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USER MANUAL MCP73855 Microchip
USB Compatible Li-Ion/Li-Polymer Charge Management Controllers
Features
• Linear Charge Management Controllers
- Integrated Pass Transistor
- Integrated Current Sense
- Reverse Blocking Protection
• High-Accuracy Preset Voltage Regulation: + 0.5%
- Two Selectable Voltage Regulation Options:
- 4.1V, 4.2V
• Programmable Charge Current
- USB Compatible Charge Current Settings
- Programmable Safety Charge Timers
• Preconditioning of Deeply Depleted Cells
• Automatic End-of-Charge Control
- Optional Continuous Cell Temperature Monitoring
MCP73853
- Charge Status Output for Direct LED Drive
- Fault Output for Direct LED Drive
MCP73853
• Automatic Power-Down
• Thermal Regulation
• Temperature Range: -40°C to +85°C
- Packaging:
- 16-Lead, 4x4 mm QFN (MCP73853)
- 10-Lead, 3x3 mm DFN (MCP73855)
Applications
• Lithium-Ion/Lithium-Polymer Battery Chargers
• Personal Data Assistants (PDAs)
- Cellular Telephones
• Hand-Held Instruments
- Cradle Chargers
- Digital Cameras
- MP3 Players
- Bluetooth Headsets
- USB Chargers
Description
The MCP7385X devices are highly-advanced, linear charge management controllers, for use in space-limited, cost-sensitive applications. The MCP73853 combines high-accuracy constant-voltage, constant-current regulation, cell preconditioning, cell temperature monitoring, advanced safety timers, automatic charge termination, internal current sensing, reverse blocking protection and charge status and fault indication in a space-saving 16-lead, 4x4 QFN package.
The MCP73855 employs all the features of the MCP73853, with the exception of the cell temperature monitor and one status output. The MCP73855 is offered in a space-saving 10-lead, 3x3 DFN package.
The MCP73853 and MCP73855 are designed specifically for USB applications, adhering to all the specifications governing the USB power bus.
The MCP7385X devices provide two selectable voltage regulation options (4.1V or 4.2V) for use with either coke or graphite anodes.
These devices have complete and fully-functional, charge management solutions, operating with an input voltage range of 4.5V to 5.5V. These are fully specified over the ambient temperature range of -40^ to +85^ .
Package Types

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MCP73853 4x4 QFN* STAT1 STAT2 EN VSS2 VSET 16 15 14 13 VDD1 EP 12 VBAT3 VDD2 2 11 VBAT2 VDD2 3 10 VBAT1 VSS1 4 9 VSS3 5 6 7 8 PROG THREF THERM TIMER MCP73855 3x3 DFN* ENSTAT1 VSET 1 10 VDD1 EP 9 VBAT2 VDD1 3 11 8 VBAT1 VSS1 4 7 VSS2 PROG 5 6 TIMER *Exposed Pad (EP) is at VSS potential.Typical Application
400 mA Lithium-Ion Battery Charger

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5V 4.7 µF 3 VDD1 VBAT1 8 2 VSET VBAT2 9 10 EN 1 STAT1 5 PROG TIMER 6 4,7 0.1 µF Single Lithium-Ion Cell MCP73855Functional Block Diagram

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Direction Control G = 0.001 VDD 3 k Ω VREF 90 kΩ Charge Current Control Amplifier 11 kΩ 10 kΩ Voltage Control Amplifier VREF 4 k Ω PROG Charge Termination Comparator IREG/12 Precondition Control Charge_OK Precon. Precondition Comp. 600 kΩ VBAT3 VREF 110 kΩ 10 kΩ UVLO COMPARATOR VUVLO EN Power-On Delay VREF 149 kΩ Constant-voltage/Recharge Comp. 1.58 kΩ VREF 300 kΩ VSET VSS1 VSS2 VSS3 THREF VREF(1.2V) Bias and Reference Generator VUVLO Temperature Comparators IREG/12 Charge Control, Charge Timers, and Status Logic Drv Stat 1 STAT1 THERM 50 kΩ 50 kΩ 50 kΩ TIMER MCP73853 ONLY Oscillator IREG/12 DCR/STAT2 MCP73853 ONLY Charge_OK VDD1 VDD2 VBAT1 VBAT21.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings\*
V_DD1,2 6.5V
All Inputs and Outputs w.r.t. V_SS ......-0.3 to (V_DD + 0.3)V
Maximum Junction Temperature, T_J ..... Internally Limited
Storage temperature ....-65°C to +150°C
ESD protection on all pins:
Human Body Model (1.5kΩ in Series with 100pF) .....≥4 kV
Machine Model (200pF, No Series Resistance) .....400V
*Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
DC CHARACTERISTICS
| Electrical Specifications: Unless otherwise indicated, all limits apply for V_DD = [V_REG(Typ) + 0.3V] to 5.5V, T_A = -40°C to 85°C . Typical values are at +25°C, V_DD = [V_REG(Typ) + 1.0V] | ||||||
| Parameters Sym Min Typ Max Units Conditions | ||||||
| Supply Input | ||||||
| Supply Voltage | V_DD | 4.5 | — | 5.5 | V | |
| Supply Current | I_SS | — | 0.28 | 4 | μA | Disabled |
| — | 0.83 | 4 | mA | Operating | ||
| UVLO Start Threshold | V_START | 4.25 | 4.45 | 4.65 V | V | _DD Low-to-High |
| UVLO Stop Threshold | V_STOP | 4.20 | 4.40 | 4.55 V | V | _DD High-to-Low |
| Voltage Regulation (Constant-Voltage Mode) | ||||||
| Regulated Output Voltage | V_REG | 4.079 | 4.1 | 4.121 | V | V_SET=V_SS |
| 4.179 | 4.2 | 4.221 | V | V_SET=V_DD | ||
| V_DD=[V_REG(Typ)+1V], | ||||||
| I_OUT=10 mA,T_A=-5°C to +55°C | ||||||
| Line Regulation | |( V_BAT/V_BAT)|/ V_DD | — | 0.020 | 0.25 | %/V | V_DD=[V_REG(Typ)+1V] to 5.5V |
| I_OUT=10 mA | ||||||
| Load Regulation | | V_BAT/V_BAT| | — | 0.022 | 0.25 % I | _OUT=10 mA to 150 mA | |
| V_DD=[V_REG(Typ)+1V] | ||||||
| Supply Ripple Attenuation | PSRR | — | 50 | — | dB | I_OUT=10 mA,10 Hz to 1 kHz |
| — | 26 | — | dB | I_OUT=10 mA,10 Hz to 10 kHz | ||
| — | 24 | — | dB | I_OUT=10 mA,10 Hz to 1 MHz | ||
| Output Reverse-Leakage Current | I_DISCHARGE | — | 0.24 | 1 | W_DD | |
| Current Regulation (Fast Charge Constant-Current Mode) | ||||||
| Fast Charge Current Regulation | I_{REG} | 70 | 85 | 100 | mA | PROG=OPEN |
| 325 | 400 | 475 | mA | PROG=VSS | ||
| T_A=-5°C to +55°C | ||||||
| Preconditioning Current Regulation (Trickle Charge Constant-Current Mode) | ||||||
| Precondition Current Regulation | I_{PREG} | 5 | 9 | 15 | mA | PROG=OPEN |
| 25 | 40 | 75 mA | PROG=VSS | T_A=-5°C to +55°C | ||
| Precondition Threshold Voltage | V_{PTH} | 2.70 | 2.80 | 2.90 | V | V_{SET}=V_{SS} |
| 2.75 | 2.85 | 2.95 | V | V_{SET}=V_{DD} | ||
| V_{BAT}Low-to-High | ||||||
| Parameters | Sym | Min | Typ | Max | Units | Conditions |
| Charge Termination | ||||||
| Charge Termination Current I | TERM | 3.7 6.5 9.3 mA18 32 46 mAP | PROG = PROG = V | OPENSST_A = -5°Cto +55°C | ||
| Automatic Recharge | ||||||
| Recharge Threshold Voltage | V RTH | V_{REG}-300mV | V_{REG}-200mV | V_{REG}-100mV | V | V_{BAT}High-to-Low |
| Thermistor Reference - MCP73853 | ||||||
| Thermistor Reference Output Voltage | V_{THREF} | 2.475 | 2.55 2.625 | VT | A = 25°C, V_{DD} = V_{REG}(Typ) + 1V, I_{THREF} = 0 mA | |
| Thermistor Reference Source Current | I_{THREF} | 200 | — | — | μA | |
| Thermistor Reference Line Regulation | \begin{array}{c}\vert (\Delta V_{THREF}/ \\ V_{THREF}) \vert/\Delta V_{DD}\end{array} | — 0.05 | 0.25 %/V | V | V | D_D = [V_{REG}(Typ) + 1V]to 5.5V |
| Thermistor Reference Load Regulation | \begin{array}{c}\vert \Delta V_{THREF}/ \\ V_{THREF}\end{array} | 0.02 0.10 % | I_{THREF} = 0 mAto 0.20 mA | |||
| Thermistor Comparator - MCP73853 | ||||||
| Upper Trip Threshold | V_{T1} | 1.18 | 1.25 | 1.32 | V | |
| Upper Trip Point Hysteresis V | T1HYS | — | -50 | — | mV | |
| Lower Trip Threshold | V_{T2} | 0.59 | 0.62 | 0.66 | V | |
| Lower Trip Point Hysteresis V | T2HYS | — | 80 | — | mV | |
| Input Bias Current | I_{BIAS} | — | — | 2 | μA | |
| Status Indicator - STAT1, STAT2 | ||||||
| Sink Current | I_{SINK} | 4 | 8 | 12 | mA | |
| Low Output Voltage | V_{OL} | — | 200 | 400 | mV | I_{SINK} = 1 mA |
| Input Leakage Current | I_{LK} | — | 0.01 | 1 | μA | I_{SINK} = 0 mA, V_{STAT1,2} = 5.5V |
| Enable Input | ||||||
| Input High Voltage Level | V_{IH} | 1.4 | — | — | V | |
| Input Low Voltage Level | V_{IL} | — | — | 0.8 | V | |
| Input Leakage Current | I_{LK} | — | 0.01 | 1 | μA | V_{ENABLE} = 5.5V |
| Thermal Shutdown | ||||||
| Die Temperature | T_{SD}$ | — | 155 | — | °C | |
| Die Temperature Hysteresis T | SDHYS | — | 10 | — | °C | |
AC CHARACTERISTICS
| Electrical Specifications: Unless otherwise indicated, all limits apply for V_DD = [V_REG (Typ) + 0.3V] to 5.5V, T_A = -40°C to 85°C. Typical values are at +25°C, V_DD = [V_REG (Typ) + 1.0V] | ||||||
| Parameters Sym Min Typ Max Units Conditions | ||||||
| UVLO Start Delay t | START | — | — | 5 | DD Low-to-High V | |
| Current Regulation | ||||||
| Transition Time Out of Preconditioning | t_DELAY | — | — | 1 | BAT m V_PTH to V_BAT ∨ V_PTH | |
| Current Rise Time Out of Preconditioning | t_RISE | — | — | 1 | OUT Rising to90% off I_REG | |
| Fast Charge Safety Timer Period | t_FAST | 1.1 1.5 | 1.9 | Hours | C | TIMER = 0.1 μF |
| Preconditioning Current Regulation | ||||||
| Preconditioning Charge Safety Timer Period | t_PRECON | 45 | 60 | 75 | Minutes | C_TIMER = 0.1 F |
| Charge Termination | ||||||
| Elapsed Time Termination Period | t_TERM | 2.2 | 3 | 3.8 Hours C | TIMER = 0.1 μF | |
| Status Indicators | ||||||
| Status Output Turn-off | t_OFF | — | — | 2 | 0 | 0 SINK μ1 mA to 0 mA |
| Status Output Turn-on | t_ON | — | — | 2 | 0 | 0 SINK μ0 mA to 1 mA |
TEMPERATURE SPECIFICATIONS
| Electrical Specifications: Unless otherwise indicated, all limits apply for V_DD = [V_REG (Typ) + 0.3V] to 5.5.Typical values are at +25°C, V_DD = [V_REG (Typ) + 1.0V] | ||||||
| Parameters | Sym | Min | Typ | Max | Units | Conditions |
| Temperature Ranges | ||||||
| Specified Temperature Range | T_A | -40 | — | +85 | °C | |
| Operating Temperature Range | T_J | -40 | — | +125 | °C | |
| Storage Temperature Range | T_A | -65 | — | +150 | °C | |
| Thermal Package Resistances | ||||||
| Thermal Resistance, 16-L, 4mm x 4mm QFN | θ_JA | — | 3 | 7 | — | 4-Layer JC51-7Standard Board,Natural Convection |
| Thermal Resistance, 10-L, 3mm x 3mm DFN | θ_JA | — | 51 | — | °C/ | 4-Layer JC51-7Standard Board,Natural Convection |
NOTES:
2.0 TYPICAL PERFORMANCE CURVES
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
NOTE: Unless otherwise indicated, V_DD = [V_REG(Typ) + 1V] , I_OUT = 10 mA and T_A = +25^ .

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| IOUT (mA) | VBAT (V) | | --------- | -------- | | 0 | 4.195 | | 50 | 4.195 | | 100 | 4.195 | | 150 | 4.195 | | 200 | 4.195 | | 250 | 4.195 | | 300 | 4.195 | | 350 | 4.195 | | 400 | 4.195 |FIGURE 2-1: Battery Regulation Voltage ( V_BAT ) vs. Charge Current ( I_OUT ).

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| IOUT (mA) | ISS (mA) | | --------- | -------- | | 0 | 0.45 | | 50 | 0.48 | | 100 | 0.50 | | 150 | 0.52 | | 200 | 0.54 | | 250 | 0.56 | | 300 | 0.58 | | 350 | 0.60 | | 400 | 0.62 | | 450 | 0.64 | | 500 | 0.66 |FIGURE 2-4: Supply Current (I SS ) vs. Charge Current (I OUT ).

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| V_DD (V) | V_BAT (V) | | -------- | --------- | | 4.5 | 4.190 | | 4.7 | 4.190 | | 4.9 | 4.190 | | 5.1 | 4.190 | | 5.3 | 4.190 | | 5.5 | 4.190 |FIGURE 2-2: Battery Regulation Voltage ( V_BAT ) vs. Supply Voltage ( V_DD ).

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| V_DD (V) | I_SS (mA) | | -------- | --------- | | 4.5 | 0.60 | | 4.7 | 0.60 | | 4.9 | 0.60 | | 5.1 | 0.60 | | 5.3 | 0.60 | | 5.5 | 0.60 |FIGURE 2-5: Supply Current (I SS) vs. Supply Voltage (VDD).

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| V_DD (V) | V_BAT (V) | | -------- | --------- | | 4 | 4.250 | | 5 | 4.230 | | 4 | 4.210 | | 7 | 4.190 | | 4 | 4.170 |FIGURE 2-3: Battery Regulation Voltage ( V_BAT ) vs. Supply Voltage ( V_DD ).

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| V_DD (V) | I_SS (mA) | | -------- | --------- | | 4.5 | 0.45 | | 4.7 | 0.45 | | 4.9 | 0.45 | | 5.1 | 0.45 | | 5.3 | 0.45 | | 5.5 | 0.45 |FIGURE 2-6: Supply Current (I SS) vs. Supply Voltage ( V_DD ).
NOTE: Unless otherwise indicated, V_DD = [V_REG(Typ) + 1V] , I_OUT = 10 mA and T_A = +25^ .

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| V_BAT (V) | +85°C | +25°C | -40°C | | --------- | ----- | ----- | ----- | | 2 | 0.15 | 0.10 | 0.08 | | 0 | 0.20 | 0.12 | 0.10 | | 2 | 0.23 | 0.14 | 0.12 | | 4 | 0.25 | 0.16 | 0.14 | | 8 | 0.27 | 0.18 | 0.16 |FIGURE 2-7: Output Leakage Current ( I_DISCHARGE ) vs. Battery Voltage ( V_BAT ).

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| TA (°C) | ISS (mA) | | ------- | -------- | | -40 | 0.45 | | -30 | 0.46 | | -20 | 0.47 | | -10 | 0.48 | | 0 | 0.49 | | 10 | 0.50 | | 20 | 0.51 | | 30 | 0.52 | | 40 | 0.53 | | 50 | 0.54 | | 60 | 0.55 | | 70 | 0.56 | | 80 | 0.57 |FIGURE 2-10: Supply Current (I SS) vs. Ambient Temperature ( T_A ).

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| V_DD (V) | V_THREF (V) | | -------- | ----------- | | 4 | 2.535 | | 5 | 2.540 | | 4 | 2.545 | | 7 | 2.548 | | 4 | 2.549 |FIGURE 2-8: Thermistor Reference Voltage ( V_THREF ) vs. Supply Voltage ( V_DD ).

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| TA (°C) | VBAT (V) | | ------- | -------- | | -40 | 4.190 | | -30 | 4.192 | | -20 | 4.194 | | -10 | 4.196 | | 0 | 4.198 | | 10 | 4.200 | | 20 | 4.202 | | 30 | 4.204 | | 40 | 4.206 | | 50 | 4.208 | | 60 | 4.210 | | 70 | 4.212 | | 80 | 4.214 |FIGURE 2-11: Battery Regulation Voltage ( V_BAT ) vs. Ambient Temperature ( T_A ).

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| I_THREF (μA) | V_THREF (V) | | ------------ | ----------- | | 0 | 2.545 | | 25 | 2.545 | | 50 | 2.545 | | 75 | 2.545 | | 100 | 2.545 | | 125 | 2.545 | | 150 | 2.545 | | 175 | 2.545 | | 200 | 2.545 |FIGURE 2-9: Thermistor Reference Voltage ( V_THREF ) vs. Thermistor Bias Current ( I_THREF ).

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| TA (°C) | VTHREF (V) | | ------- | ---------- | | -40 | 2.545 | | -30 | 2.547 | | -20 | 2.549 | | -10 | 2.550 | | 0 | 2.551 | | 10 | 2.552 | | 20 | 2.553 | | 30 | 2.554 | | 40 | 2.554 | | 50 | 2.554 | | 60 | 2.554 | | 70 | 2.554 | | 80 | 2.554 |FIGURE 2-12: Thermistor Reference Voltage ( V_THREF ) vs. Ambient Temperature ( T_A ).
NOTE: Unless otherwise indicated, V_DD = [V_REG(Typ) + 1V] , I_OUT = 10 mA and T_A = +25^ .

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| Voltage Level | Current (mA) | | ------------- | ------------ | | VDD | 5.2 | | VBAT | 10 |FIGURE 2-13: Line Transient Response.

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| Voltage Level | Current (mA) | | ------------- | ------------ | | VDD | 5.2 | | VBAT | 6.2 |FIGURE 2-16: Line Transient Response.

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| Time (ms) | Voltage (V) | |-----------|-------------| | 0 | 1 | | 2.06 | 1 | | 100 | 100 | | 3.00 | 10 |FIGURE 2-14: Load Transient Response.

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| Time (ms) | Voltage (V) | Current (mA) | |-----------|-------------|--------------| | 0 | 0 | 0 | | 2.00 | ~1 | ~1 | | 30.0 | ~4 | ~4 | | 3.00 | ~3 | ~1 |FIGURE 2-17: Load Transient Response.

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| Frequency (kHz) | Attenuation (dB) | | --------------- | ---------------- | | 0.01 | -60 | | 0.1 | -55 | | 1 | -50 | | 10 | -45 | | 100 | -35 | | 1000 | -25 | | >1000 | -60 |FIGURE 2-15: Power Supply Ripple Rejection.

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| Frequency (kHz) | Attenuation (dB) | | --------------- | ---------------- | | 0.01 | -50 | | 0.1 | -50 | | 1 | -50 | | 10 | -50 | | 100 | -40 | | 1000 | -20 |FIGURE 2-18: Power Supply Ripple Rejection.
NOTE: Unless otherwise indicated, V_DD = [V_REG(Typ) + 1V] , I_OUT = 10 mA , and T_A = +25^ .

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| R_PROG (Ω) | I_OUT (mA) | | ---------- | ---------- | | OPEN 4.8K 1.6K 536 0 | 100 | | OPEN 4.8K 1.6K 536 0 | 200 | | OPEN 4.8K 1.6K 536 0 | 300 | | OPEN 4.8K 1.6K 536 0 | 400 |FIGURE 2-19: Charge Current (I OUT) vs. Programming Resistor ( R_PROG ).

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| TA (°C) | IOUT (mA) | | ------- | --------- | | -40 | 275 | | -30 | 276 | | -20 | 277 | | -10 | 278 | | 0 | 279 | | 10 | 278 | | 20 | 277 | | 30 | 276 | | 40 | 275 | | 50 | 274 | | 60 | 273 | | 70 | 272 | | 80 | 271 |FIGURE 2-20: Charge Current (I OUT) vs. Ambient Temperature ( T_A ).
3.0 PIN DESCRIPTION
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE
| MCP73853 MCP73855 Sym Description | |||
| 1 | 2 | V_SET | Voltage Regulation Selection |
| 2 | 3 | V_DD1 | Battery Management Input Supply |
| 3 | — | V_DD2 | Battery Management Input Supply |
| 4 | 4 | V_SS1 | Battery Management 0V Reference |
| 5 | 5 | PROG | Current Regulation Set |
| 6 | — | THREF | Cell Temperature Sensor Bias |
| 7 | — | THERM | Cell Temperature Sensor Input |
| 8 | 6 | TIMER | Timer Set |
| 9 | — | V_SS3 | Battery Management 0V Reference |
| 10 | 8 | V_BAT1 | Battery Charge Control Output |
| 11 | 9 | V_BAT2 | Battery Charge Control Output |
| 12 | — | V_BAT3 | Battery Voltage Sense |
| 13 | 7 | V_SS2 | Battery Management 0V Reference |
| 14 | 10 | EN | Logic Enable |
| 15 | — | STAT2 | Fault Status Output |
| 16 | 1 | STAT1 | Charge Status Output |
| 17 | 11 | EP | Exposed Pad, V_SS Potential |
3.1 Voltage Regulation Selection ( V_SET )
Connect to V_SS for 4.1V regulation voltage. Connect to V_DD for 4.2V regulation voltage.
3.2 Battery Management Input Supply ( V_DD1 , V_DD2 )
A supply voltage of [V_REG(Typ) + 0.3V] to 5.5V is recommended. Bypass to V_SS with a minimum of 4.7 F.
3.3 Battery Management 0V Reference ( V_SS1 , V_SS2 , V_SS3 )
Connect to negative terminal of battery.
3.4 Current Regulation Set (PROG)
Preconditioning, fast and termination currents are scaled by placing a resistor from PROG to V_SS .
3.5 Cell Temperature Sensor Bias (THREF)
THREF is a voltage reference to bias external thermistor for continuous cell temperature monitoring and pre-qualification.
3.6 Cell Temperature Sensor Input (THERM)
Input for an external thermistor for continuous cell-temperature monitoring and prequalification. Connect to THREF/3 to disable temperature sensing.
3.7 Timer Set (TIMER)
All safety timers are scaled by C_TIMER/0.1 F .
3.8 Battery Charge Control Output ( V_BAT1 , V_BAT2 )
Connect to positive terminal of battery. Drain terminal of internal P-channel MOSFET pass transistor. Bypass to V_SS with a minimum of 4.7 F to ensure loop stability when the battery is disconnected.
3.9 Battery Voltage Sense (V BAT3)
Voltage sense input. Connect to positive terminal of battery. A precision internal resistor divider regulates the final voltage on this pin to V_REG
3.10 Logic Enable (EN)
Input to force charge termination, initiate charge, clear faults or disable automatic recharge.
3.11 Fault Status Output (STAT2)
Current-limited, open-drain drive for direct connection to an LED for charge status indication. Alternatively, a pull-up resistor can be applied for interfacing to a host microcontroller.
3.12 Charge Status Output (STAT1)
Current-limited, open-drain drive for direct connection to a LED for charge status indication. Alternatively, a pull-up resistor can be applied for interfacing to a host microcontroller.
NOTES:
4.0 DEVICE OVERVIEW
The MCP7385X devices are highly-advanced, linear charge management controllers. For more information, refer to the “Functional Block Diagram” on page 2. Figure 4-2 depicts the operational flow algorithm from charge initiation to completion and automatic recharge.
4.1 Charge Qualification and Preconditioning
Upon insertion of a battery or application of an external supply, the MCP7385X devices automatically perform a series of safety checks to qualify the charge. The input source voltage must be above the Undervoltage Lockout (UVLO) threshold, the enable pin must be above the logic high level, and the cell temperature monitor must be within the upper and lower thresholds (MCP73853 only). The qualification parameters are continuously monitored, with any deviation beyond the limits automatically suspending or terminating the charge cycle. The input voltage must deviate below the UVLO stop threshold for at least one clock period to be considered valid.
Once the qualification parameters have been met, the MCP7385X devices initiate a charge cycle. The charge status output is pulled low throughout the charge cycle (see Table 5-1 and Table 5-2 for charge status outputs). If the battery voltage is below the preconditioning threshold ( V_PTH ), the MCP7385X devices precondition the battery with a trickle charge. The preconditioning current is set to approximately 10% of the fast charge regulation current. The preconditioning trickle charge safely replenishes deeply depleted cells and minimizes heat dissipation during the initial charge cycle. If the battery voltage has not exceeded the preconditioning threshold before the preconditioning timer has expired, a fault is indicated and the charge cycle is terminated.
4.2 Constant Current Regulation – Fast Charge
Preconditioning ends and fast charging begins when the battery voltage exceeds the preconditioning threshold. Fast charge regulates to a constant current ( I_REG ), which is set via an external resistor connected to the PROG pin. Fast charge continues until either the battery voltage reaches the regulation voltage ( V_REG ) or the fast charge timer expires; in which case, a fault is indicated and the charge cycle is terminated.
4.3 Constant Voltage Regulation
When the battery voltage reaches the regulation voltage ( V_REG ), constant voltage regulation begins. The MCP7385X devices monitor the battery voltage at the V_BAT pin. This input is tied directly to the positive terminal of the battery. The MCP7385X devices select the voltage regulation value based on the state of V_SET .
With V_SET tied to V_SS , the MCP7385X devices regulate to 4.1V or with V_SET tied to V_DD , the MCP7385X devices regulate to 4.2V.
4.4 Charge Cycle Completion and Automatic Recharge
The MCP7385X devices monitor the charging current during the Constant-voltage Regulation mode. The charge cycle is considered complete when either the charge current has diminished below approximately 7% of the regulation current ( I_REG ) or the elapsed timer has expired.
Assuming all the qualification parameters are met, the MCP7385X devices automatically begin a new charge cycle when the battery voltage falls below the recharge threshold ( V_RTH ).
4.5 Thermal Regulation
The MCP7385X devices limit the charge current based on the die temperature. Thermal regulation optimizes the charge cycle time while maintaining device reliability. If thermal regulation is entered, the timer is automatically slowed down to ensure that a charge cycle does not terminate prematurely. Figure 4-1 depicts the thermal regulation.

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| Junction Temperature (°C) | Maximum Charge Current (mA) | | :--- | :--- | | 0 | 400 | | 80 | 400 | | 100 | 350 | | 120 | 150 | | 140 | 0 |FIGURE 4-1: Typical Maximum Charge Current vs. Junction Temperature.
4.6 Thermal Shutdown
The MCP7385X devices suspend charge if the die temperature exceeds 155°C. Charging resumes when the die temperature has cooled by approximately 10°C. The thermal shutdown is a secondary safety feature in the event that there is a failure within the thermal regulation circuitry.

flowchart
graph TD
A["Initialize"] --> B{V_DD > V_UVLO EN High}
B -->|No STAT1 = Off STAT2 = Off| C["NOTE 1"]
B -->|Yes| D{Temperature OK}
D -->|No STAT1 = Off STAT2 = Flashing Charge Current = 0| E["NOTE 1"]
D -->|Yes| F{V_BAT > V_PTH}
F -->|No| G["Preconditioning Mode Charge Current = I_PREG Reset Safety Timer"]
F -->|Yes| H["Constant-current Mode Charge Current = I_REG Reset Safety Timer"]
H --> I{V_BAT > V_PTH}
I -->|No| J["NOTE 2"]
I -->|Yes| K["Constant-voltage Mode Output Voltage = V_REG"]
K --> L{I_OUT < I_TERM Elapsed Timer Expired}
L -->|No| M{Temperature OK}
L -->|Yes| N["Charge Termination Charge Current = 0 Reset Safety Timer"]
M --> O{V_DD < V_UVLO V_BAT < V_RTH or EN Low}
O -->|No| P["No STAT1 = Off STAT2 = OnSTAT2 = Flashing"]
O -->|Yes| Q["Safety Timer Suspended Charge Current = 0"]
Q --> R{V_DD < V_UVLO or EN Low}
R -->|No| S{Fault Charge Current = 0 Reset Safety Timer}
S -->|Yes| T{Safety Timer Expired}
S -->|No| U{Safety Timer Expired}
T --> V{V_BAT > V_PTH}
U --> W{Constant-current Mode Charge Current = I_REG Reset Safety Timer}
W --> X{V_BAT > V_PTH}
X -->|No| Y["Safety Timer Expired"]
X -->|Yes| Z["Safety Timer Suspended Charge Current = 0"]
FIGURE 4-2: Operational Flow Algorithm.
5.0 DETAILED DESCRIPTION
5.1 Analog Circuitry
5.1.1 BATTERY MANAGEMENT INPUT SUPPLY ( V_DD1 , V_DD2 )
The V_DD pin is the input supply pin for the MCP7385X devices. The MCP7385X devices automatically enter a power-down mode if the voltage on the V_DD input falls below the UVLO voltage ( V_STOP ). This feature prevents draining the battery pack when the V_DD supply is not present.
5.1.2 PROG INPUT
Fast charge current regulation can be scaled by placing a programming resistor ( R_PROG ) from the PROG input to V_SS . Connecting the PROG input to V_SS allows a maximum fast charge current of 400 mA, typically. The minimum fast charge current is 85 mA (Typ) and is set by letting the PROG input float. Equation 5-1 calculates the value for R_PROG .
EQUATION 5-1:
$$ R _ {P R O G} = \frac {1 3 . 3 2 3 3 . 3 I \times_ {- R E G}}{1 4 . 1 k _ {R E G} 2 -} $$
Where:
I_REG is the desired fast charge current in amps
R_PROG is in kilohms.
The preconditioning trickle charge current and the charge termination current are scaled to approximately 10% and 7% of I_REG , respectively.
5.1.3 CELL TEMPERATURE SENSOR BIAS (THREF)
A 2.55V voltage reference is provided to bias an external thermistor for continuous cell temperature monitoring and prequalification. A ratiometric window comparison is performed at threshold levels of V_THREF/2 and V_THREF/4 .
5.1.4 CELL TEMPERATURE SENSOR INPUT (THERM)
The MCP73853 continuously monitors temperature by comparing the voltage between the THERM input and V_SS with the upper and lower temperature thresholds. A negative or positive temperature coefficient, NTC or PTC thermistor, and an external voltage divider typically develop this voltage. The temperature-sensing circuit has its own reference, to which it performs a ratiometric comparison. Therefore, it is immune to fluctuations in the supply input ( V_DD ). The temperature-sensing circuit is removed from the system when V_DD is not applied, eliminating additional discharge of the battery pack.
Figure 6-1 depicts a typical application circuit with connection of the THERM input. The resistor values of R_T1 and R_T2 are calculated with the following equations:
For NTC thermistors:
$$ R _ {T 1} = \frac {2 R _ {\text { COLD }} \times R _ {H O T}}{R _ {C O L D} - R _ {H O T}} $$
$$ R _ {T 2} = \frac {2 R * C O L D \times R _ {H O T}}{R _ {C O L D} - 3 R \times_ {H O T}} $$
For PTC thermistors:
$$ R _ {T 1} = \frac {2 R _ {C O L D} \times R _ {H O T}}{R _ {H O T} - R _ {C O L D}} $$
$$ R _ {T 2} = \frac {2 R _ {C O L D} \times R _ {H O T}}{R _ {H O T} - 3 R \times_ {C O L D}} $$
Where:
R_COLD and R_HOT are the thermistor resistance values at the temperature window of interest.
Applying a voltage equal to V_THREF/3 to the THERM input disables temperature monitoring.
5.1.5 TIMER SET INPUT (TIMER)
The TIMER input programs the period of the safety timers by placing a timing capacitor ( C_TIMER ) between the TIMER input pin and V_SS . Three safety timers are programmed via the timing capacitor:
The preconditioning safety timer period:
$$ t _ {P R E C O N} = \frac {C _ {T I M E R}}{0 . 1 \mu F} \times 1. 0 H o u r s $$
The fast charge safety timer period:
$$ t _ {F A S T} = \frac {C _ {T I M E R}}{0 . 1 \mu F} \times 1. 5 H o u r s $$
And, the elapsed time termination period:
$$ t _ {T E R M} = \frac {C _ {T I M E R}}{0 . 1 \mu F} \times 3. 0 H o u r s $$
The preconditioning timer starts after qualification and resets when the charge cycle transitions to the constant-current, fast charge phase. The fast charge timer and the elapsed timer start after the MCP7385X devices transition from preconditioning. The fast charge timer resets when the charge cycle transitions to the Constant-voltage mode. The elapsed timer expires and terminates the charge if the sensed current does not diminish below the termination threshold.
During thermal regulation, the timer is slowed down proportional to the charge current.
5.1.6 BATTERY VOLTAGE SENSE (V BAT3)
The MCP73853 monitors the battery voltage at the V_BAT3 pin. This input is tied directly to the positive terminal of the battery pack.
5.1.7 BATTERY CHARGE CONTROL OUTPUT ( V_BAT1 , V_BAT2 )
The battery charge control output is the drain terminal of an internal P-channel MOSFET. The MCP7385X devices provide constant-current and constant-voltage regulation to the battery pack by controlling this MOSFET in the linear region. The battery charge control output should be connected to the positive terminal of the battery pack.
5.2 Digital Circuitry
5.2.1 CHARGE STATUS OUTPUTS (STAT1, STAT2)
Two status outputs provide information on the state of charge for the MCP73853. One status output provides information on the state of charge for the MCP73855. The current-limited, open-drain outputs can be used to illuminate external LEDs. Optionally, a pull-up resistor can be used on the output for communication with a host microcontroller. Table 5-1 and Table 5-2 summarize the state of the status outputs during a charge cycle for the MCP73853 and MCP73855, respectively.
TABLE 5-1: STATUS OUTPUTS – MCP73853
| CHARGE CYCLE STATE | STAT1 STAT2 | |
| Qualification OFF | OFF | |
| Preconditioning | ON | OFF |
| Constant-current Fast Charge | ON | OFF |
| Constant-voltage | ON | OFF |
| Charge Complete | Flashing (1 Hz, 50% duty cycle) | OFF |
| Fault | OFF | ON |
| THERM Invalid | OFF | Flashing (1 Hz, 50% duty cycle) |
| Disabled - Sleep mode | OFF | OFF |
| Input Voltage Disconnected | OFF | OFF |
Note: OFF state: open-drain is high-impedance; ON state: open-drain can sink current, typically 7 mA; FLASHING: toggles between OFF and ON states.
TABLE 5-2: STATUS OUTPUT – MCP73855
| CHARGE CYCLE STATE | STAT1 |
| Qualification | OFF |
| Preconditioning | ON |
| Constant Current Fast Charge | ON |
| Constant Voltage | ON |
| Charge Complete | OFF |
| Fault | Flashing (1Hz, 50% duty cycle) |
| THERM Invalid | Flashing (1Hz, 50% duty cycle) |
| Disabled - Sleep mode | OFF |
| Input Voltage Disconnected | OFF |
Note: OFF state: open-drain is high impedance; ON state: open-drain can sink current, typically 7 mA; FLASHING: toggles between OFF state and ON state.
The flashing rate (1 Hz) is based on a timer capacitor ( C_TIMER ) of 0.1 F. The rate varies based on the value of the timer capacitor.
5.2.1.1 MCP73853 Only
STAT1 is on whenever the input voltage is above the under voltage lockout, the device is enabled, and all conditions are normal.
During a fault condition, the STAT1 status output is off and the STAT2 status output flashes. To recover from a fault condition, the input voltage must be removed and then reapplied, or the enable input, EN, must be deasserted to a logic low, then asserted to a logic high.
When the voltage on the THERM input is outside the preset window, the charge cycle will either not start or be suspended. However, the charge cycle is not terminated, with recovery being automatic. The charge cycle resumes (or starts) once the THERM input is valid and all other qualification parameters are met.
5.2.2 V SET INPUT
The V_SET input selects the regulated output voltage of the MCP7385X devices. With V_SET tied to S_V , the MCP7385X devices regulate to 4.1V. With V_SET tied to V_DD , the MCP7385X devices regulate to 4.2V.
5.2.3 LOGIC ENABLE (EN)
The logic enable input pin (EN) can be used to terminate a charge anytime during the charge cycle, initiate a charge cycle or initiate a recharge cycle.
Applying a logic high input signal to the EN pin, or tying it to the input source, enables the device. Applying a logic low input signal disables the device and terminates a charge cycle. When disabled, the device's supply current is reduced to 0.28 A, typically.
6.0 APPLICATIONS
The MCP7385X devices are designed to operate in conjunction with a host microcontroller or in standalone applications. The MCP7385X devices provide the preferred charge algorithm for Li-Ion/Li-Polymer
cells. The algorithm uses a constant current followed by a constant voltage charging method. Figure 6-1 depicts a typical stand-alone application circuit, while Figure 6-2 and Figure 6-3 depict the accompanying charge profile.

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Regulated Wall Cube or USB Power Bus VSET 1 VDD1 2 VDD2 3 VSS1 4 MCP73853 VSET ENSTAT1 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 VBAT3 12 VBAT2 11 VBAT1 10 VSS3 9 RPROG THREF THERM TIMERPROG CTIMER RT1 RT2 + Single Lithium-Ion CellFIGURE 6-1: Typical Application Circuit.

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| Mode | Voltage Level | | ----------------- | ------------------- | | Preconditioning Mode | V_REG | | Constant-current Mode | - | | Constant-voltage Mode | - | | Transition Threshold (V_PTH) | - | | Precondition Current (I_PREG) | - | | Termination Current (I_TERM) | - |FIGURE 6-2: Typical Charge Profile.

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| Time Period | Preconditioning Mode (V_REG) | Constant-current Mode (I_REG) | Constant-voltage Mode | | ------------------------ | ---------------------------- | ----------------------------- | --------------------- | | Preconditioning Mode | High | Low | High | | Transition Threshold (V_PTH) | Low | Medium | Medium | | Fast Charge Safety Timer | Low | High | High | | Elapsed Time Termination Timer | Low | Low | Low |FIGURE 6-3: Typical Charge Profile in Thermal Regulation.
6.1 Application Circuit Design
Due to the low efficiency of linear charging, the most important factors are thermal design and cost. These are a direct function of the input voltage, output current and thermal impedance between the battery charger and the ambient cooling air. The worst-case situation exists when the device has transitioned from the Preconditioning mode to the Constant-current mode. In this situation, the battery charger has to dissipate the maximum power. A trade-off must be made between the charge current, cost and thermal requirements of the charger.
6.1.1 COMPONENT SELECTION
Selection of the external components in Figure 6-1 is crucial to the integrity and reliability of the charging system. The following discussion is intended to be a guide for the component selection process.
6.1.1.1 CURRENT PROGRAMMING RESISTOR ( R_PROG )
The preferred fast charge current for Lithium-Ion cells is at the 1C rate, with an absolute maximum current at the 2C rate. For example, a 500 mAh battery pack has a preferred fast charge current of 500 mA. Charging at this rate provides the shortest charge cycle times without degradation to the battery pack performance or life.
400 mA is the typical maximum charge current obtainable from the MCP7385X devices. For this situation, the PROG input should be connected directly to V_SS .
6.1.1.2 THERMAL CONSIDERATIONS
The worst-case power dissipation in the battery charger occurs when the input voltage is at its maximum and the device has transitioned from the Preconditioning mode to the Constant-current mode. In this case, the power dissipation is:
$$ \text { PowerDissipation } V \quad D D M A X ^ {-} (V _ {P T H M I N} \times = R E G M A X) $$
Where V_DDMAX is the maximum input voltage, I_REGMAX is the maximum fast charge current, and V_PTHMIN is the minimum transition threshold voltage. Power dissipation with a 5V, +/-10% input voltage source is:
$$ \text { PowerDissipation } = (5. 5 V - 2. 7 V) \times 4 7 5 m A = 1. 3 3 W $$
With the battery charger mounted on a 1 inf ^2 pad of 1 oz. copper, the junction temperature rise is approximately 50°C. This allows for a maximum operating ambient temperature of 35°C before thermal regulation is entered.
6.1.1.3 EXTERNAL CAPACITORS
The MCP7385X devices are stable with or without a battery load. To maintain good AC stability in the Constant-voltage mode, a minimum capacitance of 4.7 μF is recommended to bypass the V_BAT pin to V_SS . This capacitance provides compensation when there is no battery load. In addition, the battery and interconnections appear inductive at high frequencies. These elements are in the control feedback loop during Constant-voltage mode. Therefore, the bypass capacitance may be necessary to compensate for the inductive nature of the battery pack.
Virtually any good quality output filter capacitor can be used, independent of the capacitor's minimum Effective Series Resistance (ESR) value. The actual value of the capacitor (and its associated ESR) depends on the output load current. A 4.7 F ceramic, tantalum or aluminum electrolytic capacitor at the output is usually sufficient to ensure stability for up to the maximum output current.
6.1.1.4 REVERSE BLOCKING PROTECTION
The MCP7385X devices provide protection from a faulted or shorted input or from a reversed-polarity input source. Without the protection, a faulted or shorted input would discharge the battery pack through the body diode of the internal pass transistor.
6.1.1.5 ENABLE INTERFACE
In the stand-alone configuration, the enable pin is generally tied to the input voltage. The MCP7385X devices automatically enter a low power mode when voltage on the V_DD input falls below the UVLO voltage ( V_STOP ), reducing the battery drain current to 0.28 A, typically.
6.1.1.6 CHARGE STATUS INTERFACE
Two status outputs provide information on the state of charge. The current-limited, open-drain outputs can be used to illuminate external LEDs. Refer to Table 5-1 and Table 5-2 for a summary of the state of the status output during a charge cycle.
6.2 PCB Layout Issues
For optimum voltage regulation, place the battery pack as close as possible to the device's V_BAT and V_SS pins. It is recommended that the designer minimizes voltage drops along the high-current-carrying PCB traces.
If the PCB layout is used as a heat sink, adding many vias in the heat sink pad helps to conduct more heat to the PCB backplane, thus reducing the maximum junction temperature.
NOTES:
7.0 PACKAGING INFORMATION
7.1 Package Marking Information
10-Lead DFN (MCP73855) (3x3x0.9 mm)

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XXXX YYWW NNN PIN 1Example

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3855 1139 256 PIN 116-Lead QFN (MCP73853) Example

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PIN 1-PIN 1 XXXXXX XXXXXX XXXXXX YWWNNN
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73853 I/ML 1139 256Legend: XX...X Customer specific information*
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week '01')
NNN Alphanumeric traceability code
Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information.
* Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.
10-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9mm Body [DFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
![Microchip MCP73855 - 10-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9mm Body [DFN] - 1](/content/2026/06/1214554/images/6cb92b7f46b5956940b2b0feaa3730c62bd4583ad640e52a5dd796dc189d1a40.jpg)
Microchip Technology Drawing No. C04-063C Sheet 1 of 2
10-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9mm Body [DFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
![Microchip MCP73855 - 10-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9mm Body [DFN] - 1](/content/2026/06/1214554/images/b2fc653fc76e9609060bfd444ef6515220934338a623ad2393cfd1a1255cc90c.jpg)
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NOTE 2| Units | MILLIMETERS | |||
| Dimension Limits | MIN | NOM | MAX | |
| Number of Pins | N | 10 | ||
| Pitch | e | 0.50 BSC | ||
| Overall Height | A | 0.80 | 0.90 | 1.00 |
| Standoff | A1 | 0.00 | 0.02 | 0.05 |
| Contact Thickness | A3 | 0.20 REF | ||
| Overall Length | D | 3.00 BSC | ||
| Exposed Pad Length | D2 | 2.15 | 2.35 | 2.45 |
| Overall Width | E | 3.00 BSC | ||
| Exposed Pad Width | E2 | 1.40 | 1.50 | 1.75 |
| Contact Width | b | 0.18 | 0.25 | 0.30 |
| Contact Length | L | 0.30 | 0.40 | 0.50 |
| Contact-to-Exposed Pad | K | 0.20 | - | - |
Notes:
- Pin 1 visual index feature may vary, but must be located within the hatched area.
- Package may have one or more exposed tie bars at ends.
- Package is saw singulated.
- Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing No. C04-063C Sheet 2 of 2
10-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9mm Body [DFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
![Microchip MCP73855 - 10-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9mm Body [DFN] - 1](/content/2026/06/1214554/images/9f9d71bd22fcc2b9f70c87dbac92bd4df6234d98c654ab82c432995e7679ecd6.jpg)
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W2 G Y1 C1 T2 E X1 SILK SCREENRECOMMENDED LAND PATTERN
| Units | MILLIMETERS | |||
| Dimension Limits | MIN | NOM | MAX | |
| Contact Pitch | E | 0.50 BSC | ||
| Optional Center Pad Width | W2 | 2.48 | ||
| Optional Center Pad Length | T2 | 1.55 | ||
| Contact Pad Spacing | C1 | 3.10 | ||
| Contact Pad Width (X10) | X1 | 0.30 | ||
| Contact Pad Length (X10) | Y1 | 0.65 | ||
| Distance Between Pads | G | 0.20 | ||
Notes:
- Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing No. C04-2063B
16-Lead Plastic Quad Flat, No Lead Package (ML) - 4x4x0.9 mm Body [QFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
![Microchip MCP73855 - 16-Lead Plastic Quad Flat, No Lead Package (ML) - 4x4x0.9 mm Body [QFN] - 1](/content/2026/06/1214554/images/37bd49a9f2437d12ec27f56d514a0d443c906eb445c44528640f8666485b9b24.jpg)
| Units | MILLIMETERS | |||
| Dimension Limits | MIN NOM MAX | |||
| Number of Pins N 16 | ||||
| Pitch e 0.65 BSC | ||||
| Overall Height | A | 0.80 | 0.90 | 1.00 |
| Standoff | A1 | 0.00 | 0.02 | 0.05 |
| Contact Thickness | A3 | 0.20 REF | ||
| Overall Width | E | 4.00 BSC | ||
| Exposed Pad Width | E2 | 2.50 | 2.65 | 2.80 |
| Overall Length | D | 4.00 BSC | ||
| Exposed Pad Length | D2 | 2.50 | 2.65 | 2.80 |
| Contact Width | b | 0.25 | 0.30 | 0.35 |
| Contact Length | L | 0.30 | 0.40 | 0.50 |
| Contact-to-Exposed Pad | K | 0.20 | - | - |
Notes:
- Pin 1 visual index feature may vary, but must be located within the hatched area.
- Package is saw singulated.
- Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-127B
16-Lead Plastic Quad Flat, No Lead Package (ML) - 4x4x0.9mm Body [QFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
![Microchip MCP73855 - 16-Lead Plastic Quad Flat, No Lead Package (ML) - 4x4x0.9mm Body [QFN] - 1](/content/2026/06/1214554/images/3cdd4c2964387f2d3ce3ff1b3c8f9309b9742efbaf53c09e05782656e8e6d859.jpg)
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C1 W2 C2 T2 E G Y1 X1 SILK SCREENRECOMMENDED LAND PATTERN
| Units | MILLIMETERS | |||
| Dimension Limits | MIN | NOM | MAX | |
| Contact Pitch | E | 0.65 BSC | ||
| Optional Center Pad Width | W2 | 2.50 | ||
| Optional Center Pad Length | T2 | 2.50 | ||
| Contact Pad Spacing | C1 | 4.00 | ||
| Contact Pad Spacing | C2 | 4.00 | ||
| Contact Pad Width (X16) | X1 | 0.35 | ||
| Contact Pad Length (X16) | Y1 | 0.80 | ||
| Distance Between Pads | G | 0.30 | ||
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing No. C04-2127A
APPENDIX A: REVISION HISTORY
Revision C (April 2013)
Following is the list of modifications:
- Updated Table 3-1 with the Exposed Pad information.
- Minor grammatical and spelling corrections.
Revision B (February 2012)
Following is the list of modifications:
- Updated Section 7.1 "Package Marking Information".
Revision A (November 2004)
• Original Release of this Document.
NOTES:
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

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PART NO. X XX Device Range PackageTemperatureDevice MCP73853: USB compatible charge controller with temperature monitor
MCP73853T: USB compatible charge controller with temperature monitor, Tape and Reel
MCP73855: USB compatible charge controller
MCP73855T: USB compatible charge controller, Tape and Reel
Temperature Range I = -40°C to +85°C (Industrial)
Package ML = Plastic Quad Flat No Lead, 4x4 mm Body (QFN),
16-Lead
MF = Plastic Dual Flat No Lead, 3x3 mm Body (DFN), 10-Lead
Examples:
a) MCP73853T-I/ML: Tape and Reel, USB compatible charge controller with temperature monitor
b) MCP73853-I/ML: USB compatible charge controller with temperature monitor
a) MCP73855T-I/MF: Tape and Reel, USB compatible charge controller
b) MCP73855-I/MF: USB compatible charge controller
MCP73853/55
NOTES:
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
- Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.
- There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
- Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.
QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV = ISO/TS 16949=
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC ^32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A.
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SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their respective companies.
© 2004-2013, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.

Printed on recycled paper.
ISBN: 978-1-62077-162-4
Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELoo® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
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Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
ASIA/PACIFIC
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Japan - Osaka
Tel: 81-66-152-7160
Fax: 81-66-152-9310
Japan - Yokohama
Tel: 81-45-471-6166
Fax: 81-45-471-6122
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-330-9305
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
EUROPE
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
11/29/11