HV9967B - Electronic component Microchip - Free user manual and instructions

USER MANUAL HV9967B Microchip

Integrated LED Driver with Average-Mode Current Control

Features

• 3% Accurate LED Current
• 60V, 0.8Ω Integrated MOSFET
- Low Sensitivity to External Component Variation
- Single-Resistor LED Current Setting
• Fixed Off-Time Control
- PWM Dimming Input
- Output Short-Circuit Protection with Skip Mode
• Overtemperature Protection

Applications

• DC/DC or AC/DC LED Drivers
- RGB Backlighting Drivers for Flat Panel Displays
- General Purpose Constant-Current Source
• Signage and Decorative LED Lighting
- Chargers

General Description

The HV9967B is an Average-mode current control LED driver IC operating in a Constant Off-time mode.

The IC features an integrated 60V, 0.8Ω MOSFET that can be used as a stand-alone buck converter switch or connected as a source driver for driving an external high-voltage Depletion-mode MOSFET. The HV9967B is powered through its switching output when the integrated switch is off. Therefore, the same external MOSFET can be used as a high-voltage linear regulator for powering the IC.

The LED current is programmed with one external resistor. The Average-mode current control method does not produce a peak-to-average error. This greatly improves the current accuracy as well as the line and load regulations of the LED current without any need for loop compensation or direct sensing of the LED current at a high-voltage potential. The auto-zero circuit cancels the effects of the input offset voltage and of the propagation delay of the current sense comparator.

Package Types

8-lead MSOP
(Top view)

SW 1 RSENSE 2 PGND 3 PWMD 4 8 VDD 7 AGND 6 RT 5 NC

8-lead WDFN
(Top view)

SW 1 GND 8 VDD RSENSE 2 7 AGND PGND 3 6 RT PWMD 4 5 NC

See Table 2-1 for pin information.

Functional Block Diagram

graph TD
    A["L/E Blanking"] -->|IN| B["Average Current Control Logic"]
    B --> C["OUT"]
    C --> D["R Q S Q̅"]
    D --> E["T_OFF Timer"]
    E --> F["SET"]
    F --> G["0.4V Short-Circuit Overcurrent Comparator"]
    G --> H["Vcs"]
    H --> I["LV"]
    I --> J["AVLO"]
    J --> K["+"]
    K --> L["REG"]
    L --> M["VDD"]
    M --> N["SW"]
    O["100kΩ"] --> P["AND Gate"]
    Q["Vcs"] --> R["RSENSE"]
    S["PWMD"] --> T["PGND"]
    U["PGND"] --> V["AGND"]
    W["Hiccup Time"] --> X["0.8ms"]
    Y["i"] --> Z["RT"]

Typical Application Circuit

8 VDC to 60 VDC U1 4 PWMD HV9967B SW 1 L1 R_SENSE 2 R_SENSE PGND AGND RT 3 7 6 8 R_T C_DD + C_IN D1 C_o LED String

1.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings ^()

SW to GND	-0.5V to +65V
V_DD to GND	-0.3V to 6V
Other I/O to GND	-0.3V to ( V_DD + 0.3V)
I_RT	2 mA
Junction Temperature Range, T_J	-40°C to +150°C
Storage Temperature Range, T_S	-65°C to +150°C
Continuous Power Dissipation ( T_A = +25°C):
8-lead MSOP	350 mW
8-lead WDFN	1.6W

Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability.

ELECTRICAL CHARACTERISTICS

Electrical Specifications: T_A=25°C, V_SW=10V/10 mA, V_DD=5V unless otherwise specified.
Parameter Sym. Min. Typ. Max. Unit Conditions
INPUT
Input DC Supply Voltage Range V	SWDC	8	—	60	V	DC input voltage (Note 1)
Shutdown Mode Supply Current	I_INSD	—	0.5	1	mA Pin PWMD connected to GND
INTERNAL REGULATOR
Internally Regulated Voltage	V_DD	4.7	5	5.2	V	V_PWMD=V_DD, R_T=100 kΩ
V_DD Undervoltage Lockout Upper Threshold	V_UVLOR	4.1	4.35	4.7	V	V_DD rising, as needed to ensure I_C(MIN) (Note 1)
V_DD Undervoltage Lockout Hysteresis	V_UVLO	—	150	—	mV V	D_D falling
PMW DIMMING
PWMD Input Low Voltage	V_EN(LO)	—	—	0.8	V	Note 1
PWMD Input High Voltage	V_EN(HI)	2.2	—	—	V	Note 1
PWMD Pull-Down Resistance	R_EN	50	100	150	kΩ	V_PWMD=5V
CURRENT CONTROL
RSENSE Current Threshold Voltage	V_CS(TH)	243	250	257	mV
Threshold Voltage Temperature Coefficient	dV_CS/dT	—	0.1 —	mV/°C
Current Sense Blanking Interval	T_BLANK	140	—	290	ns	Note 1
Minimum On-Time	T_ON(MIN)	—	—	950	ns	V_RSENSE=V_CS(TH)+50 mV (Note 1)
Maximum Steady-State Duty Cycle	D_MAX	80	—	—	%	Reduction in output LED current may occur beyond this duty cycle. (Note 1)
SHORT-CIRCUIT PROTECTION
Hiccup Threshold Voltage at RSENSE	V_CS(SHORT)	355	400	440	mV	Note 1
Current Limit Delay RSENSE to SW-OFF	T_DELAY	—	—	150	ns	V_RSENSE=V_CS(SHORT)+50 mV

Note 1: Denotes specifications which apply over the full operating ambient temperature range of
-40^ < T_A < +125^
2: For design guidance only

ELECTRICAL CHARACTERISTICS (CONTINUED)

Electrical Specifications: TA=25°C, VSW=10V/10 mA, VDD=5V unless otherwise specified.
Parameter	Sym.	Min.	Typ.	Max.	Unit	Conditions
Short-Circuit Hiccup Time T	HICCUP	—80	0—μs
Minimum On-Time (Short-Circuit) T	ON(MIN),SC	— —	400 ns			VRSENSE=VCS(SHORT)+50 mV
TOFF TIMER
Off Time T	OFF	28 40	48		μs	RT=100 kΩ (Note 1)
		7 10	12 R			T=100 kΩ (Note 1)
		0.7 1	1.2 R			T=10 kΩ (Note 1)
SW OUTPUT
On Resistance	RON	—	0.8	—	Ω	VDD=5V
Continuous Current	IC	0.75	—	—	A	VDD=4.75V, VRSENSE=370 mV, VSW=10V (Note 1)
OVERTEMPERATURE PROTECTION
Thermal Shutdown Temperature	TSD	125	145	—	°C	Note 2
Thermal Shutdown Hysteresis	ΔTSD	—20	—°C	Note 2

Note 1: Denotes specifications which apply over the full operating ambient temperature range of -40^ < T_A < +125^
2: For design guidance only

TEMPERATURE SPECIFICATIONS

Parameter	Sym.	Min.	Typ.	Max.	Unit	Conditions
TEMPERATURE RANGE
Operating Ambient Temperature	T_A	-40 —	+125 °C
Maximum Junction Temperature	T_J(ABSMAX)	— —	+150 °C
Storage Temperature	Ts	-65	—	+150	°C
PACKAGE THERMAL RESISTANCE
8-lead MSOP	_JA	— 216	—	°C/W
8-lead WDFN	_JA	— 60	—	°C/W

2.0 PIN DESCRIPTION

Table 2-1 shows the pin description details of HV9967B. Refer to Package Types for the location of pins.

TABLE 2-1: PIN FUNCTION TABLE

Pin Number	Pin Name Description
1 SW	Drain of 60V 0.8Ω	NDMOS switch and input of H/V regulator
2 RSENSE		Source of NDMOS switch and current sense input. Connect a resistor between RSENSE and GND to program the output current and short-circuit protection tripping current.
3 PGND	Power ground.	Must be wired to AGND on PCB.
4 PWMD	PWM dimming input.	This TTL input enables switching of SW when in High state.
5	NC	No connection
6	RT	Resistor connected between RT and VDD. This programs the off time of SW.
7 AGND	Analog ground (0V)
8	VDD	Power supply for all internal circuits. Bypass with a low-ESR capacitor to PGND (>0.5 μF). Connect gate of external Depletion-mode NFET for high-voltage operation.

3.0 APPLICATION INFORMATION

3.1 General Description

The HV9967B employs a control scheme that achieves fast and extremely accurate control of the average current in the buck inductor by sensing only the switch current. No compensation of the current control loop is required. The LED current response to PWMD input is similar to that of the peak-current control ICs, such as the HV9910B. The inductor current ripple amplitude does not affect this control scheme significantly. Therefore, the LED current is independent of the variation in inductance, switching frequency, and output voltage. Constant off-time control of the buck converter is used for stability and to reduce input voltage regulation of the LED current.

3.2 Off Timer

The timing resistor connected to RT pindetermines the off time of the gate driver and SW. The timing resistor must be wired across RT pin and VDD pin. Refer to Equation 3-1 for the computation of the SW off time.

EQUATION 3-1:

$$ \begin{array}{r l} & T _ {O F F} = R _ {T} \times 1 0 0 p F \ & \text { Within the range of } 1 0 \mathrm{k} \Omega \leq R _ {\mathrm{T}} \leq 4 0 0 \mathrm{k} \Omega \end{array} $$

3.3 Average Current Control Feedback and Output Short-Circuit Protection

The constant-current control feedback derives the average-current signal from the source current of the switching MOSFET. This current is detected with a sense resistor at the RSENSE pin. The feedback operates in a fast Open-loop mode. No compensation is required. Output current is programmed as seen in Equation 3-2:

EQUATION 3-2:

$$ I _ {L E D} = \frac {0 . 2 5 V}{R _ {C S}} $$

The above equation is only valid for continuous conduction of the output inductor. It is a good practice to design the inductor such that the peak-to-peak switching inductor ripple current in it is 30% to 40% of its average full DC current load. Hence, the recommended inductance can be computed as specified in Equation 3-3:

EQUATION 3-3:

$$ L _ {O} = \frac {V _ {Q M A X)} \times T _ {O F F}}{0 . 4 \times I _ {O}} $$

The duty cycle range of the current control feedback is limited to D ≤ 0.8 . A reduction in the LED current may occur when the LED string voltage V_O is greater than 80% of the input voltage V_IN of the HV9967B LED driver.

Reducing the output LED voltage V_O below V_O(MIN) = V_IN × D_MIN , where D_MIN = 0.8 s/(T_OFF + 8 s) , may also result in loss of LED current regulation. This condition, however, causes an increase in the LED current and can potentially trip the short-circuit protection comparator threshold.

The short-circuit protection comparator trips when the voltage at RSENSE exceeds 0.4V. When this occurs, the SW off time T_HICCUP = 800 s is generated to prevent the staircasing of the inductor current and, potentially, its saturation due to insufficient output voltage. The typical short-circuit inductor current is shown in the waveform in Figure 3-1.

FIGURE 3-1: Short-Circuit Inductor Current.

A leading-edge blanking delay is provided at RSENSE pin to prevent false triggering of the short-circuit hiccup threshold voltage and the short-circuit protection.

3.4 SW Input and Linear Regulator

The HV9967B includes an integrated 60V, 0.8Ω switching MOSFET at the SW input. The power for the IC is supplied from a built-in linear 5V regulator that is also derived from the SW input.

3.5 PWM Dimming

The HV9967B features a TTL-compatible dimming input PWMD. Applying a square-wave voltage to PWMD will modulate the duty ratio of the LED current accordingly. The rising and falling edges are limited by the current slew rate in the inductor. The first switching cycle is terminated upon reaching the 250 mV level at RSENSE pin. The circuit will reach the Steady state within three to four switching cycles regardless of the switching frequency.

3.6 Overtemperature Protection

The HV9967B includes overtemperature protection. Typically, when the junction temperature exceeds 145^ C, switching of the SW input is disabled. The switching resumes when the temperature falls by approximately 20^ C from the trip point.

4.0 PACKAGING INFORMATION

4.1 Package Marking Information

8-lead MSOP

XXXXXX YWWNNN

8-lead WDFN

Example

H9967B 323874

Example

Legend: XX...X Product Code or Customer-specific information

Y Year code (last digit of calendar year)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week '01')

NNN Alphanumeric traceability code

epb-free JEDEC ^® designator for Matte Tin (Sn)

* This package is Pb-free. The Pb-free JEDEC designator ( ) e3

can be found on the outer packaging for this package.

Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for product code or customer-specific information. Package may or not include the corporate logo.

8-Lead Plastic Micro Small Outline Package (MS) - 3x3 mm Body [MSOP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

2X 0.20 H D D/2 A N E1/2 E1 2X 0.20 H NOTE 1 1 2 e B D/2 E E 2X 4 TIPS 0.25 C

TOP VIEW

A A2 A1 8X 0.10 C SEATING PLANE C 8X b Ø 0.25 M A-B D A

SIDE VIEW

H SEE DETAIL B

VIEW A-A

Microchip Technology Drawing C04-111-MS Rev F Sheet 1 of 2

© 2022 Microchip Technology Inc.

8-Lead Plastic Micro Small Outline Package (MS) - 3x3 mm Body [MSOP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

4X θ1 R1 H R SEATING PLANE C L (L1) 4X θ1 c θ

DETAIL B

Isometric line drawing of an integrated circuit chip with multiple pins (no text or symbols)

Units		MILLIMETERS
Dimension Limits		MIN	NOM	MAX
Number of Terminals	N	8
Pitch	e	0.65 BSC
Overall Height	A	-	-	1.10
Standoff	A1	0.00	-	0.15
Molded Package Thickness	A2	0.75	0.85	0.95
Overall Length D 3.00 BSC
Overall Width	E	4.90 BSC
Molded Package Width	E1	3.00 BSC
Terminal Width	b	0.22	-	0.40
Terminal Thickness	c	0	.	0 8
Terminal Length	L	0.40	0.60	0.80
	L1 0.95 REFFootprint
	R		-0.07	-Lead Bend
	R1		-0.07	-Lead Bend
	θ		-0° 8°	Foot Angle
Draft Angle	θ1		-5° 15°

Radius Radius

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-111-MS Rev F Sheet 2 of 2

8-Lead Plastic Micro Small Outline Package (MS) - 3x3 mm Body [MSOP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

GX C G1 SILK SCREEN Y X E

RECOMMENDED LAND PATTERN

Units		MILLIMETERS
Dimension Limits		MIN	NOM	MAX
Contact Pitch	E	0.65 BSC
	CContact Pad Spacing 4.40
Contact Pad Width (X8)	X			0.45
Contact Pad Length (X8)	Y			1.45
Contact Pad to Contact Pad (X4) G1	2.95
Contact Pad to Contact Pad (X6) GX	0.20

Notes:

Dimensioning and tolerancing per ASME Y14.5M1.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing C04-2111-MS Rev F

© 2022 Microchip Technology Inc.

8-Lead Very, Very Thin Plastic Dual Flat, No Lead Package (UQ) - 3x3 mm Body [WDFN]; Supertex Legacy Package

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

(DATUM A) (DATUM B) NOTE 1 2X 0.15 C 2X 0.15 C TOP VIEW SEATING PLANE A θ // 0.10 C A1 SIDE VIEW 8X 0.08 C NOTE 1 D2 1 4 E2 K L N 5 8X b See Detail A for Pullback Leads alternative e 0.10 A B 0.05 B BOTTOM VIEW

Microchip Technology Drawing C04-291 Rev A Sheet 1 of 2

8-Lead Very, Very Thin Plastic Dual Flat, No Lead Package (UQ) - 3x3 mm Body [WDFN]; Supertex Legacy Package

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

L L1 DETAIL A

Units		MILLIMETERS
Dimension Limits		MIN	NOM	MAX
Number of Terminals	N	8
Pitch	e	0.65 BSC
Overall Height	A	0.70	0.75	0.80
Standoff	A1	0.00	0.02	0.05
Terminal Thickness	A3	0.20 REF
Overall Length	D	3.00 BSC
Exposed Pad Length	D2 1.60		-	2
Overall Width	E	3.00 BSC
Exposed Pad Width	E2	1.35 - 1.75
Terminal Width	b	0.25	0.30	0.35
Terminal Length	L	0.30	0.40	0.50
Pullback L1 -- 0.15
Mold Angle 0° 7° 14°	θ
	K		-0.20 -

. 5 0 0.20 -Terminal-to-Expos

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-291A Sheet 2 of 2

8-Lead Very, Very Thin Plastic Dual Flat, No Lead Package (UQ) - 3x3 mm Body [WDFN]; Supertex Legacy Package

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

X2 EV 8 C1 Y2 EV ØV G1 Y1 1 2 X1 E SILK SCREEN

RECOMMENDED LAND PATTERN

Units		MILLIMETERS
Dimension Limits		MIN	NOM	MAX
Contact Pitch	E	0.65 BSC
Optional Center Pad Width	X2			2.50
Optional Center Pad Length	Y2			1.75
	C1C	Contact Pad S	pacing 3.00
Contact Pad Width (X8)	X1			0.35
Contact Pad Length (X8)	Y1			0.85
Contact Pad to Center Pad (X8) G1	0.20
Thermal Via Diameter V			0.33
Thermal Via Pitch EV			1.20

Notes:

1. Dimensioning and tolerancing per ASME Y14.5M

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

1. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process

Microchip Technology Drawing C04-2291 Rev A

© 2021 Microchip Technology Inc.

APPENDIX A: REVISION HISTORY

Revision B (June 2023)

• Changed PWMD Input High Voltage from 2V to 2.2V
• Changed the package type "8-lead DFN K7" to "8-lead WDFN K7"
• Updated the 8-lead WDFN K7 package outline drawings
  • Made minor text changes throughout the document

Revision A (February 2020)

• Converted Supertex Doc# DSFP-HV9967B to Microchip DS20005734A
• Updated the package marking format
• Updated the packaging quantity of the 8-lead DFN K7 package from 3000/Reel to 3300/Reel to align it with the actual BQM
  • Made minor text changes throughout the document

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.

PART NO. Device XX Package Options X Environmental Media Type

Device: HV9967B = Integrated LED Driver with Average-Mode Current Control

Packages: MG = 8-lead MSOP K7 = 8-lead WDFN

Environmental: G = Lead (Pb)-free/RoHS-compliant Package

Media Type: (blank) = 2500/Reel for an MG Package, 3300/Reel for a K7 Package

Examples:

a) HV9967BMG-G: Integrated LED Driver with Average-Mode Current Control, 8-lead MSOP, 2500/Reel

b) HV9967BK7-G: Integrated LED Driver with Average-Mode Current Control, 8-lead WDFN, 3300/Reel

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