EMC1833 - Electronic component Microchip - Free user manual and instructions

USER MANUAL EMC1833 Microchip

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.
- Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.
- There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
- Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated.

Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV = ISO/TS 16949=

Trademarks

The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, CryptoAuthentication, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.

Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.

GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries.

All other trademarks mentioned herein are property of their respective companies.

© 2017, Microchip Technology Incorporated, All Rights Reserved.

ISBN: 978-1-5224-2696-7

Table of Contents

Preface 5

Introduction....5

Document Layout 5

Conventions Used in this Guide 6

Recommended Reading....7

The Microchip Website....7

Product Change Notification Service....7

Customer Support 7

Document Revision History 7

Chapter 1. Product Overview

1.1 Introduction 9

1.2 EMC1833 Device Overview 9

1.3 EMC1833 Evaluation Board Overview 9

1.4 Evaluation Board Kit Contents 10

Chapter 2. Installation and Operation

2.1 Getting Started 11

2.2 System and Configuration Requirements 11

2.3 Board Setup 11

2.4 Software Setup 13

Chapter 3. Software GUI Description

3.1 Thermal Management Utility Software GUI Overview 17

3.2 Real-Time Acquisition Action Buttons 18

3.3 Temperatures, Sensor Settings and Registers List tabs 19

3.4 Data Acquisition Charting Area 23

Appendix A. Schematic and Layouts

A.1 Introduction 30

A.2 ADM00773 Board – Schematic 31

A.3 ADM00773 Board – Schematic 2 32

A.4 Board – Top Silk 33

A.5 Board – Top Copper and Silk 33

A.6 Board – Top Copper 34

A.7 Board – Bottom Copper 34

A.8 Board – Bottom Copper and Silk 35

A.9 Board – Bottom silk 35

Appendix B. Bill of Materials (BOM) 36

Worldwide Sales and Service 38

Preface

NOTICE TO CUSTOMERS

All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our website (www.microchip.com) to obtain the latest documentation available.

Documents are identified with a "DS" number. This number is located on the bottom of each page, in front of the page number. The numbering convention for the DS number is "DSXXXXXXXXA", where "XXXXXXXXX" is the document number and "A" is the revision level of the document.

For the most up-to-date information on development tools, see the MPLAB ^® IDE online help. Select the Help menu, and then Topics to open a list of available online help files.

INTRODUCTION

This chapter contains general information that will be useful to know before using the EMC1833 Evaluation Board User's Guide. Items discussed in this chapter include:

• Document Layout
• Conventions Used in this Guide
  • Recommended Reading
  • The Microchip Website
  • Product Change Notification Service
• Customer Support
  • Document Revision History

DOCUMENT LAYOUT

This document describes how to use the EMC1833 Evaluation Board User's Guide as a development tool to emulate and debug firmware on a target board. The manual layout is as follows:

• Chapter 1. “Product Overview” – Important information about the EMC1833 Evaluation Board User’s Guide.
• Chapter 2. “Installation and Operation” – This chapter includes a detailed description of each function of the evaluation board and instructions on how to use the board.
• Chapter 3. “Software GUI Description” – Includes instructions to evaluate the EMC1833 for temperature sensing applications.
• Appendix A. “Schematic and Layouts” – Shows the schematic and layout diagrams for the EMC1833 Evaluation Board User’s Guide.
• Appendix B. “Bill of Materials (BOM)” – Lists the parts used to build the EMC1833 Evaluation Board User’s Guide.

CONVENTIONS USED IN THIS GUIDE

This manual uses the following documentation conventions:

DOCUMENTATION CONVENTIONS

Description Represents Examples
Arial font:
Italic characters Referenced books	Books MPLAB	^ IDE User's Guide
	Emphasized text ...is the only compiler...
Initial caps A window the Output	ut window
	A dialog the Settings dialog
	A menu selection select Enable Programmer
Quotes A field name in a window or dialog		"Save project before build"
Underlined, italic text with right angle bracket	A menu path	File>Save
Bold characters	A dialog button	Click OK
	A tab	Click the Power tab
N'Rnnnn	A number in verilog format, where N is the total number of digits, R is the radix and n is a digit.	4'b0010, 2'hF1
Text in angle brackets <>	A key on the keyboard	Press,,
Courier New font:
Plain Courier New	Sample source code	#define START
	Filenames	autoexec.bat
	File paths	c:\mccl8\h
	Keywords	_asm, _endasm, static
	Command-line options	-Opa+, -Opa-
	Bit values	0, 1
	Constants	0xFF, 'A'
Italic Courier New	A variable argument	file.o, where file can be any valid filename
Square brackets []	Optional arguments	mccl8 [options] file [options]
Curly brackets and pipe character: { | }	Choice of mutually exclusive arguments; an OR selection	errorlevel {0|1}
Ellipses...	Replaces repeated text	var_name [, var_name...]
	Represents code supplied by user	void main (void) { ... }

RECOMMENDED READING

This user's guide describes how to use the EMC1833 Evaluation Board. Other useful documents are listed below. The following Microchip documents are available and recommended as supplemental reference resources:

EMC1812/13/14/15/33 Data Sheet – “EMC1812/13/14/15/33 DS Multi-Channel Low-Voltage Remote Diode Sensor Family Data Sheet” (DS20005751).

PIC18(L)F2X/45K50 Data Sheet – “28/40/44-Pin, Low-Power, High-Performance Microcontrollers with XLP Technology” (DS30000684).

THE MICROCHIP WEBSITE

Microchip provides online support via our website at www.microchip.com. This website is used as a means to make files and information easily available to customers. Accessible by using your favorite internet browser, the website contains the following information:

• Product Support – Data sheets and errata, application notes and sample programs, design resources, user's guides and hardware support documents, latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives

PRODUCT CHANGE NOTIFICATION SERVICE

Microchip's customer notification service helps keep customers current on Microchip products. Subscribers will receive email notifications whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest.

To register, access the Microchip website at www.microchip.com, click on Product Change Notification and follow the registration instructions.

CUSTOMER SUPPORT

Users of Microchip products can receive assistance through several channels:

• Distributor or Representative
- Local Sales Office
• Field Application Engineer (FAE)
- Technical Support

Customers should contact their distributor, representative or FAE for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document.

Technical support is available through the website at: http://www.microchip.com/support

DOCUMENT REVISION HISTORY

Revision A (February 2018)

- Initial release of this document.

NOTES:

Chapter 1. Product Overview

1.1 INTRODUCTION

This chapter provides an overview of the EMC1833 Evaluation Board:

• What is the EMC1833 Device?
• What is the EMC1833 Evaluation Board?
• What the EMC1833 Evaluation Board Kit Contains

1.2 EMC1833 DEVICE OVERVIEW

The EMC1833 Evaluation Board is used to evaluate the EMC18XX family of remote diode temperature monitors. Users can now easily evaluate many of the integrated features of the EMC18XX device family. The device also has a on-board connector configured for an anti-parallel diode to allow for off-board temperature measurements. In addition, the evaluation board connects to PC through a USB interface. Temperature can be data-logged using the Microchip Thermal Management Software Graphical User Interface (GUI).

1.3 EMC1833 EVALUATION BOARD OVERVIEW

The board enables users to easily evaluate many custom programmable features such as Rate of Change, Temperature Alert Limit settings, Temperature Conversion Rate, Resistance Error Correction (REC) and Power Modes.

Figure 1-1 shows the top view of the EMC1833 Evaluation Board.

CE e SCL ALERT J11 +3.3V +5V GND SDA GND J2 MICROCHIP EMC1833 Customer Evaluation Board ADM00773 Q1 R1 R2 R8 EMC1833 C2 C3

FIGURE 1-1: EMC1833 Evaluation Board (ADM00773) - Top View.

Figure 1-2 shows the bottom view of the EMC1833 Evaluation Board.

FB1 C5 U1 SOT-213 C4 R16 C6 C18 R21 C19 U2 U-N-28 X1 C7 R4 LABEL1 04-10567-R2

FIGURE 1-2: EMC1833 Evaluation Board (ADM00773) - Bottom View.

1.4 EVALUATION BOARD KIT CONTENTS

The EMC1833 Evaluation Board Kit includes:

• EMC1833 Evaluation Board (ADM00773)
- USB cable
• 2N3904FS-ND transistor (TO-92 package)
- Important Information Sheet

Chapter 2. Installation and Operation

2.1 GETTING STARTED

This section describes how to power-up and interface with the EMC1833 Evaluation Board. Items discussed in this chapter include:

• System and configuration requirements
• The hardware setup required prior to using the evaluation board
  • Performing software setup
• Operating the device's software interface, the Thermal Management Utility - [EMC1833] GUI.

2.2 SYSTEM AND CONFIGURATION REQUIREMENTS

The EMC1833 Evaluation Board is designed to be used in a Microsoft Windows® XP® (SP3 or later) environment, based on the Microsoft.NETTM Framework 2. Users can utilize the Microsoft .NET Framework 2 web installer package to download and install the .NET Framework components. For USB connectivity, the minimal physical requirement for the PC is a standard USB 2.0 port. In case the board connects to the PC through a USB hub, use a self-powered hub.

2.3 BOARD SETUP

Before the EMC1833 Evaluation Board can be used, a few steps must be performed to install the PC software and configure the board's hardware.

1. Download the support material (PC application) that can be found on the ADM00773 board page, at www.microchip.com. Unzip the archive and install the .exe file.
2. Connect the collector and base of the transistor to the DP input and the emitter to the DN input. The orientation of the transistor is shown below. Note the transistor is flat side down, as you can observe in Figure 2-1.

CE SCL ALERT J11 +3.2V +RL GND GND J2 Q1 R1 R2 C2 C3 ENC1833 MICROCHIP EMC1833 Customer Evaluation Board ADM00773

FIGURE 2-1: Board Connections.

2.3.1 Hardware Setup and Description

Follow these steps to set up the hardware:

1. The board has a mini-USB connector for a PC interface. Connect the USB cable from the evaluation board to a PC.
2. Start the Thermal Management Software GUI for temperature data logging or to evaluate the sensor board features.

This evaluation board is fully powered from PC USB source, 5V. Once power is applied via USB, and the USB is successfully enumerated then the PIC ^® microcontroller is ready to receive commands from the host PC to program the EMC1833 settings or transfer temperature data.

graph TD
    A["PIC18LF25k50"] -->|I²C bus| B["EMC1833"]
    B --> C["Connector"]
    C --> D["Off-board diode connected transistor"]
    E["PC"] -->|USB Interface| A
    F["Test points for VDD, Alert, SDA, and SCL"] --> B

FIGURE 2-2: EMC1833 Evaluation Board Circuit Block Diagram.

The block diagram in Figure 2-2 shows that the EMC1833 device is able to monitor and report the ambient temperature of two external diode-connected transistors. One diode is installed on the PCB. A two-pin connector allows the user to connect an additional transistor for evaluation of off-board temperature applications. The Alert outputs, SDA, SCK, and VDD are connected to test points for external connections; in addition, these outputs are also connected to the microcontroller I/O pins so that the Alert Output statuses can be detected in software.

2.4 SOFTWARE SETUP

Follow the installation procedure illustrated below:

1. Open the Thermal Management Utility v1.5.5.exe then click Next in the Application Install window.

Thermal Management Utility v1.5.5 Setup Application Install Welcome to the Setup Wizard for the Thermal Management Utility. < Back Next > Cancel

FIGURE 2-3: Application Install Dialog Box.

1. Read and Accept the License Agreement and click Next.

Thermal Management Utility v1.5.5 Setup License Agreement Please read the following License Agreement. You must accept the terms of this agreement before continuing with the installation. MICROCHIP SOFTWARE NOTICE AND DISCLAIMER: You may use this software, and any derivatives created by any person or entity by or on your behalf, exclusively with Microchips products. Microchip and its licensors retain all ownership and intellectual property rights in the accompanying software and in all derivatives hereto. Do you accept this license? ● I accept the agreement ○ I do not accept the agreement BitRock Installer < Back Next > Cancel

FIGURE 2-4: License Agreement Dialog Box.

1. Select an installation directory and click Next.

Thermal Management Utility v1.5.5 Setup Installation Directory Please specify the directory where the Thermal Management Utility will be installed. Installation Directory C:\Program Files (x86)\Microchip\ThermalManag BitRock Installer < Back Next > Cancel

FIGURE 2-5: Installation Directory Dialog Box.

1. Select Next to continue with the installation process.

Thermal Management Utility v1.5.5 Setup Ready to Install Setup is now ready to begin installing the Thermal Management Utility on your computer. BitRock Installer < Back Next > Cancel

FIGURE 2-6: Ready to Install Dialog Box.

1. In the Install Complete dialog box click Finish to finalize installation.

Thermal Management Utility v1.5.5 Setup Install Complete The Thermal Management Utility has been successfully installed on your computer. ✓ View Release Notes File < Back Finish Cancel

FIGURE 2-7: Install Complete Dialog Box.

NOTES:

Chapter 3. Software GUI Description

3.1 THERMAL MANAGEMENT UTILITY SOFTWARE GUI OVERVIEW

The Microchip Thermal Management Software GUI allows users to evaluate the EMC1833 for temperature sensing applications. Once the hardware is connected, the software recognizes the device ID and displays the corresponding GUI for the evaluation board. Disconnecting the USB will close the GUI. This tool enables users to evaluate the sensor features and perform temperature data-log. Figure 3-1 depicts the Thermal Management Utility GUI.

Thermal Management Utility - [EMC1833] View/Select GUIs One Shot 1 Temperature Sensor Settings Registers List Results Internal Ext 1 Ext 2 Temperature (C) 22.75 22.125 22.375 Global Max (C) 0 Samples Max (C) 0 ROC result 0 Hottest Diode Hottest Comparison ON Hottest Compare for Internal Diode Ext Diode 1 Ext Diode 2 Hottest Temp (C) Hottest Diode Status Internal Ext 1 Ext 2 High Limit Low Limit Therm Limit Fault ROC High Limit ROC Low Limit ROC Slope ROC Odd Update Registers Stripchart Data Acquisition Temperature (°C) Plot Options il Temperature External Diode 1 Temp External Diode 2 Tem Firmware Version: V0.2.1

FIGURE 3-1: Thermal Management Utility GUI.

As displayed in Figure 3-1, the GUI can be divided into three sections:

1. One Shot action buttons
2. Temperatures, Sensor Settings and Registers List tabs
3. Data Acquisition Charting area

3.2 REAL-TIME ACQUISITION ACTION BUTTONS

The Play, Stop, and Reset icons (Figure 3-2) can be used to perform continuous data acquisitions.

graph TD
    A["Stop Recording Real-Time acquisition"] --> B["Start/Record Real-Time acquisition"]
    B --> C["Reset Real-Time acquisition"]
    C --> D["Pause Real-Time acquisition"]
    D --> E["Start Real-Time acquisition"]
    E --> F["Start Real-Time acquisition"]
    F --> G["One Shot"]

FIGURE 3-2: Real-Time Acquisition Icons.

To initiate data logging, click the Record Acquisitions button. The system displays the Save As window (see Figure 3-3), where users need to select a file name and a location, then click the Save button.

Save As Microchip Technology Inc ▶ Thermal Management Utility ▶ 1.5.4.0 Search 1.5.4.0 Organize ▶ New folder Favorites Downloads Recent Place Libraries Documents Music Pictures Subversion Videos Computer Name Date modified Type Size No items match your search. File name: temp Save as type: Data File (*.txt) Hide Folders Save Cancel

FIGURE 3-3: Save As Window for Recording Acquisitions.

To stop the data logging click the Stop Recording button. Users can now go to the file location to view the file.

3.3 TEMPERATURES, SENSOR SETTINGS AND REGISTERS LIST TABS

3.3.1 Temperatures Tab

The Temperatures tab displayed in Figure 3-4 shows the results of the Internal Diode 1 and Diode 2 sensors. This tab also displays the result of the various user programmable features of the EMC1833, such as the temperature ALERT and THERM status, Diode Fault status, the Rate of Change (ROC), and hottest diode comparison.

FIGURE 3-4: Temperatures Tab.

3.3.2 Sensor Settings Tab

The Sensor Settings tab is divided into two sections:

• General Settings
• Rate of Change

Figure 3-5 displays the General Settings section under the Sensor Settings tab. This is where the user configures and enables/disables various features of the device.

Refer to the MCP1812/13/14/15/33 data sheet for detailed information on the operation of these features and settings.

Temperatures Sensor Settings Registers List Rate of Change General Settings Sensor Settings Select or clear the check boxes to enable and disable features Temperature hysteresis value for ALERT and THERM Dynamic Averaging On Active Mode Run REC D1/D2 On Range (C) 0..127.875 Anti Parallel Diode On Consecutive Alert 1 Therm Hysteresis 10 Consecutive Therm 4 Conversion Rate 4 Limit Settings (C) Internal Ext 1 Ext 2 High 85 85 85 Low 0 0 0 Therm 85 85 85 ALERT limits Set output type as comparator or interrupt Mask the alert signal for all temperature channels and ROC events Mask the alert signal for specific temperature channels Alerts Alert Pin Mode Interrupt Mask All Mask Individual Settings Internal Diode External Diode 1 ROC 1 External Diode 2

FIGURE 3-5: Sensor Settings Tab - General Settings.

Figure 3-6 displays the Rate of Change (ROC) section under the Sensor Settings tab. This is where the user configures the ROC feature. Refer to the MCP1812/13/14/15/33 data sheet for detailed information regarding the ROC setup and operation.

Rate of Change General Settings Temperature Rate of Change Settings Enable ROC Hysteresis (C) 0 Channel 1 Gain 1 Samples 2 Limit (C) 0

FIGURE 3-6: Rate of Change Tab.

Since the software is constantly polling the status register the status bits are cleared as soon as an out of bounds condition is satisfied when in the Interrupt mode.

A quick way to validate the ROC is utilizing the Standby mode along with the one-shot temperature measurement.

ROC validation example:

1. Select Standby mode.
2. Set the Gain and Samples drop downs.
3. Select the Enable ROC check box.
4. Click one-shot.
5. Update registers and log temperature for Remote Diode 1.
6. Repeat steps 4 and 5 for the samples selected (when all samples have completed the ROC result value will update).
7. Calculate the ROC result using Equation 3-1 and compare to the calculated value in the ROC result within the GUI.

EQUATION 3-1:

$$ \frac {\Delta \mathrm{T}}{\Delta \mathrm{t}} \frac {[ \mathrm{T} (\mathrm{t} _ {\max}) - (\mathrm{T}) ] \yen \text {gain}}{\text {sample 1 - (}} $$

Where:

$$ \begin{array}{l} T \left(T _ {T \max}\right) = \text { Temperature at the end of the interval }. \ T (t _ {0}) = \text { Temperature at the beginning of the interval. } \ \end{array} $$

3.3.3 Registers List Tab

The Registers List tab (Figure 3-7) contains a read-only table that contains all the user registers.

Name	Address High	Address Low	Data High	Data Low
Ext1 Temp	0x01	0x10	0x16	0xC0
Status	-	0x02	-	0x00
Config	-	0x03	-	0x00
Convert	-	0x04	-	0x06
Internal Diode High Limit	-	0x05	-	0x55
Internal Diode Low Limit	-	0x06	-	0x00
Ext1 High Limit	0x07	0x13	0x55	0x00
Ext1 Low Limit	0x08	0x14	0x00	0x00
One Shot	-	0x0F	-	0x00
Scratchpad1	-	0x11	-	0x00
Scratchpad2	-	0x12	-	0x00
Ext2 High Limit	0x15	0x17	0x55	0x00
Ext2 Low Limit	0x16	0x18	0x00	0x00
Ext1 Therm Limit	-	0x19	-	0x55
Ext2 Therm Limit	-	0x1A	-	0x55
Ext Diode Fault Status	-	0x1B	-	0x00
Ext Diode Fault Mask	-	0x1F	-	0x00
Internal Therm Limit	-	0x20	-	0x55
Therm Hysteresis	-	0x21	-	0x0A
Consecutive Alert	-	0x22	-	0x70
Ext2 Temp	0x23	0x24	0x16	0x80
Ext1 Ideality	-	0x27	-	0x12
Ext2 Ideality	-	0x28	-	0x12
High Limit Status	-	0x3A	-	0x00
Low Limit Status	-	0x3B	-	0x00
Therm Limit Status.

FIGURE 3-7: Registers List Tab.

3.4 DATA ACQUISITION CHARTING AREA

Figure 3-8 shows the data acquisition interface with a plot of the EMC1833 Internal Diode, Diode 1 and Diode 2.

FIGURE 3-8: Microchip Thermal Management Sensor GUI Data Plot.

The logging interval can be adjusted using the interval scroll bar from 100ms to 30s, as shown in Figure 3-8.

The data acquisition charting area (Figure 3-8) can be customized by double clicking the chart. Performing this action opens the Data Acquisition Customization window, available in Figure 3-9.

Users can also zoom into a specific plot range by clicking and dragging the section. The data in the chart can also be exported using the Export button.

Data Acquisition Customization... General | Plot | Subsets | Points | Axis | Font | Color | Style | Main Title: Data Acquisition Sub Title: Show Annotations Border Style No Border Line Shadow 3D Inset Viewing Style Color Monochrome Monochrome + Symbols Font Size Large Medium Small Numeric Precision 0 1 2 3 Grid Lines Both Y X None Grid in front of data Display Graph Table Both OK Cancel Apply Help Export... Maximize... Export Data

FIGURE 3-9: Data Acquisition Customization Window.

3.4.0.1 DATA ACQUISITION CUSTOMIZATION WINDOW DESCRIPTION

The Data Acquisition Customization window contains eight tabs which contain different options allowing users to customize the data acquisition charting area.

The General tab (Figure 3-9) determines how the data acquisition charting area is displayed. General options include the border style, viewing style, font size, numeric precision and grid lines.

The Display option determines how the data acquisition charting area is generated: a graph, a table, or both.

The Plot tab, displayed in Figure 3-10, allows users to customize the appearance of the data sensor plots.

Data Acquisition Customization... General Plot Subsets Points Axis Font Color Style All Subsets Internal Temp Ext1 Temp Ext2 Temp 3D Off Shadow 3D Mark Data Points Plot Style Area Bar Line Points Points+BestFitCurve Points+BestFitCurve II Points+BestFitLine Points+BestFitLine II Points+Line Points+Spline Spline OK Cancel Apply Export... Maximize...

FIGURE 3-10: Data Acquisition Customization - Plot Tab.

Users can also control the appearance of the subsets plots using the Subsets tab, displayed in Figure 3-11.

Data Acquisition Customization... General Plot Subsets Points Axis Font Color Style Subsets to Graph Internal Temp Ext1 Temp Ext2 Temp Scrolling Subsets 0 < > OK Cancel Apply Export... Maximize...

FIGURE 3-11: Data Acquisition Window - Subsets Tab.

The Points tab, displayed in Figure 3-12, controls the number of data points displayed in the graph and the orientation of the labels on the X-Axis.

Data Acquisition Customization... General Plot Subsets Points Axis Font Color Style Points to Graph Sequential Selected 100 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Point Label Orientation Auto Vertical Horizontal Slanted OK Cancel Apply Export... Maximize...

FIGURE 3-12: Data Acquisition Window - Points Tab.

The Axis tab, displayed in Figure 3-13, determines the scale and range of the Y-Axis.

Data Acquisition Customization... General Plot Subsets Points Axis Font Color Style Y Axis Linear Auto Log Min Max Min/Max Min Max -40.0000 100 OK Cancel Apply Export... Maximize...

FIGURE 3-13: Data Acquisition Window - Axis Tab.

Users can modify the options in the Font tab, displayed in Figure 3-14, to change the size, font and style of the text that appears in the data acquisition charting area. A sample text is also provided for preview before applying the changes to the charting area.

Data Acquisition Customization... General Plot Subsets Points Axis Font Color Style Main Title: Times New Roman □ bold □ italic □ underline Sub-Title: Times New Roman □ bold □ italic □ underline Subset / Point / Axis Labels: Arial Baltic □ bold □ italic □ underline Table Data: Arial sample: AaBbCcDdEeFfGg OK Cancel Apply ExportMaximize_...

FIGURE 3-14: Data Acquisition Window - Font Tab.

The Color tab, displayed in Figure 3-15, determines which colors are used by the system. Optionally, users can select a preconfigured style in the Quick Styles section.

Data Acquisition Customization... General Plot Subsets Points Axis Font Color Style Graph Attributes Desk Foreground Desk Background Shadow Color Graph Foreground Graph Background Table Foreground Table Background Quick Styles Bitmap / Gradient Styles Light Medium Dark Inset Inset Inset Shadow Shadow Shadow Line Line Line No Border No Border No Border OK Cancel Apply Export... Maximize...

FIGURE 3-15: Data Acquisition Window - Color Tab.

Through the Style tab, displayed in Figure 3-16, users can customize the line style, color, and data point type for each temperature plot.

Data Acquisition Customization... General Plot Subsets Points Axis Font Color Style Internal Temp Ext1 Temp Ext2 Temp Point Type: Solid Circle Line Type: OK Cancel Apply Export Maximize...

FIGURE 3-16: Data Acquisition Window - Style Tab.

NOTES:

Appendix A. Schematic and Layouts

A.1 INTRODUCTION

This appendix contains the following schematics and layouts for the EMC1833 Evaluation Board:

• ADM00773 Board – Schematic
• ADM00773 Board – Schematic 2
- Board – Top Silk
• Board – Top Copper and Silk
- Board – Top Copper
- Board – Bottom Copper
- Board – Bottom Copper and Silk
- Board – Bottom silk

A.2 ADM00773 BOARD - SCHEMATIC

A.3 ADM00773 BOARD - SCHEMATIC 2

C7 13.2V GND 0.1uF 100V X1 20MHz U2 0805 VDD NCLR/VPP 26 R16 100R 10k R21 +3.3V C18 0.1uF GND RA0/AN0/C1INA/ULPWU/RP0 RC0/T1OSO/TICKI/RP11 8 C402 1% RA1/AN1/C2INA/RP1 RC1/T1OSI/UO/E/RP12 9 RA2/AN2/VREF-/CVREF/C2INB RC2/AN1/C7PLS/RP13 10 RA3/AN3/YREF+/C1INB VUSH 11 VDDCORL/VCAP RC4/D-/VM 12 RA5/AN4/SS1/HLVDIN/RCV/RP2 RC5/D-/VP 13 RA6/OSC2/CLKO RC6/TX1/CKI/RP17 14 RA7/OSC1/CLKI RC7/RX1/DTI/SDOL/RP18 15 VSS R30/AN12/INT0/RP3 16 RB1/AN10/RTCC/RP4 17 RH2/AN8/C1FDI/VMOR/REFOR/P5 18 RB3/AN9/CTED2/VPO/RP6 19 RB4/KBI0/SCKI/SCLI/RP7 20 RB5/KBI1/SDI1/SDA1/RP8 21 RB6/KBI2/PGC/RP9 22 RB7/KBE3/PGD/RP10 23 RDN HDR-2.54 MALE 1x6 J11 GND

A.4 BOARD - TOP SILK

CE SCL ALERT J11 +3.3V +5V GND SDA GND J3 Q1 R1 R8 EMC1833 J2 R2 U3 C2 C3 EMC1833 MICROCHIP EMC1833 Customer Evaluation Board ADM00773

A.5 BOARD – TOP COPPER AND SILK

CE MCC ALOR SAD SOP J1 +5.2V +0V SND MICROCHIP EMC1833 Customer Evaluation Board AOM00773

A.6 BOARD - TOP COPPER

Pure electrical circuit lines without any symbols or text, rendered in red on a white background (no text or labels)

A.7 BOARD - BOTTOM COPPER

Pure electrical circuit lines without any symbols or text, rendered on a blue background (no readable text or labels)

A.8 BOARD - BOTTOM COPPER AND SILK

PAD4 PAD2 U1 C4 R6 C6 C9 JABEL1 PAD3 04-10567-R2 PAD1

A.9 BOARD - BOTTOM SILK

Appendix B. Bill of Materials (BOM)

TABLE B-1: BILL OF MATERIALS (BOM) FOR EMC1833 EVALUATION BOARD (ADM00773) (1)

Qty.	Reference Description Manufacturer Part Number
4 C	2, C6, C7,C18	Capacitor Ceramic, 0.1 μF, 100V, 10%,X7R, SMD, 0603	Murata Electronics NorthAmerica, Inc.	GRM188R72A104KA35D
1 C	3 Capacitor Ceramic, 1000 pF, 50V, 20%,X7R, SMD, 0603	KEMET	C0603C102M5RACTU
2 C	4, C5	Capacitor Ceramic, 10 μF, 10V, 10%,X5R, SMD, 0805	Taiyo Yuden Co., Ltd.	LMK212BJ106KD-T
1 C	19	Capacitor Ceramic, 10 μF, 10V, 10%,X5R, SMD, 0805	Taiyo Yuden Co., Ltd.	LMK212BJ106KG-T
1 FB1	Ferrite, 2A, 220R, SMD, 0805	Murata Electronics NorthAmerica, Inc.	BLM21PG221SN1D
1 J2	Connector USB mini-B, Female, SMD,R/A	Hirose Electric Co., Ltd.	UX60-MB-5ST
1 J3	Connector Term, Block, 5 MM2-Position, GRN	PHOENIX CONTACT	1792863
4 PAD1, PAD2,PAD3, PAD4	Mechanical HW Rubber PAD,Cylindrical, D7.9, H5.3, Black	3M	SJ61A11
1 PCB1	Printed Circuit Board - EMC1833 Evalua-tion Board	Microchip TechnologyInc.	04-10567-R2
1 Q1	Transistor BJT, NPN, 40V, 200 mA,310 mW, SOT-23-3	Fairchild Semiconductor®	MMBT3904
4 R1, R2, R8,R21	Resistor TKF, 10k, 1%, 1/10W, SMD,0402	Panasonic® - BSG	ERJ-2RKF1002X
1 R4 Resistor TKF	10k, 5%, 1/10W, SMD,0603	Panasonic® - BSG	ERJ-3GEYJ103V
1 R16	Resistor TKF, 100R, 1%, 1/10W, SMD,0402	Panasonic® - BSG	ERJ-2RKF1000X
1 TP1	Connector Test Point, Loop, Orange, TH	Keystone Electronics Corp.	5013
2 TP2, TP7	Connector Test Point, Loop, Black, TH	Keystone Electronics Corp.	5011
1 TP3	Connector Test Point, Loop, Red, TH	Keystone Electronics Corp.	5010
3 TP4, TP5,TP6	Connector Test Point, Loop, White, TH	Keystone Electronics Corp.	5012
1 U1 Microchip Analog LDO, 3.3V, SOT-223-3		Microchip TechnologyInc.	MCP1825ST-3302E/DB
1 U2 Microchip MCU, 8-bit, 48 MHz, 32 kB,2 kB, QFN-28		Microchip TechnologyInc.	PIC18LF25K50-I/ML
1 U3 Three Channel 1.8V, I ^2 C,Temperature Sensor		Microchip TechnologyInc.	EMC1833T-AE/RW
1 X1	DO NOT POPULATE	Murata Electronics NorthAmerica, Inc.	CSTCE20M0V13L99-R0

Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM used in manufacturing uses all RoHS-compliant components.

TABLE B-2: BILL OF MATERIALS (BOM) FOR EMC1833 EVALUATION BOARD (ADM00773) - MECHANICAL PARTS ^(1)

Qty.	Reference Description	Manufacturer Part Number
1	CBL1 Mechanical H	HW, cable USB-A Male to Mini USB-B Male, 3 ft, Black	Qualtek Electronics Corp. 30	21003-03
1	Q2 Transistor, NPN	40V, 0.2A, TO-92 Fairchild Semiconductor	®	2N3904TA

Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM used in manufacturing uses all RoHS-compliant components.

Worldwide Sales and Service

AMERICAS

Corporate Office

2355 West Chandler Blvd. Chandler, AZ 85224-6199

Tel: [phone]

Fax: [phone]

Technical Support:

http://www.microchip.com/

support

Web Address:

www.microchip.com

Atlanta

Duluth, GA

Tel: [phone]

Fax: [phone]

Austin, TX

Tel: [phone]

Boston

Westborough, MA

Tel: [phone]

Fax: [phone]

Chicago

Itasca, IL

Tel: [phone]

Fax: [phone]

Dallas

Addison, TX

Tel: [phone]

Fax: [phone]

Detroit

Novi, MI

Tel: [phone]

Houston, TX

Tel: [phone]

Indianapolis

Noblesville, IN

Tel: [phone]

Fax: [phone]

Tel: [phone]

Los Angeles

Mission Viejo, CA

Tel: [phone]

Fax: [phone]

Tel: [phone]

Raleigh, NC

Tel: [phone]

New York, NY

Tel: [phone]

San Jose, CA

Tel: [phone]

Tel: [phone]

Canada - Toronto

Tel: [phone]

Fax: [phone]

ASIA/PACIFIC

Australia - Sydney

Tel: [phone]

China - Beijing

Tel: [phone]

China - Chengdu

Tel: [phone]

China - Chongqing

Tel: [phone]

China - Dongguan

Tel: [phone]

China - Guangzhou

Tel: [phone]

China - Hangzhou

Tel: [phone]

China - Hong Kong SAR

Tel: [phone]

China - Nanjing

Tel: [phone]

China - Qingdao

Tel: [phone]

China - Shanghai

Tel: [phone]

China - Shenyang

Tel: [phone]

China - Shenzhen

Tel: [phone]

China - Suzhou

Tel: [phone]

China - Wuhan

Tel: [phone]

China - Xian

Tel: [phone]

China - Xiamen

Tel: [phone]

China - Zhuhai

Tel: [phone]

ASIA/PACIFIC

India - Bangalore

Tel: [phone]

India - New Delhi

Tel: [phone]

India - Pune

Tel: [phone]

Japan - Osaka

Tel: [phone]

Japan - Tokyo

Tel: [phone]

Korea - Daegu

Tel: [phone]

Korea - Seoul

Tel: [phone]

Malaysia - Kuala Lumpur

Tel: [phone]

Malaysia - Penang

Tel: [phone]

Philippines - Manila

Tel: [phone]

Singapore

Tel: [phone]

Taiwan - Hsin Chu

Tel: [phone]

Taiwan - Kaohsiung

Tel: [phone]

Taiwan - Taipei

Tel: [phone]

Thailand - Bangkok

Tel: [phone]

Tel: [phone]

Fax: [phone]

Denmark - Copenhagen

Tel: [phone]

Fax: [phone]

Finland - Espoo

Tel: [phone]

France - Paris

Tel: [phone]

Fax: [phone]

Germany - Garching

Tel: [phone]

Germany - Haan

Tel: [phone]

Germany - Heilbronn

Tel: [phone]

Germany - Karlsruhe

Tel: [phone]

Germany - Munich

Tel: [phone]

Fax: [phone]

Germany - Rosenheim

Tel: [phone]

Israel - Ra'anana

Tel: [phone]

Italy - Milan

Tel: [phone]

Fax: [phone]

Italy - Padova

Tel: [phone]

Netherlands - Drunen

Tel: [phone]

Fax: [phone]

Norway - Trondheim

Tel: [phone]

Poland - Warsaw

Tel: [phone]

Romania - Bucharest

Tel: [phone]

Spain - Madrid

Tel: [phone]

Fax: [phone]

Sweden - Gothenberg

Tel: [phone]

Sweden - Stockholm

Tel: [phone]

UK - Wokingham

Tel: [phone]

Fax: [phone]