PAC1934 - Electronic component Microchip - Free user manual and instructions

USER MANUAL PAC1934 Microchip

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.
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- There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
- Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

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The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BeaconThings, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

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SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.

Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.

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All other trademarks mentioned herein are property of their respective companies.

© 2018, Microchip Technology Incorporated, All Rights Reserved. ISBN: 978-1-5224-2926-5

Table of Contents

Preface 5

Introduction....5

Document Layout 5

Conventions Used in this Guide 6

Recommended Reading....7

The Microchip Website....7

Customer Support 7

Document Revision History 7

Quick Start Guide 9

Chapter 1. Product Overview

1.1 Introduction ...... 11

1.2 MCP331x1 16/14/12-Bit 1 Msps SAR ADC Evaluation Board Features ..... 11

1.3 MCP331x1 16/14/12-Bit 1 Msps SAR ADC Evaluation Board Overview ..... 12

1.4 SAR ADC Device Configuration 14

1.5 Curiosity PIC32MZEF Development Board (DM320104) Overview ..... 15

1.6 SAR ADC Utility Software Overview 16

1.7 What the MCP331x1 16/14/12-Bit 1 Msps SAR ADC Evaluation Kit Contains 18

1.8 MCP331x1 16/14/12-Bit 1 Msps SAR ADC Evaluation Kit Requirements ... 18

Chapter 2. Installation and Operation

2.1 Configuration Requirements ...... 19

2.1.1 Power Input Connection 19

2.2 Evaluation Kit Setup 19

2.2.1 Input Optimization 20

Chapter 3. Firmware

3.1 PIC32MZ2048EFM100 Initialization 21

3.2 Data Acquisition 21

3.3 USB Transfer 23

3.4 ADC functions 24

Appendix A. Schematic and Layouts

A.1 Introduction 27

A.2 ADM00872 27

A.3 ADM00873 27

A.4 Board ADM00872 – Schematic 28

A.5 Board ADM00872 – Schematic Regulators 29

A.6 Board ADM00872 – Top Silk Layer 30

A.7 Board ADM00872 – Top Copper and Silk Layer 31

A.8 Board ADM00872 – Top Copper Layer 32

A.9 Board ADM00872 – Bottom Copper Layer 33

A.10 Board ADM00872 – Bottom Copper and Silk Layer 34

A.11 Board ADM00872 – Bottom Silk Layer 35

A.12 Board ADM00873 – Schematic 36

A.13 Board ADM00873 – Schematic Regulators 37

A.14 Board ADM00873 – Top Silk Layer 38

A.15 Board ADM00873 – Top Copper and Silk Layer 39

A.16 Board ADM00873 – Top Copper Layer 40

A.17 Board ADM00873 – Bottom Copper Layer 41

A.18 Board ADM00873 – Bottom Copper and Silk Layer 42

A.19 Board ADM00873 – Bottom Silk Layer 43

Appendix B. Bill of Materials (BOM)

Worldwide Sales and Service ....53

Preface

NOTICE TO CUSTOMERS

All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our website (www.microchip.com) to obtain the latest documentation available.

Documents are identified with a "DS" number. This number is located on the bottom of each page, in front of the page number. The numbering convention for the DS number is "DSXXXXXXXXA", where "XXXXXXXXX" is the document number and "A" is the revision level of the document.

For the most up-to-date information on development tools, see the MPLAB ^® IDE online help. Select the Help menu, and then Topics to open a list of available online help files.

INTRODUCTION

This chapter contains general information that will be useful to know before using the MCP331x1 16/14/12-Bit 1 Msps SAR ADC Evaluation Kit. Items discussed in this chapter include:

• Document Layout
  • Conventions Used in this Guide
• Recommended Reading
  • The Microchip Website
• Customer Support
  • Document Revision History

DOCUMENT LAYOUT

This document describes how to use the MCP331x1 16/14/12-Bit 1 Msps SAR ADC Evaluation Kit to demonstrate the performance of the MCP331x1 device family. The manual layout is as follows:

• “Quick Start Guide”—Provides quick, step-by-step information on setting up the MCP331x1 16/14/12-Bit 1 Msps SAR ADC Evaluation Kit.
• Chapter 1. "Product Overview" – Important information about the MCP331x1 16/14/12-Bit 1 Msps SAR ADC Evaluation Kit.
• Chapter 2. “Installation and Operation” – Includes instructions on how to get started with the MCP331x1 16/14/12-Bit 1 Msps SAR ADC Evaluation Kit.
• Chapter 3. "Firmware" - Includes information about the firmware that is included with the MCP331x1 16/14/12-Bit 1 Msps SAR ADC Evaluation Kit.
• Appendix A. “Schematic and Layouts” – Refer to the board's web page for the complete Schematics and Layouts.
• Appendix B. “Bill of Materials (BOM)” – Refer to the board's web page for the complete Bill of Materials.

CONVENTIONS USED IN THIS GUIDE

This manual uses the following documentation conventions:

DOCUMENTATION CONVENTIONS

Description Represents Examples
Arial font:
Italic characters Referenced books	Books MPLAB	^ IDE User's Guide
	Emphasized text ...is the only compiler...
Initial caps A window the Output	ut window
	A dialog the Settings dialog
	A menu selection select Enable Programmer
Quotes A field name in a window or dialog		"Save project before build"
Underlined, Italic text with right angle bracket	A menu path File>Save	——
Bold characters	A dialog button	Click OK
	A tab	Click the Power tab
N'Rnnnn	A number in verilog format, where N is the total number of digits, R is the radix and n is a digit.	4'b0010, 2'hF1
Text in angle brackets <>	A key on the keyboard	Press,,
Courier New font:
Plain Courier New	Sample source code	#define START
	Filenames	autoexec.bat
	File paths	c:\mccl8\h
	Keywords	_asm, _endasm, static
	Command-line options	-Opa+, -Opa-
	Bit values	0, 1
	Constants	0xFF, 'A'
Italic Courier New	A variable argument	file.o, where file can be any valid filename
Square brackets []	Optional arguments	mccl8 [options] file [options]
Curly brackets and pipe character: { | }	Choice of mutually exclusive arguments; an OR selection	errorlevel {0|1}
Ellipses...	Replaces repeated text	var_name [, var_name...]
	Represents code supplied by user	void main (void) { ... }

RECOMMENDED READING

This user's guide describes how to use the MCP331x1 16/14/12-Bit 1 Msps SAR ADC Evaluation Kit. Another useful document is listed below. The following Microchip document is available and recommended as a supplemental reference resource.

- MCP331x1 Data Sheet – “1 Msps 16/14/12-Bit Differential Input SAR ADC” (DS20005947)

THE MICROCHIP WEBSITE

Microchip provides online support via our website at www.microchip.com. This website is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the website contains the following information:

• Product Support – Data sheets and errata, application notes and sample programs, design resources, user's guides and hardware support documents, latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives

CUSTOMER SUPPORT

Users of Microchip products can receive assistance through several channels:

• Distributor or Representative
- Local Sales Office
• Field Application Engineer (FAE)
- Technical Support

Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document.

Technical support is available through the website at: http://www.microchip.com/support.

DOCUMENT REVISION HISTORY

Revision A (April 2018)

- Initial release of this document.

NOTES:

Quick Start Guide

Steps 1-9 below provide a quick start for setting up the MCP331x1 16/14/12-Bit 1 Msps SAR ADC Evaluation Kit:

MICROCHIP ADP00873 HCP53141 SAR_Adc_Uti lity.exe SAR_ADC_Evaluation_Utility File Help Device Selection MCP03131D-16 Interface Mode 3-minute CS without BUSY Input Structure Differential Operating Mode Continuous Analysis Sampling Frequency 1000 KHz Spectral Leakage 2 KHz DC Leakage 2 KHz FFT Window Blackman Periodogram Length 15.984 Domain Time PR_DFE FFT 3FSI

1. Move the PWR IN jumper to connect pins VIN and VBUS.
2. Connect micro USB cable from PC to J12 on the PIC32MZ Curiosity board. This USB is used for both power and data transfer for the Curiosity board.
3. Program the PIC32MZ with the latest MCP331x1_EVB.X firmware (available on Microchip.com) using an external programmer (ICD, PICKit, etc) connected to the ICSP HDR (J16).
4. Once the firmware is loaded, remove the programmer and wait for LED4 to illuminate with a solid red light. A solid red lit LED indicates that the firmware is loaded and the board is working as intended.
5. Connect the MCP331x1 EVB (ADM00872/ADM00873) to the top right mikroBUS header (J10).
6. Connect a 9V power supply to the barrel jack connection point using either the supplied 9V wall power supply, or alternatively connect 9V from an external power source to the H1 headers. D1 directly below the barrel jack will illuminate to confirm that 9V is being supplied to the EVB.
7. Connect a fully differential signal source to the SMA connectors at J1 (positive input) only, and place a jumper on J6 to connect the negative input to Vref/2.
8. Install and launch SAR_ADC_Utility.exe (available on Microchip.com). The software will automatically recognize the plugged in device and launch the GUI.
9. Once the GUI is open, use the blue 'play' buttons to run single or continuous acquisitions. The GUI will display all performance analysis data related to the acquired signal.

NOTES:

Chapter 1. Product Overview

1.1 INTRODUCTION

This chapter provides an overview of the MCP331x1 16/14/12-Bit 1 Msps SAR ADC Evaluation Board and covers the following topics:

• MCP331x1 16/14/12-Bit 1 Msps SAR ADC Evaluation Board Features
• MCP331x1 16/14/12-Bit 1 Msps SAR ADC Evaluation Board Overview
  • SAR ADC Device Configuration
  • Curiosity PIC32MZEF Development Board (DM320104) Overview
  • SAR ADC Utility Software Overview
  • What the MCP331x1 16/14/12-Bit 1 Msps SAR ADC Evaluation Kit Contains
• MCP331x1 16/14/12-Bit 1 Msps SAR ADC Evaluation Kit Requirements

1.2 MCP331X1 16/14/12-BIT 1 MSPS SAR ADC EVALUATION BOARD FEATURES

This MCP331x1 16/14/12-Bit 1 Msps SAR ADC Evaluation Kit is a fully-assembled, programmed and tested solution to evaluate and demonstrate the MCP331x1 operating performance.

The MCP331x1 16/14/12-Bit 1 Msps SAR ADC Evaluation Kit features:

• Full-Scale Analog Input Range: -V_REF to +V_REF
- ADM00872 with MCP33131D/21D/11D: -5 V PP to +5 V PP
- ADM00873 with MCP33131D/21D/11D: -4 V PP to +4 V PP
• Dynamic Performance Monitoring
- Evaluation of Performance Metrics, such as: SNR, SFDR, INL, DNL, and so on
- Ability to Save and Load Software Configurations
- Ability to Save and Load Raw Data for User Post-Processing
For information about the device features, refer to the MCP331x1 data sheet.

1.3 MCP331X1 16/14/12-BIT 1 MSPS SAR ADC EVALUATION BOARD OVERVIEW

The MCP331x1 16/14/12-Bit 1 Msps SAR ADC Evaluation Board is intended to demonstrate the performance of the MCP331x1 device family. This evaluation board is used together with:

• Curiosity PIC32MZEF Development Board (DM320104)
• SAR ADC Utility Software

Figure 1-1 displays the system setup.

graph LR
    A["Signal Input"] --> B["MCP331x1 Evaluation Board (Note 1)"]
    B --> C["SPI"]
    C --> D["Curiosity PIC32MZEF Development Board (DM320104) (Note 2)"]
    D --> E["USB"]
    E --> F["PC GUI (SAR ADC Utility Software) (Note 3)"]
    G["9V Power Supply"] --> B
    H["5V Power Supply"] --> D

FIGURE 1-1: MCP331x1 16/14/12-Bit 1 Msps SAR ADC Evaluation Kit System Setup.

This evaluation board supports the MCP331x1 device family, which is Microchip Technology Inc.'s baseline single-channel 12/14/16-bit 1 Msps SAR Analog-to-Digital Converter (ADC).

The MCP331x1 Evaluation Board comes with the MCP331x1 device on board. All conditions and features can be evaluated using this evaluation board. Refer to Figure 1-2 and Figure 1-3 for photos of the evaluation boards, and refer to Table 1-1 for our currently available device offerings.

TABLE 1-1: DEVICE OFFERING (1)

Part Number	Resolution Sample	Rate SNR	(2)	SFDR (2)	Input Configuration
MCP33131D-10	16-bit	1 Msps	91.3 dBFS	103.5 dB	Differential
MCP33121D-10	14-bit	1 Msps	85.1 dBFS	103.5 dB	Differential
MCP33111D-10	12-bit	1 Msps	73.9 dBFS	99.3 dB	Differential

Note 1: Contact Microchip Technology Inc. for availability.

2: SNR and SFDR are measured with f_IN = 10 kHz , V_IN = -1 dBFS , V_REF = 5V

FIGURE 1-2: MCP331x1 16/14/12-Bit 1 Msps SAR ADC Evaluation Board, 5V Reference.

SN02 GND3 MUCROCHIP ADM00873 MCP331 x 1 Eval Bd. 4V Supply CT1 + GND CL R33 R57 L5 470 C30 C51 L4 Device ID Selection

FIGURE 1-3: MCP331x1 16/14/12-Bit 1 Msps SAR ADC Evaluation Board, 4V Reference.

1.4 SAR ADC DEVICE CONFIGURATION

Each evaluation board features a 4-way SPST DIP switch (schematic designator: SW1) that allows the user to manually configure the board for a variety of available devices, as well as configure the input, resolution and speed for each device. Table 1-2 lists each available switch setting. Refer to Figure 2-1 from Chapter 2. "Installation and Operation" to view the location of SW1.

TABLE 1-2: SW1 DEVICE CONFIGURATION SETTINGS

Part Number Resolution Speed			Input Configuration	SW1 Setting: (ID3:ID2:ID1:ID0)	Notes
MCP33111-05 12	500 ksps Single-Ended 0-0-0-0
MCP33111D-05 12	500 ksps	Differential	0-0-0-1
MCP33121-05	14 500 ksps Single-Ended 0-0-1-0
MCP33121D-05	14	500 ksps	Differential	0-0-1-1
MCP33131-05	16 500 ksps Single-Ended 0-1-0-0
MCP33131D-05	16	500 ksps	Differential	0-1-0-1
MCP33141-05	18	500 ksps	Single-Ended	0-1-1-0	Future Use
MCP33141D-05	18	500 ksps	Differential	0-1-1-0	Future Use
MCP33141-10	18	1 Msps	Single-Ended	1-0-0-0	Future Use
MCP33141D-05	18	1 Msps	Differential	1-0-0-1	Future Use
MCP33111-10 12	1 Msps Single-Ended 1-0-1-0
MCP33111D-10	12	1 Msps	Differential	1-0-1-1
MCP33121-10	14	1 Msps	Single-Ended	1-1-0-0
MCP33121D-10	14	1 Msps	Differential	1-1-0-1
MCP33131-10	16	1 Msps	Single-Ended	1-1-1-0
MCP33131D-10	16	1 Msps	Differential	1-1-1-1	Default

1.5 CURIOSITY PIC32MZEF DEVELOPMENT BOARD (DM320104) OVERVIEW

The Curiosity PIC32MZEF Development Board (DM320104) is a fully-integrated 32-bit development platform featuring the high-performance PIC32MZ EF Series PIC® Microcontroller (PIC32MZ2048EFM100), which is utilized for capturing the digital data received from the MCP331x1 Analog-to-Digital Converter (ADC) evaluation board. Figure 1-1 shows the connection of the Curiosity Development Board (DM320104) directly between the MCP331x1 16/14/12-Bit 1 Msps SAR ADC Evaluation Board and the SAR ADC Utility Software.

The Curiosity Development Board (DM320104) connects to the PC through a USB cable, providing the user with two functionalities:

• The ability to send user commands directly to the device from the SAR ADC Utility Software.
• The ability to collect data from the evaluation board and send it to the SAR ADC Utility Software.

Refer to Figure 1-4 for close-up photos of the Curiosity PIC32MZEF Development Board (DM320104). More information, including user guides and other resources for the Curiosity Development Board, can be found by visiting www.microchip.com.

PWR IN J8 V10 V15 J2 C20 U7 +5U RST/RSP1 RST/RSP3 CS/RPD1 SCK/RP01 HISO/RP014 HOSI/RP03 +3.3V R85 2PS6 +5U GND R86 3 PS60 GND 13V 5V PWR SEL MICROCHIP GND LED4 R68 3 R70 3 LED1 LED2 LED3 S1 ICSP HDR MCROCHIP PIC32 MZ EF GND +3.3U GND MICROCHIP PIC R97 C47 C40 C27 R78 R74 3 R76 3 R78 3 R81 R79 R78 3 R76 3 R78 3 R78 3 R78 3 R78 3 R78 3 R78 3 R78 3 R78 3 R78 3 R78 3 R78 3 R78 3 R78 3 R78 3 R78 3 R78 3 R78 3 GND

FIGURE 1-4: Curiosity PIC32MZEF Development Board (DM320104).

1.6 SAR ADC UTILITY SOFTWARE OVERVIEW

The SAR ADC Utility Software is the graphical user interface (GUI) used to communicate with the device and to configure its operating parameters. The software communicates with the part through the Curiosity PIC32MZEF Development Board and a USB cable, allowing the user to program the internal ADC registers. When the user interacts with the software (for example, by updating the registers), the user's commands are passed to the MCP331x1 device through the Curiosity PIC32MZEF Development Board. Once the commands are executed by the MCP331x1 Evaluation Board, the software receives the requested data from the Curiosity PIC32MZEF Development Board. The software will then analyze the data, perform a FFT or other analysis, and display the results. Refer to Figure 1-1 for a diagram of the system setup. Figure 1-5 shows a screen shot of the GUI with FFT display while running in Continuous operating mode. Figure 1-6 shows a screen shot of the GUI while running in Single-Shot mode 16-bit digital output display.

FIGURE 1-5: SAR ADC Utility Software Displaying a Typical FFT Waveform.

FIGURE 1-6: SAR ADC Utility Software Displaying a Single Acquisition Bit Position Digital Output.

The SAR ADC Utility Software is available for download at www.microchip.com. For instructions on using the GUI, refer to the software's supporting documentation included with the installation file, as well as within the application Help menu.

1.7 WHAT THE MCP331X1 16/14/12-BIT 1 MSPS SAR ADC EVALUATION KIT CONTAINS

The MCP331x1 16/14/12-Bit 1 Msps SAR ADC Evaluation Board includes the following items:

• MCP331x1 16/14/12-Bit 1 Msps SAR ADC Evaluation Board in two options:
• 4V_REF , (ADM00873), or
• 5V_REF , (ADM00872)
• 9V wall plug-in power supply
• Important Information Sheet

1.8 MCP331X1 16/14/12-BIT 1 MSPS SAR ADC EVALUATION KIT REQUIREMENTS

MCP331x1 16/14/12-Bit 1 Msps SAR ADC Evaluation Board requires:

• Sold separately
• Type A male-to-micro-B USB cable
• Not provided with the kit
• External signal input
• Supplied by the user
  • SAR ADC Utility Software
• Available on the Microchip website

- Curiosity PIC32MZEF Development Board (DM320104)

Chapter 2. Installation and Operation

2.1 CONFIGURATION REQUIREMENTS

To power-up and run the evaluation kit, the following are required:

• SAR ADC Utility Software
• MCP331x1 16/14/12-Bit 1 Msps SAR ADC Evaluation Board
• Curiosity PIC32MZEF Development Board (DM320104)
- Type A Male-to-Micro-B USB cable
- External Signal Source, differential or single-ended output (see Section 2.2.1 "Input Optimization")

2.1.1 Power Input Connection

This MCP331x1 Evaluation Board comes with a 9V wall plug-in switching power supply (Trident: WSU090-2000-13). This power supply is able to provide a 9V, 2A maximum output. It can be connected to an AC wall outlet rated between 100V AC and 240V AC, at a frequency of 50 Hz to 60 Hz. The other end of the power supply is a 2.1 mm barrel plug that connects to the MCP331x1 Evaluation Board (see Figure 2-1). If the user chooses to connect a different external power supply, a minimum output of 500 mA is required, with a voltage output between 6V-12V. There is no on-board 9V regulator, so the 9V OUT pin (TP4) will read a voltage equal to the voltage input value selected by the user.

WARNING

Avoid connecting a power supply with a voltage greater than what is recommended in this user guide. Doing so can damage the voltage regulators, requiring them to be replaced.

2.2 EVALUATION KIT SETUP

1. Connect the MCP331x1 Evaluation Board and the Curiosity PIC32MZEF Development Board as shown in Figure 2-1.
2. Connect the Curiosity PIC32MZEF Development Board to a computer using a type A male-to-micro-B USB cable. In order to power the Curiosity Board through USB, the USB cable must be plugged-in to the USB connection located at J12. In addition to this, the headers located at J8 need to have the jumper connecting the V_BUS pin to V_IN . Figure 2-1 shows the component locations.
3. Power-up the MCP331x1 Evaluation Board using the provided 9V power supply.
4. Connect a differential or single-ended analog input signal to the MCP331x1 Evaluation Board SMA terminals. For single-ended operation, populate jumper J6 (see Figure 2-1 for jumper location). By populating this jumper, the negative signal input will be tied to V_REF/2 ( V_COM ). Another option is to terminate the negative signal input using a 50Ω termination.
5. Run the SAR ADC Utility Software. See Section 1.6 "SAR ADC Utility Software Overview".

Analog Inputs ADC Power Circuit MCP331x1 16/14/12-Bit 1 Msps SAR ADC Evaluation Board (ADM00873) VCOM (VREF/2 for S.E. Source) Jumper (J6) -1V/GND Driver Input Select (J4) Driver Enable (J8) Differential Driver (U1) VREF Regulator (U5) ADC Device (U3) USB Power Supply (J12) Curiosity Power Source Selection Header (J8) MICROCHIP ADH00873 HCP331x1 Eval Bd Configuration Switch (SW1) Curiosity PIC32MZEF Development Board (DM320104)

FIGURE 2-1: The MCP331x1 16/14/12-Bit 1 Msps SAR ADC Evaluation Board (ADM00873), connected to the Curiosity PIC32MZEF Development Board (DM320104).

2.2.1 Input Optimization

The best way to evaluate the MCP331x1 device is to use a clean analog input signal with as little noise as possible, and no harmonic contents. The AP2722, for example, can be used to generate a clean analog signal for evaluation purposes. If using a less pure signal source, a filter can be added between the signal source and EVB to remove any noise outside of the desired frequency.

Chapter 3. Firmware

3.1 PIC32MZ2048EFM100 INITIALIZATION

MPLAB ^® X IDE and MPLAB ^® Harmony were used to develop the firmware for the PIC32MZ2048EFM100 on the Curiosity Development Board (DM320104).

The frequency of the PIC32MZ2048EFM100 was decreased under its maximum capabilities in order to achieve maximum SPI clock. The MCU runs at 130 MHz, and the SPI prescaler is set to perform a division by 2 in order to obtain an SPI clock frequency of 65 Mhz. This is the minimum SPI speed required to successfully read 16-bits of data out of the ADC at 1 Msps.

In the firmware for this demo, a USB stack was used to achieve communication with the GUI. Direct Memory Access (DMA) was used together with SPI and Output Compare in order to acquire data and to gate the clock during acquisition.

In this demonstration, the ADC acquisition is triggered by the CONV pulse (RPD5), which is generated by the OC2. The OC2 is generated by Timer3 (OCTSEL = 1). Timer 3 is also used to generate OC1 which triggers the DMA SPI transfer. Because both the SPI transfer and CONV pulse are generated by the same timer, they are synchronous. Figure 3-1 displays the timing diagram between CONV pulse and SPI transfer.

Tek Run Trig d a 130.3μs ----_110_1_ b 131.03μs ----_111_1_ Δ704.4Cns SFI(MOSI) FF FF SFI(MISO) OE 28 FF FF FF FF OB D8 CLK MISO CONV MOSI 200ns 2.500S/s D4 +→130.6664μs 100k points 1.40 V D15-D0 Timing Resolution: 2.00ns Bus Search events found: 41 8 Aug 2017 11:21:07

FIGURE 3-1: SPI Transfer and CONV Pulse.

The reason for using OC2 and not SS is related to Electromagnetic Interference (EMI). By using OC2, the user can control the timing between falling edge of the CONV pulse and SPI transfer, and also the timing between the transfer and CONV rising edge-ADC conversion start. For best EMI performance, it is recommended to keep a few nanoseconds between SPI transfer and ADC start.

There are moments during the ADC operation where SPI transfer can affect the output results. There are two main periods during ADC operation: SAR register settling and sample and hold capacitor charging. Time intervals T1 and T2 from Figure 3-2 are the least recommended time intervals for SPI transfer. During T1, the SAR ADC is settling its lower bits and is most easily affected by noise. During T2, the sample and hold capacitor voltage needs to be as clean as possible for accurate conversion. By performing data read out in the recommended time interval, the maximum value of SNR can be achieved.

FIGURE 3-2: Recommended Period for Data Read Out.

Once the data is transferred from the ADC to SPI, the DMA will place it in a 8192 word buffer (ADC_BUFFER[ ]). Since the sampling speed is 1 Msps, this buffer will be updated every 8.1 ms, making timing less critical for other tasks.

The GUI requires a larger amount of data to be processed in order to indicate accurate performance characteristics: FFT, THD, SINAD, etc. Because of this, a larger data buffer is created in RAM (storage \\ ), with a length of 262144bytes. 32 DMA transfers are required to fill this buffer. The flow chart in Figure 3-3 provides a simple overview of the sample acquisition process, and an overview of the entire firmware process.

graph TD
    A["Start (Power-On)"] --> B["USB Transfer Commands"]
    B --> C["Request Device ID (0x60)"]
    C --> D["Configure SPI Speed (0x81)"]
    D --> E["4 Sampling Speeds: 1000 ksps, 500 ksps, 250 ksps, 125 ksps"]
    E --> F["Request Single Shot (0x50)"]
    F --> G["In this mode the Hardware SPI is disabled and switched to Software SPI with a lower speed. It will acquire one sample and enable the Hardware SPI again."]
    G --> H["Calibrate ADC (0x70)"]
    H --> I["ADC Self Calibration"]
    I --> J{Self Calibration Complete}
    J -->|No| K["Get Calibration Status (0x71)"]
    J -->|Yes| L["Calculate ADC Transmits Converted Data (SPI)"]
    L --> M["MCU Receives Incoming Data (SPI)"]
    M --> N["Double Buffering"]
    N --> O["SPI DMA CH1"]
    N --> P["SPI DPA CH2"]
    O --> Q["Store Incoming Data in ADC_BUFFER["] (8192bytes)]
    P --> Q
    Q --> R{ADC_BUFFER[] Full}
    R -->|No| S["Transfer ADC_BUFFER["] Contents_to_storage[] (262144bytes)]
    R -->|Yes| T["Transmit USB Transfer Packet to GUI"]
    S --> U{USB Transfer Packet Ready}
    U -->|No| V["Construct USB Transfer Packet: (32768bytes of sampled data + 512bytes configuration and settings information)"]
    U -->|Yes| W["Transmit USB Transfer Packet to GUI"]
    V --> X["Output: Sample ADC Input (Stand-by Mode)"]
    X --> Y{CNVST Rising Edge Detected}
    Y -->|No| X
    Y -->|Yes| Z["ADC Input Conversion"]
    Z --> AA{ADC Input Conversion Complete}
    AA -->|No| Z
    AA -->|Yes| AB["CNVST Set to Logic Low"]
    AB --> AC["ADC Transmits Converted Data (SPI)"]
    AC --> AD["MCU Receives Incoming Data (SPI)"]
    AD --> AE["Double Buffering"]
    AE --> AF["SPI DMA CH1"]
    AE --> AG["SPI DPA CH2"]
    AF --> AH["Store Incoming Data in ADC_BUFFER["] (8192bytes)]
    AG --> AH
    AH --> AI{ADC_BUFFER[] Full}
    AI -->|No| AJ["Transfer ADC_BUFFER["] Contents_to_storage[] (262144bytes)]
    AI -->|Yes| AK["Transmit USB Transfer Packet to GUI"]

FIGURE 3-3: Firmware and ADC Samples Acquisition Flowchart.

3.3 USB TRANSFER

The MCU firmware implements a WinUSB device to handle the data transfer between the USB host (a PC for example) and the USB device (evaluation board).

Each USB transfer has a length of 33280 bytes out of which first 512 bytes are configuration and setting bytes. The remaining 32768 bytes will contain samples. This will require 8 logical transfers to be executed (Figure 3-4). The physical USB layer will split the 33280 byte packets into 512 byte chunks before transmitting on the USB bus.

512 bytes for configuration 32768 bytes – samples 33280 bytes USB transfer packet

FIGURE 3-4: USB Transfer Frame.

3.4 ADC FUNCTIONS

In addition to the actual sample transfer from MCU to PC, there are other ADC functions available: Calibration, Read Device ID, and Sampling Speed Change.

The PC not only receives data from the EVB, but it also sends 512 bits of data back to the MCU. The 512 length size is required because of the USB high-speed endpoint size. Out of these, only the first 5 are meaningful.

The first element: receivedDataBuffer[0] is indicating to the MCU the desired function. For 0x80, the MCU will send samples. For 0x81, the transfer is stopped and MCU RAM is filled with samples from the ADC. The code will not perform transfers in the same time as the acquisition of ADC samples.

The Calibration function is executed when value 0x70 is received. Calibration status function has code 0x71. Table 3-1 provides the command structure byte values sent to and the responses from the PIC32MZ2048EFM100 on the Curiosity Development Board (DM320104). Figure 3-5 displays the timing diagram of the calibration process.

TABLE 3-1: COMMAND STRUCTURE BYTE VALUES

Command	receivedDataBuffer[x] transmitDataBuffer[x] Description
	Byte[0]	Byte[1] Byte[2]	Byte[3] Byte[0]	Byte[1] Byte[2]	Byte[3] Byte[4] Byte[5]
Send Samples	0x80 —	[0 to 7] Package Index	0x80	0x00	—	—	33280 Byte reply [0-511] – Irrelevant [512 – 33279] – Data samples Combine the read data into a 16b signed value as follows: dataH: dataL = read[odd index]: read—even index]
Change Sampling Speed	0x81 —	1-4 Sampling speed	0x81	0x01	—	—	Select sampling speed from Byte[3] and change transmitDataBuffer[1] = 0x80 to start send data
			0x80	0x01	—	—
Calibrate ADC	0x70	—	—	0x70	0x01	—	—	[0x70, 0x01] – Command received successfully [0x70, 0x00]– Error
Calibration Status	0x71	—	—	0x71	0x01	—	—	[0x71, 0x01] – Calibration successful [0x71, 0x00] – Calibration failed
Acquire Single Sample	0x50	—	—	0x50	MSb	LSb	—	[0x50, ADCHighByte, ADCLOWByte]
Read Device ID	0x60	—	—	0x60	—	—	—	[0x60, chip ID]

Tek Stop 3.5ms 6.65ms Δ3.072ms SPI(MOSI) SPI(COSO) CLK MISO CONV MOSI 2.00ms 500MS/s D4\ →1.678906ms 10M points 1.40 V D15-00 Timing Resolution: 2.00ms Bus Search events found: 2 8 Aug 2017 12:00:05 Mode Sample Record Length 10M FastAcq Off Delay On Off Horizontal Position Waveform Display XY Display Off

FIGURE 3-5: ADC Calibration.

Read Device ID code is 0x60. In order to retrieve the chip ID, more read registers are required. Figure 3-6 describes the read register command format.

To retrieve the samples, the GUI will send to the MCU information on the packet required to be received as an index, which is a number from 0 to 7. This index is sent to the MCU in receivedDataBuffer[4].

Another function controlled by the GUI is the sampling speed change. There are four available sampling speeds. These are selected in accordance with the value received in receivedDataBuffer[3]. The sampling speed is controlled by changing the prescaler of the reference system clock.

Tek PreVu MISI: 95 MOSI: 5C 00 MISO: 3F MISO: FF 90 CLK MISO CONV MOSI 4.00μs 2.50GS/s D-4\ 142.9064 μs 1M points 1.40 V D15-00 Timing Resolution: 2.00ns Bus Search events found: 12 8 Aug 2017 11:39:42

FIGURE 3-6: Read Register from ADC.

NOTES:

Appendix A. Schematic and Layouts

A.1 INTRODUCTION

This appendix contains the following schematics and layouts for the MCP331x1 16/14/12-Bit 1 Msps SAR ADC Evaluation Board (4V REF , ADM00873 and 5V REF , ADM00872).

A.2 ADM00872

• Board ADM00872 – Schematic
• Board ADM00872 – Schematic Regulators
- Board ADM00872 – Top Silk Layer
- Board ADM00872 – Top Copper and Silk Layer
- Board ADM00873 – Top Copper Layer
- Board ADM00873 – Bottom Copper Layer
- Board ADM00873 – Bottom Copper and Silk Layer
- Board ADM00872 – Bottom Silk Layer

A.3 ADM00873

• Board ADM00873 – Schematic
• Board ADM00873 – Schematic Regulators
- Board ADM00873 – Top Silk Layer
• Board ADM00873 – Top Copper and Silk Layer
- Board ADM00873 – Top Copper Layer
- Board ADM00873 – Bottom Copper Layer
- Board ADM00873 – Bottom Copper and Silk Layer
- Board ADM00873 – Bottom Silk Layer

DS50002733A-page 28 © 2018 Microchip Technology Inc.
A.4 BOARD ADM00872 - SCHEMATIC

Differential Input TP1 R45 R27 DNP DIPF/DR/FR * C filter >20 x C sample. * Keep to < 500 kHz DCB ADJ-240-ALI-240 DNP C8 C69 C59 C36 C18 C16 C14 C12 C10 C8 C6 C4 C2 C1 R27 R26 R25 R24 R23 R22 R21 R19 R18 R17 R16 R15 R14 R13 R12 R11 R10 R9 R8 R7 R6 R5 R4 R3 R2 R1 GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND

MCP331x1 16/14/12-Bit 1 Maps SAR ADC Evaluation Kit Users Guide

A.5 BOARD ADM00872 - SCHEMATIC REGULATORS

Terminal I.C J5 Power, am, 2 Vrms OND CT1 4V TANT-B R26 R C41 20V 1.3V-4E OND AV ADM REGULATOR MAX/SPY/ADRLY OND B1/MP S/N/S/B OND C44 80F OND C27 90X 1.3V-4E OND C20 40F OND C43 15F OND TP5 To ADC Driver, Reference Changed to Green LED TP4 ACI ACI ACI ACI ACI ACI ACI ACI ACI ACI ACI ACI ACI ACI ACI ACI ACI ACI ACI ACI ACI ACI ACI ACI ACI ACI ACI ACI ACI ACI ACI ACI ACI ACI

A.6 BOARD ADM00872 - TOP SILK LAYER

J2 J1 GND2 C52 -1V TP10 R47 GND3 J6 GND1 R9 C34 R23 R1 C33 R22 +6V R6 R5 R4 U1 C18 F86 Driver En. OFF ON C20 R12 R3 C35 J8 +6V TP6 C43 R26 IBJ C42 C41 U9 R27 C44 R30 AVREF1 Eval Bd. VREF/2 R19 IN1 R24 S.E only R18 IN1 VREF TP7 C9 C59 C3 C4 C41 +1.8V C5 TP6 3.3V R32 C18 SD1 SCLK CNUST SDD0 CNV SCK SD1 SD0 OFF SHI ON OFF SHI Device ID Selection SUV Circuit CT1 L8 R28 C48 C46 C47 L9 D2 R20 R21 R29 D3 R31 D46 U10 R21 R29 R31 R57 PRD/Reset L5 C50 C51 SUT OUT GND

A.7 BOARD ADM00872 - TOP COPPER AND SILK LAYER

J2 J6 GND1 GND2 TP1 GND3 J4 +6U R7 R1 R22 R23 C34 C33 C32 C31 C2 C1 U1 F85 J8 +6U OFF Driver En. ON TP5 C20 R12 R3 C36 R18 R10 VREF/2 R11 VREF R19 IN1 R24 (ILE only) AOC GND4 CNUST S00 S01 SCLK S00 R12 R35 C19 C14 U4 GND0 CNU SCK SD1 SD0 R13 OFF S41 ON TP8 MCU+3.0V Device ID Selection 5V Circuit CT1 L8 R28 C48 D2 C45 R20 C45 R21 R29 D3 R31 C16 U10 R29 R31 R25 R27 U9 C14 R30 C42 C41 C41 R27 PV-REF L5 L6 S0 OUT GND

A.8 BOARD ADM00872 - TOP COPPER LAYER

Top-down schematic of a circuit board layout with traces, pads, and components (no text or labels)

A.9 BOARD ADM00872 - BOTTOM COPPER LAYER

04-10724-R1

A.10 BOARD ADM00872 - BOTTOM COPPER AND SILK LAYER

04-10724-R1 CE Earth GND LABEL1 C8 CI1 C12 R37 R38 AGND +3.3V from MCU +5V from MCU DGND Digital GND

A.11 BOARD ADM00872 - BOTTOM SILK LAYER

Earth GND C8 1 C C11 LABEL1 C12 AGND +3.3V from MCU +5V from MCU DGND Digital GND

A.12 BOARD ADM00873 - SCHEMATIC

Reference: 4.096V DINP DNP if not needed F=102pJ RC=10Hz Option: MC28 To by-pass US: Populate R2, Remove R38 and R28 N=102pJ RC=655 Hz SAR ADC VR3F AV4 AV4 AV4 AV4 AV4 AV4 AV4 AV4 AV4 AV4 AV4 AV4 AV4 AV4 AV4 AV4 AV4 AV4 AV4 AV4 AV4 AV4 AV4 AV4 AV4 AV4 AV4 AV4 AV4 AV4 AV4 AV4 AV4 AV4

A.13 BOARD ADM00873 - SCHEMATIC REGULATORS

J5 7mA ADR 2.5V +0.18 CND HENSINA-162 C11 14A-1-R C10 13A-1-R C97 13A-1-R C96 13A-1-R C95 13A-1-R C94 13A-1-R C93 13A-1-R C92 13A-1-R C91 13A-1-R C89 13A-1-R C88 13A-1-R C87 13A-1-R C86 13A-1-R C85 13A-1-R C84 13A-1-R C83 13A-1-R C82 13A-1-R C81 13A-1-R C79 13A-1-R C78 13A-1-R C77 13A-1-R C76 13A-1-R C75 13A-1-R C74 13A-1-R C73 13A-1-R C72 13A-1-R C71 13A-1-R C70 13A-1-R C69 13A-1-R C68 13A-1-R C67 13A-1-R C66 13A-1-R C65 13A-1-R C64 13A-1-R C63 13A-1-R C62 13A-1-R C61 13A-1-R C60 13A-1-R C59 13A-1-R C58 13A-1-R C57 13A-1-R C56 13A-1-R C55 13A-1-R C54 13A-1-R C53 13A-1-R C52 13A-1-R C51 13A-1-R C50 13A-1-R C49 13A-1-R C48 13A-1-R C47 13A-1-R C46 13A-1-R C45 13A-1-R C44 13A-1-R C43 13A-1-R C42 13A-1-R C41 13A-1-R C40 13A-1-R C39 13A-1-R C38 13A-1-R C37 13A-1-R C36 13A-1-R C35 13A-1-R C34 13A-1-R C33 13A-1-R C32 13A-1-R C31 13A-1-R C30 13A-1-R C29 13A-1-R C28 13A-1-R C27 13A-1-R C26 13A-1-R C25 13A-1-R C24 13A-1-R C23 13A-1-R C22 13A-1-R C21 13A-1-R C20 13A-1-R C19 13A-1-R C18 13A-1-R C17 13A-1-R C16 13A-1-R C15 13A-1-R C14 13A-1-R- +5V OUT- RSDI 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V -5V OUT- RSDI 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5SIN/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/DC/NCN/DCN/DCN/DCN/DCN/DCN/DCN/DCN/DCN/DCN/DCN/DCN/DCN/DCN/DCN/DCN/DCN/DCN/DCN/DCN/DCN/DCN/DCN/DCN/DCN/DCN/DCN/DCN/DCN/DCN/DCN/DCN/DCN/DCN/DCn / +2.0 VOUT- RSDI 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5MEN/ RSDI 5MEN/ RSDI 5MEN/ RSDI 5MEN/ RSDI 5MEN/ RSDI 5MEN/ RSDI 5MEN/ RSDI 5MEN/ RSDI 5MEN/ RSDI 5MEN/ RSDI 5MEN/ RSDI 5MEN/ RSDI 5MEN/ RSDI 5MELUICOS (AC) (AC) (AC) (AC) (AC) (AC) (AC) (AC) (AC) (AC) (AC) (AC) (AC) (AC) (AC) (AC) (AC) (AC) (AC) (AC) (AC) (AC) (AC) (AC) (AC) (AC) (AC) (AC) (AC) (AC) (AC) (AC) (AC) (AC)

A.14 BOARD ADM00873 - TOP SILK LAYER

J2 J1 GND2 C52 -1V TP10 R47 C48 L9 D2 C45 R20 C46 R21 D3 U10 R31 R28 +5.5V J4 +5.5V J6 GND1 C33 R22 R1 C34 R23 R26 R4 C46 R48 R10 OFF ON Driver En. J8 U2 R36 R39 R36 +5.5V C43 TP5 C41 R26 C42 U9 FBI C44 R30 R33 R57 PWR/Reset J3 C49 L5 IN1- R24 for S.E R19 R18 R11 TNI+ R10 +1.8V TP7 TP6 +1.8V C59 C55 C51 C31 C30 C25 C26 C25 C25 C26 C26 C26 C26 C26 C26 C26 C26 C26 C26 C26 C26 C26 C26 C26 C26 C26 C26 C26 C26 C26 C26 C26 C26 C26 C25 C50 C51 SUV OUT SUV OUT TP4 SUV OUT TP8 +3.3V from MCU Device ID Selection

A.15 BOARD ADM00873 - TOP COPPER AND SILK LAYER

J2 J1 GND2 C52 -1U TP10 R47 L8 R28 CT1 H1 + GND Ext PWR J6 GND1 R49 C33 R48 GND3 R23 C34 R22 R1 +5.5V R8 18 FB4 D4 R2 C1 U1 C2 D7 T8 OFF ON C20 RS2 R12 C22 R38 TP5 C43 R26 C41 FBI C42 U9 C44 R30 L5 PWR/Reset J3 R57 C49 UREF/2 R8 C37 Driver En. R3 C35 UREF/2 R19 IN1- R24- for S.E. R18 IN1+ R10 R11 C59 1.8V TP27 (4V) F88 ADC GT GND4 CNUST SOLI SCLK SCLK C13 CP6 CP8 SP6 3.3V R55 B00 R54 F83 R34 R35 C19 C17 R31A AGND J10 A J10 B DGND R17 103 R16 102 R16 101 R14 100 TP8 +3.3V from HCU Device ID Selection

A.16 BOARD ADM00873 - TOP COPPER LAYER

Pure electrical circuit lines without any symbols

A.17 BOARD ADM00873 - BOTTOM COPPER LAYER

04-10726-R1

A.18 BOARD ADM00873 - BOTTOM COPPER AND SILK LAYER

Earth GND 04-10726-R1 CE C8 1 C23 R2 Cl2 R42 R03 R44 AGND +3.3V from MCU +5V from MCU DGND Digital GND

A.19 BOARD ADM00873 - BOTTOM SILK LAYER

Earth GND C8 1 1 C23 R2 C12 R42 RB3 R44 AGND +3.3V from MCU +5V from MCU DGND Digital GND

NOTES:

Appendix B. Bill of Materials (BOM)

TABLE B-1: BILL OF MATERIALS (BOM) FOR ADM00872 (1)

Qty.	Reference Description Manufacturer Part Number
4 C1	C10,C15, C59	Capacitor ceramic 0.1 μF, 16V, 10%, X7R,SMD, 0603	AVX Corporation 0603	YC104KAT2A
1 C12	Capacitor ceramic, 0.1 μF, 16V, 10%, X7R,SMD, 0603DO NOT POPULATE		AVX Corporation 0603	YC104KAT2A
4 C14	C25,C41, CT1	Capacitor tantalum 10 μF, 20V, 10%, 2.1Ω,SMD, 1210	AVX Corporation TAJB	106K020RNJ
3 C17	C26,C42	Capacitor ceramic 2.2 μF, 50V, 10%, X7R,SMD, 1206	TDK Corporation	CGA5L3X7R1H225K160AB
3 C19	C32,C44	Capacitor ceramic 470 pF, 50V, 10%, X7R,SMD, 0603	Johanson Dielectrics	500R14W471KV4T
6 C2	C8, C9,C16, C20,C64	Capacitor ceramic 1 μF, 16V, 10%, X7R,SMD, 0603	SamsungElectro-MechanicsAmerica, Inc.	CL10B105KA8NNNC
1 C3	Capacitor ceramic 22 μF, ±10%, 25V, X5R,1206		Murata ElectronicsNorth America, Inc.	GRM31CR61E226KE15L
2 C33	C34	Capacitor ceramic, 0.062 μF, 1206, CER,50V, 5%, COGDO NOT POPULATE	Murata ElectronicsNorth America, Inc.	GRM31C5C1H623JA01L
2 C35	C37	Capacitor ceramic 2200 pF, 50V, C0G, NP0,0603 (1608 Metric) 0.063" L x 0.031	Murata ElectronicsNorth America, Inc.	GRM1885C1H222FA01D
3 C4	C7, C11	Capacitor ceramic, 100 pF, 25V, 10%, NP0,SMD, 0603	AVX Corporation 0603	3A101KAT2A
3 C45	C47,C52	Capacitor ceramic 4.7 μF, 25V, 10%, X7R,SMD, 0805	TDK Corporation	C2012X7R1E475K125AB
1 C46	Capacitor ceramic 0.1 μF, 50V, 10%, X7R,SMD, 0805		Yageo Corporation	CC0805KRX7R9BB104
1 C48	Capacitor ceramic 22 μF, 16V, 20%, X5R,SMD, 1206		SamsungElectro-MechanicsAmerica, Inc.	CL31A226KOCLFNC
2	C49, C50	Capacitor ceramic 22 μF, 16V, X5R, 0805	TDK Corporation	C2012X5R1C226K125AC
4 C5	C18,C31, C43	Capacitor ceramic 10 μF, ±10%, 25V, X5R,MLCC, 0805	Murata ElectronicsNorth America, Inc	GRM219R61E106KA12D
1 C51	Capacitor ceramic 10 μF, 50V, 20%, X7S,SMD, 1210		TDK Corporation	C3225X7S1H106M
1 C6	Capacitor tantalum 10 μF, 16V, 20%, 8Ω,SMD, A		KEMET	T491A106M016AT
1 C60	Capacitor ceramic 1 μF, 16V, 10%, X7R,SMD, 0603		Yageo Corporation	CC0603KRX7R7BB105
1 D1	Diode LED Red, 2V, 30 mA, 2 mcd, clear,SMD, 0603		Lite-On®, Inc.	LTST-C190EKT
Qty.	Reference	Description	Manufacturer	Part Number
1 D2	Diode schottky, 30V, 1A, POWERDI323 Diodes		Incorporated®	PD3S130L-7
1 D3	Diode rectifier, 1N4148, 855 mV, 300 mA, 75V, SOD-323DO NOT POPULATE		Diodes Incorporated 1	N4148WS-7-F
7	F B FB3, FB4, FB5, FB6, FB7	Ferrite bead, 1R , 0B03, 12N Wurth Elektronik	742792662
4 GND1, GND2, GND3, GND4		Connector TP, Loop, Black, TH Keystone Electronics Corp.		5011
1 H1	Connector terminal, 3.5 mm, 6A Female, 1 x 2 TH, R/A		Keystone Electronics Corp.	8722
3 IN1+, IN1-, TP7		Connector header-2.54, Male, 1x1, Gold, 5.97MH, TH, Vertical DO NOT POPULATE	Samtec, Inc. TSW-101	-07-L-S
2 J1, J2 Connector		radio frequency, Coaxial, SMA Female, TH, R/A	TE Connectivity, Ltd.	5-1814400-1
2 J10_A, J10_B		Connector header-2.54 Male, 1x8, Gold, 5.84MH, TH	FCI	68001-108HLF
2 J3, J6 Connector		header, 1.27 mm, T/H, Gold, 2 POS	Harwin Plc.	M50-3530242
2	J4, J8	Connector header, 1.27 mm, T/H, AU, 3 POS	Harwin Plc.	M50-3530342
1	J5	Connector power, Jack Male, 2.5 mm, CLSD	CUI Inc.	PJ-002B
1	L5	Fixed inductor, 47 H, 2A, 135 m , SMD	Bourns®, Inc.	SRR1240-470M
1	L6	Fixed inductor, 1 mH, 250 mA 6 , TH	Wurth Elektronik	7447462102
1	L8	Fixed inductor, 1 H, 1A, 60 m , SMD	Murata Electronics North America, Inc	QH32CN1R0M33L
1	L9	Fixed Shielded Power Inductor, 4.7 H	Coilcraft	LPS3015-472MRB
1 PCB1	MC P331x1 16/14/12-Bit 1 Msps SAR ADC Evaluation Board Printed Circuit Board		Microchip Technology Inc.	04-10724-R1
2 R1	R9 Resistor TF, 20R, 1%, 1/16W, SMD, 0603 Stackpole Electronics, Inc.			RNCP0603FTD20R0
2 R10, R11 Resistor TF, 10k, 0.1%, 1/10W, SMD, 0603 Panasonic ® - ECG				ERA-3AEB103V
5 R12, R14, R15, R16, R17		Resistor TKF, 10k, 5%, 1/10W, SMD, 0603	Panasonic - ECG	ERJ-3GEYJ103V
1 R13 Resistor TKF, 30k, 1%, 1/10W, SMD, 0603 Stackpole Electronics, Inc.				RMCF0603FT30K0
2	R18, R19	Resistor TKF, 0R, SMD, 0402	Panasonic - ECG	ERJ-2GE0R00X
8 R2	R25, R33, R36, R37, R44, R48, R49	Resistor TKF, 0R, 1/10W, SMD, 0603	Panasonic - ECG	ERJ-3GSY0R00V
1	R20	Resistor TKF, 0R, 1/16W, SMD, 0402	Yageo Corporation	RC0402JR-070RL
1 R21	Resistor TKF, 0R, 1/16W, SMD, 0402DO NOT POPULATE		Yageo Corporation RC0402JR-070RL
3 R22, R23, R24		Resistor TKF, 0R, SMD, 0402DO NOT POPULATE	Panasonic - ECG ERJ-2GE0R00X
3 R26, R32, R40		Resistor TKF, 1R, 1%, 1/10W, SMD, 0603 ROHMSemiconductor	KTR03EZPF1R00
1 R27	Thick Film Resistors, SMD, 0805, 82 kΩ, 1%, Anti-Surge, AEC-Q200		Panasonic - ECG ERJ-P6WF8202V
1 R28	Resistor, TFK, 35.7 kΩ, 1%, 1/10W, SMD, 0603DO NOT POPULATE		Vishay/Dale CRCW060335K7FKEA
1	R29	Resistor, SMD, 14 kΩ, 1%, 1/8W, 0805	Panasonic - ECG	ERJ-6ENF1402V
2	R3, R8	Resistor TKF, 24R, 1%, 1/10W, SMD, 0603	Yageo Corporation	RC0603FR-0724RL
2 R30, R41	Resistor, TKF, 348k, 1/10W, 1%, SMD, 0603 Stackpole Electronics, Inc.		RMCF0603FT348K
1	R31	Resistor TKF, 56k, 1%, 1/8W, SMD, 0805	Vishay/Dale	CRCW080556K0FKEA
1	R34	Resistor, SMD, 143 kΩ, 1%, 1/10W, 0603	Bourns, Inc.	CR0603-FX-1433ELF
1 R35	Resistor, SMMD, 237 kΩ, 1%, 1/10W, 0603 Stackpole Electronics, Inc.		RMCF0603FT237K
3 R38, R42, R43		Resistor TKF, 33R, 5%, 1/10W, SMD, 0603	Panasonic - ECG	ERJ-3GEYJ330V
1 R39	Resistor, TKF, 33R, 5%, 1/10W, SMD, 0603DO NOT POPULATE		Panasonic - ECG ERJ-3GEYJ330V
4 R4, R5, R6, R7		Resistor TF, 1k, 0.1%, 1/10W, SMD, 0603	Panasonic - ECG	ERA-3AEB102V
1 R46	Resistor TKF, 158k, 1%, 1/10W, SMD, 0603 Yageo Corporation RC0603FR-07158KL
1 R47	Resistor TKF, 0R, 1/8W, SMD, 0805 Panasonic - ECG ERJ-6GEY0R00V
1	R57	Resistor TKF, 2k, 1%, 1/10W, SMD, 0603	Panasonic - ECG	ERJ-3EKF2001V
1	SW1	Switch DIP, 4-POS, SLIDE, SMD, 6V	Nidec Copal Electronics, Inc.	CHS-04TB
7	TP1, TP4, TP5, TP6, TP8, TP9, TP10	Connector header-2.54 Male, 1x1, Gold, 5.97MH, TH, Vertical	Samtec, Inc.	TSW-101-07-L-S
1	U1	IC OP-AMP, Differential, RRO LFCSP-16	Analog Devices Inc.	ADA4940-1ACPZ-R7
1 U2	IC POWER, VREF, MSOP-8 Linear Technology Corporation			LTC6655BHMS8-5#PBF
1 U3	MCP33131D-10-I/MS Microchip Technology Inc.			MCP33131D-10-I/MS
3 U4	U6, U9 Microchip Analog LDO, 2.5V-5V, MSOP-8 Microchip Technology Inc.			MIC5219YMM
1 U10	Microchip Analog Switcher, Buck 2V to 15V, SOT-23-6		Microchip Technology Inc.	MCP16301T-E/CH

Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM used in manufacturing uses all RoHS-compliant components.

TABLE B-2: BILL OF MATERIALS (BOM) - MECHANICAL PARTS FOR ADM00872 (1)

Qty.	Reference Description	Manufacturer Part Number
3 JP1	JP2, JP3 1.27 mm Jumper at Pins 1 and 2 of J81.27 mm Jumper at Pins 1 and 2 of J31.27 mm Jumper at Pins 1 and2 of J4	Harwin Plc. M50-2000	005
1 LABEL1 Microchip Technology Product Label
5 PAD1	PAD2, PAD3, PAD4, PAD5	Mechanical Hardware Rubber Pad, Cylindrical, D7.9, H5.3, Black	3M SJ61A11
1	PS1	100-240V, Wall Plug-in, Power Supply	Triad Magnetics	WSU090-2000-13
1 SCR1	Mechanical Hardware Machine Screw, PAN Phillips, 4-40, Nylon	Digi-Key® Electronics	H544-ND
	STANDOFF1	Mechanical HW Standoff, #4-40 x 3/4", F/F, HEX, Nylon	Keystone Electronics Corp.	1902D

Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM used in manufacturing uses all RoHS-compliant components.

TABLE B-3: BILL OF MATERIALS (BOM) FOR ADM00873 ^(1)

Qty.	Reference Description	Manufacturer	Part Number
4	C1, C10, C15, C59	Capacitor ceramic 0.1 μF, 16V, 10%, X7R, SMD, 0603	AVX Corporation	0603YC104KAT2A
1 C12	Capacitor ceramic, 0.1 μF, 16V, 10%, X7R, SMD, 0603DO NOT POPULATE		AVX Corporation	0603YC104KAT2A
4	C13, C18, C31, C43	Capacitor ceramic 10 μF, ±10%, 25V, X5R, MLCC, 0805	Murata Electronics North America, Inc.	GRM219R61E106-KA12D
4	C14, C25, C41, CT1	Capacitor tantalum 10 μF, 20V, 10%, 2.1Ω, SMD, B	AVX Corporation TA	JB106K020RNJ
3 C17, C26, C42	Capacitor ceramic 2.2 μF, 50V, 10%, X7R, SMD, 1206		TDK Corporation CG	A5L3X7R1H225K160AB
3 C19, C32, C44	Capacitor ceramic 470 pF, 50V, 10%, X7R, SMD, 0603		Johanson Dielectrics	500R14W471KV4T
11	C2, C3, C4, C8, C9, C11, C16, C20 C22, C60, C64	Capacitor ceramic 1 μF, 25V, X7R, 0603	Samsung Electro-Mechanics America, Inc.	CL10B105KA8NNNC
1 C21	Capacitor tantalum 22 μF, 16V, 10%, 2.3Ω, SMD, B		AVX Corporation	TAJB22226K016R
2 C33, C34	Capacitor ceramic, 0.062 μF, 1206, CER, 50V, 5%, COGDO NOT POPULATE		Murata Electronics North America, Inc.	GRM31C5C1H623-JA01L
2 C35, C37	Capacitor ceramic 2200 pF, 50V, C0G, NP0, 0603 (1608 Metric) 0.063" L x 0.031		Murata Electronics North America, Inc.	GRM1885C1H222-FA01D
3 C45, C47, C52	Capacitor ceramic 4.7 uF, 25V, 10%, X7R, SMD, 0805		TDK Corporation	C2012X7R1E475K125 AB
1 C46	Capacitor ceramic 0.1 uF, 50V, 10%, X7R, SMD, 0805		Yageo Corporation	CC0805KRX-7R9BB104
1 C48	Capacitor ceramic 22 uF, 16V, 20%, X5R, SMD, 1206		Samsung Electro-Mechanics America, Inc.	CL31A226KOCLFNC
2 C49, C50	Capacitor tantalum 100 uF, 20V, 10%, 140 mΩ, SMD, R		Vishay/Dale	595D107X9020R2T
Qty.	Reference	Description	Manufacturer	Part Number
1 C5	Capacitor ceramic 2.2 u	F, 16V, 10%, X5R, SMD, 0603	TDK Corporation C1	608X5R1C225K
1 C51	Capacitor ceramic 10 μ	F, 50V, 20%, X7S, SMD, 1210	TDK Corporation C3	225X7S1H106M
1 C6	Capacitor tantalum 10 μ	F, 16V, 20%, 8Ω, SMD, A	KEMET T491A106M	016AT
2 C7	C23 Capacitor ceramic	100 pF, 25V, 10%, NP0, SMD, 0603	AVX Corporation 06	033A101KAT2A
1 D1	Diode LED Red, 2V, 30	mA, 2 mcd, clear, SMD, 0603	Lite-On®, Inc. LTST-	C190EKT
1 D2	Diode schottky, 30V, 1A	POWERDI323 Diodes	Incorporated®	PD3S130L-7
1 D3	Diode rectifier, 1N4148,	855 mV, 300 mA, 75V, SOD-323	Diodes Incorporated®	1N4148WS-7-F
1	D4	Diode array, 1.1V, 200 mA, 200V, SMD, SOT-23-3	Fairchild Semiconductor®	MMBD1503A
8 FB1	FB2, FB3, FB4, FB5, FB6, FB7, FB8	Ferrite bead, 1 kΩ, 0603, 1LN	Wurth Elektronik	742792662
4 GND1	GND2, GND3, GND4	Connector TP, Loop, Black, TH	Keystone Electronics Corp.	5011
1 H1	Connector terminal, 3.5	mm, 6A Female, 1 x 2 TH, R/A	Keystone Electronics Corp.	8722
3 IN1	+, IN1-, TP7	Connector header-2.54, Male, 1x1, Gold, 5.97MH, TH, Vertical DO NOT POPULATE	Samtec, Inc.	TSW-101-07-L-S
2 J1	J2	Connector radio frequency, Coaxial, SMA, Female, TH, R/A	TE Connectivity, Ltd.	5-1814400-1
2 J10	_A, J10_B	Connector header-2.54 Male, 1x8, Gold, 5.84MH, TH	FCI	68001-108HLF
3 J3	J6, J7	Connector header-1.27 Male, 1x2, Gold, TH, Vertical	Harwin PI	M50-3530242
2 J4	J8	Connector header, 1.27 mm, T/H, AU, 3 POS	Harwin Plc.	M50-3530342
1 J5		Connector Power, Jack Male, 2.5 mm, CLSD	CUI Inc.	PJ-002B
1 L5		Fixed inductor, 47 μH, 2A, 135 mΩ, SMD	Bourns®, Inc.	SRR1240-470M
1	L6	Fixed inductor, 1 mH, 250 mA 6Ω, TH	Wurth Elektronik	7447462102
1	L8	Fixed inductor, 1 μH, 1A, 60 mΩ, SMD	Murata Electronics North America, Inc	LQH32CN1R0M33L
1	L9	Fixed Shielded Power Inductor, 4.7 μH	Coilcraft	LPS3015-472MRB
1 PCB1	MC	P331x1 16/14/12-Bit 1 Msps SAR ADC Evaluation Board Printed Circuit Board	Microchip Technology Inc.	04-10726-R1
2 R1	R9	Resistor TF, 20R, 1%, 1/16W, SMD, 0603	Stackpole Electronics, Inc.	RNCP0603FTD20R0
2 R10	R11	Resistor TF, 10k, 0.1%, 1/10W, SMD, 0603	Panasonic® - ECG	ERA-3AEB103V
1 R12	Resistor TF, 10k, 1%,	1/16W, SMD, 0603	TE Connectivity, Ltd.	5-1879337-9
1 R13	Resistor TKF, 30k, 5%,	1/10W, SMD, 0603	Panasonic® - ECG	ERJ-3GEYJ303V
4 R14	R15, R16, R17 Resistor	TKF, 10k, 5%, 1/10W, SMD, 0603	Panasonic® - ECG	ERJ-3GEYJ103V
2 R18	R19 Resistor TKF, 0R	SMD, 0402 Panasonic	® - ECG	ERJ-2GE0R00X
1 R2	Resistor TKF, 0R, 1/10W	SMD, 0603DO NOT POPULATE	Panasonic® - ECG	ERJ-3GSY0R00V
1 R20	R39 Resistor TKF, 0R	1/16W, SMD, 0402 Yageo Corporation	RC0402JR-070RL
2 R21	R45 Resistor TKF, 0R	1/16W, SMD, 0402DO NOT POPULATE	Yageo Corporation	RC0402JR-070RL
1 R25	Resistor TKF, 7.15K, 1%	1/10W, SMD, 0603	Panasonic® - ECG	ERJ-3EKF7151V
3 R22	R23, R24 Resistor TKF	0R, SMD, 0402DO NOT POPULATE	Panasonic® - ECG	ERJ-2GE0R00X
3 R26	R32, R40 Resistor TKF	1R, 1%, 1/10W, SMD, 0603	ROHM Semiconductor	KTR03EZPF1R00
1 R27	Resistor TKF, 82K, 1%	1/10W, SMD, 0603	Panasonic® - ECG	ERJ-3EKF8202V
1 R28	Resistor, TFK, 35.7 kΩ	1%, 1/10W, SMD, 0603DO NOT POPULATE	Vishay/Dale CRCW0	60335K7FKEA
1 R29	Resistor TKF, 14k, 1%	1/8W, SMD, 0805	Panasonic® - ECG	ERJ-6ENF1402V
2 R3	R8	Resistor TKF, 24R, 1%, 1/10W, SMD, 0603	Yageo Corporation	RC0603FR-0724RL
1 R30	Resistor TKF, 280k, 1%	1/10W, SMD, 0603	Panasonic® - ECG	ERJ-3EKF2803V
1 R31	Resistor TKF, 56k, 1%	1/8W, SMD, 0805	Vishay/Dale CRCW0	80556K0FKEA
8 R33	R38, R42, R48, R49, R50, R51, R56	Resistor TKF, 0R, 1/10W, SMD, 0603	Panasonic® - ECG	ERJ-3GSY0R00V
1 R34	Resistor, SMD, 143 kΩ	1%, 1/10W, 0603	Bourns®, Inc.	CR0603-FX-1433ELF
1 R35	Resistor, SMD, 237 kΩ	1%, 1/10W, 0603	Stackpole Electronics, Inc.	RMCF0603FT237K
1 R36	Resistor TKF, 10.5R, 1%	1/10W, SMD, 0603	Vishay/Dale CRCW0	60310R5FKEA
1 R39	Resistor, TKF, 33R, 5%	1/10W, SMD, 0603DO NOT POPULATE	Panasonic® - ECG	ERJ-3GEYJ330V
5 R4	R5, R6, R7, R37	Resistor TF, 1k, 0.1%, 1/10W, SMD, 0603	Panasonic® - ECG	ERA-3AEB102V
1 R41	Resistor TKF, 348k, 1/10W, 1%, SMD, 0603		Stackpole Electronics, Inc.	RMCF0603FT348K
1 R43	Resistor TKF, 13.3k, 1%	1/10W, SMD, 0603	Stackpole Electronics, Inc.	RMCF0603FT13K3
4 R44	R53, R54, R55 Resistor TKF, 33R, 1%, 1/10W, SMD, 0603	ROHM Semiconductor	MCR03EZPFX33R0
1 R46	Resistor TKF, 158k, 1%, 1/10W, SMD, 0603	Yageo Corporation	RC0603FR-07158KL
1 R47	Resistor TKF, 0R, 1/8W, SMD, 0805 Panasonic	® - ECG ERJ-6GEY0R00V
1 R52	Resistor TKF, 47k, 1%, 1/10W, SMD, 0603	Panasonic® - ECG ERJ-3EKF4702V
1 R57	Resistor TKF, 2k, 1%, 1/10W, SMD, 0603	Panasonic® - ECG ERJ-3EKF2001V
1 SW1	Switch DIP, 4-POS, SLIDE, SMD, 6V Copal Electronics	Inc.	CHS-04TB
7 TP1	TP4, TP5, TP6, TP8, TP9, TP10	Connector header-2.54 Male, 1x1, Gold, 5.97MH, TH, Vertical	Samtec, Inc. TSW-101-07-L-S
1 U1	IC OP-AMP, Differential, RROLFCSP-16	Analog Devices Inc.	ADA4940-1ACPZ-R7
1 U2	Microchip Analog, VREF, 4.096V, SOT-23-6	Linear Technology Corporation	MCP1501T-40E/CHY
1 U3	MCP33131D-10-I/MS Microchip	Technology Inc.	MCP33131D-10-I/MS
3 U4	U6, U9 Microchip Analog LDO, 2.5V-5V, MSOP-8	Microchip Technology Inc.	MIC5219YMM
1 U5	IC Op Amp GP, 3.5 MHz, RRO, SOT23-5	Microchip Technology Inc.	MCP6286T-E/OT
1 U10	Microchip Analog Switcher, Buck 2V to 15V, SOT-23-6	Microchip Technology Inc.	MCP16301T-I/CHY

Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM used in manufacturing uses all RoHS-compliant components.

TABLE B-4: BILL OF MATERIALS (BOM) - MECHANICAL PARTS FOR ADM00873 (1)

Qty.	Reference		Description	Manufacturer	Part Number
3 JP1	JP2, JP3	1.2	7 mm Jumper at Pins 1 and 2 of J81.27 mm Jumper at Pins 1 and 2 of J31.27 mm Jumper at Pins 1 and 2 of J4	Harwin Plc.	M50-2000005
1 LABEL1		Microchip Technology Product Label
5 PAD	D1, PAD2, PAD3,PAD4, PAD5		Mechanical Hardware Rubber Pad,Cylindrical, D7.9, H5.3, Black	3M	SJ61A11
1	PS1		100-240V, Wall Plug-in Power Supply	Triad Magnetics	WSU090-2000-13
1 SCR1		Mechanical Hardware Machine Screw,PAN Phillips, 4-40, Nylon		Digi-Key ^ Electronics	H544-ND
	STANDOFF1		Mechanical HW Standoff, #4-40 x 3/4",F/F, HEX, Nylon	Keystone Electronics Corp.	1902D

Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM used in manufacturing uses all RoHS-compliant components.

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