MCP6282 - Carte d'évaluation Microchip - Free user manual and instructions

USER MANUAL MCP6282 Microchip

8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User's Guide

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.
- Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.
- There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
- Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance and WiperLock are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.

All other trademarks mentioned herein are property of their respective companies.

© 2005, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.

Printed on recycled paper.

QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV

=ISO/TS 16949:2002=

Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company's quality system processes and procedures are for its PICmicro® 8-bit MCUs, KEELOC® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

Table of Contents

Preface ....1

Chapter 1. Product Overview .... 5

1.1 Introduction ...... 5
1.2 What is the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board? .... 5
1.3 What the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Kit Includes ..... 5

Chapter 2. Installation and Operation ....7

2.1 Introduction 7
2.2 Features 7
2.3 Getting Started 8
2.4 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Description ...... 12

Appendix A. Schematic and Layouts 19

A.1 Introduction 19
A.2 Schematics and PCB Layout 19

Appendix B. Bill of Materials (BOM)......27

Appendix C. Microchip Analog and Interface Device Compatibility 29

C.1 Introduction 29

Appendix D. Rev. 1 PCB Errata....35

D.1 Introduction 35
D.2 Rev 1 PCB Issues 35

Worldwide Sales and Service 38

8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User's Guide

NOTES:

Preface

NOTICE TO CUSTOMERS

All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our web site (www.microchip.com) to obtain the latest documentation available.

Documents are identified with a "DS" number. This number is located on the bottom of each page, in front of the page number. The numbering convention for the DS number is "DSXXXXXA", where "XXXXX" is the document number and "A" is the revision level of the document.

For the most up-to-date information on development tools, see the MPLAB ^® IDE on-line help. Select the Help menu, and then Topics to open a list of available on-line help files.

INTRODUCTION

This chapter contains general information that will be useful to know before using the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board. Items discussed in this chapter include:

• Document Layout
• Conventions Used in this Guide
• Recommended Reading
  • The Microchip Web Site
• Customer Support
• Document Revision History

DOCUMENT LAYOUT

This document describes how to use the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board. The manual layout is as follows:

• Chapter 1. “Product Overview” – Important information about the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board.
• Chapter 2. “Installation and Operation” – Includes instructions on how to get started with this evaluation board.
• Appendix A. “Schematic and Layouts” – Shows the schematic and layout diagrams for the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board.
• Appendix B. “Bill of Materials (BOM)” – Lists the parts used to build the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board.
• Appendix C. "Microchip Analog and Interface Device Compatibility" – Documents the Microchip Analog & Interface devices that are footprint compatible with this PCB.
• Appendix D. "Rev. 1 PCB Errata" – Describes the PCB Errata for the Revision 1 board.

CONVENTIONS USED IN THIS GUIDE

This manual uses the following documentation conventions:

DOCUMENTATION CONVENTIONS

Description Represents Examples
Arial font:
Italic characters Referenced books	MPLAB	^® IDE User's Guide
	Emphasized text ...is the only compiler...

RECOMMENDED READING

This blank PCB is generic and can be used with any Microchip device that is offered in one of the following 8-pin packages:

• SOIC
• DIP
• M S O P
• TSSOP

For more information regarding devices available in these 8-pin packages, please refer to the Microchip web site at www.microchip.com.

Microchip provides online support via our web site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information:

• Product Support – Data sheets and errata, application notes and sample programs, design resources, user's guides and hardware support documents, latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives

CUSTOMER SUPPORT

Users of Microchip products can receive assistance through several channels:

• Distributor or Representative
- Local Sales Office
• Field Application Engineer (FAE)
- Technical Support
- Development Systems Information Line

Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document.

Technical support is available through the web site at: http://support.microchip.com

In addition, there is a Development Systems Information Line which lists the latest versions of Microchip's development systems software products. This line also provides information on how customers can receive currently available upgrade kits.

The Development Systems Information Line numbers are:

1-800-755-2345 – United States and most of Canada

1-480-792-7302 - Other International Locations

DOCUMENT REVISION HISTORY

Revision A (March 2005)

- Initial Release of this Document.

8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User's Guide

NOTES:

Chapter 1. Product Overview

1.1 INTRODUCTION

This chapter provides an overview of the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board and covers the following topics:

• What is the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board?
- What the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board kit includes

The 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board allows the system designer to quickly evaluate the operation of Microchip Technology's devices in any of the following 8-pin packages:

• SOIC
• DIP
• M S O P
• TSSOP

Some of the Microchip family of devices that can be evaluated in the PCB include:

• A/D Converters (ADCs) (ADCs)
- Battery Chargers
- Comparators
• D/A Converters (DACs) (DACs)
- DC-to-DC Converters
• Digital Potentiometers (Digi-Pots)
- Fan Controllers
- Integrated Devices
- Interface Devices
- Linear Regulators
• Operational Amplifiers (Op Amps)
• Power MOSFET Drivers
- Switching Regulators
• Temperature Sensors
- P I C m®iMicrocontrollers

- Programmable Gain Amplifiers (PGAs)s (PGAs)

• Voltage Supervisors and Voltage Detectors

1.3 WHAT THE 8-PIN SOIC/MSOP/TSSOP/DIP EVALUATION BOARD KIT INCLUDES

This 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Kit includes:

• Three 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board PCBs
• 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User's Guide (DS51544) (Electronic version on CD)

8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User's Guide

NOTES:

Chapter 2. Installation and Operation

2.1 INTRODUCTION

This blank Printed Circuit Board (PCB) allows any 8-pin device in the following four package types to be installed:

1. SOIC-8
2. PDIP-8
3. MSOP-8
4. TSSOP-8

This board is generic so that any device may be installed. Refer to the device data sheet, however, for suitability of device evaluation.

As well as the device, other desired passive components (resistors and capacitors) and connection posts may be installed. This allows the board to evaluate a minimum configuration for the device. Also, this allows the device to be easily jumpered into an existing system.

2.2 FEATURES

The 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board has the following features:

• Connection terminals may be either through-hole or surface-mount
• Four 8-pin package footprints supported:

- SOIC

- DIP

- M S O P

- TSSOP

- Footprints for optional passive components for:

- Power supply filtering

- Device bypass capacitor

- Output filtering

- Output pull-up resistor

- Output pull-down resistor

- Output loading resistor

- Output series resistor

- Up to four additional passive components

- Silk-screen area to write specifics of implemented circuit (on back of PCB), such as TC1232 4.75V, (to indicate that the device is the TC1232 with the 4.75V trip point)

- P I C m®iMCU Baseline Flash Microcontroller Programmer (BFMP) Header

- Can be used for SOIC-8, MSOP-8, TSSOP-8 to DIP-8 converter

2.3 GETTING STARTED

The 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board is a blank PCB that allows the user to configure the circuit to the exact requirements. The passive components use the surface-mount 805 package layout.

This evaluation board supports the following Microchip device families:

• A/D Converters (ADCs) (ADCs)
- Battery Chargers
- Comparators
• D/A Converters (DACs) (DACs)
- DC-to-DC Converters
• Digital Potentiometers (Digi-Pots)
- Fan Controllers
- Integrated Devices
- Interface Devices
- Linear Regulators
• Operational Amplifiers (Op Amps)
• Power MOSFET Drivers
- Switching Regulators
• Temperature Sensors
• PICmicro Microcontrollers

- Programmable Gain Amplifiers (PGAs)s (PGAs)

• Voltage Supervisors and Voltage Detectors

Figure 2-1 shows the evaluation board circuit. Pin "n" of each device (U1, U2, U3 and U4) are tied together. These pins are then connected with pad "n" of the PCB (through a circuit). This circuit allows each pin to individually have any of the following: a pull-up resistor, a pull-down resistor, an in-line resistor and/or a loading/filtering capacitor. Device-filtering capacitors are available (C2 and C3), as well as a power supply filtering capacitor (C1).

There may be cases where some additional passive components are desired for the evaluation circuit. The PCB has four 805 footprints that are not connected (labeled P1, P2, P3 and P4) and can easily be jumpered into the desired circuit.

RAD1 R1A* (3) R2A* R3A* C1A* RAD2 R1B* (3) R2B* R3B* C1B* RAD3 R1C* (3) R2C* R3C* C1C* RAD4 R1D* (3) R2D* R3D* C1D* UX VSS C2 (2) VDD VDD C3 (2) VSS R2H* R3H* C1H* RAD5 RAD6 RAD7 RAD8 RAD9 RAD10 RAD11 TP11 TP12 TP13 TP14 RAD11 TP15 TP16 TP12 TP13 TP14 TP15 TP16 TP17 TP18 To power plane To ground plane

* Optional components, circuit-dependent.
Note 1: Can be any passive component (R, C, ...) that fits onto a 805 surface-mount footprint.
2: Optional power/device filtering capacitors.
3: When installing this component, ensure to cut the trace between the two pads of the device.

FIGURE 2-1: 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Circuit.

2.3.1 The Hardware

Figure 2-2 shows the layout of the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board. This is a small four-layer board (1.5" x 2" (38.1 mm x 50.8 mm)). There are ten connection points/pads that can use either through-hole or surface-mount connector posts.

The pad labeled VDD is connected to the PCB power plane, while the pad labeled VSS is connected to the PCB ground plane. All the passive components that are connected to VDD or VSS are connected to either the power plane or ground plane.

The eight remaining PCB pads correspond to the device pins (i.e.; pad 1 connects to pin 1).

Each pad has four passive components associated with them: a pull-up resistor, a pull-down resistor, an in-line resistor and a filtering/load capacitor. The pull-up resistor is always R2X, the pull-down resistor is R3X, the in-line resistor is R1X and the filtering/load capacitor is C1X. The "X" is an alpha character that corresponds to a particular pad (A to H). As an example, Pad 5's pull-up resistor is R2E.

The green area of Figure 2-2 shows the silk-screen on the bottom layer of the PCB. This is where the details of the implemented circuit can be written.

Capacitor C1 is the power supply filtering capacitor.

Capacitors C2 and C3 are bypass capacitors that may be required to be installed, depending on the device selected and the system requirements (such as the noise present on the power supply). Table 2-1 describes the components.

A 6-pin header interface is available that supports the PICmicro MCU Baseline Flash Microcontroller Programmer (BFMP) interface. For additional information, refer to Section 2.4.5 "Baseline Flash Microcontroller Programmer (BFMP) Interface (Header J1)".

R1H R2H R1G R2G R2F R1F R2E R1E PAD8 VSS VDD C1H R3H PAD7 VSS VDD C1G R1G G1F R1F VSS VDD G1F R3E PAD6 VSS VDD J1 VDD VSS 8-Pin SOIC/MSO TSSORXNDIP GVA Bd. VDD VSS R3A C1A VDD VSS PAD1 PAD2 R1B R2B R2C RC1 R3D C1D PAD3 VDDVSS PAD4 R1A R2A

FIGURE 2-2: 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Layout.

TABLE 2-1: OPTIONAL PASSIVE COMPONENTS

Device Comment
C1 Power supply bypass capacitor
C2, C3 Device Filtering capacitor
C1A, C1B C1C, C1D, C1E, C1F, C1G, C1H Output filter capacitor
R1A, R1B, R1C, R1D, R1E, R1F, R1G, R1H In-line resistance of device output
R2A, R2B, R2C, R2D, R2E, R2F, R2G, R2H Pull-up resistor
R3A, R3B, R3C, R3D, R3E, R3F, R3G, R3H Pull-down resistor
P1, P2, P3, P4 Optional Passive Components

2.4 8-PIN SOIC/MSOP/TSSOP/DIP EVALUATION BOARD DESCRIPTION

The 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board PCB is designed to be flexible in the type of device evaluation that can be implemented.

The following sections describe each element of this evaluation board in further detail. Refer to Figure 2-3.

2.4.1 Power and Ground

The 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board has a VDD Pad and a VSS pad. These pads can have connection posts installed that allows easy connection to the power ( V_DD ) and ground ( V_SS ) planes. The layout allows either through-hole or surface-mount connectors.

The power and ground planes are connected to the appropriate passive components on the PCB (such as power plane to R2X and ground plane to R3X and C1X).

2.4.2 PCB PADs

For each package pin (pins 1 to 8), there is a PCB pad (pads 1 to 8). The device will have some power pins ( V_DD ) and some ground pins ( V_SS ). To ease connections on the PCB, vias to the power and ground plane have been installed close to each PCB pad. This allows any pad to be connected to the power or ground plane, so when power is connected to the VDD and VSS pads, the power is connected to the appropriate device pin.

Jumpering to VSS

R1H R2H PAD8 VSS VDD C1H R3H

Jumpering to VDD

R1H R2H PAD8 VSS VDD C1H R3H

FIGURE 2-3: Jumpering the PCB pad to either VDD or VSS.

Revision 1 of this PCB has an issue that these vias are not connected to the desired power and ground planes (they are open). For additional information, refer to Appendix D. "Rev. 1 PCB Errata".

2.4.3 Passive Components (R1X, R2X, R3X, C1X, R1, R2, C1, C2, C3, P1, P2, P3 and P4)

The footprints for these components are present to allow maximum flexibility in the use of this PCB to evaluate a wide range of SOT-23-3 devices. The purpose of these components may vary depending on the device under evaluation and how it is to be used in the desired circuit. Refer to the device data sheet for the recommended components that should be used when evaluating that device.

• Component R1X allows an in-line resistor that can be installed between the device pin and the PCB pad. This may be required when interfacing this PCB to other circuits
• Component R2X allows a pull-up resistor to be installed for the device pin
• Component R3X allows a pull-down resistor to be installed for the device pin
• Component C1X allows a capacitive load/filter to be installed for the device pin
• Component C1 allows a power supply filtering capacitor to be installed
• Components C2 and C3 allows a device filtering capacitor to be installed
• Components P1, P2, P3, and P4 are not connected and give a footprint (805 surface-mount) for a passive component (resistor, capacitor, etc.) to be installed and jumpered into the PCB circuit. This allows for the evaluation of some simple device circuits to be implemented on this PCB

2.4.4 Installing Resistor R1X

Resistor R1X is shorted by default. Therefore, if resistor R1X is to be installed, the trace across the component must be cut before it is installed (see Figure 2-4).

While evaluating a device, it may be desirable to see the signals on both sides of this resistor. A test point is available so that both signals may be monitored. This test point is the avenue between components R3X and C1X (see Figure 2-4).

R1H R2H This trace must be cut before resistor R1X can be installed Test point PAD8 VSS VDD C1H R3H

FIGURE 2-4: Test point when resistor R1X is installed.

2.4.5 Baseline Flash Microcontroller Programmer (BFMP) Interface (Header J1)

The BFMP interface allows a PICmicro MCU device to be programmed with programmers that support this interface, such as the BFMP programmer (part number PG164101).

The PCB supports two device pinouts. The default pinout already has the traces connected to the appropriate PICmicro MCU pins. The optional pinout requires three PCB traces to be cut and then three connections to be made (see Figure 2-5).

TABLE 2-2: BFMP HEADER SIGNALS AND PICMICRO MCU PINS

BFMP Header Signal	Pin Number		Comment
	Default Pinout	Optional Pinout (1)
CLK 6 4 ICSPTM Clock
DT 7 5 ICSP Data
VPP 4 8

Note 1: Requires PCB traces to be cut and then jumpered.

U1 TP1A 1 P1 P8 8 TP8A TP2A 2 P2 P7 7 TP7A TP3A 3 P3 P6 6 TP6A TP4A 4 P4 P5 5 TP5A DIP-8 J1 NC CLK DT VSS VDD VPP TP4A TP6A TP5A TP7A GND TP8A TP4A Required "Cuts" and "Jumpers" for Optional PICmicro® MCU pinout

FIGURE 2-5: BFMP Header and Connections

Top-Layer Traces Bottom-Layer Traces

FIGURE 2-6: PCB Traces (Top and Bottom Layers).

2.4.6 The PCB as a SOIC-8, MSOP-8, or TSSOP-8 to DIP-8 Socket Converter

There may be occasions when it is desirable to convert the footprint of the device to that of a DIP package. This allows the device to be installed into an existing DIP socket. Two 1x4 row pins need to be installed into the PCB's DIP footprint when the device is installed into the appropriate package footprint.

This allows the PCB to convert the SOIC-8, MSOP-8 or TSSOP-8 footprints to a 300-mil DIP-8 footprint.

2.4.7 Evaluating a Voltage Supervisor or Voltage Detector Device

2.4.7.1 VOLTAGE SUPERVISORS

The following voltage supervisor is supported by this evaluation board.

TABLE 2-3: 8-PIN VOLTAGE SUPERVISOR

Device SO	IC DIP MSOP TSSOP Comment
TC1232 Yes Yes		—	—

When evaluating a voltage supervisor/voltage detector device, a minimum set of test equipment should be available. Table 2-4 shows the recommended test equipment.

TABLE 2-4: TEST EQUIPMENT

Hardware	Connect to:	Comment
Variable Power Supply	V_DD, V_SS	This allows the voltage to the SOT23 Evaluation Board to be varied so the device output can be monitored.
Arbitrary Waveform Generator	V_DD, V_SS	This is similar to a variable power supply, but allows programmability into the input signal that the device will be subjected to. This also allows a particular waveform to be repeated (such as a 60 Hz sine wave that varies from 1V to 5V).
Digital Multi-Meter (D.M.M.)	V_OUT^(1)	Used to indicate the output state (low or high) of the voltage supervisor/voltage detector.
Oscilloscope	V_OUT^(1)	Allows the device conditions and response to be evaluated due to the ability to capture this information. This is useful for faster signals and cases where small spikes need to be detected.
Test Light (LED) V	OUT^(1)	Used to visually indicate the output state (low or high) of the voltage supervisor/voltage detector. Ensure that the current requirements of this LED can be supplied by the device's output pin.

Note 1: The pad connection to connect to the V_OUT or pin will be dependent on the device and the footprint option used.

A typical system that would be used to evaluate the voltage supervisor/voltage detector device is shown in Figure 2-7. This also shows an example input and output waveform for a voltage supervisor/voltage detector device.

graph LR
    A["Variable Power Supply or Arbitrary Waveform Generator"] --> B["Voltage Supervisor or Voltage Detector"]
    B --> C["C1"]
    B --> D["R2"]
    B --> E["R3"]
    B --> F["R1"]
    F --> G["Test Point"]
    G --> H["PCB Pad"]
    H --> I["Oscilloscope"]
    J["Arbitrary Waveform Generator Output"] --> K["Device V_DD out of valid operating range. Output voltage may be indeterminate."]
    L["Test Point or VOUT"] --> M["Device V_DD out of valid operating range. Output voltage may be indeterminate."]

FIGURE 2-7: Evaluation System.

2.4.8 Example Op Amp Circuits

This section shows how the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board could be used to evaluate op amp circuits. The first circuit is for the MCP601 and is shown in Figure 2-8. Figure 2-9 shows which components on the PCB would be installed and how the “unconnected” passive components would be jumpered into the circuit.

The second circuit is for the MCP6021 and is shown in Figure 2-10. Figure 2-11 shows which components on the PCB would be installed and how the “unconnected” passive components would be jumpered into the circuit.

R2 is connected to pad 2 (not installed on PCB) R1C C1C C (P1) 3 7 + 2 4 6

FIGURE 2-8: Op Amp Circuit #1 (MCP601).

PAD1 PAD2 External to PCB R2 Trace is cut, resistor is installed PAD3 R1C C1C U1 1 8 2 7 3 6 4 5 P1 PAD4 R1D V_DD To power plane V_SS C1 To ground plane V_SS V_DD C2 V_DD PAD5 PAD6 PAD7 PAD8

FIGURE 2-9: PCB Connections for Op Amp Circuit #1 (MCP601).

R1C R3C 3 + 7 2 4 6 R1B R (P1)

FIGURE 2-10: Op Amp Circuit #2 (MCP6021).

PAD1 Trace is cut, resistor is installed PAD2 R1B* Trace is cut, resistor is installed PAD3 R1C* R3C* U1 1 8 2 7 3 6 4 5 P1 PAD6 PAD4 VDD C2 VDD VSS To power plane To ground plane

FIGURE 2-11: PCB Op Amp Circuit #2 (MCP6021).

Appendix A. Schematic and Layouts

A.1 INTRODUCTION

This appendix contains the schematics and layouts for the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board. Diagrams included in this appendix:

• Board Schematic - Digital Circuitry
- Board – Top Layer + Bottom Layer + Silk-Screen
- Board – Top Layer + Silk-Screen
- Board – Bottom Layer
- Board – Power Plane
- Board – Ground Plane
- Board – Component Layer

A.2 SCHEMATICS AND PCB LAYOUT

Figure A-3 shows the schematic of the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board.

Figure A-2 shows the layout for the top layer of the 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board. The layer order is shown in Figure A-1.

Top Layer Ground Layer Power Layer Bottom Layer

FIGURE A-1: Layer Order.

FIGURE A-2: 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Schematic.

R1H R2H R1G R2G R2F R1F R2E R1E PAD8 VSS VDD C1H R3H PAD7 VSS VDD C1G R1G PAD6 VSS VDD C1F R1F P3 G4F R3F PAD5 VSS VDD J1 VDD VSS VDD VSS R3A C1A VDD VSS PAD1 PAD2 R1B R2B R2C RC1 R3C C1C VDD VSS PAD3 R3D C1D VDDVSS PAD4 R1A R2A R2D R1D

FIGURE A-3: 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Layout – Top Layer + Bottom Layer + Silk-Screen.

8-Pi 9 SOC/MSP TSSOP/DIP Eval.5.D. R2E R1E PAD5 VSSVDD C1E R3E J1 R2D R1D R3D C1D VDDVSS PAD4 R2D R1F PAD6 VSS VDD P3 U2 R2F R1F R3F VDD VSS C2 VSS VDD P4 R3C C1C VDD VSS PAD3 R2C RC1 R1G R2G C1G R3G PAD7 VSS VDD C1H R3H U3 U1 VDD VSS PAD2 R2B C1A VSS VDD P2 R1H R2H PAD8 VSS VDD C1H R3H VDD VSS R3A C1A VDD VSS PAD1 R1A R2A

FIGURE A-4: 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Gerber – Top Layer + Silk-Screen.

102-0000005 SR0000005

FIGURE A-5: 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Gerber – Bottom Layer.

FIGURE A-6: 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Gerber – Power Plane

FIGURE A-7: 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Gerber – Ground Plane.

8-Pip SOC/MSP TSSOP/DIP Eval BD. PAD5 R1E VSSVDD R2E R3E C1E R1D PAD6 VSS VDD P3 R1F R2F C1F R3F VSS VDD P4 C2 VSS VDD P2 R1G R2G C1G R3G PAD7 VSS VDD R1H R2H C1H R3H PAD8 VSS VDD C1I R2A P1 U3\U1 P2 VDD VSS PAD2 R2B R3C C1C VDD VSS PAD3 R2C RC1 VDD VSS PAD1 R3A C1A R1A R2A

FIGURE A-8: 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Gerber – Component Layer.

Appendix B. Bill of Materials (BOM)

TABLE B-1: BILL OF MATERIALS

Qty	Reference Description	Manufacturer Part Number
1 PCB	103-00050 SOT23	Evaluation Board PCB Microchip	Technology Inc.	103-00060
0 U1	SOIC-8 Device Microchip		Technology Inc.	User-specified
0 U2	MSOP-8 Device Microchip		Technology Inc.	User-specified
0 U3	DIP-8 Device	Microchip	Technology Inc.	User-specified
0 U4	TSSOP-8 Device	Microchip	Technology Inc.	User-specified
0 C1,	C2, C3	Device Power Supply Bypass CapacitorSurface-mount (805 package)(Optional - Application-dependent)	—	User-specified
0 C1A	C1B, C1C,C1D, C1E, C1F,C1G, C1H	Output Filer CapacitorSurface-mount (805 package)(Optional - Application-dependent)	—	User-specified
0 R1A	R1B, R1C,R1D, R1E, R1F,R1G, R1H	Output inline resistorSurface-mount (805 package)(Optional - Application-dependent)	—	User-specified
0 R2A	R2B, R2C,R2D, R2E, R2F,R2G, R2H	Output Pull-up resistorSurface-mount (805 package)(Optional - Application-dependent)	—	User-specified
0 R3A	R3B, R3C,R3D, R3E, R3F,R3G, R3H	Output Pull-down resistorSurface-mount (805 package)(Optional - Application-dependent)	—	User-specified
0 P1,	P2, P3, P4 Passive component (not connected) that can be “blue wired” into the desired circuit. The device layout supports the 805 package.(Optional - Application-dependent)
0	J1	BFMP Header (6-pin, 100 mil spacing)	—	—
0	PAD1, PAD2, PAD3,PAD4, PAD5, PAD6,PAD7, PAD8, V_DD , V_SS	Through-hole connector(s) for PAD1, PAD2, PAD3, PAD4, PAD5, PAD6, PAD7, PAD8, V_DD , V_SS	Keystone Electronics®	5012
0	PAD1, PAD2, PAD3, PAD4, PAD5, PAD6, PAD7, PAD8, V_DD , V_SS	Surface-mount connector(s) for PAD1, PAD2, PAD3, PAD4, PAD5, PAD6, PAD7, PAD8, V_DD , V_SS	Keystone Electronics®	5016

8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board User's Guide

NOTES:

Appendix C. Microchip Analog and Interface Device Compatibility

C.1 INTRODUCTION

This appendix documents the Michrochip Analog and Interface devices that are footprint compatible with this PCB.

The Analog and Interface devices currently fall into the following categories:

• A/D Converters (ADCs) (ADCs)
- Battery Chargers
- Comparators
• D/A Converters (DACs) (DACs)
- DC-to-DC Converters
• Digital Potentiometers (Digi-Pots)
- Fan Controllers
- Integrated Devices
- Interface Devices
- Linear Regulators
• Operational Amplifiers (Op Amps)
• Power MOSFET Drivers
- Switching Regulators
• Temperature Sensors

- Programmable Gain Amplifiers (PGAs)s (PGAs)

• Voltage Supervisors and Voltage Detectors

Table C-1 shows the Michrochip Analog and Interface devices that are currently supported. As new devices become available, this PCB may be able to support them. Please check the device data sheet to verify if the device is available in one of the package types supported by this PCB.

TABLE C-1: ANALOG AND INTERFACE DEVICES PCB COMPATIBILITY

Device SO	C DIP MSOP	TSSOP	Comment
Voltage Supervisors and Voltage Detectors
TC1232 Yes Yes — —
Digital Potentiometer
M C	P	4	0	2	1 Ye s
MCP41010	Yes Yes — —
MCP41050	Yes Yes — —
MCP41100	Yes Yes — —
Switching Regulator
MCP1601	— — Yes —
MCP1612	— — Yes —
MCP1630	— — Yes —
MCP1650	— — Yes —
MCP1651	— — Yes —
MCP1652	— — Yes —
DC-to-DC Converters
MCP1252	— — Yes —
MCP1253	— — Yes —
TC682	Yes Yes — —
TC962	Yes Yes — —
TC1044S Yes	Yes — —
TC1121	Yes Yes Yes	—
TC1142	— — Yes —
TC7660 Yes Yes — —
TC7660B Yes Yes — —
TC7660H	Yes Yes — —
TC7660S Yes Yes — —
TCM680	Yes Yes — —
Linear Regulators
MCP1726	Yes — —
TC1107	Yes — —	Yes	—
TC1173	Yes — —	Yes	—
TC1174	Yes — —	Yes	—
TC1263 Yes — —
TC1265 Yes — —
T C	1	2	6	6	Ye s —
TC1268 Yes — —
TC1269	— — Yes —
TC1300	— — Yes —
TC1301A — — Yes —
TC1301B — — Yes —
TC1302A — — Yes —
TC1302B — — Yes —
TC1306	— — Yes —

Note 1: Installation of PCB capacitor C2 (or C3) is recommended for all devices. See data sheet for recommended value.
2: Installation of PCB capacitor C1 recommended. See data sheet for recommended value.

TABLE C-1: ANALOG AND INTERFACE DEVICES PCB COMPATIBILITY

Device SO	IC DIP	MSOP	TSSOP	Comment
Operational Amplifiers (Op Amps)
MCP601 Yes	Yes — Yes	Note 2
MCP602 Yes	Yes — Yes	Note 2
MCP603 Yes	Yes — Yes	Note 2
MCP606 Yes	Yes — Yes
MCP607 Yes	Yes — Yes
MCP608 Yes	Yes — Yes
MCP616 Yes	Yes Yes —
MCP617 Yes	Yes Yes —
MCP618 Yes	Yes Yes —
MCP6001 Yes	Yes Yes —
MCP6004 Yes	Yes Yes —
MCP6021 Yes	Yes — Yes	Note 2
MCP6022 Yes	Yes — Yes	Note 2
MCP6023 Yes	Yes — Yes	Note 2
MCP6041 Yes	Yes Yes —
MCP6042 Yes	Yes Yes —
MCP6043 Yes	Yes Yes —
MCP6141 Yes	Yes Yes —
MCP6142 Yes	Yes Yes —
MCP6143 Yes	Yes Yes —
MCP6231 Yes	Yes Yes —
MCP6232 Yes	Yes Yes —
MCP6241 Yes	Yes Yes —
MCP6242 Yes	Yes Yes —
MCP6271 Yes	Yes Yes —	Note 2
MCP6272 Yes	Yes Yes —	Note 2
MCP6273 Yes	Yes Yes —	Note 2
MCP6275 Yes	Yes Yes —	Note 2
MCP6281 Yes	Yes Yes —	Note 2
MCP6282 Yes	Yes Yes —	Note 2
MCP6283 Yes	Yes Yes —	Note 2
MCP6285 Yes	Yes Yes —	Note 2
MCP6291 Yes	Yes Yes —	Note 2
MCP6292 Yes	Yes Yes —	Note 2
MCP6293 Yes	Yes Yes —	Note 2
MCP6295 Yes	Yes Yes —	Note 2
TC913 — Yes	—
TC1029 Yes	Yes Yes —
TC7650 — Yes	—
TC7652 — Yes	—

Note 1: Installation of PCB capacitor C2 (or C3) is recommended for all devices. See data sheet for recommended value.
2: Installation of PCB capacitor C1 recommended. See data sheet for recommended value.

TABLE C-1: ANALOG AND INTERFACE DEVICES PCB COMPATIBILITY

Device	SOIC	DIP	MSOP	TSSOP	Comment
Programmable Gain Amplifiers (PGAs)
MCP6S21 Yes	Yes Yes —	Note 2
MCP6S22 Yes	Yes Yes —	Note 2
MCP6S91 Yes	Yes Yes —	Note 2
MCP6S92 Yes	Yes Yes —	Note 2
Power MOSFET Drivers
TC1410 Yes Yes Yes —
TC1410N Yes Yes Yes —
TC1411 Yes Yes Yes —
TC1411N Yes Yes Yes —
TC1426 Yes Yes —
TC1427 Yes Yes —
TC1428 Yes Yes —
TC4403 — Yes —
TC4426A Yes Yes —
TC4427A Yes Yes —
TC4428A Yes Yes —
TC4426 Yes Yes Yes —
TC4427 Yes Yes Yes —
TC4428 Yes Yes Yes —
TC426 Yes Yes —
TC427 Yes Yes —
TC428 Yes Yes —
TC4404 Yes Yes —
TC4405 Yes Yes —
TC1412 Yes Yes Yes —
TC1412N Yes Yes Yes —
TC1413 Yes Yes Yes —
TC1413N Yes Yes Yes —
TC4423 — Yes —
TC4424 — Yes —
TC4425 — Yes —
TC429 Yes Yes —
TC4420 Yes Yes —
TC4429 Yes Yes —
TC4421 — Yes —
TC4422 — Yes —
TC4626 — Yes —
TC4627 — Yes —
TC4431 Yes Yes —
TC4432 Yes Yes —

Note 1: Installation of PCB capacitor C2 (or C3) is recommended for all devices. See data sheet for recommended value.
2: Installation of PCB capacitor C1 recommended. See data sheet for recommended value.

TABLE C-1: ANALOG AND INTERFACE DEVICES PCB COMPATIBILITY

Device SO	IC DIP	MSOP	TSSOP	Comment
Comparators
MCP6541 Yes	Yes Yes —
MCP6542 Yes	Yes Yes —
MCP6543 Yes	Yes Yes —
MCP6546 Yes	Yes Yes —
MCP6547 Yes	Yes Yes —
MCP6548 Yes	Yes Yes —
TC1025 Yes	Yes Yes —
TC1028 — —	Yes —
TC1031 — —	Yes —
TC1040 — —	Yes —
T C	1	0	4	1	Y e s
A/D Converters (ADCs)
MCP3001 Yes	Yes — Yes
MCP3002 Yes	Yes — Yes
MCP3201 Yes	Yes — Yes
MCP3202 Yes	Yes — Yes
MCP3301 Yes	Yes Yes —
TC3400 Yes	Yes — —
D/A Converters (DACs)
MCP4821 Yes	Yes Yes —
MCP4822 Yes	Yes Yes —
MCP4921 Yes	Yes Yes —
T C	1	3	2	0	Y e s
T C	1	3	2	1	Y e s

Note 1: Installation of PCB capacitor C2 (or C3) is recommended for all devices. See data sheet for recommended value.
2: Installation of PCB capacitor C1 recommended. See data sheet for recommended value.

TABLE C-1: ANALOG AND INTERFACE DEVICES PCB COMPATIBILITY

Device	SOIC	DIP	MSOP	TSSOP	Comment
Temperature Sensors
M C	P	9	8	0	1 Y e
M C	P	9	8	0	3 Y e
TC72 — Yes —
TCN75 Yes — Yes —
TC620 Yes Yes — —
TC621 Yes Yes — —
TC622 Yes Yes — —
TC623 Yes Yes — —
TC624 Yes Yes — —
Fan Controllers
TC642 Yes Yes Yes —
TC642B Yes Yes Yes —
TC646 Yes Yes Yes —
TC646B Yes Yes Yes —
TC647 Yes Yes Yes —
TC647B Yes Yes Yes —
TC648 Yes Yes Yes —
TC648B Yes Yes Yes —
TC649 Yes Yes Yes —
TC649B Yes Yes Yes —
TC650	— — Yes —
TC651	— — Yes —
TC652	— — Yes —
TC653	— — Yes —
Battery Chargers
MCP7344	— — Yes —
MCP73827	— — Yes —
MCP73828	— — Yes —
MCP73843	— — Yes —
Integrated Devices
TC1026C	Yes Yes	Yes —
Interface Devices
MCP201 Yes Yes — —
MCP2122	Yes Yes	— —
MCP2551	Yes Yes	— —

Note 1: Installation of PCB capacitor C2 (or C3) is recommended for all devices. See data sheet for recommended value.
2: Installation of PCB capacitor C1 recommended. See data sheet for recommended value.

Appendix D. Rev. 1 PCB Errata

D.1 INTRODUCTION

This appendix documents the issues with the Rev 1 PCB. The Rev 2 PCB fixes these issues.

D.2 REV 1 PCB ISSUES

There are two issues with the Rev 1 PCB. These are:

1. VDD and VSS vias near each pad are No Connects (they should have been connected to the appropriate power or ground plane). See Figure D-1 shows the location of these vias that are No Connects. Figure D-3 shows alternate connections that can be made.
2. The silk-screen on the bottom layer was not processed. This was only intended for indicating the circuit of the board. This can be done with a sticky label.

Figure D-2 shows how to determine the PCB revision.

R1H R2H R1G R2G R2F R1F R2E R1E TP 4A TP 7A TP 5A TP 6A TP 7A TP 5A TP 6A TP 5A TP 7A TP 6A TP 5A TP 6A TP 5A TP 7A TP 6A TP 5A TP 6A TP 5A TP 7A TP 6A TP 5A TP 6A TP 5A TP 7A TP 6A TP 5A TP 6A TP 5A TP 7A TP 5A TP 6A TP 5A TP 7A TP 6A TP 5A TP 6A TP 5A TP 7A TP 6A TP 5A TP 6A TP 5A TP 7A TP 6A TP 5A TP 6A TP 5A TP 6A TP 5A TP 7A TP 6A TP 5A TP 6A TP 5A TP 7A TP 6A TP 5A TP 6A TP 5A TP 7A TP 6A TP 5A TP 6A TP 5A TP 6A TP 7A TP 6A TP 5A TP 6A TP 5A TP 7A TP 6A TP 5A TP 6A TP 5A TP 7A TP 6A TP 5A TP 6A TP 5A TP 7A TP 6A TP 5A TP 6A TP 7A TP 6A TP 5A TP 6A TP 5A TP 7A TP 6A TP 5A TP 6A TP 7A TP 6A TP 5A TP 6A TP 5A TP 7A TP 6A TP 5A TP 6A TP 7A TP 8-Pin SDIC/MSO PLSOS/SDIC/MSO PLSOS/SDIC/MSO PLSOS/SDIC/MSO PLSOS/SDIC/MSO PLSOS/SDIC/MSO PLSOS/SDIC/MSO PLSOS/SDIC/MSO PLSOS/SDIC/MSO PLSOS/SDIC/MSO PLSOS/SDIC/MSO PLSOS/SDIC/MSO PLSOS/SDI-0.0.0.0.0.0.0.0.0.0.0.0.0.0.0.0.0.0.0.0.0.0.0.0.0.0.0.0.0.0.0.0.0.0.0.0.0.0.0.0.0.0.0.0.0.0.0.0.0.0.0.

FIGURE D-1: 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Gerber - Top Layer + Silk-Screen.

102-000001 This indicates a Rev 1 PCB

FIGURE D-2: 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board Revision Marking (Gerber – Bottom Layer)

Figure D-3 shows how the pad can be connected to either the V_DD or V_SS plane of the PCB.
Jumpering to VSS

R1H R2H PAD8 VSS VDD C1H R3H

Jumpering to VDD

R1H R2H PAD8 VSS VDD C1H R3H

FIGURE D-3: Alternate Jumpering the PCB pad to either VSS or VDD.

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