cover as described in Section 3.2.
2. Remove the screws securing the power supply to the chassis, which are located on the rear of the chassis. Set these screws aside for later use.
3. Disconnect the power supply from the motherboard connections.
4. Gently lift the power supply out of the chassis.
5. Replace the failed power supply with an identical power supply model.
6. Secure the new power supply using the screws previously set aside.
7. Plug the AC power cord back into the module and power-up the system.

Note: BMC interface will detect power supply status when the system is powered on, but the power supply will not support the standby mode for PMBus. This means when the system is turned on about a minute after plugging in the AC, the BMC will not be able to access the power supply information.

Power Supply

Figure 3-12. Power Supply Location

Chapter 4

Motherboard Connections

This section describes the connections on the motherboard and provides pinout definitions. Note that depending on how the system is configured, not all connections are required. The LEDs on the motherboard are also described here. A motherboard layout indicating component locations may be found in Chapter 1. More detail can be found in the Motherboard Manual. Please review the Safety Precautions in Appendix A before installing or removing components.

4.1 Power Connections

ATX Power Supply Connector

The 24-pin power supply connector (JPWR3) meets the ATX SSI EPS 12V specification. You must also connect the 8-pin (JPWR1/JPWR2/JPWR4) processor power connector to the power supply. Refer to the next page for more information on JPWR1/JPWR2/JPWR4.

ATX Power 24-pin Connector Pin Definitions
Pin# Definition Pin# Definition
13 +3.3V 1 +3.3V
14 -12V 2 +3.3V
15 Ground 3 Ground
16 PS_ON	4 +5V
17 Ground 5 Ground
18 Ground 6 +5V
19 Ground 7 Ground
20 Res (NC)	8 PWR_OK
21 +5V	9 5 VSB
22 +5V	10 +12V
23	+5V	11	+12V
24 Ground 12 +3.3V

8-Pin Power Connector

JPWR1, JPWR2 and JPWR4 is an 8-pin 12V DC power input for the CPU that must be connected to the power supply. Refer to the table below for pin definitions..

8-pin PowerPin Definitions
Pin# Definition
1 - 4	Ground
5 - 8	P12V (12V Power)

Required Connection

4.2 Headers and Connectors

Fan Headers

There are eight 4-pin fan headers (FAN1 \~ FAN7, FANA) on the motherboard. All these 4-pin fan headers are backwards compatible with the traditional 3-pin fans. However, fan speed control is available for 4-pin fans only by Thermal Management via the BMC interface. Refer to the table below for pin definitions.

Fan HeaderPin Definitions

Pin# Definition

1 Ground (Black)

2 2.5A/+12V (Red)

3 Tachometer

4 PWM_Control

SGPIO Headers

There are three Serial Link General Purpose Input/Output (I-SGPIO1 and I-SGPIO2) headers located on the motherboard. I-SGPIO is for SATA use. Refer to the tables below for pin definitions.

SGPIO HeaderPin Definitions
Pin# Definition Pin# Definition
1 NC	2 NC
3 Ground 4 Data
5 Load	6 Ground
7 Clock	8 NC

NC = No Connection

Disk-On-Module Power Connector

Two power connectors for SATA DOM (Disk-On-Module) devices are located at JSD1 and JSD2. Connect appropriate cables here to provide power support for your SATA DOM devices.

DOM Power Pin Definitions
Pin# Definition
1 5V
2 Ground
3 Ground

TPM/Port 80 Header

A Trusted Platform Module (TPM)/Port 80 header is located at JTPM1 to provide TPM support and Port 80 connection. Use this header to enhance system performance and data security. Refer to the table below for pin definitions. Please go to the following link for more information on the TPM: http://www.supermicro.com/manuals/other/TPM.pdf.

Trusted Platform Module Header Pin Definitions
Pin# Definition Pin# Definition
1 +3.3V 2 SPI_CS#
3 RESET# 4 SPI_MISO
5 SPI_CLK 6 GND
7 SPI_MOSI 8 NC
9 +3.3V Stdby 10 SPI_IRQ#

Power SMB (I²C) Header

The Power System Management Bus (I ^2 C) connector (JPI2C1) monitors the power supply, fan, and system temperatures. Refer to the table below for pin definitions.

Power SMB HeaderPin Definitions
Pin#	Definition
1	Clock
2	Data
3	PMBUS_Alert
4	Ground
5	+3.3V

4-pin BMC External I²C Header

A System Management Bus header for BMC is located at JIPMB1. Connect the appropriate cable here to use the IPMB I ^2 C connection on your system. Refer to the table below for pin definitions.

External I2C Header Pin Definitions
Pin#	Definition
1	Data
2	Ground
3	Clock
4	No Connection

NVMe SMBus Headers

NVMe SMBus (I ^2 C) headers (JNVI2C), used for PCIe SMBus clock and data connections, provide hot-plug support via a dedicated SMBus interface. This feature is only available for a Supermicro complete system with an SMCI-proprietary NVMe add-on card and cable installed. See the table below for pin definitions.

NVMe SMBus Header Pin Definitions
Pin#	Definition
1	Data
2	Ground
3	Clock
4	VCCIO

NVMe Connectors

Use the two NVMe connectors (JNVME1 and JNVME2) to attach high-speed PCIe storage devices.

Note: When installing an NVMe device on a motherboard, please be sure to connect the first NVMe port first (JNVME1) for your system to work properly.

Chassis Intrusion

A Chassis Intrusion header is located at JL1 on the motherboard. Attach the appropriate cable from the chassis to inform you of a chassis intrusion when the chassis is opened. Refer to the table below for pin definitions.

Note: Chassis intrusion is not supported on SYS-730A-I.

Chassis Intrusion Pin Definitions

Pin# Definition

1 Intrusion Input

2 Ground

Speaker Header (Optional for an External Speaker/Buzzer)

A speaker header, located at JD1, can be used in conjunction with an external speaker (optional). Use an appropriate cable to connect this header to an external speaker or buzzer for support of BIOS beep codes and system alarms. See the layout below for JD1 location.

SATA Ports

Six SATA 3.0 ports (I-SATA0/1/2/3/4/5) are located on the X12DAi-N6 motherboard supported by the C621A chipset. These SATA ports support RAID 0, 1, 5, and 10. In addition, there are also two SATA ports (I-SATA6, I-SATA7) that include SATA DOM power. SATA ports provide serial-link signal connections, which are faster than the connections of Parallel ATA.

Note: For more information on the SATA HostRAID configuration, please refer to the Intel SATA HostRAID user's guide posted on our website at http://www.supermicro.com.

M.2 Slot

The X12DAi-N6 motherboard has two M.2 slots (JM2_1 and JM2_2). M.2 allows for a variety of card sizes, increased functionality, and spatial efficiency. The M.2 socket on the motherboard supports PCIe 4.0 x4 (32 Gb/s) SSD cards in the 2280 and 22110 form factors.

Note: JM2_2 cannot be used if a graphics card is installed in any of the PCIe slots 1-5.

VROC Intel RAID Key Header

The JRK1 header allows the user to enable RAID functions for NVMe connections. Refer to the table below for pin definitions.

Intel RAID Key Header Pin Definitions
Pin# Definition
1 GND
2 PU 3.3V Stdby
3	GND
4	PCH RAID KEY

VROC Intel RAID Key Header

The JRK1 header allows the user to enable RAID functions for NVMe connections. Refer to the table below for pin definitions.

Intel RAID Key Header Pin Definitions
Pin# Definition
1 GND
2 PU 3.3V Stdby
3	GND
4	PCH RAID KEY

NC = No Connection

Control Panel

JF1 contains header pins for various buttons and indicators that are normally located on a control panel at the front of the chassis. These connectors are designed specifically for use with Supermicro chassis. See the figure below for the descriptions of the front control panel buttons and LED indicators.

Figure 4-1. JF1 Control Panel Pins

Front Control Panel LEDs

Front Control Panel (JF1)LED Indicators
Event Power (LED1) HDD (LED2)			LAN(LED3/4)	UID (LED5)	Information(LED5)	Power Fail(LED6)	SYS-730A-ISupport
Power On Solid On Supported
HDD Activity Blinking Supported
NIC Activity Blinking Not supported
Overheat Solid On Not supported
Fan Fail					Blinking @1Hz		Not supported
Power Fail					Blinking @1/4Hz	Solid On	Not supported
Local UID On				Solid On			Not supported
Remote UID On				Blinking 1Hz			Not supported
Checking	BMC/BIOSBlinking @4HZ						Not supported
Recovering/Updating	BMC Blinking@4HZBMC 2 Blinks@4Hz,1 Pause @2Hz(on-on-off-off(			BIOS/BMCBlinking@10Hz			Not supported
Flash Not Detectedor Golden ImageCheck Failed	BMC/BIOSBlinking @1HZ						Not supported
CPLD RecoveryMode				Blinking@10Hz(MB UIDLED)	Blinking @10Hz(FP Red LED)		Not supported

Note: JF1 pins 3-13 and 15-20 are not supported by the SYS-730A-I front control panel.

Power On & BMC/BIOS Status LED Button

The Power On and BMC/BIOS Status LED button is located on pins 1 and 2 of JF1. Momentarily contacting both pins will power on/off the system or display BMC/BIOS status.

Refer to the tables below for more information.

Power Button & BIOS/BMC Status LED Indicator Pin Definitions (JF1)

Pin# Definition

1 Signal

2 Ground

Power ButtonPin Definitions (Pin 1 & Pin 2 of JF1)
Status Event
Green: solid on System power on
BMC/BIOS blinking green @ 4Hz BMC/BIOS checking
BIOS blinking green @ 4Hz BIOS recovery/update in progress
BMC blinking red x2 (2 blinks red) @ 4Hz, 1 pause @ 2Hz (on-on-off-off)	BMC recovery/update in progress
BMC/BIOS blinking green @ 1Hz Flash not detected or golden image	checking failure

4.3 Input/Output Ports

Technical diagram of a computer hardware layout with labeled components including CPU, GPU, and PC modules

Figure 4-2. I/O Port Locations and Definitions

Diagram showing labeled components of a computer tower, including VGA, server racks, and Ethernet ports with numbered labels.

Rear I/O Ports
# Description # Description
1 VGA Port 6 7.1 HD Audio
2 USB0 (USB 3.2 Gen 1) 7 LAN1
3 USB1 (USB 3.2 Gen 1) 8 LAN2
4 USB2 (USB 3.2 Gen 1) 9 USB4 (USB 3.2 Gen 2) type A
5 USB3 (USB 3.2 Gen 1)

VGA Port

A video (VGA) port is located next to LAN2 on the I/O back panel. Refer to the board layout below for the location.

7.1 HD (High-Definition) Audio

This motherboard features a 7.1 Channel High-Definition Audio (HDA) codec that provides 8 DAC channels. The HD audio supports multiple-streaming 7.1 sound playback through the front_panel stereo output via the subwoofer speakers. Download the appropriate software from our website to enable this function.

7.1 HD Audio Conn# Signal 1 SPDIF_Out 2 Surround_Out 3 CEN/LFE_Out 4 Mic_In 5 Line_Out 6 Line_In REAR PANEL PHONJACK 3 CEN/LFE OUT LINE IN SURROUND OUT LINE OUT MIC IN HD Audio 2 SURROUND OUT LINE OUT SPDIF OUT REAR PANEL 6 LINE IN/DC-SURR OUT 5 LINE OUT MIC IN

Front Accessible Audio Header

A 10-pin audio header, located at JA1, allows you to use the onboard sound for audio playback. Connect an audio cable to the audio header to use this feature. See the layout below for onboard audio header.

COM Ports

COM connections (COM1) are located on the motherboard. COM1 is located next to PCIe Slot 1 (JPCIE1).

COM PortPin Definitions
Pin# Definition Pin# Definition
1 DCD	6 DSR
2 RXD	7 RTS
3 TXD	8 CTS
4 DTR	9 RI
5	Ground	10	N/A

Ethernet Ports

Two Gigabit Ethernet ports (LAN1, LAN2) are located on the I/O back panel. These Ethernet ports support 1GbE LAN connections on the X12DAi-N6. All of these ports accept RJ45 cables. Please refer to the LED Indicator section for LAN LED information.

LAN PortPin Definition
Pin# Definition Pin# Definition
1 TD0-	11 P3V3_Dual
2 TD0+	12 Act LED (Yellow)
3 TD1-	13		Link 1000(Amber)
4 TD1+	14		Link 100 LED(Green)
5 TD2-	15 GND
6 TD2+	16 GND
7 TD3-	17 GND
8 TD3+	18 GND
9 COMMCT
10 GND

4.4 Jumpers

Explanation of Jumpers

To modify the operation of the motherboard, jumpers are used to choose between optional settings. Jumpers create shorts between two pins to change the function associated with it. Pin 1 is identified with a square solder pad on the printed circuit board. See the motherboard layout page for jumper locations.

Note: On a two-pin jumper, "Closed" means the jumper is on both pins and "Open" indicates the jumper is either on only one pin or has been completely removed.

Connector Pins Jumper Setting 3 2 1 ● ● ■ 3 2 1

CMOS Clear

JBT1 is used to clear CMOS, which will also clear any passwords. Instead of pins, this jumper consists of contact pads to prevent accidentally clearing the contents of CMOS.

To Clear CMOS

1. First power down the system and unplug the power cord(s).
2. Remove the cover of the chassis to access the motherboard.
3. Remove the onboard battery from the motherboard.
4. Short the CMOS pads with a metal object such as a small screwdriver for at least four seconds.
5. Remove the screwdriver (or shorting device).
6. Re-install the motherboard battery.
7. Replace the cover, reconnect the power cord(s), and power on the system.

Note: Clearing CMOS will also clear all passwords.

Do not use the PW_ON connector to clear CMOS.

Watchdog

Watchdog (JWD1) is a system monitor that can reboot the system when a software application hangs. Close pins 1-2 to reset the system if an application hangs. Close pins 2-3 to generate a non-maskable interrupt (NMI) signal for the application that hangs. Refer to the table below for jumper settings. The Watchdog must also be enabled in the BIOS.

WatchdogJumper Settings
Jumper Setting Definition
Pins 1-2 Reset
Pins 2-3 NMI
Open Disabled

Management Engine (ME) Recovery

Use jumper JPME1 to select ME Firmware Recovery mode, which will limit resource allocation for essential system operation only in order to maintain normal power operation and management. In the single operation mode, online upgrade will be available via Recovery mode. See the table below for jumper settings.

Manufacturer ModeJumper Settings
Jumper Setting Definition
Pins 1-2 Normal
Pins 2-3 ME Recovery

4.5 LED Indicators

LAN LEDs

Two LAN ports (LAN 1 and LAN 2) are located on the I/O back panel of the motherboard. Each Ethernet LAN port has two LEDs. The solid green LED indicates activity, while the other LED may be amber or off to indicate the speed of the connection. Refer to the tables below for more information.

LAN Activity LED
Color Status Definition
Green Flashing Active

LAN Link LED

LED Color Definition

Yellow/Amber 1Gbps

M.2 LED

Two M.2 LEDs are located at LE4 and LE7 on the motherboard. When the LED is blinking, M.2 functions normally. Refer to the table below for more information.

M.2 LED State

LED Color Definition

Green: Blinking Device Working

Onboard Power LED

The Onboard Power LED is located at PWRLED on the motherboard. When this LED is on, the system is on. Be sure to turn off the system and unplug the power cord before removing or installing components. Refer to the table below for more information.

Onboard Power LED Indicator
LED Color Definition
Off	System Off(power cable not connected)
Green System	On

BMC Heartbeat LED

A BMC Heartbeat LED is located at LEDM1 on the motherboard. When LEDM1 is blinking, the BMC is functioning normally. Refer to the table below for more information.

BMC Heartbeat LED Indicator
LED Color Definition
Green:Blinking	BMC Normal

Chapter 5

Software

After the hardware has been installed, you can install the Operating System (OS), configure RAID settings and install the drivers.

5.1 Microsoft Windows OS Installation

If you will be using RAID, you must configure RAID settings before installing the Windows OS and the RAID driver. Refer to the RAID Configuration User Guides posted on our website at www.supermicro.com/support/manuals.

Installing the OS

1. Create a method to access the MS Windows installation ISO file. That might be a DVD, perhaps using an external USB/SATA DVD drive, or a USB flash drive, or the IPMI KVM console.
2. Retrieve the proper RST/RSTe driver. Go to the Supermicro web page for your motherboard and click on "Download the Latest Drivers and Utilities", select the proper driver, and copy it to a USB flash drive.
3. Boot from a bootable device with Windows OS installation. You can see a bootable device list by pressing F11 during the system startup.

Please select boot device: ATEN Virtual CDROM YSOJ → IPMI virtual drive (Legacy) ASUS SDRW-08D2S-U F601 → USB DVD device (Legacy) USB FLASH DRIVE PMAP → USB flash drive with OS installation (Legacy) IBA 40-10G Slot 1900 v1060 → PXB boot (Legacy) UEFI: ATEN Virtual CDROM YSOJ → IPMI virtual drive (UEFI) UEFI: ASUS SDRW-08D2S-U F601 → USB DVD device (UEFI) UEFI: Built-in EFI Shell Enter Setup ↑ and ↓ to move selection ENTER to select boot device ESC to boot using defaults

Figure 5-1. Select Boot Device

1. During Windows Setup, continue to the dialog where you select the drives on which to install Windows. If the disk you want to use is not listed, click on "Load driver" link at the

Where do you want to install Windows? Name Total size Free space Type Refresh Delete Format New Load driver Extend We couldn't find any drives. To get a storage driver, click Load driver. Next

Figure 5-2. Load Driver Link

bottom left corner.

To load the driver, browse the USB flash drive for the proper driver files.

• For RAID, choose the SATA/sSATA RAID driver indicated then choose the storage drive on which you want to install it.

• For non-RAID, choose the SATA/sSATA AHCI driver indicated then choose the storage drive on which you want to install it.

• Once all devices are specified, continue with the installation.

• After the Windows OS installation has completed, the system will automatically reboot multiple times.

5.2 Driver Installation

The Supermicro website contains drivers and utilities for your system at https://www.supermicro.com/wdl/driver. Some of these must be installed, such as the chipset driver.

After accessing the website, go into the CDR_Images (in the parent directory of the above link) and locate the ISO file for your motherboard. Download this file to a USB flash drive or a DVD. (You may also use a utility to extract the ISO file if preferred.)

Another option is to go to the Supermicro website at http://www.supermicro.com/products/. Find the product page for your motherboard, and "Download the Latest Drivers and Utilities". Insert the flash drive or disk and the screenshot shown below should appear.

SUPERMICRO X12DAi-N6 Motherboard Drivers & Tools (Win2019) Intel C621A Chipset X12DAi-N6 SUPERMICRO Computer Inc. Intel Chipset INF files Microsoft .Net Framework 4.8 (Optional) ASPEED Graphics Driver Intel Virtual RAID on CPU Intel PRO Network Connections Drivers SUPERMICRO SuperDoctor 5 Build driver diskettes and manuals Browse CD Auto Start Up Next Time For more information, please visit SUPERMICRO's web site.

Figure 5-3. Driver & Tool Installation Screen

Note: Click the icons showing a hand writing on paper to view the readme files for each item. Click the computer icons to the right of these items to install each item (from top to the bottom) one at a time. After installing each item, you must re-boot the system before moving on to the next item on the list. The bottom icon with a CD on it allows you to view the entire contents.

5.3 SuperDoctor® 5

The Supermicro SuperDoctor 5 is a program that functions in a command-line or web-based interface for Windows and Linux operating systems. The program monitors such system health information as CPU temperature, system voltages, system power consumption, fan speed, and provides alerts via email or Simple Network Management Protocol (SNMP).

SuperDoctor 5 comes in local and remote management versions and can be used with Nagios to maximize your system monitoring needs. With SuperDoctor 5 Management Server (SSM Server), you can remotely control power on/off and reset chassis intrusion for multiple systems with SuperDoctor 5 or IPMI. SuperDoctor 5 Management Server monitors HTTP, FTP, and SMTP services to optimize the efficiency of your operation.

SuperDoctor® Manual and Resources

SuperDoctor 5 Health Info Certificate error localhost:1444/SuperDoctor5 Loading Select Language English AOSMIN Loadout Motherboard: CTB360-CB-ML Voltage Temperature Hard Disk install Smartwatch SUPRITICAL/MODER (2038C05) Memory Ask me anything

Figure 5-4. SuperDoctor 5 Interface Display Screen (Health Information)

5.4 BMC

The motherboard provides remote access, monitoring and management through the baseboard management controller (BMC) and other management controllers distributed among different system modules. There are several BIOS settings that are related to BMC. For general documentation and information on BMC, visit our website at:

www.supermicro.com/en/solutions/management-software/bmc-resources

BMC ADMIN User Password

For security, each system is assigned a unique default BMC password for the ADMIN user. This can be found on a sticker on the chassis and a sticker on the motherboard. The sticker also displays the BMC MAC address.

BMC AC1F6BC PWD SUOKJ

Figure 5-5. BMC Password Label

See the motherboard layout in Chapter 1 for the location of the label.

Chapter 6

Optional Components

This chapter describes optional system components.

6.1 Optional Parts List

Optional Parts List
Feature Part Number
Mobile Rack CSE-M14TQC/CSE-M28SACB
2.5" to 3.5" SSD/HDD adapter tray MCP-220-73102-0N
2.5" HDD cage (4x Internal 2.5" HDD) MCP-220-73201-0N
5.25" HH 24X DVD-RW SATA DRIVE PBF DVM-LITE-DVDRW24-HBT1
4U Active CPU Heat Sink SNK-P0080AP4
NVMe cable (one cable supports two U.2 NVMe SSDs) CBL-SAST-0953

6.2 Additional Storage

A mobile rack can be installed in the chassis' 5.25" bay to support hot-swappable drives. An additional internal 2.5" hard drive cage can be installed beneath the rotating drive cage. Both the mobile rack and the hard drive cage require additional hardware or cables.

6.3 TPM Security Module

SPI capable TPM 2.0 with Infineon 9670 controller, vertical form factor

The JTPM1 header is used to connect a Trusted Platform Module (TPM). A TPM is a security device that supports encryption and authentication in hard drives. It enables the motherboard to deny access if the TPM associated with the hard drive is not installed in the system.

Details and installation procedures are at:

http://www.supermicro.com/manuals/other/TPM.pdf.

• AOM-TPM-9670V

Chapter 7

Troubleshooting and Support

7.1 Information Resources

Website

A great deal of information is available on the Supermicro website, supermicro.com.

SUPERMIC® Products Solutions Company News Support OPEN STORAGE SUMMIT '21 Driving advanced platform innovations for scale-out cloud and datacenter infrastructure

Figure 7-1. Supermicro Website

• Specifications for servers and other hardware are available by clicking on Products.
• The Support option offers downloads (manuals, BIOS/BMC, drivers, etc.), FAQs, RMA, warranty, and other service extensions.

Direct Links for the SYS-730A-I System

SYS-730A-I specifications page

X12DAi-N6 motherboard page for links to the Quick Reference Guide, User Manual, validated storage drives, etc.

Direct Links for General Support and Information

Frequently Asked Questions

Add-on card descriptions

TPM User Guide

General Memory Configuration Guide: X12

BMC User Guide

SuperDoctor5 Large Deployment Guide

For validated memory, use our Product Resources page

Direct Links (continued)

Product Matrices page for links to tables summarizing specs for systems, motherboards, power supplies, riser cards, add-on cards, etc.

Security Center for recent security notices

Supermicro Phone and Addresses

7.2 BMC Interface

The system supports the Baseboard Management Controller (BMC) Interface. BMC is used to provide remote access, monitoring and management. There are several BIOS settings that are related to BMC.

For general documentation and information on BMC, please visit our website at: https://www.supermicro.com/manuals/other/BMC_Users_Guide_X12_H12.pdf.

System Component Info Health Event Log Storage Monitoring Configuration + Remote Control Maintenance System System Manage UG Control Firmware Update Sensor Readings System Firmware Version 8.18.94 (DETA) Firmware Build Time 04/10/2029 Host:1.6.6 BIDS Version BIDS Build Time CPLD Version F0.05.06 BMC Mac Address AC:1F 60.2D 22.0C LAN 1 Mac Address AC:1F 60.CA 22.6A LAN 2 Mac Address AC:1F 60.CA 22.8B LAN 1 Mac Address OC:C4 7A:D9:M2.7E LAN 2 Mac Address OC:C4 7A:D9:M2.7F LAN 1 Mac Address AC:1F 60.CF 32.7A LAN 2 Mac Address AC:1F 60.CF 37.FB Host Server Host Name Server IP Address 173.31.56.213 IPv6 Address 1 for60.0.0 or if80.0 ifc3.340 IPv6 Address 2 IPv6 Address 3 IPv6 Address 4 IPv6 Address 5 IPv6 Address 6 Power Consumption Sita Peak - Average Usage - Vaxi Peak X.Time(min), Y:Power Consumption (Watt) Remote Console Preview JAVA plug in HTMLS release Image

Figure 7-2. BMC Dashboard

7.3 Troubleshooting Procedures

Use the following procedures to troubleshoot your system. If you have followed all of the procedures below and still need assistance, refer to the Technical Support Procedures or Returning Merchandise for Service section(s) in this chapter. Power down the system before changing any non hot-swap hardware components.

No Power

1. Remove power from the system.

2. Remove the system from the rack, if necessary, and place on a stable surface.

Power LED JPWR1 JPWR2 JPWR3 JPWR4 CPU2 CPU1 POWER LED POWER LED POWER LED POWER LED POWER LED POWER LED POWER LED POWER LED POWER LED POWER LED POWER LED POWER LED POWER LED POWER LED POWER LED POWER LED POWER LED POWER LED POWER LED POWER LED POWER LED POWER LED POWER LED POWER LED POWER LED POWER LED POWER LED POWER LED POWER LED POWER LED POWER LED POWER LED POWER LED POWER LED

Figure 7-3. Location of the MB Power LED

1. Remove the tower side cover.

2. Move aside any other cables obstructing the view of the power LED.

3. Reconnect the power cables and power up the system.

4. As you try to power up the system, note any beep codes. Refer to the next section for details on beep codes.

5. Check that the power LED on the motherboard is on.
6. Make sure that the power connector is connected to your power supply.
7. Make sure that no short circuits exist between the motherboard and chassis.
8. Disconnect all cables from the motherboard, including those for the keyboard and mouse.
9. Remove all add-on cards.
10. Install a CPU, a heatsink, connect the internal speaker (if applicable), and the power LED to the motherboard. Make sure that the heatsink is fully seated.
11. Use the correct type of onboard CMOS battery as recommended by the manufacturer. Check to verify that it still supplies \~3VDC. If it does not, replace it with a new one. Warning: To avoid possible explosion, do not install the battery upside down.
12. Verify that all jumpers are set to their default positions.
13. Check that the power supplies' input voltage operate at 100-120V or 180-240V.
14. Turn the power switch on and off to test the system

No Video

1. If the power is on but you have no video, remove all the add-on cards and cables.

2. As you try to power up the system, note any beep codes. Refer to the next section for details on beep codes.

System Boot Failure

If the system does not display POST (Power-On-Self-Test) or does not respond after the power is turned on, check the following:

Turn on the system with only one DIMM module installed. If the system boots, check for bad DIMM modules or slots by following the Memory Errors Troubleshooting procedure below.

Memory Errors

1. Make sure that the DIMM modules are properly and fully installed.
2. Confirm that you are using the correct memory. Also, it is recommended that you use the same memory type and speed for all DIMMs in the system. See Section 3.4 for memory details.
3. Check for bad DIMM modules or slots by swapping modules between slots and noting the results.
4. Check the power supply voltage 115V/230V switch.

Losing the System's Setup Configuration

1. Make sure that you are using a high quality power supply. A poor quality power supply may cause the system to lose the CMOS setup information.
2. The battery on your motherboard may be old. Check to verify that it still supplies \~3VDC. If it does not, replace it with a new one.
3. If the above steps do not fix the setup configuration problem, contact your vendor for repairs.

When the System Becomes Unstable

If the system becomes unstable during or after OS installation, check the following:

1. CPU/BIOS support: Make sure that your CPU is supported and that you have the latest BIOS installed in your system.
2. Memory support: Make sure that the memory modules are supported by testing the modules using memtest86 or a similar utility.
   Note: Refer to the product page on our website at http://www.supermicro.com for memory and CPU support and updates.
3. HDD support: Make sure that all hard disk drives (HDDs) work properly. Replace the bad HDDs with good ones.

4. System cooling: Check the system cooling to make sure that all heatsink fans and CPU/system fans, etc., work properly. Check the hardware monitoring settings in the BMC to make sure that the CPU and system temperatures are within the normal range. Also check the front panel Overheat LED and make sure that it is not on.

5. Adequate power supply: Make sure that the power supply provides adequate power to the system. Make sure that all power connectors are connected. Please refer to our website for more information on the minimum power requirements.

6. Proper software support: Make sure that the correct drivers are used.

If the system becomes unstable before or during OS installation, check the following:

1. Source of installation: Make sure that the devices used for installation are working properly, including boot devices such as CD.
2. Cable connection: Check to make sure that all cables are connected and working properly.
3. Using the minimum configuration for troubleshooting: Remove all unnecessary components (starting with add-on cards first), and use the minimum configuration (but with a CPU and a memory module installed) to identify the trouble areas. Refer to the steps listed in Section 7.3 above for proper troubleshooting procedures.
4. Identifying bad components by isolating them: If necessary, remove a component in question from the chassis, and test it in isolation to make sure that it works properly. Replace a bad component with a good one.
5. Check and change one component at a time instead of changing several items at the same time. This will help isolate and identify the problem.
6. To find out if a component is good, swap this component with a new one to see if the system will work properly. If so, then the old component is bad. You can also install the component in question in another system. If the new system works, the component is good and the old system has problems.

7.4 BIOS Error Beep (POST) Codes

During the POST (Power-On Self-Test) routines, which are performed each time the system is powered on, errors may occur.

Non-fatal errors are those which, in most cases, allow the system to continue the boot-up process. The error messages normally appear on the screen.

Fatal errors are those which will not allow the system to continue the boot-up procedure. If a fatal error occurs, you should consult with your system manufacturer for possible repairs.

These fatal errors are usually communicated through a series of audible beeps. The table below lists some common errors and their corresponding beep codes encountered by users.

BIOS Error Beep (POST) Codes
Beep Code Error	Message Description
1 short Refresh Circuits have been reset (Ready to power up)
5 short, 1 long Memory error No memory detected in system
5 long, 2 short Display memory read/write error Video adapter missing or with faulty memory
1 long continuous System OH System overheat condition

Additional BIOS POST Codes

The AMI BIOS supplies additional checkpoint codes, which are documented online at http://www.supermicro.com/support/manuals/ ("AMI BIOS POST Codes User's Guide").

When BIOS performs the Power On Self Test, it writes checkpoint codes to I/O port 0080h. If the computer cannot complete the boot process, a diagnostic card can be attached to the computer to read I/O port 0080h (Supermicro p/n AOC-LPC80-20).

For information on AMI updates, please refer to http://www.ami.com/products/.

7.5 Crash Dump Using BMC

In the event of a processor internal error (IERR) that crashes your system, you may want to provide information to support staff. You can download a crash dump of status information using BMC. The BMC manual is available at https://www.supermicro.com/en/solutions/management-software/bmc-resources.

Check BMC Error Log

1. Access the BMC web interface.
2. Click the Server Health tab, then Event Log to verify an IERR error.

Dashboard System Component Info Health Event Log Configuration Remote Control Maintenance Advanced Settings Filter x Sensor-specific x Threshold x Generic x OEM x Unspecified Health Event Log Clear Health Event Log Export to Excel Severity * * * Data/Time Sensor Type Categories Description Event Type 2020-10-15 18:57:06 ACPowerOn [OEM] First AC Power on - Assertion Sensor-specific 2020-10-15 18:56:43 System MIC [OEM] Dedicated LAN Link Up - Assertion Sensor-specific 2020-10-15 17:41:37 ACPowerOn [OEM] First AC Power on - Assertion Sensor-specific 2020-10-15 17:41:17 System MIC [OEM] Dedicated LAN Link Up - Assertion Sensor-specific 2020-10-15 17:41:14 System MIC [OEM] Dedicated LAN Link Down - Assertion Sensor-specific 2020-10-15 17:41:12 System MIC [OEM] Dedicated LAN Link Up - Assertion Sensor-specific x < 1 / 1 / 1 1 - 6 / 6

Figure 7-4. BMC Event Log

In the event of an IERR, the BMC executes a crash dump. You must download the crash dump and save it.

7.6 UEFI BIOS Recovery

Warning: Do not upgrade the BIOS unless your system has a BIOS-related issue. Flashing the wrong BIOS can cause irreparable damage to the system. In no event shall Supermicro be liable for direct, indirect, special, incidental, or consequential damages arising from a BIOS update. If you do update the BIOS, do not shut down or reset the system while the BIOS is updating to avoid possible boot failure.

Overview

The Unified Extensible Firmware Interface (UEFI) provides a software-based interface between the operating system and the platform firmware in the pre-boot environment. The UEFI specification supports an architecture-independent mechanism that will allow the UEFI OS loader stored in an add-on card to boot the system. The UEFI offers clean, hands-off management to a computer during system boot.

Recovering the UEFI BIOS Image

A UEFI BIOS flash chip consists of a recovery BIOS block and a main BIOS block (a main BIOS image). The recovery block contains critical BIOS codes, including memory detection and recovery codes for the user to flash a healthy BIOS image if the original main BIOS image is corrupted. When the system power is turned on, the recovery block codes execute first. Once this process is complete, the main BIOS code will continue with system initialization and the remaining POST (Power-On Self-Test) routines.

Note 1: Follow the BIOS recovery instructions below for BIOS recovery when the main BIOS block crashes.

Note 2: When the BIOS recovery block crashes, you will need to follow the procedures to make a Returned Merchandise Authorization (RMA) request. Also, you may use the Supermicro Update Manager (SUM) Out-of-Band (https://www.supermicro.com.tw/products/nfo/SMS_SUM.cfm) to reflash the BIOS.

Recovering the Main BIOS Block with a USB Device

This feature allows the user to recover the main BIOS image using a USB-attached device without additional utilities used. A USB flash device such as a USB Flash Drive, or a USB CD/DVD ROM/RW device can be used for this purpose. However, a USB Hard Disk drive cannot be used for BIOS recovery at this time.

The file system supported by the recovery block is FAT (including FAT12, FAT16, and FAT32) which is installed on a bootable or non-bootable USB-attached device. However, the BIOS might need several minutes to locate the SUPER.ROM file if the media size becomes too large due to the huge volumes of folders and files stored in the device.

To perform UEFI BIOS recovery using a USB-attached device, follow the instructions below.

1. Using a different machine, copy the "Super.ROM" binary image file into the Root "\" directory of a USB device or a writable CD/DVD.
   Note 1: If you cannot locate the "Super.ROM" file in your drive disk, visit our website at www.supermicro.com to download the BIOS package. Extract the BIOS binary image into a USB flash device and rename it "Super.ROM" for the BIOS recovery use.
   Note 2: Before recovering the main BIOS image, confirm that the "Super.ROM" binary image file you download is the same version or a close version meant for your motherboard.
2. Insert the USB device that contains the new BIOS image ("Super.ROM") into your USB drive and reset the system when the following screen appears.
3. After locating the healthy BIOS binary image, the system will enter the BIOS Recovery menu as shown below.

SUPERMO BMC IP:10.132.161.13 PEI--Could Not Find Recovery Image... 87

Note: At this point, you may decide if you want to start the BIOS recovery. If you decide to proceed with BIOS recovery, follow the procedures below.

Option Setup Utility - Copyright (C) 2017 American Megatrends, Inc. Main Advanced Earnings PDF Recovery Security Boot Save & Exit Please select blocks you want to update Reset Value (Enabled) Boot Black Update (Enabled) ▶ Proceed with flash update Set this option to reset NORM to default values H: Select Screen T4: Select Item Enter Select +/- Change Out... F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit ESC: EXIT Version 2.19.1960 Copyright 12/7/2017 American Megatrends, Inc.

1. When the screen as shown above displays, use the arrow keys to select the item "Proceed with flash update" and press the key. You will see the BIOS recovery progress as shown in the screen below.

Note: Do not interrupt the BIOS flashing process until it has completed.

1. After the BIOS recovery process is complete, press any key to reboot the system.
2. Using a different system, extract the BIOS package into a USB flash drive.

Auto Setup Utility - Copyright (C) 2017 American Newsrends, Inc. Recovery WARNING System firmware is being updated. Keyboard is locked. DO NOT TURN THE POWER OFF IT Price firmware update is completed press any key to reboot the system Program new data write new boot block... 17% +: Select Screen T4: Select item Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: For Indicnd Default F4: Save & Exit EKC: Exit Version 2.18.1266. Copyright (C) 2017 American Newsrends, Inc.

1. Press continuously during system boot to enter the BIOS Setup utility. From the top of the tool bar, select Boot to enter the submenu. From the submenu list, select Boot

Ratio Setup Utility - Copyright (CF 2017 American Mapsrends, Inc. Recovery) HABNINIT System firmware is being updated. Keyboard is locked. DO NOT THAN THE POWER OFF !!! Once firmware update is completed press any key to reboot the system Flash update Flash update completed. Press any key to reset the system #+: Select Screen I1: Select Items Enter: Select +/-: Change Opt. F1: General Help F2: Previous Values F3: Optimized Defaults F4: Save & Exit SRS: Exit Version 2.15.1956. Copyright (CF 2017 American Repetrends, Inc.

Option #1 as shown below. Then, set Boot Option #1 to [UEFI AP:UEFI: Built-in EFI Shell]. Press to save the settings and exit the BIOS Setup utility.

1. When the UEFI Shell prompt appears, type fs# to change the device directory path. Go to the directory that contains the BIOS package you extracted earlier from Step 6. Enter flash.nsh BIOSname.### at the prompt to start the BIOS update process.

Auto Setup Utility - Copyright (C) 2017 American Megatrends, Inc. Main Advanced Event Log: IPRC Security Boot Save & Exit Boot Configuration Boot mode select [Dual] LEGACY to EFT support [Disabled] FIXED BOOT ORDER Priorities Boot Option #3 [IDEF] HP(IDEF: Max...) Boot Option #2 [OW/DVD] Boot Option #3 [USB Hard Disk] Boot Option #4 [USB CD/DVI] Boot Option #5 [USB Key/DimDisk] Boot Option #6 [USB Floopy] Boot Option #7 [USB Lan] Boot Option #8 [Network: IBM GE SI,...] Boot Option #9 [IDEF Hard Disk] Boot Option #10 [IDEF CPU/DVI] Boot Option #11 [IDEF USB Hard Disk] Boot Option #12 [IDEF USB CPU/DVI] Boot Option #13 [IDEF USB Key/IDEF...] Boot Option #14 [IDEF USB Floopy] Boot Option #15 [IDEF USB Lan] Boot Option #16 [IDEF Network] Boot Option #17 [Hard Disk] Add New Boot Option Sets the system boot order +/- Select Screen T4: Select Item Enter: Select +/-: Change Opt, F1: Genera) Help F2: Precious Values F3: Optimized Defaults F4: Save & Exit ESC: Exit Version 2.19.126t Copyright (S) SRL American Megatrends, Inc.

Note: Do not interrupt this process until the BIOS flashing is complete.

LEFI Interactive Shell v2.1 ESR II LEFI v2.50 (American Regatrends, 0x008900C) Mapping status FSD: K13P07/0x0P07-0x1; FSLR001/0x0/PCL(0x14,0x0)/0x0(0x1,0x0)/0x1(LMR,0x07991072,0x096,0x1 DRG592) BLRR: Riso(x1) FSLR001/0x0/PCL(0x14,0x0)/0x0(0x1,0x0) Press FSR is 1 seconds to make startup.msh or any other key to continue. Shell: FSD FSD: VAPD005-> cd SAPMHE2.0362012 FSD: VAPD005/0APMHE2.0362017-> flogh.msh X13P07_3X4

1. The screen above indicates that the BIOS update process is complete. When you see the screen above, unplug the AC power cable from the power supply, clear CMOS, and plug

Done. [ Access Once Port Ex ] +Block Index 0=51: 0x18 Done. * Program BIOS and ME (including AOT) regions... * * AMD Firmware Update Utility v0.09.01.1317 Copyright ©2017 American Registrends Inc. All Rights Reserved. OPUD = 50662 Reading Flash ....... done - ME Data Size checking . OK - PFS checksums ....... OK - Check BookAgeout ....... do Grading Boot Block ....... done Updating Boot Block ....... done Verifying Boot Book ....... done Striking Mesh Block ....... 0400132049 (OD)

the AC power cable in the power supply again to power on the system.

1. Press continuously to enter the BIOS Setup utility.

Verifying NLL Book ....... done - Update success for ROR - Update success for SE... - Successful update Recovery Loader to (PRR) - Successful update NTSE11- - Successful update FMR11- - Successful update NR, 1081 and NTSE21- - Successful update FLOD and UTO11- - ML entire image update success 11 WARNING : System must power-off to have the changes take effect! Moving FOR/WR000/SAP/ME2_03162057/10x64_at1 -> FOR/WR000/SAP/ME2_00362017_v df, sac - [s] Moving FOR/WR000/SAP/ME2_03162057/10x64_at1 -> FOR/WR000/SAP/ME2_03162017_v ?ifuvel, sac - [s] ********************************************************************** * Please ignore this "Shell cannot read from file - double error" * Learning message due to it does not impact flashing process. ********************************************************************** (* *) (-) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* *) (* )

1. Press to load the default settings.
2. After loading the default settings, press to save the settings and exit the BIOS Setup utility.

7.7 CMOS Clear

JBT1 is used to clear CMOS, which will also clear any passwords. Instead of pins, this jumper consists of contact pads to prevent accidentally clearing the contents of CMOS.

To Clear CMOS

1. First power down the system completely.
2. Remove chassis side cover to access the motherboard.
3. Remove the onboard battery from the motherboard.
4. Short the CMOS pads with a metal object such as a small screwdriver for at least four seconds.
5. Remove the screwdriver or shorting device.
6. Re-install the motherboard battery.
7. Replace the cover, reconnect the power cords and power on the system.

Notes: Clearing CMOS will also clear all passwords.

Do not use the PW_ON connector to clear CMOS.

JBT1 contact pads

7.8 Where to Get Replacement Components

If you need replacement parts for your system, to ensure the highest level of professional service and technical support, purchase exclusively from our Supermicro Authorized Distributors/System Integrators/Resellers. A list can be found at: http://www.supermicro.com. Click the "Where to Buy" tab.

7.9 Reporting an Issue

Technical Support Procedures

Before contacting Technical Support, please take the following steps. If your system was purchased through a distributor or reseller, please contact them for troubleshooting services. They have the best knowledge of your specific system configuration.

1. Please review the Troubleshooting Procedures in this manual and Frequently Asked Questions on our website before contacting Technical Support.
2. BIOS upgrades can be downloaded from our website. Note: Not all BIOS can be flashed depending on the modifications to the boot block code.

3. If you still cannot resolve the problem, include the following information when contacting us for technical support:

4. System, motherboard, and chassis model numbers and PCB revision number

5. BIOS release date/version (this can be seen on the initial display when your system first boots up)
6. System configuration

An example of a Technical Support form is posted on our website. Distributors: For immediate assistance, please have your account number ready when contacting our technical support department by email.

Returning Merchandise for Service

A receipt or copy of your invoice marked with the date of purchase is required before any warranty service will be rendered. You can obtain service by calling your vendor for a Returned Merchandise Authorization (RMA) number. When returning to the manufacturer, the RMA number should be prominently displayed on the outside of the shipping carton, and mailed prepaid or hand-carried. Shipping and handling charges will be applied for all orders that must be mailed when service is complete.

For faster service, RMA authorizations may be requested online (http://www.supermicro.com/support/rma/).

Whenever possible, repack the chassis in the original Supermicro carton, using the original packaging material. If these are no longer available, be sure to pack the chassis securely, using packaging material to surround the chassis so that it does not shift within the carton and become damaged during shipping.

This warranty only covers normal consumer use and does not cover damages incurred in shipping or from failure due to the alteration, misuse, abuse or improper maintenance of products.

During the warranty period, contact your distributor first for any product problems.

Vendor Support Filing System

For issues related to Intel, use the Intel IPS filing system:

https://www.intel.com/content/www/us/en/design/support/ips/training/welcome.html

For issues related to Red Hat Enterprise Linux, since it is a subscription based OS, contact your account representative.

7.10 Feedback

Supermicro values your feedback as we strive to improve our customer experience in all facets of our business. Please email us at [e-mail] to provide feedback on our manuals.

Appendix A

Standardized Warning Statements for AC Systems

About Standardized Warning Statements

The following statements are industry standard warnings, provided to warn the user of situations which have the potential for bodily injury. Should you have questions or experience difficulty, contact Supermicro's Technical Support department for assistance. Only certified technicians should attempt to install or configure components.

Read this appendix in its entirety before installing or configuring components in the Supermicro chassis.

These warnings may also be found on our website at http://www.supermicro.com/about/policies/safety_information.cfm.

Warning Definition

Warning! This warning symbol means danger. You are in a situation that could cause bodily injury. Before you work on any equipment, be aware of the hazards involved with electrical circuitry and be familiar with standard practices for preventing accidents.

警告の定義

この警告サインは危険を意味します。

Installation Instructions

Warning! Read the installation instructions before connecting the system to the power source.

設置手順書

Warning! This product relies on the building's installation for short-circuit (overcurrent) protection. Ensure that the protective device is rated not greater than: 250 V, 20 A.

サーキット・ブレーカー

Power Disconnection Warning

Warning! The system must be disconnected from all sources of power and the power cord removed from the power supply module(s) before accessing the chassis interior to install or remove system components.

CAUTION: This unit has redundant power sources. Please disconnect all the power cords before servicing.

電源切断の警告

Equipment Installation

Warning! Only trained and qualified personnel should be allowed to install, replace, or service this equipment.

機器の設置

Warning! This unit is intended for installation in restricted access areas. A restricted access area can be accessed only through the use of a special tool, lock and key, or other means of security. (This warning does not apply to workstations).

アクセス制限区域

Warning! There is the danger of explosion if the battery is replaced incorrectly. Replace the battery only with the same or equivalent type recommended by the manufacturer. Dispose of used batteries according to the manufacturer's instructions

電池の取り扱い

Redundant Power Supplies

Warning! This unit might have more than one power supply connection. All connections must be removed to de-energize the unit.

冗長電源装置

Warning! Hazardous voltage or energy is present on the backplane when the system is operating. Use caution when servicing.

バックプレーンの電圧

Comply with Local and National Electrical Codes

Warning! Installation of the equipment must comply with local and national electrical codes.

地方および国の電気規格に準拠

Warning! Ultimate disposal of this product should be handled according to all national laws and regulations.

製品の廃棄

Warning! Hazardous moving parts. Keep away from moving fan blades. The fans might still be turning when you remove the fan assembly from the chassis. Keep fingers, screwdrivers, and other objects away from the openings in the fan assembly's housing.

ファン・ホットスワップの警告

Power Cable and AC Adapter

Warning! When installing the product, use the provided or designated connection cables, power cables and AC adaptors. Using any other cables and adaptors could cause a malfunction or a fire. Electrical Appliance and Material Safety Law prohibits the use of UL or CSA-certified cables (that have UL/CSA shown on the cord) for any other electrical devices than products designated by Supermicro only.

電源コードとACアダプター

Dual Intel Xeon 3rd Gen Intel Xeon Scalable Processors (Socket P+) with up to 40 cores and a thermal design power (TDP) of up to 270W

Note: Refer to the motherboard specifications pages on our website for updates to supported processors. Certain CPU SKUs are conditionally supported. Please contact Supermicro Technical Support for additional information about specialized system optimization.

Chipset

Intel PCH C621A

BIOS

AMI BIOS

ACPI 3.0 or later, PCI firmware 4.0 support, BIOS rescue hot-key, SPI dual/quad speed support, RTC (Real Time Clock) wakeup, and SMBIOS 3.0 or later

Memory

Up to 4 TB of 3DS LRDIMM/LRDIMM/3DS RDIMM/RDIMM DDR4 (288-pin) ECC memory with speeds of 3200/2933/2666 MHz in 16 memory slots and up to 4 TB of Intel Optane PMem 200 Series with speeds of up to 3200 MHz

Note: PMem 200 Series are supported on 3rd gen Intel Xeon Scalable Platinum, Gold and selected Silver processors.

Storage Drives

Drive Bays:

Four fixed 3.5" SATA drive bays

Connectors:

Two onboard NVMe connectors (optional cables required for NVMe support)

One VROC Key header

PCI Expansion Slots

One PCIe 4.0 x8 slot

Five PCIe 4.0 x16 slots

Two onboard PCIe 4.0 x4 M.2 slots in the 2280 and 22110 form factors

Networking

Two 1GbE LAN ports

Input/Output

COM: one onboard serial COM header

SATA: eight onboard S-SATA 3.0 ports (two are SuperDOM supported)

VGA: one rear VGA port

USB: four rear USB 3.2 Gen 1 ports, one rear USB 3.2 Gen 2 port, two front USB 3.2 Gen 1 ports, one front USB 3.2 Gen 2

Type-C port

Audio: 7.1 HD Audio rear ports, one onboard buzzer header, one front line-out, one front mic-in

Motherboard

X12DAi-N6

Chassis

CSE-735D4-1K26B

Security

Onboard TPM/Port 80 header

System Cooling

Two internal fans, two CPU heatsinks (sold separately)

Power Supply

Model: PWS-1K26P-PQ, 1200W, 80Plus Platinum level

AC Input

100-127 Vac, 9-7.5A, 50-60 Hz

200-240 Vac, 6-5A, 50-60 Hz

+12V

Max: 66.7 A, Min: 0 A (100 Vac–127 Vac)

Max: 83 A, Min: 0 A (200 Vac–240 Vac)

+5 V standby: Max: 4 A, Min: 0 A

Operating Environment

Operating Temperature: 10° to 40° C (50° to 95° F)

Non-operating Temperature: -40° to 60° C (-40° to 140° F)

Operating Relative Humidity: 8% to 90% (non-condensing)

Non-operating Relative Humidity: 5% to 95% (non-condensing)

Regulatory Compliance

FCC Class A, ICES, CE, VCCI, RCM, NRTL, CB

Applied Directives, Standards

EMC/EMI: 2014/30/EU (EMC Directive)

FCC Part 15

ICE-003

VCC 32-1

AS/NZS CISPR 32

EN55032

EN55035

CISPR 24

EN 61000-3-2

EN 61000-3-3

EN 61000-4-2

EN 61000-4-3

EN 61000-4-4

EN 61000-4-5

EN 61000-4-6

EN 61000-4-8

EN 61000-4-11

Green Environment:

2011/65/EU (RoHS Directive)

EC 1907/2006 (REACH)

2012/19/EU (WEEE Directive)

Product Safety: 2014/35/EU (LVD Directive)

UL/CSA 60950-1, 62368-1 (USA and Canada)

IEC/EN 60950-1, 62368-1

Perchlorate Warning

California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only to products containing CR (Manganese Dioxide) Lithium coin cells. "Perchlorate Material-special handling may apply. See www.dtsc.ca.gov/hazardouswaste/perchlorate"