MCP73861 - Electronic component Microchip - Free user manual and instructions

Product Type	Battery Charge Management IC
Battery Chemistry	Single-cell Li-Ion, Li-Polymer
Maximum Charge Current	1 A (programmable)
Supply Voltage Range	4.5 V to 6.0 V
Package Type	MSOP-10 (3 mm x 3 mm)
Weight	0.03 g (typical)
Operating Temperature Range	-40 °C to +85 °C
Charge Termination Method	Constant current / constant voltage (CC/CV)
Safety Features	Overvoltage protection, thermal regulation, charge status output
Typical Application	Portable devices, battery-powered systems
Power Dissipation	0.5 W (maximum)
Charging Status Indication	Open-drain status output (active low)
Standby Current	1 µA (typical)
Regulation Accuracy	±0.5% (voltage), ±5% (current)
Maintenance and Cleaning	No maintenance required; keep free of moisture and static discharge
Spare Parts Availability	Contact Microchip distributors
Repairability	Not repairable; replace if faulty

Frequently Asked Questions - MCP73861 Microchip

What is the MCP73861?

The MCP73861 is a linear charge management controller for single-cell Li-Ion or Li-Polymer batteries, offering up to 1 A charge current.

How do I set the charge current?

Connect a programming resistor (R_PROG) between the PROG pin and ground. The charge current is inversely proportional to the resistor value, calculated as I_CHARGE = 1000 V / R_PROG (typical).

What is the input voltage range?

The recommended input voltage is between 4.5 V and 6.0 V. Voltages above 6.5 V may damage the device.

Does the MCP73861 include thermal protection?

Yes, it features thermal regulation that reduces charge current to prevent overheating, plus thermal shutdown if die temperature exceeds safe limits.

Can I charge a 4.2 V Li-Ion battery with this IC?

Yes, the MCP73861 has a fixed 4.2 V regulation voltage for single-cell Li-Ion batteries. There are also versions for 4.1 V or 4.5 V (check datasheet).

How do I know when charging is complete?

The STAT pin goes low (active) during charging and becomes high-impedance (open-drain off) when charge is complete or a fault occurs.

What is the package size?

The MCP73861 is available in a 10-lead MSOP package with dimensions approximately 3 mm x 3 mm.

Can I use the MCP73861 with a USB power source?

Yes, a typical USB 2.0 port (5 V) is suitable, provided it can supply at least the programmed charge current. Use proper decoupling capacitors.

What is the accuracy of the charge voltage?

The regulation voltage accuracy is ±0.5% over the full temperature range.

Is the MCP73861 RoHS compliant?

Yes, the MCP73861 is RoHS compliant and lead-free.

USER MANUAL MCP73861 Microchip

Advanced Single or Dual Cell, Fully Integrated Li-Ion/Li-Polymer Charge Management Controllers

Features:

• Linear Charge Management Controllers:
- Integrated Pass Transistor
- Integrated Current Sense
- Reverse-Blocking Protection
• High-Accuracy Preset Voltage Regulation: + 0.5%
- Four Selectable Voltage Regulation Options:
- 4.1V, 4.2V - MCP73861/3
- 8.2V, 8.4V - MCP73862/4
- Programmable Charge Current: 1.2A Maximum
• Programmable Safety Charge Timers
• Preconditioning of Deeply Depleted Cells
• Automatic End-of-Charge Control
- Optional Continuous Cell Temperature Monitoring
- Charge Status Output for Direct LED Drive
- Fault Output for Direct LED Drive
• Automatic Power-Down
• Thermal Regulation
• Temperature Range: -40°C to +85°C
• Packaging: 16-Pin, 4 x 4 QFN 16-Pin SOIC

Applications:

• Lithium-Ion/Lithium-Polymer Battery Chargers
• Personal Data Assistants (PDAs)
- Cellular Telephones
• Hand-Held Instruments
- Cradle Chargers
• Digital Cameras
- MP3 Players

Description:

The MCP7386X family of devices features highly advanced linear charge management controllers for use in space-limited, cost-sensitive applications. The devices combine high-accuracy, constant voltage and current regulation, cell preconditioning, cell temperature monitoring, advanced safety timers, automatic charge termination, internal current sensing, reverse-blocking protection, charge status and fault indication in either a space-saving 16-pin 4 x 4 QFN package, or a 16-pin SOIC package. The MCP7386X provides a complete, fully functional, stand-alone charge management solution with a minimum number of external components.

The MCP73861/3 is intended for applications utilizing single-cell Lithium-Ion or Lithium-Polymer battery packs, while the MCP73862/4 is intended for dual series cell Lithium-Ion or Lithium-Polymer battery packs. The MCP73861/3 has two selectable voltage-regulation options available (4.1V and 4.2V), for use with either coke or graphite anodes and operate with an input voltage range of 4.5V to 12V. The MCP73862/4 has two selectable voltage-regulation options available (8.2V and 8.4V), for use with coke or graphite anodes, and operate with an input voltage range of 8.7V to 12V.

The MCP73861/2 and MCP73863/4 differ only in the function of the charge status output (STAT1) when a charge cycle has been completed. The MCP73861/2 flashes the output, while the MCP73863/4 turns the output off. Refer to Section 5.2.1 "Charge Status Outputs (STAT1, STAT2)".

The MCP7386X family of devices are fully specified over the ambient temperature range of -40^ to +85^ .

Package Types

STAT1 STAT2 EN VSS2 VSET 16 15 14 13 VDD2 2 EP 12 VBAT3 VDD2 3 17 11 VBAT2 VSS1 4 9 VBAT1 PROG THREF THERM TIMER 5 6 7 8 VSS3

16-Pin SOIC16-Pin QFN

in QFN STAT2 1 ● 16 EN STAT1 2 15 VSS2 VSET 3 14 VBAT3 VDD1 4 13 VBAT2 VDD2 5 12 VBAT1 VSS1 6 11 VSS3 PROG 7 10 TIMER THREF 8 9 THERM

Typical Application

1.2A Lithium-Ion Battery Charger 5V○ 4.7μF 2,3 VDD VBAT3 12 1 VSET VBAT 10,11 4.7 μF EN THREF 6 STAT1 THERM 7 6.19 kΩ STAT2 TIMER 8 7.32 kΩ PROG VSS 4,9,13 0.1 μF + Single Lithium-Ion Cell MCP73861/3 Note: Pin numbers shown are for QFN package. Please refer to Section 6.0 "Applications" for details.

Functional Block Diagram

Direction Control G = 0.001 VREF 90 kΩ Charge Current Control Amplifier 11 kΩ 10 kΩ Voltage Control Amplifier 4 kΩ VDD1 VDD2 PROG VREF Charge Termination Comparator UREG/12 Precondition Control Charge_OK Precon Precondition Comp. 600 kΩ (1.65 MΩ) VBAT3 Values in () reflect the MCP73862/4 devices EN VUVLO COMPARATOR VUVLO Power-On Delay VUVLO VREF (1.2V) Bias and Reference Generator THREF THERM 100 kΩ Temperature Comparators 50 kΩ 50 kΩ IREG/12 Oscillator Charge Control, Charge Timers And Status Logic Drv Stat 1 Drv Stat 2 STAT1 STAT2 TIMER Charge_OK

1.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings†

V_DDN 13.5V

V_BATN, V_SET, EN, STAT1, STAT2 w.r.t. V_SS ·s·s-0.3 to (V_DD + 0.3)V

PROG, THREF, THERM, TIMER w.r.t. V_SS -0.3 to 6V

Maximum Junction Temperature, T_J .....Internally Limited

Storage temperature ....-65°C to +150°C

ESD protection on all pins:

Human Body Model (1.5 kΩ in series with 100 pF)....≥ 4 kV

Machine Model (200 pF, No series resistance) .....300V

† Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

DC CHARACTERISTICS

Electrical Specifications: Unless otherwise indicated, all limits apply for V_DD = [V_REG(typ.) + 0.3V] to 12V, T_A = -40°C to +85°C. Typical values are at +25°C, V_DD = [V_REG(typ.) + 1.0V]
Parameters Sym. Min. Typ. Max. Units Conditions
Supply Input
Supply Voltage	V_DD	4.5	—	12	V	MCP73861/3
		8.7	—	12	V	MCP73862/4
Supply Current	I_SS	—	0.17	4	μA	Disabled
		—	0.53	4	mA	Operating
UVLO Start Threshold	V_START	4.25	4.5	4.65	V	MCP73861/3
		8.45	8.8	9.05	V	MCP73862/4 V_DD Low-to-High
UVLO Stop Threshold	V_STOP	4.20	4.4	4.55	V	MCP73861/3
		8.40	8.7	8.95	V	MCP73862/4 V_DD High-to-Low
Voltage Regulation (Constant-Voltage Mode)
Regulated Output Voltage	V_REG	4.079	4.1	4.121	V	MCP73861/3, V_SET = V_SS
		4.179	4.2	4.221	V	MCP73861/3, V_SET = V_DD
		8.159	8.2	8.241	V	MCP73862/4, V_SET = V_SS
		8.358	8.4	8.442	V	MCP73862/4, V_SET = V_DD V_DD = [V_REG(typ.) + 1V], I_OUT = 10 mA T_A = -5°C to +55°C
Line Regulation	|( V_BAT/V_BAT)| / V_DD	—	0.025 0.25	%/V V		_DD = [V_REG(typ.)+1V] to 12V I_OUT = 10 mA
Load Regulation	| V_BAT/V_BAT|	—	0.01	0.25	%	I_OUT = 10 mA to 150 mA V_DD = [V_REG(typ.)+1V]
Supply Ripple Attenuation	PSRR	—	60	—	dB	I_OUT = 10 mA, 10 Hz to 1 kHz
		—	42	—	dB	I_OUT = 10 mA, 10 Hz to 10 kHz
		—	28	—	dB	I_OUT = 10 mA, 10 Hz to 1 MHz
Output Reverse Leakage Current	I_DISCHARGE	—	0.23	1	μA	V_DD < V_BAT = V_REG(typ.), V_DD = 1.5 k to Ground
Output Reverse Leakage Switchover Time	I_DISCHARGE\_SW	—	0	1000	ms	V_DD < V_BAT, V_DD <= 1.5 k to Ground
Parameters	Sym.	Min.	Typ.	Max.	Units	Conditions
Current Regulation (Fast Charge Constant-Current Mode)
Fast Charge Current Regulation	I_REG	85 100 111020 1200425 500 57	5 mA PROG = OPEN1380 mA PROG = V75 mA PROG = 1.6 kΩ			sS T_A = -5°C to +55°C
Preconditioning Current Regulation (Trickle Charge Constant-Current Mode)
Precondition Current Regulation	I_PREG	5 10 15	mA PROG = OPEN			sS PROG = 1.6 kΩ T_A = -5°C to +55°C
		60 120 180	mA PROG = V
		25	50	75	mA
Precondition Threshold Voltage	V_PTH	2.70	2.80	2.90	V	MCP73861/3, V_SET = V_SS
		2.75	2.85	2.95	V	MCP73861/3, V_SET = V_DD
		5.40	5.60	5.80	V	MCP73862/4, V_SET = V_SS
		5.50	5.70	5.90	V	MCP73862/4, V_SET = V_DD V_BAT Low-to-High
Charge Termination
Charge Termination Current	I_TERM	6	8.5	11	mA	PROG = OPEN sS PROG = 1.6 kΩ T_A = -5°C to +55°C
		70	90 120 mA	PROG = V
		32	41	50	mA
Automatic Recharge
Recharge Threshold Voltage	V_RTH	V_REG -300 mV V_REG -600 mV	V_REG -200 mV V_REG -400 mV	V_REG -100 mV V_REG -200 mV	V	MCP73861/3 MCP73862/4 V_BAT High-to-Low
Thermistor Reference
Thermistor Reference Output Voltage	V_THREF	2.475 2.55	2.625 V	T		A = 25°C,V_DD = V_REG(typ.) + 1V,I_THREF = 0 mA
Thermistor Reference Source Current	I_THREF	200 —	—	μA
Thermistor Reference Line Regulation	| V_THREF/V_THREF| V_DD	—	0.1 0.25 %/V V			DD = [V_REG(typ.) + 1V] to 12V
Thermistor Reference Load Regulation	| V_THREF/V_THREF| V_DD		0.01	0.10	%	I_THREF = 0 mA to 0.20 mA
Thermistor Comparator
Upper Trip Threshold	V_T1	1.18	1.25	1.32	V
Upper Trip Point Hysteresis	V_T1HYS	—	-50	—	mV
Lower Trip Threshold	V_T2	0.59	0.62	0.66	V
Lower Trip Point Hysteresis	V_T2HYS	—	80	—	mV
Input Bias Current	I_BIAS	—	—	2	μA
Status Indicator – STAT1, STAT2
Sink Current	I_SINK	4	8	12	mA
Low Output Voltage	V_OL	— 200 400 mV I				SINK = 1 mA
Input Leakage Current	I_LK	—	0.01	1	μA	I_SINK = 0 mA, V_STAT1,2 = 12V
Enable Input
Input High Voltage Level V	IH	1.4 — — √
Input Low Voltage Level V	IL	—	—	0		8 V
Input Leakage Current I	LK	—	0	.	0	ENABLE ^1 = 12V 1
Thermal Shutdown
Die Temperature	T_SD	—	155	— °C
Die Temperature Hysteresis	T_SDHYS	—	10	—	°C

AC CHARACTERISTICS

Electrical Specifications: Unless otherwise indicated, all limits apply for V_DD = [V_REG (typ.) + 0.3V] to 12V, T_A = -40°C to +85°C . Typical values are at +25°C , V_DD = [V_REG (typ.) + 1.0V]
Parameters	Sym.	Min.	Typ.	Max.	Units	Conditions
UVLO Start Delay	t_START	—	—	5	ms	V_DD Low-to-High
Current Regulation
Transition Time Out of Preconditioning	t_DELAY	—	—	1	ms	V_BAT < V_PTH to V_BAT > V_PTH
Current Rise Time Out of Preconditioning	t_RISE	—	—	1	ms	I_OUT Rising to 90% of I_REG
Fast Charge Safety Timer Period	t_FAST	1.1	1.5	1.9	Hours	C_TIMER = 0.1 μF
Preconditioning Current Regulation
Preconditioning Charge Safety Timer Period	t_PRECON	45	60	75	Minutes	C_TIMER = 0.1 μF
Charge Termination
Elapsed Time Termination Period	t_TERM	2.2	3	3.8	Hours	C_TIMER = 0.1 μF
Status Indicators
Status Output turn-off	t_OFF	—	—	200	μs	I_SINK = 1 mA to 0 mA
Status Output turn-on	t_ON	—	—	200	μs	I_SINK = 0 mA to 1 mA

TEMPERATURE SPECIFICATIONS

Electrical Specifications: Unless otherwise indicated, all limits apply for V_DD = [V_REG (typ.) + 0.3V] to 12V.Typical values are at +25°C, V_DD = [V_REG (typ.) + 1.0V]
Parameters	Sym.	Min.	Typ.	Max.	Units	Conditions
Temperature Ranges
Specified Temperature Range	T_A	-40	—	+85	°C
Operating Temperature Range	T_J	-40	—	+125	°C
Storage Temperature Range	T_A	-65	—	+150	°C
Thermal Package Resistances
Thermal Resistance, 16-lead,4 mm x 4 mm QFN	θ_JA	—	47	—	°C/W	4-Layer JC51-7 Standard Board,Natural Convection
Thermal Resistance, 16-lead SOIC	θ_JA	—	86.1	—	°C/W	4-Layer JC51-7 Standard Board,Natural Convection

2.0 TYPICAL PERFORMANCE CURVES

Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

NOTE: Unless otherwise indicated, V_DD = [V_REG(typ.) + 1V] , I_OUT = 10 mA and T_A = +25^ , Constant-voltage mode.

FIGURE 2-1: Battery Regulation Voltage ( V_BAT ) vs. Charge Current ( I_OUT ).

FIGURE 2-4: Supply Current (I SS ) vs. Charge Current (I OUT ).

FIGURE 2-2: Battery Regulation Voltage ( V_BAT ) vs. Supply Voltage ( V_DD ).

FIGURE 2-5: Supply Current (I SS) vs. Supply Voltage (VDD).

FIGURE 2-3: Battery Regulation Voltage ( V_BAT ) vs. Supply Voltage ( V_DD ).

FIGURE 2-6: Supply Current (I SS) vs. Supply Voltage ( V_DD ).

NOTE: Unless otherwise indicated, V_DD = [V_REG(typ.) + 1V] , I_OUT = 10 mA and T_A = +25^ , Constant-voltage mode.

FIGURE 2-7: Output Leakage Current ( I_DISCHARGE ) vs. Battery Regulation Voltage ( V_BAT ).

FIGURE 2-10: Supply Current (I SS) vs. Ambient Temperature ( T_A ).

FIGURE 2-8: Thermistor Reference Voltage ( V_THREF ) vs. Supply Voltage ( V_DD ).

FIGURE 2-11: Battery Regulation Voltage ( V_BAT ) vs. Ambient Temperature ( T_A ).

FIGURE 2-9: Thermistor Reference Voltage ( V_THREF ) vs. Thermistor Bias Current ( I_THREF ).

FIGURE 2-12: Thermistor Reference Voltage ( V_THREF ) vs. Ambient Temperature ( T_A ).

NOTE: Unless otherwise indicated, V_DD = [V_REG(typ.) + 1V] , I_OUT = 10 mA and T_A = +25^ , Constant-voltage mode.

FIGURE 2-13: Battery Regulation Voltage ( V_BAT ) vs. Charge Current ( I_OUT ).

FIGURE 2-16: Supply Current (I SS ) vs. Charge Current (I OUT ).

FIGURE 2-14: Battery Regulation Voltage ( V_BAT ) vs. Supply Voltage ( V_DD ).

FIGURE 2-17: Supply Current (I SS) vs. Supply Voltage (VDD).

FIGURE 2-15: Battery Regulation Voltage ( V_BAT ) vs. Supply Voltage ( V_DD ).

FIGURE 2-18: Supply Current (I SS) vs. Supply Voltage (VDD).

NOTE: Unless otherwise indicated, V_DD = [V_REG(typ.) + 1V] , I_OUT = 10 mA and T_A = +25^ , Constant-voltage mode.

FIGURE 2-19: Output Leakage Current ( I_DISCHARGE ) vs. Battery Regulation Voltage ( V_BAT ).

FIGURE 2-22: Supply Current (I SS) vs. Ambient Temperature ( T_A ).

FIGURE 2-20: Thermistor Reference Voltage ( V_THREF ) vs. Supply Voltage ( V_DD ).

FIGURE 2-23: Battery Regulation Voltage ( V_BAT ) vs. Ambient Temperature ( T_A ).

FIGURE 2-21: Thermistor Reference Voltage ( V_THREF ) vs. Thermistor Bias Current ( I_THREF ).

FIGURE 2-24: Thermistor Reference Voltage ( V_THREF ) vs. Ambient Temperature ( T_A ).

NOTE: Unless otherwise indicated, V_DD = [V_REG(typ.) + 1V] , I_OUT = 10 mA and T_A = +25^ , Constant-voltage mode.

FIGURE 2-25: Line Transient Response.

FIGURE 2-28: Line Transient Response.

FIGURE 2-26: Load Transient Response.

FIGURE 2-29: Load Transient Response.

FIGURE 2-27: Power Supply Ripple Rejection.

FIGURE 2-30: Power Supply Ripple Rejection.

NOTE: Unless otherwise indicated, V_DD = [V_REG(typ.) + 1V] , I_OUT = 10 mA and T_A = +25^ , Constant-voltage mode.

FIGURE 2-31: Charge Current (I OUT) vs. Programming Resistor ( R_PROG ).

FIGURE 2-32: Charge Current (I OUT) vs. Ambient Temperature ( T_A ).

3.0 PIN DESCRIPTION

The descriptions of the pins are listed in Table3.1.

TABLE 3-1: PIN FUNCTION TABLE

MCP73861/2/3/4		Symbol Function	Symbol Function
QFN SOIC
1	3	V_SET	Voltage Regulation Selection
2	4	V_DD1	Battery Management Input Supply
3	5	V_DD2	Battery Management Input Supply
4	6	V_SS1	Battery Management 0V Reference
5	7	PROG	Current Regulation Set
6	8	THREF	Cell Temperature Sensor Bias
7	9	THERM	Cell Temperature Sensor Input
8	10	TIMER	Timer Set
9	11	V_SS3	Battery Management 0V Reference
10	12	V_BAT1	Battery Charge Control Output
11	13	V_BAT2	Battery Charge Control Output
12	14	V_BAT3	Battery Voltage Sense
13	15	V_SS2	Battery Management 0V Reference
14	16	EN	Logic Enable
15	1	STAT2	Fault Status Output
16	2	STAT1	Charge Status Output
17	-	EP	Exposed Pad; Battery Management 0V Reference

3.1 Voltage Regulation Selection ( V_SET )

MCP73861/3: Connect V_SET to V_SS for 4.1V regulation voltage, connect to V_DD for 4.2V regulation voltage. MCP73862/4: Connect V_SET to V_SS for 8.2V regulation voltage, connect to V_DD for 8.4V regulation voltage.

3.2 Battery Management Input Supply ( V_DD2 , V_DD1 )

A supply voltage of [V_REG (typ.) + 0.3V] to 12V is recommended. Bypass to V_SS with a minimum of 4.7 F. A 1.5 k resistor should be connected from V_DD to ground when using disconnectable supplies to force V_DD < V_BAT when the supply is disconnected and assure low leakage current.

3.3 Battery Management 0V Reference ( V_SS1 , V_SS2 , V_SS3 )

Connect to negative terminal of battery and input supply.

3.4 Current Regulation Set (PROG)

Preconditioning, fast and termination currents are scaled by placing a resistor from PROG to V_SS .

3.5 Cell Temperature Sensor Bias (THREF)

THREF is a voltage reference to bias external thermistor for continuous cell temperature monitoring and prequalification.

3.6 Cell Temperature Sensor Input (THERM)

THERM is an input for an external thermistor for continuous cell-temperature monitoring and prequalification. Connect to THREF/3 to disable temperature sensing.

3.7 Timer Set

All safety timers are scaled by C_TIMER/0.1 F .

3.8 Battery Charge Control Output ( V_BAT1 , V_BAT2 )

Connect to positive terminal of battery. Drain terminal of internal P-channel MOSFET pass transistor. Bypass to V_SS with a minimum of 4.7 F to ensure loop stability when the battery is disconnected.

3.9 Battery Voltage Sense (V BAT3)

V_BAT3 is a voltage sense input. Connect to positive terminal of battery. A precision internal resistor divider regulates the final voltage on this pin to V_REG

3.10 Logic Enable (EN)

EN is an input to force charge termination, initiate charge, clear faults or disable automatic recharge.

3.11 Fault Status Output (STAT2)

STAT2 is a current-limited, open-drain drive for direct connection to a LED for charge status indication. Alternatively, a pull-up resistor can be applied for interfacing to a host microcontroller.

3.12 Charge Status Output (STAT1)

STAT1 is a current-limited, open-drain drive for direct connection to a LED for charge status indication. Alternatively, a pull-up resistor can be applied for interfacing to a host microcontroller.

3.13 Exposed Pad (EP)

There is an internal electrical connection between the exposed thermal pad and V_SS . The EP must be connected to the same potential as the V_SS pin on the Printed Circuit Board (PCB).

4.0 DEVICE OVERVIEW

The MCP7386X family of devices are highly advanced linear charge management controllers. Refer to the functional block diagram. Figure 4-2 depicts the operational flow algorithm from charge initiation to completion and automatic recharge.

4.1 Charge Qualification and Preconditioning

Upon insertion of a battery, or application of an external supply, the MCP7386X family of devices automatically performs a series of safety checks to qualify the charge. The input source voltage must be above the Undervoltage Lockout (UVLO) threshold, the enable pin must be above the logic-high level and the cell temperature must be within the upper and lower thresholds. The qualification parameters are continuously monitored. Deviation beyond the limits automatically suspends or terminates the charge cycle. The input voltage must deviate below the UVLO stop threshold for at least one clock period to be considered valid.

Once the qualification parameters have been met, the MCP7386X initiates a charge cycle. The charge status output is pulled low throughout the charge cycle (see Table 5-1 for charge status outputs). If the battery voltage is below the preconditioning threshold ( V_PTH ), the MCP7386X preconditions the battery with a trickle-charge. The preconditioning current is set to approximately 10% of the fast charge regulation current. The preconditioning trickle-charge safely replenishes deeply depleted cells and minimizes heat dissipation during the initial charge cycle. If the battery voltage has not exceeded the preconditioning threshold before the preconditioning timer has expired, a fault is indicated and the charge cycle is terminated.

4.2 Constant Current Regulation – Fast Charge

Preconditioning ends, and fast charging begins, when the battery voltage exceeds the preconditioning threshold. Fast charge regulates to a constant current ( I_REG ), which is set via an external resistor connected to the PROG pin. Fast charge continues until the battery voltage reaches the regulation voltage ( V_REG ), or the fast charge timer expires; in which case, a fault is indicated and the charge cycle is terminated.

4.3 Constant Voltage Regulation

When the battery voltage reaches the regulation voltage ( V_REG ), constant voltage regulation begins. The MCP7386X monitors the battery voltage at the V_BAT pin. This input is tied directly to the positive terminal of the battery.

The MCP7386X selects the voltage regulation value based on the state of V_SET . With V_SET tied to V_SS , the MCP73861/3 and MCP73862/4 regulate to 4.1V and 8.2V, respectively. With V_SET tied to V_DD , the MCP73861/3 and MCP73862/4 regulate to 4.2V and 8.4V, respectively.

4.4 Charge Cycle Completion and Automatic Re-Charge

The MCP7386X monitors the charging current during the Constant-voltage regulation mode. The charge cycle is considered complete when the charge current has diminished below approximately 8% of the regulation current ( I_REG ), or the elapsed timer has expired.

The MCP7386X automatically begins a new charge cycle when the battery voltage falls below the recharge threshold ( V_RTH ), assuming all the qualification parameters are met.

4.5 Thermal Regulation

The MCP7386X family limits the charge current based on the die temperature. Thermal regulation optimizes the charge cycle time while maintaining device reliability. If thermal regulation is entered, the timer is automatically slowed down to ensure that a charge cycle will not terminate prematurely. Figure 4-1 depicts the thermal regulation profile.

FIGURE 4-1: Typical Maximum Charge Current vs. Die Temperature.

4.6 Thermal Shutdown

The MCP7386X family suspends charge if the die temperature exceeds 155°C. Charging will resume when the die temperature has cooled by approximately 10°C. The thermal shutdown is a secondary safety feature in the event that there is a failure within the thermal regulation circuitry.

graph TD
    A["Initialize"] --> B{V_DD > V_UVLO EN High}
    B -->|No STAT1 = Off STAT2 = Off| C{Temperature OK}
    B -->|Yes| D{V_BAT > V_PTH}
    C -->|No| E["Preconditioning Mode Charge Current = I_PREG Reset Safety Timer"]
    C -->|Yes| F["Constant-Current Mode Charge Current = I_REG Reset Safety Timer"]
    D -->|No| F
    D -->|Yes| G["Constant-Voltage Mode Output Voltage = V_REG"]
    F --> H{V_BAT > V_PTH}
    H -->|No| I["Safety Timer Expired"]
    H -->|Yes| J["Fault Charge Current = 0 Reset Safety Timer"]
    I --> K{Temperature OK}
    K -->|No STAT1 = Off STAT2 = OnSTAT2 = Flashing| L{V_DD < V_UVLO or EN Low}
    K -->|Yes| M{V_DD < V_UVLO or EN Low}
    L --> N{Safety Timer Suspended Charge Current = 0}
    M --> O{Safety Timer Suspended Charge Current = 0}
    N --> P{I_OUT < I_TERM Elapsed Timer Expired}
    O --> Q{I_OUT < I_TERM Elapsed Timer Expired}
    P --> R{I_OUT < I_TERM Elapsed Timer Expired}
    Q --> S{I_OUT < I_TERM Elapsed Timer Expired}
    R --> T{I_OUT < I_TERM Elapsed Timer Expired}
    S --> U{I_OUT < I_TERM Elapsed Timer Expired}
    T --> V{I_OUT < I_TERM Elapsed Timer Expired}
    U --> W{I_OUT < I_TERM Elapsed Timer Expired}
    V --> X{I_OUT < I_TERM Elapsed Timer Expired}
    W --> Y{I_OUT < I_TERM Elapsed Timer Expired}
    X --> Z{I_OUT < I_TERM Elapsed Timer Expired}
    Y --> AA{I_OUT < I_TERM Elapsed Timer Expired}
    Z --> AB{I_OUT < I_TERM Elapsed Timer Expired}
    AA --> AC{I_OUT < I_TERM Elapsed Timer Expired}
    AB --> AD{I_OUT < I_TERM Elapsed Timer Expired}
    AC --> AE{I_OUT < I_TERM Elapsed Timer Expired}
    AD --> AF{I_OUT < I_TERM Elapsed Timer Expired}
    AE --> AG{I_OUT < I_TERM Elapsed Timer Expired}
    AF --> AH{I_OUT < I_TERM Elapsed Timer Expired}
    AG --> AI{I_OUT < I_TERM Elapsed Timer Expired}
    AH --> AJ{I_OUT < I_TERM Elapsed Timer Expired}
    AI --> AK{I_OUT < I_TERM Elapsed Timer Expired}
    AJ --> AL{I_OUT < I_TERM Elapsed Timer Expired}
    AK --> AM{I_OUT < I_TERM Elapsed Timer Expired}
    AL --> AN{I_OUT < I_TERM Elapsed Timer Expired}
    AM --> AO{I_OUT < I_TERM Elapsed Timer Expired}
    AN --> AP{I_OUT < I_TERM Elapsed Timer Expired}
    AO --> AQ{I_OUT < I_TERM Elapsed Timer Expired}
    AP --> AR{I_OUT < I_TERM Elapsed Timer Expired}
    AQ --> AS{I_OUT < I_TERM Elapsed Timer Expired}
    AR --> AT{I_OUT < I_TERM Elapsed Timer Expired}
    AS --> AU{I_OUT < I_TERM Elapsed Timer Expired}
    AT --> AV{I_OUT < I_TERM Elapsed Timer Expired}
    AU --> AW{I_OUT < I_TERM Elapsed Timer Expired}
    AV --> AX{I_OUT < I_TERM Elapsed Timer Expired}
    AW --> AY{I_OUT < I_TERM Elapsed Timer Expired}
    AX --> AZ{I_OUT < I_TERM Elapsed Timer Expired}
    AY --> BA{I_OUT < I_TERM Elapsed Timer Expired}
    AZ --> BB{I_OUT < I_TERM Elapsed Timer Expired}
    BA --> BC{I_OUT < I_TERM Elapsed Timer Expired}
    BB --> BD{I_OUT < I_TERM Elapsed Timer Expired}
    BC --> BE{I_OUT < I_TERM Elapsed Timer Expired}
    BD --> BF{I_OUT < I_TERM Elapsed Timer Expired}
    BE --> BG{I_OUT < I_TERM Elapsed Timer Expired}
    BF --> BH{I_OUT < I_TERM Elapsed Timer Expired}
    BG --> BI{I_OUT < I_TERM Elapsed Timer Expired}
    BH --> BJ{I_OUT < I_TERM Elapsed Timer Expired}
    BI --> BK{I_OUT < I_TERM Elapsed Timer Expired}
    BJ --> BL{I_OUT < I_TERM Elapsed Timer Expired}
    BK --> BM{I_OUT < I_TERM Elapsed Timer Expired}
    BL --> BN{I_OUT < I_TERM Elapsed Timer Expired}
    BM --> BO{I_OUT < I_TERM Elapsed Timer Expired}
    BN --> BP{I_OUT < I_TERM Elapsed Timer Expired}
    BO --> BQ{I_OUT < I_TERM Elapsed Timer Expired}
    BP --> BR{I_OUT < I_TERM Elapsed Timer Expired}

FIGURE 4-2: Operational Flow Algorithm.

5.0 DETAILED DESCRIPTION

5.1 Analog Circuitry

5.1.1 BATTERY MANAGEMENT INPUT SUPPLY ( V_DD1 , V_DD2 )

The V_DD input is the input supply to the MCP7386X. The MCP7386X automatically enters a Power-down mode if the voltage on the V_DD input falls below the UVLO voltage ( V_STOP ). This feature prevents draining the battery pack when the V_DD supply is not present. The V_DD inputs should be tied to ground with a resistor <= 1.5 kΩ to prevent V_DD from floating and staying at V_BAT level if the input supply is disconnected. The resistor will assure that V_DD < V_BAT when the input supply is removed.

5.1.2 PROG INPUT

Fast charge current regulation can be scaled by placing a programming resistor ( R_PROG ) from the PROG input to V_SS . Connecting the PROG input to V_SS allows for a maximum fast charge current of 1.2A, typically. The minimum fast charge current is 100 mA, set by letting the PROG input float. The following formula calculates the value for R_PROG :

$$ R _ {P R O G} \quad \frac {1 3 . 2 H I \times_ {R E G}}{1 2 \times I _ {R E G} 1 . 2 -} $$

Where:

I_REG = the desired fast charge current in amps.

R_PROG = measured in kΩ.

The preconditioning trickle-charge current and the charge termination current are scaled to approximately 10% and 8% of I_REG respectively.

5.1.3 CELL TEMPERATURE SENSOR BIAS (THREF)

A 2.5V voltage reference is provided to bias an external thermistor for continuous cell temperature monitoring and prequalification. A ratio metric window comparison is performed at threshold levels of V_THREF/2 and V_THREF/4 .

5.1.4 CELL TEMPERATURE SENSOR INPUT (THERM)

The MCP73861/2/3/4 continuously monitors temperature by comparing the voltage between the THERM input and V_SS with the upper and lower temperature thresholds. A negative or positive temperature coefficient, NTC or PTC thermistor and an external voltage-divider typically develop this voltage. The temperature sensing circuit has its own reference to which it performs a ratio metric comparison. Therefore, it is immune to fluctuations in the supply input ( V_DD ). The

temperature-sensing circuit is removed from the system when V_DD is not applied, eliminating additional discharge of the battery pack.

Figure 6-1 depicts a typical application circuit with connection of the THERM input. The resistor values of R_T1 and R_T2 are calculated with the following equations.

For NTC thermistors:

$$ R _ {T I} = \frac {2 \times R _ {C O L D} \times R _ {H O T}}{R _ {C O L D} - R _ {H O T}} $$

$$ R _ {T 2} = \frac {2 \times R _ {C O L D} \times R _ {H O T}}{R _ {C O L D} - 3 \times R _ {H O T}} $$

For PTC thermistors:

$$ R _ {T I} = \frac {2 \times R _ {C O L D} \times R _ {H O T}}{R _ {H O T} - R _ {C O L D}} $$

$$ R _ {T 2} = \frac {2 \times R _ {C O L D} \times R _ {H O T}}{R _ {H O T} - 3 \times R _ {C O L D}} $$

Where:

R_COLD and R_HOT are the thermistor resistance values at the temperature window of interest.

Applying a voltage equal to V_THREF/3 to the THERM input disables temperature monitoring.

5.1.5 TIMER SET INPUT (TIMER)

The TIMER input programs the period of the safety timers by placing a timing capacitor ( C_TIMER ) between the TIMER input pin and V_SS . Three safety timers are programmed via the timing capacitor.

The preconditioning safety timer period:

$$ t _ {P R E C O N} = \frac {C _ {T I M E R}}{0 . 1 \mu F} \times 1. 0 H o u r s $$

The fast charge safety timer period:

$$ t _ {F A S T} = \frac {C _ {T I M E R}}{0 . 1 \mu F} k. 5 H o u r s $$

The elapsed time termination period:

$$ t _ {T E R M} = \frac {C _ {T I M E R}}{0 . 1 \mu F} \times 3. 0 H o u r s $$

The preconditioning timer starts after qualification and resets when the charge cycle transitions to the fast charge, Constant-current mode. The fast charge timer and the elapsed timer start once the MCP7386X transitions from preconditioning. The fast charge timer resets when the charge cycle transitions to the Constant-voltage mode. The elapsed timer will expire and terminate the charge if the sensed current does not diminish below the termination threshold.

During thermal regulation, the timer is slowed down proportional to the charge current.

5.1.6 BATTERY VOLTAGE SENSE (V BAT3)

The MCP7386X monitors the battery voltage at the V_BAT3 pin. This input is tied directly to the positive terminal of the battery pack.

5.1.7 BATTERY CHARGE CONTROL

OUTPUT ( V_BAT1 , V_BAT2 )

The battery charge control output is the drain terminal of an internal P-channel MOSFET. The MCP7386X provides constant current and voltage regulation to the battery pack by controlling this MOSFET in the linear region. The battery charge control output should be connected to the positive terminal of the battery pack.

5.2 Digital Circuitry

5.2.1 CHARGE STATUS OUTPUTS (STAT1, STAT2)

Two status outputs provide information on the state of charge. The current-limited, open-drain outputs can be used to illuminate external LEDs. Optionally, a pull-up resistor can be used on the output for communication with a host microcontroller. Table 5-1 summarizes the state of the status outputs during a charge cycle.

TABLE 5-1: STATUS OUTPUTS

CHARGE CYCLE STAT1	STAT1 STAT2
Qualification Off Off
Preconditioning	On	Off
Constant-Current Fast Charge	On	Off
Constant-Voltage	On Off
Charge Complete	Flashing (1 Hz, 50% duty cycle) (MCP73861/2)	Off(All Devices)
	Off(MCP73863/4)
Fault	Off On
THERM Invalid	Off	Flashing (1 Hz 50% duty cycle)
Disabled – Sleep mode	Off Off
Input Voltage Dis-connected (1.5KΩ Pulldown)	Off Off

Legend: Off state: Open-drain is high-impedance On state: Open-drain can sink current typically 7 mA Flashing: Toggles between off state and on state

The flashing rate (1 Hz) is based off a timer capacitor ( C_TIMER ) of 0.1 F. The rate will vary based on the value of the timer capacitor.

During a Fault condition, the STAT1 status output will be off and the STAT2 status output will be on. To recover from a Fault condition, the input voltage must be removed and then reapplied, or the enable input (EN) must be de-asserted to a logic-low, then asserted to a logic-high.

When the voltage on the THERM input is outside the preset window, the charge cycle will not start, or will be suspended. The charge cycle is not terminated and recovery is automatic. The charge cycle will resume (or start) once the THERM input is valid and all other qualification parameters are met. During an invalid THERM condition, the STAT1 status output will be off and the STAT2 status output will flash.

5.2.2 V SET INPUT

The V_SET input selects the regulated output voltage of the MCP7386X. With V_SET tied to V_SS , the MCP73861/3 and MCP73862/4 regulate to 4.1V and 8.2V, respectively. With V_SET tied to V_DD , the MCP73861/3 and MCP73862/4 regulate to 4.2V and 8.4V, respectively.

5.2.3 LOGIC ENABLE (EN)

The logic enable input pin (EN) can be used to terminate a charge at any time during the charge cycle, as well as to initiate a charge cycle or initiate a recharge cycle.

Applying a logic-high input signal to the EN pin, or tying it to the input source, enables the device. Applying a logic-low input signal disables the device and terminates a charge cycle. When disabled, the device's supply current is reduced to 0.17 A, typically.

6.0 APPLICATIONS

The MCP7386X is designed to operate in conjunction with a host microcontroller or in stand-alone applications. The MCP7386X provides the preferred charge algorithm for Lithium-Ion and Lithium-Polymer cells Constant-current followed by Constant-voltage.

Figure 6-1 illustrates a typical stand-alone application circuit, while Figures 6-2 and 6-3 illustrate the accompanying charge profile

Unregulated Wall Cube 1.5K VSET VDD1 VDD2 VSS1 PROG RPROG THREF RT1 RT2 STAT2 ENSTAT1 14 15 16 VBAT3 VBAT2 VBAT1 VSS3 TIMER CTIMER + Single Lithium-Ion Cell

FIGURE 6-1: Typical Application Circuit.

FIGURE 6-2: Typical Charge Profile.

FIGURE 6-3: Typical Charge Profile in Thermal Regulation.

6.1 Application Circuit Design

Due to the low efficiency of linear charging, the most important factors are thermal design and cost, which are a direct function of the input voltage, output current and thermal impedance between the battery charger and the ambient cooling air. The worst-case situation is when the device has transitioned from the Preconditioning mode to the Constant-current mode. In this situation, the battery charger has to dissipate the maximum power. A trade-off must be made between the charge current, cost and thermal requirements of the charger.

6.1.1 COMPONENT SELECTION

Selection of the external components in Figure 6-1 is crucial to the integrity and reliability of the charging system. The following discussion is intended as a guide for the component selection process.

6.1.1.1 Current Programming Resistor (RPROG)

The preferred fast charge current for Lithium-Ion cells is at the 1C rate, with an absolute maximum current at the 2C rate. For example, a 500 mAh battery pack has a preferred fast charge current of 500 mA. Charging at this rate provides the shortest charge cycle times without degradation to the battery pack performance or life.

1200 mA is the maximum charge current obtainable from the MCP7386X. For this situation, the PROG input should be connected directly to V_SS .

6.1.1.2 Thermal Considerations

The worst-case power dissipation in the battery charger occurs when the input voltage is at the maximum and the device has transitioned from the Pre-conditioning mode to the Constant-current mode. In this case, the power dissipation is:

PowerDissipation V= DDMAX-(VPTHMIN × REGMAX) Where: VDDMAX = the maximum input voltage REGMAX = the maximum fast charge current VPTHMIN = the minimum transition threshold voltage

Power dissipation with a 5V, ±10% input voltage source is:

$$ \text { PowerDissipation } \quad (5. 5 V - 2. 7 V) \times 5 7 5 m A \quad 1. 6 1 W = $$

With the battery charger mounted on a 1 in ^2 pad of 1 oz. copper, the junction temperature rise is 60°C, approximately. This would allow for a maximum operating ambient temperature of 50°C before thermal regulation is entered.

6.1.1.3 External Capacitors

The MCP7386X is stable with or without a battery load. In order to maintain good AC stability in the Constant-voltage mode, a minimum capacitance of 4.7 F is recommended to bypass the V_BAT pin to V_SS . This capacitance provides compensation when there is no battery load. In addition, the battery and interconnections appear inductive at high frequencies. These elements are in the control feedback loop during Constant-voltage mode. Therefore, the bypass capacitance may be necessary to compensate for the inductive nature of the battery pack.

Virtually any good quality output filter capacitor can be used, independent of the capacitor's minimum Effective Series Resistance (ESR) value. The actual value of the capacitor (and its associated ESR) depends on the output load current. A 4.7 F ceramic, tantalum or aluminum electrolytic capacitor at the output is usually sufficient to ensure stability for up to a 1A output current.

6.1.1.4 Reverse-Blocking Protection

The MCP7386X provides protection from a faulted or shorted input, or from a reversed-polarity input source. Without the protection, a faulted or shorted input would discharge the battery pack through the body diode of the internal pass transistor.

6.1.1.5 Enable Interface

In the stand-alone configuration, the enable pin is generally tied to the input voltage. The MCP7386X automatically enters a Low-power mode when voltage on the V_DD input falls below the UVLO voltage ( V_STOP ), reducing the battery drain current to 0.23 A, typically.

6.1.1.6 Charge Status Interface

Two status outputs provide information on the state of charge. The current-limited, open-drain outputs can be used to illuminate external LEDs. Refer to Table 5-1 for a summary of the state of the status outputs during a charge cycle.

6.2 PCB Layout Issues

For optimum voltage regulation, place the battery pack as close as possible to the device's V_BAT and V_SS pins, recommended to minimize voltage drops along the high current-carrying PCB traces.

If the PCB layout is used as a heatsink, adding many vias in the heatsink pad can help conduct more heat to the backplane of the PCB, thus reducing the maximum junction temperature.

NOTES:

7.0 PACKAGING INFORMATION

7.1 Package Marking Information

16-Lead QFN

XXXXX XXXXXX XXXXXX YWWNNN

Example:

73861 I/ML 1108 256

16-Lead SOIC (150 mil) Example:

XXXXXXXXXXXXXX XXXXXXXXXXXXXX YYWWNNN

MCP73861 I/SL e3 1108256

Legend: XX...X Customer-specific information

Y Year code (last digit of calendar year)

YY Year code (last 2 digits of calendar year)

WW Week code (week of January 1 is week '01')

NNN Alphanumeric traceability code

ePb-free JEDEC designator for Matte Tin (Sn)

* This package is Pb-free. The Pb-free JEDEC designator (e3) can be found on the outer packaging for this package.

Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.

16-Lead Plastic Quad Flat, No Lead Package (ML) - 4x4x0.9 mm Body [QFN]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

Units		MILLIMETERS
Dimension Limits		MIN NOM MAX
Number of Pins N 16
Pitch e 0.65 BSC
Overall Height	A	0.80	0.90	1.00
Standoff	A1	0.00	0.02	0.05
Contact Thickness	A3	0.20 REF
Overall Width	E	4.00 BSC
Exposed Pad Width	E2	2.50	2.65	2.80
Overall Length	D	4.00 BSC
Exposed Pad Length	D2	2.50	2.65	2.80
Contact Width	b	0.25	0.30	0.35
Contact Length	L	0.30	0.40	0.50
Contact-to-Exposed Pad	K	0.20	-	-

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-127B

16-Lead Plastic Quad Flat, No Lead Package (ML) - 4x4x0.9mm Body [QFN]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

C1 W2 C2 T2 E G Y1 X1 SILK SCREEN

RECOMMENDED LAND PATTERN

Units		MILLIMETERS
Dimension Limits		MIN	NOM	MAX
Contact Pitch	E	0.65 BSC
Optional Center Pad Width	W2			2.50
Optional Center Pad Length	T2			2.50
Contact Pad Spacing	C1		4.00
Contact Pad Spacing	C2		4.00
Contact Pad Width (X16)	X1			0.35
Contact Pad Length (X16)	Y1			0.80
Distance Between Pads	G	0.30

Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing No. C04-2127A

16-Lead Plastic Small Outline (SL) - Narrow, 3.90 mm Body [SOIC]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

2X 0.10 C A-B 2X NOTE 5 A D E1 E 2X 0.10 C D NOTE 1 1 2 3 e B NOTE 5 0.20 C 2X N/2 TIPS NX b Φ 0.25M C A-B D TOP VIEW // 0.10 C A2 A1 SIDE VIEW NX SEATING PLANE C A h h c H SEE VIEW C I VIEW A-A

Microchip Technology Drawing No. C04-108C Sheet 1 of 2

16-Lead Plastic Small Outline (SL) - Narrow, 3.90 mm Body [SOIC]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

α 4X Θ φ L (L1) 4X β

VIEW C

Isometric line drawing of an integrated circuit chip with multiple pins (no text or symbols)

Units		MILLIMETERS
Dimension Limits		MIN	NOM	MAX
Number of Pins	N	16
Pitch	e	1.27 BSC
Overall Height	A	-	-	1.75
Molded Package Thickness	A2	1.25	-	-
Standoff §	A1	0.10	-	0.25
Overall Width	E	6.00 BSC
Molded Package Width	E1	3.90 BSC
Overall Length	D	9.90 BSC
Chamfer (Optional)	h	0.25	-	0.50
Foot Length	L	0.40	-	1.27
Footprint	L1	1.04 REF
Lead Angle		0^	-	-
Foot Angle		0^	-	8^
Lead Thickness	c	0.10	-	0.25
Lead Width	b	0.31	-	0.51
Mold Draft Angle Top		5^	-	15^
Mold Draft Angle Bottom		5^	-	15^

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Dimension D does not include mold flash, protrusions or gate burrs, which shall not exceed 0.15 mm per end. Dimension E1 does not include interlead flash or protrusion, which shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only.
5. Datums A & B to be determined at Datum H.

Microchip Technology Drawing No. C04-108C Sheet 2 of 2

16-Lead Plastic Small Outline (SL) - Narrow, 3.90 mm Body [SOIC]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

Gx C G SILK SCREEN Y E X

RECOMMENDED LAND PATTERN

Units		MILLIMETERS
Dimension Limits		MIN	NOM	MAX
Contact Pitch	E	1.27 BSC
Contact Pad Spacing	C		5.40
Contact Pad Width	X			0.60
Contact Pad Length	Y			1.50
Distance Between Pads	Gx	0.67
Distance Between Pads	G	3.90

Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing No. C04-2108A

APPENDIX A: REVISION HISTORY

Revision F (March 2013)

The following is the list of modifications:

1. Added the Output Reverse Leakage Switchover Time parameter to the DC Characteristics table.
2. Updated Section 3.2.
3. Updated Section 5.1.1.
4. Updated Figure 6-1.

Revision E (April 2011)

The following is the list of modifications:

1. Updated Figure 2-4.

Revision D (December 2008)

The following is the list of modifications:

1. Updated package outline diagrams.

Revision C (August 2005)

The following is the list of modifications:

1. Added MCP73863 and MCP73864 devices throughout data sheet.
2. Added Appendix A: Revision History.
3. Updated QFN and SOIC package diagrams.

Revision B (December 2004)

The following is the list of modifications:

Added SOIC package throughout data sheet.

Revision A (June 2004)

Original Release of this Document.

NOTES:

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, contact the Microchip sales office.

PART NO. X /XX

Device

Range

PackageTemperature

Device: MCP73861: Single-Cell Charge Controller with

Temperature Monitor

MCP73861T: Single-Cell Charge Controller with

Temperature Monitor, Tape and Reel

MCP73862: Dual Series Cells Charge Controller with

Temperature Monitor

MCP73862T: Dual Series Cells Charge Controller with

Temperature Monitor, Tape and Reel

MCP73863: Single-cell Charge Controller with

Temperature Monitor

MCP73863T: Single-Cell Charge Controller with

Temperature Monitor, Tape and Reel

MCP73864: Dual Series Cells Charge Controller with

Temperature Monitor

MCP73864T: Dual Series Cells Charge Controller with

Temperature Monitor, Tape and Reel

Temperature Range:

= -40°C to +85°C (Industrial)

Package:

ML = Plastic Quad Flat No Lead. 4x4 mm Body (QFN).

16-lead

SL = Plastic Small Outline, 150 mm Body (SOIC),

16-lead

Examples:

a) MCP73861-I/ML: Single-Cell Controller

16LD-QFN package.

b) MCP73861T-I/ML: Tape and Reel,

Single-Cell Controller

16LD-QFN package.

c) MCP73861-I/SL: Single-Cell Controller

16LD-SOIC package.

d) MCP73861T-I/SL: Tape and Reel,

Single-Cell Controller

16LD-SOIC package.

a) MCP73862-I/ML: Dual-Cell Controller

16LD-QFN package.

b) MCP73862T-I/ML: Tape and Reel,

Dual-Cell Controller

16LD-QFN package

c) MCP73862-I/SL: Dual-Cell Controller

16LD-SOIC package.

d) MCP73862T-I/SL: Tape and Reel,

Dual-Cell Controller

16LD-SOIC package.

a) MCP73863-I/ML: Single-Cell Controller

16LD-QFN package.

b) MCP73863T-I/ML: Tape and Reel,

Single-Cell Controller

16LD-QFN package.

c) MCP73863-I/SL: Single-Cell Controller

16LD-SOIC package.

d) MCP73863T-I/SL: Tape and Reel,

Single-Cell Controller

16LD-SOIC package.

a) MCP73864-I/ML: Dual-Cell Controller

16LD-QFN package.

b) MCP73864T-I/ML: Tape and Reel,

Dual-Cell Controller

16LD-QFN package.

c) MCP73864-I/SL: Dual-Cell Controller

16LD-SOIC package.

d) MCP73864T-I/SL: Tape and Reel,

Dual-Cell Controller

16LD-SOIC package.

NOTES:

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.
- Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.
- There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
- Microchip is willing to work with the customer who is concerned about the integrity of their code.
- Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.

QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV = ISO/TS 16949=

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC ^32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

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11/29/12