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USER MANUAL SY89206V Microchip

3.3V/5V 1 GHz Differential PECL/ECL Receiver/Buffer

Features

• Maximum Frequency >1.0 GHz
• 3.3V and 5V Power Supply Options
• 250 ps Typical Propagation Delay
• High Bandwidth Output Transitions
- Internal 75 kΩ Input Pull-Down Resistors
• 100k PECL/ECL Compatible
- Open Input Default State
- Industrial Temperature Range: -40^ to +85^
• Available in an Ultra-Small 8-Pin 2 mm x 2 mm DFN Package

Package Type

Microchip SY89206V - Package Type - 1

text_image SY89206V 8-Lead DFN NC 1 8 VCC D 2 7 Q /D 3 A₇⁴⁰⁶⁷⁵ 6 /Q VBB 4 5 VEE

General Description

The SY89206V is a differential PECL/ECL receiver/buffer in a space-saving (2 mm x 2 mm) DFN package. The device is functionally equivalent to the SY100EL16V, but features a 70% smaller footprint.

The SY89206V provides a VBB output for either single-ended use or as a DC bias for AC-coupling to the device. The VBB pin should be used only as a bias for the SY89206V as its current sink/source capability is limited. Whenever used, the VBB pin should be bypassed with a 0.01 F capacitor to VCC.

Under open input conditions (pulled to VEE), internal input clamps will force the Q output LOW.

Block Diagram

Microchip SY89206V - Block Diagram - 1

text_image D /D A_V≈40V/V Q /Q

1.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings †

PECL Power Supply Voltage ( V_CC ) (Note 1)....+8V
NECL Power Supply Voltage ( V_EE ) (Note 2)....-8V
PECL Mode Input Voltage ( V_IN ) (Note 3) ..... +6V
NECL Mode Input Voltage ( V_IN ) (Note 4) ..... -6V
Continuous Output Current ( I_OUT ) 50 mA
Surge Output Current ( I_OUT ) 100 mA

† Notice: Stresses above those listed under “Absolute Maximum ratings” may cause permanent damage to the device. Exposure to maximum rating conditions for extended periods may affect device reliability.

Note 1: V EE = 0V.

2: V CC = 0V.
3: V_EE = 0V, V_IN ≤ V_CC.
4: V CC = 0V, VIN ≥ VEE.

5: Mil Std. 883 Human Body Model, all pins

DC ELECTRICAL CHARACTERISTICS (Note 1)

Electrical Characteristics: V_CC = 3.0V to 5.5V; V_EE = 0V or V_EE = -5.5V to -3.0V; V_CC = 0V ; T_A = -40^ to +85°C, unless otherwise stated.

ParameterSymbolMin.Typ.Max.UnitsConditions
Power Supply Current I_EE 2126mA
Output High Voltage (Note 2) V_OH V_CC - 1.085 V_CC - 0.88 V
Output Low Voltage (Note 2) V_OL V_CC - 1.830 V_CC - 1.555 V
Input High Voltage (Single-Ended) V_IH V_CC - 1.165 V_CC - 0.880 V
Input Low Voltage (Single-Ended) V_IL V_CC - 1.810 V_CC - 1.475 V
Output Reference Voltage V_BB V_CC - 1.38 V_CC - 1.26 V
Common Mode Range (Note 3) V_IHCMR V_EE + 2.0 V_CC - 0.4 V
Input High Current I_IH 150μA —
Input Low Current I_IL 0.5μA —

Note 1: Devices are designed to meet the DC specifications shown in the above table after thermal equilibration has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse airflow greater than 500 lFpm is maintained.

2: Outputs are terminated through a 50Ω resistor to V CC - 2.0V.

3: The CMR range is referenced to the most positive side of the differential input voltage. Normal operation is obtained if the high level falls within the specified range and the peak-to-peak voltage lies between 150 mV and 1V.

AC ELECTRICAL CHARACTERISTICS

Electrical Characteristics: V_CC = 3.3V to 5.5V, V_EE = 0V or V_EE = -5.5V to -3.0V; V_CC = 0V ; T_A = -40^ to +85°C, unless otherwise stated. R_L = 50 to V_CC - 2.0V

Parameter Symbol Min. Typ. Max. Units Conditions
Maximum Frequency fMAX1.0 —— GHz VOUT ≥ 400 mV
Propagation Delay D to Q (Differential) t_PLH, t_PHL 125250375ps
Propagation Delay D to Q (Single-Ended) t_PLH, t_PHL 75250425ps
Duty Cycle Skew (Note 1) t_SKEW 520ps
Input Swing (Note 2) V_PP 1501000mV
Output Rise/Fall Time Q (20% to 80%) t_f/t_f 100225350ps

Note 1: Duty cycle skew is the difference between a t_PLH and t_PHL propagation delay through a device.
2: Input swing for which AC parameters are ensured. The device has a DC gain of ≈40 .

TEMPERATURE SPECIFICATIONS

Parameters Symbol Min.Typ. Max.Units Conditions
Temperature Ranges
Operating Temperature Range TA-40 —+85 °C —
Storage Temperature Range TS-65 —+150 °C —
Lead Temperature TLEAD— +260 °C Soldering, 20 sec.
Package Thermal Resistance (DFN)
Junction-to-Ambient _JA 93°C/WStill-Air
87500 Ifpm
Junction-to-Case _JC 45— °C/W —

2.0 PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 2-1.

TABLE 2-1: PIN FUNCTION TABLE

Pin NumberPin Name Type Description
2, 3 D, /D100K ECL InputDifferential PECL/ECL Input: The signal inputs include internal 75 kΩ pull-down resistors. If inputs are left open, Q output will default to LOW. See Section 3.0 “Input Interface Application” for single-ended inputs.
7, 6Q, /Q100K ECL OutputDifferential PECL/ECL Output: Q output defaults to LOW if D inputs left open. See Section 4.0 “Termination Recommendations” for recommendations on terminations.
8VCCPositive Power SupplyPositive Power Supply: Bypass with 0.1 μF//0.01 μF low ESR capacitors.
5VEE Exposed PadNegative Power SupplyNegative Power Supply: VEE and exposed pad must be tied to most negative supply. For PECL/LVPECL connect to ground.
4VBBReference Voltage OutputBias Voltage: V_CC - 1.32V. Used as reference voltage when AC coupling to the D, /D inputs. Max sink/source is ±0.5 mA.
1NCNo connection.

3.0 INPUT INTERFACE APPLICATION

Microchip SY89206V - INPUT INTERFACE APPLICATION - 1

text_image Vcc 0.01µF /D VBB SY89206V

FIGURE 3-1: Single-Ended LVPECL Input (Terminating Unused Input).

4.0 TERMINATION RECOMMENDATIONS

Microchip SY89206V - TERMINATION RECOMMENDATIONS - 1

text_image VCC Z0 = 50Ω Z0 = 50Ω VCC -2V R1 R1 VCC R2 R2 VCC = 3.3V; R1 = 130Ω, R2 = 82Ω VCC = 5V; R1 = 83Ω, R2 = 125Ω

FIGURE 4-1: Parallel Thevenin-Equivalent Termination.

Microchip SY89206V - TERMINATION RECOMMENDATIONS - 2

text_image Vcc Z0 = 50Ω Z0 = 50Ω Vcc 50Ω 50Ω Rpd C (Optional) Vcc = 3.3V; Rpd = 50Ω Vcc = 5V; Rpd = 100Ω 0.01μF

FIGURE 4-2: Three Resistor Y - Termination.

Microchip SY89206V - TERMINATION RECOMMENDATIONS - 3

text_image VCC R1 ZO = 50Ω VCC R2 VCC—2V R1 R3 VCC R4 VCC—1.3V VCC= 3.3V; R1 = 130Ω, R2 = 82Ω, R3 = 1kΩ, R4 = 1.6kΩ, VCC= 5V; R1 = 83Ω, R2 = 125Ω, R3 = 1kΩ, R4 = 2.8kΩ,

FIGURE 4-3: Terminating Unused I/O.

5.0 PACKAGING INFORMATION

5.1 Package Marking Information

8-Lead DFN*

Microchip SY89206V - Package Marking Information - 1

XXX NNN

Example

Microchip SY89206V - Package Marking Information - 2

206 160

Legend: XX...X Product code or customer-specific information

Y Year code (last digit of calendar year)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week '01')

NNN Alphanumeric traceability code

ePb-free JEDEC ^® designator for Matte Tin (Sn)

* This package is Pb-free. The Pb-free JEDEC designator (e3) can be found on the outer packaging for this package.

•, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle mark).

Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Package may or may not include the corporate logo.

Underbar (_) and/or Overbar (−) symbol may not be to scale.

TITLE

8 LEAD DEN 2x2mm PACKAGE OUTLINE & RECOMMENDED LAND PATTERN

DRAWING #

DFN22-8LD-PL-1

UNIT MM

Microchip SY89206V - TITLE - 1

text_image PIN +1 ID BY MARKING 2.00 BSC 1.00 BSC 1 2 2.00 BSC 1.00 BSC

TOP VIEW NOTE: 1, 2, 3

Microchip SY89206V - TITLE - 2

text_image 0.35±0.05 1.30±0.05 0.25±0.05 0.50 BSC PBN 41 R0.100 TYP 0.125±0.050 1.20±0.10 EXP PAD 1.75 REF 0.60±0.10 EXP PAD

BOTTOM VIEW NOTE: 1, 2, 3

Microchip SY89206V - TITLE - 3

text_image 0.85±0.05 [0.05] SEATING PLANE 0.00-0.05 0.203±0.025

END VIEW NOTE: 1, 2, 3

Microchip SY89206V - TITLE - 4

text_image 0.40±0.02 0.80±0.02 0.26±0.02 1.30±0.02 1.80 BSC BSC -0.50

RECOMMENDED LAND PATTERN NOTE: 4, 5

NOTE:

  1. MAX PACKAGE WARPAGE IS 0.05 MM
  2. MAX ALLOWABLE BURR IS 0.076MM IN ALL DIRECTIONS
  3. PIN #1 IS ON TOP WILL BE LASER MARKED
  4. RED CIRCLE IN LAND PATTERN INDICATE THERMAL VIA
    SIZE SHOULD BE 0.30-0.35MM IN DIAMETER AND SHOULD BE
    CONNECTED TO GND FOR MAX THERMAL PERFORMANCE
  5. GREEN RECTANGLES (SHADED AREA) INDICATE SOLDER
    STENCIL OPENING ON EXPOSED PAD AREA. SIZE SHOULD BE
    0.60×0.40 MM IN SIZE, 0.20 MM SPACING.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging.

NOTES:

APPENDIX A: REVISION HISTORY

Revision A (June 2019)

  • Converted Micrel document SY89206V to Microchip data sheet DS20006210A.
  • Minor text changes throughout.
  • Removed all reference to the EOL SY89216V.
  • Updated DC and AC parameter tables in the 1.0 "Electrical Characteristics" section.

Revision B (August 2019)

- Updated minimum value for Common Mode Range in DC Electrical Characteristics (Note 1).

NOTES:

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.

Microchip SY89206V - PRODUCT IDENTIFICATION SYSTEM - 1

text_image PART NO. X -XX Device Voltage Option Package Range SpecialTemp Processing

Device: SY89206: 1 GHz Differential PECL/ECL Receiver/Buffer

Voltage Option: V = 3.3V, 5V

Package: M = 8-Lead DFN

Temperature Range: G = -40^ to +85^ (NiPdAu Pb-Free)

Special Processing: TR = 1,000/Reel

Examples:

at SY39206VMG-TR: 1 GHz Differential PECL/ECL Receiver/Buffer, 3.3V/5V, -40°C to +85°C, 8-Lead DFN, 1,000/Reel

Note 1: Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option.

NOTES:

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.
- Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.
- There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
- Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated.

For information regarding Microchip's Quality Management Systems, please visit www.microchip.com/quality.

Trademarks

The Microchip name and logo, the Microchip logo, Adaptec, AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon, TempTrackr, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

APT, ClockWorks, The Embedded Control Solutions Company, EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub, TimePictra, TimeProvider, Vite, WinPath, and ZL are registered trademarks of Microchip Technology Incorporated in the U.S.A.

Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BlueSky, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.

The Adaptec logo, Frequency on Demand, Silicon Storage Technology, and Symmcom are registered trademarks of Microchip Technology Inc. in other countries.

GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries.

All other trademarks mentioned herein are property of their respective companies.

© 2019, Microchip Technology Incorporated, All Rights Reserved.

ISBN: 978-1-5224-4928-7

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Brand : Microchip

Model : SY89206V

Category : Electronic component