SY88932L - Electronic component Microchip - Free user manual and instructions

USER MANUAL SY88932L Microchip

The SY88932L is the smallest available laser driver with a programmable modulation current up to 60mA for Fabry-Perot (FP) or distribution feedback (DFB) lasers. The device is suitable for SOENT/SDH applications with data rates up to 4.25Gbps. The SY88932L accepts either CML level or AC-coupled PECL inputs, and incorporates an active low TTL /EN function which shuts off the modulation current when HIGH.

Datasheets and support documentation can be found on Micrel's web site at www.micrel.com.

Features

• Up to 4.25Gbps operation
  • Modulation current to 60mA
• Rise/fall times 65ps typical
  • Input 50Ω internally terminated to VCC
  • TTL /EN with internal 75kΩ pull-down
• Designed for use with MIC3000 optical transceiver management IC
  • Voltage programmable laser modulation current
• Single 3.3V power supply
• Operating temperature range of -40^ to +85^
  • Available in tiny 16-pin QFN package

Applications

• Fiber optical module
• Transponder
• XAUI CWDM
  • SONET/ SDH transmission system
• Add-drop MUX
• Metro area network
  • 4.25Gbps optical transmitter

Block Diagram

graph TD
    A["Internal Logic"] --> B["VREF Generator"]
    A --> C["Modulation Control"]
    C --> D["V_CNTRL"]
    C --> E["GND"]
    F["VCC"] --> G["R_EXT /OUT"]
    H["VCC"] --> I["I_BIAS"]
    J["VCC"] --> K["GND"]
    L["D_IN"] --> A
    M["D_IN"] --> A
    N["/EN"] --> A
    O["V_REF"] --> A
    P["V_REF"] --> A
    Q["V_REF"] --> A
    R["OUT"] --> S["Inductor"]
    T["I_MOD"] --> U["Inverter"]
    V["I_BIAS"] --> W["Ground"]

Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel [phone] • fax [phone] • http://www.micrel.com

Ordering Information

Part Number Package	Type	Operating Range	Package Marking Lead	Finish
SY88932LMI	QFN-16	Industrial	932L	Sn-Pb
SY88932LMITR ^(1)	QFN-16	Industrial	932L	Sn-Pb
SY88932LMG	QFN-16	Industrial	932L withPb-Free bar-line indicator	Pb-FreeNiPdAu
SY88932LMGTR ^(1)	QFN-16	Industrial	932L withPb-Free bar-line indicator	Pb-FreeNiPdAu

Note:
1. Tape and Reel.

Pin Configuration

/EN VCNTRL VREF GND 16 15 14 13 GND 1 OUT DIN 2 OUT /DIN 3 OUT GND 4 OUT 5 6 7 8 VCC VCC GND GND 16-Pin QFN

Pin Description

Pin Number	Pin Name	Pin Function
2, 3	DIN, /DIN	NRZ differential data (inputs), CML terminated interface with 50 to V_CC .
1, 4, 7, 8, 13	GND	Ground.
5, 6	VCC	Positive power supply.
9, 10, 11, 12	OUT, /OUT	Open collector (outputs) from the modulation driver.
14	VREF	Voltage reference, nominally 1.25V with respect to ground.
15 VCNTRL Voltage control of I _MOD. 5k input impedance. See “Typical Operating Characteristics.”
16	/EN	Enable: TTL-compatible active low input with 75k pull-down resistor.

Truth Table ^(1,2)

D	/D	/EN	OUT^(3)	/OUT
L	H	L	H	L
H	L	L	L	H
X	X	H	H	L

Notes:

1. Truth table parameters are given for voltage rather than optical outputs. Hence, a voltage HIGH and OUT means no modulation current is flowing through OUT, and a voltage LOW on OUT means modulation current is flowing through OUT. A voltage LOW implies an optical HIGH, and vice versa.
2. L = LOW, H = HIGH, X = don't care.
3. I_OUT ≤ I_MOD_OFF when /EN is HIGH.

Absolute Maximum Ratings ^(1)

Supply Voltage ( V_cc )....-0.5V to +4.0V

CML Input Voltage ( V_IN )

TTL Control Input Voltage ( V_IN )....0V to V_CC

Lead Temperature (soldering, 20sec.) 265°C

Storage Temperature ( T_s ) -65^ to +150^

Operating Ratings ^(2)

Supply Voltage ( V_cc )....+3.0V to +3.6V

Ambient Temperature ( T_A ) -40^ to +85^

Junction Temperature (T _J ) ....-40°C to +120°C

Junction Thermal Resistance ^(3)

QFN

(_JA) Still-Air 61°C/W

(ψ JB) Still-Air....38°C/W

DC Electrical Characteristics

V_CC = 3.0V to 3.6V ; GND = 0V; T_A = -40^ C to +85^ C , Typical values at V_CC = 3.3V , T_A = 25^ C .

Symbol	Parameter	Condition	Min	Typ	Max	Units
I_CC	Power Supply Current	Note 4		57	80	mA
I_MOD	Modulation Current Range		10		60	mA
I_MOD\_OFF	Modulation Off Current	/EN = V_IHEN			200	μA
V_IR	CML Input Voltage Range		V_CC-0.8		V_CC+0.4	V
V_ID	CML Input Differential Voltage ( D_IN , / D_IN )	Note 5	400	800	1600	m V_PP
V_IHEN	TTL Input HIGH Voltage (/EN)		2.0			V
V_ILEN	TTL Input LOW Voltage (/EN)				0.8	V
V_OUT	Voltage (OUT, /OUT)	Note 6	V_CC-1.5		V_CC	V
V_REF	Reference Voltage	Note 7	1.2	1.25	1.3	V

Notes:

1. Permanent device damage may occur is Absolute Maximum Ratings are exceeded. This is a stress rating only and functional operation is not implied at conditions other than those detailed in the operational sections of this datasheet. Exposed to Absolute Maximum Ratings conditions for extended periods may affect device reliability.
2. The device is not guaranteed to function outside its operating rating.
3. Thermal resistance numbers are 4-layer PCB. Thermal performance assumes exposed pad is soldered (or equivalent) to the same potential as the ground pins on the PCB.
4. Excluding I_MOD . I_MOD set to 60mA with 25Ω load to V_CC on OUT, /OUT. Inputs floating.
5. V_ID is the voltage required to guarantee a stable logic level. For logic “1”, D_IN must be V_ID/2 above /D IN . For stable logic “0”, DIN must be V_ID/2 below /D _IN .
6. OUT and /OUT are current outputs. This specification defines the voltage range that the user must guarantee these pins remain within for proper operation.
7. V_REF intended to source/sink ≤ |5mA|.

AC Electrical Characteristics ^(8)

V_CC = 3.0V to 3.6V ; GND = 0V; T_A = -40^ C to +85^ C , Typical values at V_CC = 3.3V , T_A = 25^ C .

Symbol	Parameter	Condition	Min	Typ	Max	Units
t_r, t_f Output	Rise/Fall Times(20% to 80%)	Note 9		65	100	ps
DJ	Deterministic Jitter	Note 9, 10		20		ps_PP

Notes:

1. AC characteristics are guaranteed by design and characterization.
2. I_MOD = 60mA.
3. Deterministic jitter measured using K28.5 pattern of 2.486Gbps, V_ID = 1600mV_PP .

Typical Operating Characteristics

Package Information

Pin 1 Dot By Marking 3.000±0.050 3.000±0.050

TOP VIEW

PIN #1 IDENTIFICATION CHAMFER 0.300 X 45° 1.550±0.050 Exp. DAP 0.400±0.050 1.550±0.050 Exp. DAP 0.500 Bsc 0.230±0.050 0.400±0.050 1.500 Ref.

BOTTOM VIEW

0.850±0.050 0.000-0.050 0.203±0.025

SIDE VIEW
NOTE:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. MAX. PACKAGE WARPAGE IS 0.05 mm.
3. MAXIMUM ALLOWABLE BURRS IS 0.076 mm IN ALL DIRECTIONS
4. PIN #1 ID ON TOP WILL BE LASER/INK MARKED.

16-Pin QFN

Package EP- Exposed Pad Die CompSide Island Heat Dissipation Heat Dissipation Heavy Copper Plane VEE VEE Heavy Copper Plane

PCB Thermal Consideration for 16-Pin QFN Package

Package Notes:

1. Package meets Level 2 qualifications.
2. All parts are dry-packaged before shipment.
3. Exposed pads must be soldered to a ground for proper thermal management.

MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA

TEL [phone] FAX [phone] WEB http://www.micrel.com

The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.

Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser's use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser's own risk and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale.

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