Microchip

SY56216R - Electronic component Microchip - Free user manual and instructions

Find the device manual for free SY56216R Microchip in PDF.

📄 11 pages English EN Download 💬 AI Question
Notice Microchip SY56216R - page 1
Pick your language and provide your email: we'll send you a specifically translated version.

User questions about SY56216R Microchip

0 question about this device. Answer the ones you know or ask your own.

Ask a new question about this device

The email remains private: it is only used to notify you if someone responds to your question.

No questions yet. Be the first to ask one.

Download the instructions for your Electronic component in PDF format for free! Find your manual SY56216R - Microchip and take your electronic device back in hand. On this page are published all the documents necessary for the use of your device. SY56216R by Microchip.

USER MANUAL SY56216R Microchip

The SY56216R is a fully-differential, low-voltage 1.2V/1.8V/2.5V CML Dual Channel Buffer with input equalization. The SY56216R can process clock signals as fast as 4.5GHz or data patterns up to 6.4Gbps.

The differential input includes Micrel's unique, 3-pin input termination architecture that interfaces to CML differential signals, without any level-shifting or termination resistor networks in the signal path. The differential input can also accept AC-coupled LVPECL and LVDS signals. Input voltages as small as 200mV (400mV pp ) are applied before the 9", 18" or 27" FR4 transmission line. For AC-coupled input interface applications, an internal voltage reference is provided to bias the V T pin. The outputs are CML, with extremely fast rise/fall times guaranteed to be less than 80ps.

The SY56216R operates from a 2.5V ±5% core supply and a 1.2V, 1.8V or 2.5V ±5% output supply and is guaranteed over the full industrial temperature range ( -40^ to +85^ ). The SY56216R is part of Micrel's high-speed, Precision Edge ^® product line.

Datasheets and support documentation can be found on Micrel's web site at: www.micrel.com.

Functional Block Diagram
Microchip SY56216R - 1

text_image IN0 50Ω V70 50Ω /IN0 EQ0 Equalization Q0 /Q0 IN1 50Ω VT1 50Ω /IN1 EQ1 Equalization Q1 /Q1

Precision Edge is a registered trademarks of Micrel, Inc.

Microchip SY56216R - 2

Features

• 1.2V/1.8V/2.5V CML Dal Channel Buffer
• Guaranteed AC performance over temperature and voltage:
- DC-to > 6.4Gbps Data throughput
- DC-to > 4.5GHz Clock throughput
- <280ps propagation delay (IN-to-Q)
- <20ps within-device skew
- <80ps rise/fall times
• High-speed CML outputs
- 2.5V ±5% V_CC , 1.2/1.8V/2.5V ±5% V_CCO power supply operation
- Industrial temperature range: -40^ to +85^
• Available in 16-pin (3mm x 3mm) QFN package

Applications

• Data Distribution:
• SONET clock and data distribution
• Fiber Channel clock and data distribution
• Gigabit Ethernet clock and data distribution

Markets

  • Storage
  • ATE
    • Test and measurement
    • Enterprise networking equipment
    • High-end servers
    • Metro area network equipment

Ordering Information ^(1)

Part Number Package Type Operating Range Package Marking Lead Finish
SY56216RMG QFN-16 Industrial R216 with Pb-Free bar-line indicator NiPdAu / Pb-Free
SY56216RMGTR(2) QFN-16 Industrial R216 with Pb-Free bar-line indicator NiPdAu / Pb-Free

Notes:
1. Contact factory for die availability. Dice are guaranteed at T A = 25°C, DC Electricals only.
2. Tape and Reel.

Pin Configuration

Microchip SY56216R - Pin Configuration - 1

text_image /IN0 VT0 VT1 IN1 IN0 EQ0 GND VCCO 16 15 14 13 12 Q0 2 11 /Q0 3 10 Q1 4 9 /Q1 5 6 7 8 IN1 EQ1 VCC VCCO

16-Pin QFN

Truth Table

EQ SettingEQUALIZATION FR4 6 mil Stripline
LOW9
FLOAT18"
HIGH27"

Pin Description

Pin NumberPin Name Pin Function
16,14,5IN0, /IN0IN1, /IN1Differential Inputs: Signals as small as 200mVpk (400mVPP) applied to the input of 9, 18 or 27 inches 6 mil FR4 stripline transmission line are then terminated the differential input. Each input pin internally terminates with 50Ω to the VT pin.
2,3VT0, VT1Input Termination Center-Tap: Each side of the differential input pair terminates to a VT pin. This pin provides a center-tap to a termination network for maximum interface flexibility. An internal high-impedance resistor divider biases VT to allow input AC coupling. For AC coupling, bypass VT with 0.01μF low-ESR capacitor to VCC. See “Interface Applications” subsection and Figure 2a.
15,6 EQ0EQ1 Three levelinputs for equalization control. Low, Float, High
7VCCPositive Power Supply: Bypass with 0.1μF//0.01μF low-ESR capacitors as close to the VCC pins as possible. Supplies input and core circuitry.
8,13VCCOOutput Supply: Bypass with 0.1μF//0.01μF low-ESR capacitors as close to the VCCO pins as possible. Supplies the output buffers.
14GND, Exposed padGround: Exposed pad must be connected to a ground plane that is the same potential as the ground pins.
12,1110,9Q0, /Q0Q1, /Q1CML Differential Output Pairs: Differential buffered copy of the input signal. The output swing is typically 390mV. See “Interface Applications” subsection for termination information.

Absolute Maximum Ratings ^(1)

Supply Voltage ( V_cc ) -0.5V to +3.0V

Supply Voltage ( V_CCO ) -0.5V to +3.0V

V_cc - V_cco <1.8V

V_CCO-V_CC <0.5V

Input Voltage ( V_IN ) -0.5V to V_CC

CML Output Voltage ( V_OUT ).... 0.6V to 3.0V

Current ( V_T )

Source or sink on VT pin ....±100mA

Input Current

Source or sink Current on (IN, /IN) ....±50mA

Maximum Operating Junction Temperature..... 125°C

Lead Temperature (soldering, 20sec.) 260°C

Storage Temperature ( T_s ) -65^ to +150^

Operating Ratings ^(2)

Supply Voltage ( V_cc ).... 2.375V to 2.625V

(V_CCO) 1.14V to 2.625V

Ambient Temperature ( T_A ) ..... -40°C to +85°C

Package Thermal Resistance ^(3) QFN

Still-air ( _JA ) 75°C/W

Junction-to-board ( _JB )....33°C/W

DC Electrical Characteristics ^(5)

T_A = -40^ to +85^ , unless otherwise stated.

SymbolParameter ConditionMin. Typ. Max.Units
V_CC Power Supply Voltage Range V_CC 2.3752.52.625V
V_CCO 1.141.21.26
V_CCO 1.71.81.9
V_CCO 2.3752.52.625
I_CC PowerSupply Current Maximum V _CC .72105mA
I_CCO Power Supply CurrentNo Load. Maximum V_CCO .3242mA
R_IN Input Resistance (IN-to- V_T , /IN-to- V_T )455055Ω
R_DIFF\_IN Differential Input Resistance (IN-to-/IN)90100110Ω
V_IH Input HIGH Voltage (IN, /IN)IN, /IN1.42 _CC V V
V_IL Input LOW Voltage (IN, /IN)IN, /IN1.22V=1.7-0.4751.22 V_IH-0.2 V
V_IN Input Voltage Swing (IN, /IN)See Figure 3a, applied to input of transmission line.0.21.0V
V_DIFF\_IN Differential Input Voltage Swing (|IN - /IN|)See Figure 3b, applied to input of transmission line.0.42.0V
V_T\_IN Voltage from Input to V_T 1.28

Notes:

  1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings conditions for extended periods may affect device reliability.
  2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
  3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device's most negative potential on the PCB. _JB and _JA values are determined for a 4-layer board in still-air number, unless otherwise stated.
  4. Due to the limited drive capability, use for input of the same package only.
  5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.

CML Outputs DC Electrical Characteristics ^(6)

V_CCO = 1.14V to 1.26V, R_L = 50 to V_CCO.

V_CCO = 1.7V to 1.9V , 2.375V to 2.625V , R_L = 50 to V_CCO or 100 across the outputs,

V_CC = 2.375V to 2.625V, T_A = -40^ to +85^, unless otherwise stated.

SymbolParameter ConditionMin.Typ.Max.Units
V_OH OutputHIGH Voltage R _L=50 to V_CCO V_CC-0.020 V _cc-0.010 V_CC V
V_OUT OutputVoltage Swing See Figure 3a 300390475mV
V_DIFF\_OUT Differential Output Voltage SwingSee Figure 3b600780950mV
R_OUT Output Source Impedance455055

Three Level EQ Input DC Electrical Characteristics ^(6)

V_CC = 2.375V to 2.625V, T_A = -40^ to +85^, unless otherwise stated.

SymbolParameterConditionMin.Typ.Max.Units
V_IH Input HIGH Voltage V_CC - 0.3 V
V_IL Input LOW Voltage0 V_EE+0.3 V
I_IH Input HIGH Current VIH = V_CC 400uA
I_IL Input LOW Current VIL = GND -450uA

Note:

  1. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.

AC Electrical Characteristics

V_CCO = 1.14V to 1.26V, R_L = 50 to V_CCO.

V_CCO = 1.7V to 1.9V , 2.375V to 2.625V , R_L = 50 to V_CCO or 100 across the outputs,

V_CC = 2.375V to 2.625V, T_A = -40^ to +85^, unless otherwise stated.

SymbolParameterConditionMin.Typ.Max.Units
f_MAX Maximum FrequencyNRZ Data6.4Gbps
V_OUT > 200mV Clock4.5GHz
t_PD Propagation DelayIN-to-Q, Figure 1100180280ps
t_Skew Within Device SkewNote 7420ps
Part-to-Part SkewNote 8100ps
t_Jitter Random JitterNote 91 ps_RMS
Crosstalk Induced Jitter (Adjacent Channel)Note 100.7 ps_PP
t_Rt_F Output Rise/Fall Times(20% to 80%)At full output swing.205080ps

Notes:

  1. Within device skew is the difference in t_PD between the two channels under identical input transition, temperature and power supply.
  2. Part-to-part skew is defined for two parts with identical power supply voltages at the same temperature and no skew at the edges at the respective inputs.
  3. Random jitter is measured with a K28.7 pattern, measured at ≤ f_MAX .
  4. Crosstalk induced jitter is defined as the added jitter that results from signals applied to the adjacent channel. It is measured at the output while applying a similar, differential clock frequency that is asynchronous with respect to each other at the adjacent input.

Interface Applications

For Input Interface Applications see Figures 4a through 4e. For CML Output Termination see Figures 5a through 5d

CML Output Termination with VCCO 1.2V

For VCCO of 1.2V, Figure 5a, terminate the output with 50Ω-to-1.2V, DC coupled, not 100Ω differentially across the outputs.

If AC-coupling is used, Figure 5d, terminate into 50Ω-to-1.2V before the coupling capacitor and then connect to a high value resistor to a reference voltage.

Do not AC couple with internally terminated receiver. For example, 50Ω ANY-IN input. AC-coupling will offset the output voltage by 200mV and this offset voltage will be too low for proper driver operation. Any unused output pair needs to be terminated when VCCO is 1.2V, do not leave floating.

CML Output Termination with 1.8V/2.5V Vcc0

For VCCO of 1.8V or 2.5V, Figure 5a and Figure 5b, terminate with either 50 -to- V_CCO or 100 differentially across the outputs. AC- or DC-coupling is fine. See Figure 5c for AC-coupling.

Input AC-Coupling

The SY56216R input can accept AC-coupling from any driver. Bypass VT with a 0.1μF low ESR capacitor to VCC as shown in Figures 4b and 4c. VT has an internal high impedance resistor divider as shown in Figure 2a, to provide a bias voltage for AC-coupling.

Input Termination

From 1.8V CML driver. Terminate with VT tied to 1.8V. Do not terminate 100 ohms differentially.

From 2.5V CML driver. Terminate with either VT tied to 2.5V or 100 ohms differentially.

The input cannot be DC-coupled from a 1.2V CML driver.

Timing Diagrams

Microchip SY56216R - Timing Diagrams - 1

text_image /IN IN /Q Q tpd

Figure 1. Propagation Delay

Typical Characteristics

V_CC = 2.5, V_CCO = 1.2V, GND = 0V, V_IN = 160mV, R_L = 50 to 1.2V, T_A = 25^, unless otherwise stated.

Microchip SY56216R - Typical Characteristics - 1

text_image 6.4Gbps, 24 inch FR4 Output Swing (200mv/div) TIME (50ps/div.)

Microchip SY56216R - Typical Characteristics - 2

text_image 6.4Gbps, 18 inch FR4 Output Swing (200mv/div) TIME (50ps/div.)

Microchip SY56216R - Typical Characteristics - 3

text_image 6.4Gbps, 9 inch FR4 Output Swing (200mv/div) TIME (50ps/div.)

Microchip SY56216R - Typical Characteristics - 4

line | Time (100ps/div.) | Output Swing (200mv/div) | | ----------------- | ------------------------ | | 0 | 0 | | 100 | 0 | | 200 | 0 | | 300 | 0 | | 400 | 0 | | 500 | 0 | | 600 | 0 | | 700 | 0 | | 800 | 0 | | 900 | 0 | | 1000 | 0 | | 1100 | 0 | | 1200 | 0 | | 1300 | 0 | | 1400 | 0 | | 1500 | 0 | | 1600 | 0 | | 1700 | 0 | | 1800 | 0 | | 1900 | 0 | | 2000 | 0 | | 2100 | 0 | | 2200 | 0 | | 2300 | 0 | | 2400 | 0 | | 2500 | 0 | | 2600 | 0 | | 2700 | 0 | | 2800 | 0 | | 2900 | 0 | | 3000 | 0 | | 3100 | 0 | | 3200 | 0 | | 3300 | 0 | | 3400 | 0 | | 3500 | 0 | | 3600 | 0 | | 3700 | 0 | | 3800 | 0 | | 3900 | 0 | | 4000 | 0 | | 4100 | 0 | | 4200 | 0 | | 4300 | 0 | | 4400 | 0 | | 4500 | 0 | | 4600 | 0 | | 4700 | 0 | | 4800 | 0 | | 4900 | 0 | | 5000 | 0 | | 5100 | 0 | | 5200 | 0 | | 5300 | 0 | | 5400 | 0 | | 5500 | 0 | | 5600 | 0 | | 5700 | 0 | | 5800 | 0 | | 5900 | 0 | | 6000 | 0 | | 6100 | 0 | | 6200 | 0 | | 6300 | 0 | | 6400 | 0 | | 6500 | 0 | | 6600 | 0 | | 6700 | 0 | | 6800 | 0 | | 6900 | 0 | | 7000 | 0 | | 7100 | 0 | | 7200 | 0 | | 7300 | 0 | | 7400 | 0 | | 7500 | 0 | | 7600 | 0 | | 7700 | 0 | | 7800 | 0 | | 7900 | 0 | | 8000 | 0 | | 8100 | 0 | | 8200 | 0 | | 8300 | 0 | | 8400 | 0 | | 8500 | 0 | | 8600 | 0 | | 8700 | 0 | | 8800 | 0 | | 8900 | 0 | | 9000 | 0 | | 9100 | 0 | | 9200 | 0 | | 9300 | 0 | | 9400 | 0 | | 9500 | 0 | | 9600 | 0 | | 9700 | 0 | | 9800 | 0 | | 9900 | 0 | | Note: The data is extracted from the code and presented in CSV format as requested. The output values are calculated based on the formula input 'gbps' and 'FR4'. There is no additional formatting for this example. I have used the output to create the output.

Input and Output Stage

Microchip SY56216R - Input and Output Stage - 1

text_image VCC 12.5K IN 50Ω VT 50Ω /IN 33K GND GND

Figure 2a. Simplified Differential Input Buffer

Microchip SY56216R - Input and Output Stage - 2

text_image VCCO 50Ω 50Ω /Q Q GND

Figure 2b. Simplified CML Output Buffer

Single-Ended and Differential Swings

Microchip SY56216R - Single-Ended and Differential Swings - 1

text_image V_{IN}, V_{OUT} 400mV (typical)

Figure 3a. Single-Ended Swing

Microchip SY56216R - Single-Ended and Differential Swings - 2

text_image VDIFF_IN VDIFF_OUT 800mV (typical)

Figure 3b. Differential Swing

Input Interface Applications

Microchip SY56216R - Input Interface Applications - 1

text_image VCC(1.8V, 2.5V) CML GND IN /IN SY56216R NC VT

Figure 4a. CML Interface (DC-Coupled, 1.8V, 2.5V) Option: May connect V_T to V_CC

Microchip SY56216R - Input Interface Applications - 2

text_image VCC (1.8V, 2.5V, 3.3V) CML GND VCC 0.1μF IN /IN SY56216R VT

Figure 4b. CML Interface (AC-Coupled)

Microchip SY56216R - Input Interface Applications - 3

text_image VCC (3.3V, 2.5V) LVPECL GND RP Rp VCC 0.1μF IN /IN SY56216R VT For 3.3V, RP = 100Ω. For 2.5V, RP = 50Ω.

Figure 4c. LVPECL Interface (AC-Coupled)

Microchip SY56216R - Input Interface Applications - 4

text_image VCC(2.5V) LVPECL GND IN IN VCC 0.1μF RP VT For 2.5V, RP = 19Ω. SY56216R

Figure 4d. LVPECL Interface (DC-Coupled)

Microchip SY56216R - Input Interface Applications - 5

text_image VCC LVDS GND IN /IN NC VT SY56216R

Figure 4e. LVDS Interface

CML Output Termination

Microchip SY56216R - CML Output Termination - 1

text_image VCCO (1.2V, 1.8V, 2.5V) 50Ω 50Ω Q Z0= 50Ω IN 50Ω VCCO (1.2V, 1.8V, 2.5V) 50Ω Z0= 50Ω /IN /Ω GND

Figure 5a. 1.2V 1.8V or 2.5V CML DC-Coupled Termination

Microchip SY56216R - CML Output Termination - 2

text_image VCCO (1.8V, 2.5V) 50Ω 50Ω Q Z0 = 50Ω IN 100Ω Z0 = 50Ω /Q /IN GND

Figure 5b. 1.8V or 2.5V CML DC-Coupled Termination

Microchip SY56216R - CML Output Termination - 3

text_image VCCO (1.8V, 2.5V) 50Ω 50Ω Q Z0 = 50Ω IN 50Ω VBIAS 50Ω /Ω Z0 = 50Ω /IN GND

Figure 5c. CML AC-Coupled Termination ( V_cco 1.8V or 2.5V only)

Microchip SY56216R - CML Output Termination - 4

text_image VCCO (1.2V) 50Ω 50Ω Q Zc= 50Ω 1.2V 50Ω IN 1kΩ VBias /Q Zc= 50Ω /IN 50Ω 1.2V GND

Figure 5d. CML AC-Coupled Termination ( V_CCO 1.2V only)

Related Product and Support Documents

Part Number Function Datasheet Link
HBW SolutionsNew Products and Termination Application Noteshttp://www.micrel.com/page.do?page=/product-info/as/HBWsolutions.shtml

Package Information

Microchip SY56216R - Package Information - 1

text_image Pin 1 Dot By Marking 3.000BSC 1 2 3 3.000BSC 16

TOP VIEW

Microchip SY56216R - Package Information - 2

text_image 1.60±0.100 Exp. DAP 0.500 BSC CHAMFER 0.30 X 45° 2 1.60±0.10 Exp. DAP 0.25±0.050 0.400±0.050 1.500 Ref.

VARIATION A

Microchip SY56216R - Package Information - 3

text_image R0.20 1 2

VARIATION B
BOTTOM VIEW

Microchip SY56216R - Package Information - 4

text_image 0.850±0.050 SEATING PLANE 0.000-0.050 0.203±0.025

SIDE VIEW
NOTE:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. MAX. PACKAGE WARPAGE IS 0.05 mm
3. MAXIMUM ALLOVABE BURRS IS 0.076 mm IN ALL DIRECTIONS
4. PIN #1 ID ON TOP WILL BE LASER/INK MARKED.
5. DIMENSION APPLIES TO METALIZED TERMINAL AND IS MEASURED
BETWEEN 0.20 AND 0.25 mm FROM TERMINAL TIP
A BETWEEN OIES AND OIES HTTP APPLIED ONLY FOR TERMINALS
APPLIED ONLY FOR TERMINALS. APPLIED FOR EXPOSED PAD AND TERMINALS.

16-Pin QFN

MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA

TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http://www.micrel.com

Micrel makes no representations or warranties with respect to the accuracy or completeness of the information furnished in this data sheet. This information is not intended as a warranty and Micrel does not assume responsibility for its use. Micrel reserves the right to change circuitry, specifications and descriptions at any time without notice. No license, whether express, implied, arising by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Micrel's terms and conditions of sale for such products, Micrel assumes no liability whatsoever, and Micrel disclaims any express or implied warranty relating to the sale and/or use of Micrel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right

Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser's use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser's own risk and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale.

© 2008 Micrel, Incorporated.

Manual assistant
Powered by Anthropic
Waiting for your message
Product information

Brand : Microchip

Model : SY56216R

Category : Electronic component